Mica plate with framework

By setting up skeleton components on the cloud mother board substrate, the amount of rubber dipping is reduced, and the problem that the glue releases toxic gases and the excessive glue amount affects the structural strength under high temperature conditions, and the stability and intensity of the cloud mother board will be achieved.

CN222407512UActive Publication Date: 2025-01-28CHANGDE SHENGXING TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421019455.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-11
Publication Date
2025-01-28
Estimated Expiration
2034-05-11

AI Technical Summary

Technical Problem

When existing mica boards are produced, the glue will release toxic gas under high temperature conditions, and the amount of glue applied will affect the structural strength and stability of the mica board, resulting in interlayer peeling.

Method used

A cloud -mothers with a skeleton are designed. By setting multiple installations of slot holes on one side of the cloud mother board substrate, and installing skeleton components in the groove hole, the amount of glue is reduced to prevent peeling between the layers. The skeleton components include the first skeleton, the second skeleton, and the third skeleton. The connection column and the connection slot are used to achieve a variety of thickness adaptation, and epoxy resin glue is filled by pressure glue.

Benefits of technology

Effectively reduce the amount of glue in the cloud mother board substrate, prevent the layers from peeling, avoid the release of toxic gases at high temperature conditions, and at the same time improve the structural strength and stability of the cloud mother board.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222407512U_ABST
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Abstract

The utility model relates to a mica plate with a skeleton, comprising a mica plate substrate, one side of the mica plate substrate is provided with a plurality of mounting slots, the plurality of mounting slots are arranged in an array on one side of the mica plate substrate, and the plurality of mounting slots are internally provided with skeleton assemblies. According to the mica plate, the impregnation amount during hot-pressing compounding of impregnated mica paper in the mica plate substrate can be effectively reduced, and the situation of interlayer stripping of the mica plate substrate in the use process is prevented, so that the problems that during production of an existing mica plate, a sizing material can be continuously released and a large amount of toxic and harmful gas is generated under the high-temperature condition; and if the glue application amount is too small, the overall structural strength and stability of the mica plate can be influenced.
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Description

Technical Field

[0001] The utility model relates to the technical field of mica plates, in particular to a mica plate with a skeleton. Background Art

[0002] Mica is a special sheet silicate mineral. Its crystal structure is a lamellar structure composed of two layers of silicon-oxygen tetrahedrons sandwiched by a layer of aluminum-oxygen octahedron. The special lamellar structure of mica determines that it has extremely high electrical insulation perpendicular to the cleavage plane. At the same time, it also has good transparency, excellent strippability, chemical stability, reducibility, and the ability to maintain the above excellent physical and chemical properties under high temperature conditions. It is a very important insulating material. As an important electrical insulating material, mica insulating materials need to have a sufficiently large area during use. With the depletion of large mica resources, sheet insulating materials prepared from crushed mica through appropriate processing methods have become the mainstream of mica insulation.

[0003] After searching, the Chinese patent with the announcement number CN218948633U discloses a mica composite plate structure, which belongs to the technical field of mica products. It includes at least two stainless steel mesh layers and one more mica paper layer than the stainless steel mesh layers, the stainless steel mesh layers and the mica paper layers are alternately distributed, and a silicone resin layer is coated between the mica paper layer and the stainless steel mesh layer, and the silicone resin passes through the mesh of the stainless steel mesh layer. The utility model has the advantages of high mechanical strength.

[0004] When this patent is actually used, there are the following defects:

[0005] In this patent, when the glue is applied between the mica paper layer and the stainless steel mesh layer, the glue will continuously release and produce a large amount of toxic and harmful gases under high temperature conditions. However, if the amount of glue applied is too little, it will affect the overall structural strength and stability of the mica board, making the mica board structurally unstable after molding and prone to interlayer peeling after continuous use. Utility Model Content

[0006] In view of the technical problem that in the existing patents, when the glue is coated between the mica paper layer and the stainless steel mesh layer, the glue will continuously release and produce a large amount of toxic and harmful gases under high temperature conditions, but if the amount of glue applied is too little, it will affect the overall structural strength and stability of the mica board, resulting in poor structural stability of the mica board after molding, and easy interlayer peeling after continuous use, the utility model provides a mica board with a skeleton.

[0007] The technical solution adopted by the utility model is: a mica board with a skeleton, including a mica board substrate, a plurality of mounting slots are opened on one side of the mica board substrate, the plurality of mounting slots are arranged in an array on one side of the mica board substrate, and skeleton components are arranged in the plurality of mounting slots.

[0008] By setting the skeleton component, the amount of glue impregnation during hot-pressing and compounding of the impregnated mica paper in the mica board substrate can be effectively reduced, thereby preventing the mica board substrate from peeling off between layers during use.

[0009] Furthermore, the skeleton assembly includes a first skeleton, a second skeleton and a third skeleton.

[0010] Furthermore, the second skeleton is arranged between the first skeleton and the third skeleton, and connecting columns are fixedly installed on one side of the first skeleton and the second skeleton, and connecting grooves are opened on one side of the third skeleton and the other side of the second skeleton, and two adjacent connecting columns correspond to the connecting grooves.

[0011] Furthermore, three clamping blocks are fixedly installed on the peripheral side of the connecting column, and three clamping grooves are opened on the peripheral side of the inner wall of the connecting groove, and the clamping blocks correspond to the clamping grooves.

[0012] By providing the connection columns and connection grooves, the skeleton assembly can be used for mica boards of various thicknesses.

[0013] Furthermore, gaps between the first frame, the second frame, the third frame and the mounting slots are filled with epoxy resin glue by pressure injection.

[0014] Furthermore, glass fiber cloths are arranged on both sides of the mica board substrate, and mica paper is arranged on one side of the two glass fiber cloths and one side of the mica board substrate.

[0015] Furthermore, the mica board substrate is formed by hot-pressing and composite forming of a plurality of mica sheets.

[0016] Furthermore, a carbon fiber fabric layer is arranged between the plurality of mica sheets.

[0017] The beneficial effects of the utility model are as follows: compared with the prior art, in the utility model;

[0018] By setting up the skeleton component, the amount of glue impregnation during hot pressing and compounding of the impregnated mica paper in the mica board substrate can be effectively reduced, and the interlayer peeling of the mica board substrate during use can be prevented, thereby effectively solving the problem that the glue of the existing mica board will continue to release and generate a large amount of toxic and harmful gases under high temperature conditions during production, and if the amount of glue applied is too little, it will affect the overall structural strength and stability of the mica board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the main structure of the mica board of the utility model;

[0020] Figure 2It is a schematic diagram of the cross-sectional structure of the mica board of the utility model;

[0021] Figure 3 It is a schematic diagram of the skeleton assembly structure of the utility model;

[0022] Figure 4 It is a schematic diagram of the exploded structure of the skeleton assembly of the utility model.

[0023] The markings in the figure are: 1. Mica board substrate; 2. Glass fiber cloth; 3. Mica sheet; 4. Carbon fiber fabric layer; 5. Mounting slot; 6. Skeleton assembly; 7. First skeleton; 8. Second skeleton; 9. Third skeleton; 10. Connecting column; 11. Connecting groove; 12. Card block; 13. Card slot; 14. Mica paper. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be noted that the terms "front", "up", "down", "left", "right", "vertical", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] The following is combined with Figure 1-4 The utility model is further described.

[0027] In order to solve the problems existing in the background technology, the present application proposes the following technical solution: a mica board with a skeleton.

[0028] The specific technical solution includes a mica board substrate 1, a plurality of mounting slots 5 are opened on one side of the mica board substrate 1, and the plurality of mounting slots 5 are arranged in an array on one side of the mica board substrate 1, and a skeleton component 6 is arranged in each of the plurality of mounting slots 5.

[0029] Reference Figure 3-4The skeleton assembly 6 of this embodiment includes a first skeleton 7, a second skeleton 8 and a third skeleton 9. The second skeleton 8 is arranged between the first skeleton 7 and the third skeleton 9. A connecting column 10 is fixedly installed on one side of the first skeleton 7 and the second skeleton 8. A connecting groove 11 is opened on one side of the third skeleton 9 and the other side of the second skeleton 8. Two adjacent connecting columns 10 correspond to the connecting grooves 11. Three clamping blocks 12 are fixedly installed on the peripheral side of the connecting column 10. Three clamping grooves 13 are opened on the peripheral side of the inner wall of the connecting groove 11. The clamping blocks 12 correspond to the clamping grooves 13. The gaps between the first skeleton 7, the second skeleton 8 and the third skeleton 9 and the installation slot hole 5 are filled with epoxy resin glue by pressure injection.

[0030] By setting the first skeleton 7, the second skeleton 8 and the third skeleton 9, it is possible to insert the connecting column 10 on one side of the first skeleton 7 into the connecting groove 11 on one side of the second skeleton 8, and then rotate the first skeleton 7 so that the connecting column 10 drives the block 12 to rotate into the groove 13 on the inner wall side of the connecting groove 11, and then repeat the above steps to clamp the connecting column 10 on one side of the second skeleton 8 into the connecting groove 11 on one side of the third skeleton 9. When mica boards of different thicknesses need to be produced, multiple second skeletons 8 can be clamped on the first skeleton 7 and the third skeleton 9 according to the above steps, so that the skeleton component 6 can be suitable for mica boards of various thicknesses, thereby greatly improving the practicability and convenience of the mica board during production. The skeleton component 6 is made of rubber material, which can effectively improve the impact resistance of the mica board during use.

[0031] Reference Figure 2 In this embodiment, glass fiber cloth 2 is arranged on both sides of the mica board substrate 1, and mica paper 14 is arranged on one side of the two glass fiber cloths 2 and one side of the mica board substrate 1. The mica board substrate 1 is formed by hot-pressing and compositely forming a plurality of mica sheets 3, and carbon fiber fabric layers 4 are arranged between the plurality of mica sheets 3.

[0032] By providing the carbon fiber fabric layer 4 and the glass fiber cloth 2, the structural strength and stability of the mica board substrate 1 can be improved, thereby ensuring the service life of the mica board.

[0033] In order for those skilled in the art to fully understand the technical solution, this application makes the following overall summary:

[0034] When in use, the mica sheets 3 and the carbon fiber fabric layers 4 are stacked in sequence and hot-pressed to form a mica board substrate 1, and then a mounting slot 5 is opened on the mica board substrate 1, and then a skeleton component 6 assembled into a required thickness is installed in the mounting slot 5, and epoxy resin glue is filled in the gap between the skeleton component 6 and the mounting slot 5 by pressure injection, and then glass fiber cloth 2 and mica paper 14 are pasted on one side of both sides of the mica board substrate 1, and then it is hot-pressed to form a finished mica board.

[0035] The standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The content not described in detail in this specification belongs to the prior art known to professional and technical personnel in this field.

[0036] Although the embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mica board with a skeleton, characterized in that: It comprises a mica board substrate (1), wherein one side of the mica board substrate (1) is provided with a plurality of mounting slots (5), the plurality of mounting slots (5) are arranged in an array on the one side of the mica board substrate (1), and a skeleton component (6) is arranged in each of the plurality of mounting slots (5).

2. A mica board with a skeleton according to claim 1, characterized in that: The frame assembly (6) comprises a first frame (7), a second frame (8) and a third frame (9).

3. A mica board with a skeleton according to claim 2, characterized in that: The second frame (8) is arranged between the first frame (7) and the third frame (9); one side of the first frame (7) and the second frame (8) are fixedly mounted with connecting columns (10); one side of the third frame (9) and the other side of the second frame (8) are provided with connecting grooves (11); two adjacent connecting columns (10) correspond to the connecting grooves (11).

4. The mica board with a skeleton according to claim 3, characterized in that: Three clamping blocks (12) are fixedly mounted on the peripheral side of the connecting column (10), and three clamping grooves (13) are opened on the peripheral side of the inner wall of the connecting groove (11), and the clamping blocks (12) correspond to the clamping grooves (13).

5. The mica board with a skeleton according to claim 4, characterized in that: The gaps between the first frame (7), the second frame (8) and the third frame (9) and the mounting slot hole (5) are filled with epoxy resin glue by means of pressure injection.

6. The mica board with a skeleton according to claim 1, characterized in that: Glass fiber cloths (2) are provided on both sides of the mica board substrate (1), and mica paper (14) is provided on one side of the two glass fiber cloths (2) and one side of the mica board substrate (1).

7. The mica board with a skeleton according to claim 6, characterized in that: The mica board substrate (1) is formed by hot-pressing and composite forming of a plurality of mica sheets (3).

8. The mica board with a skeleton according to claim 7, characterized in that: Carbon fiber fabric layers (4) are arranged between the plurality of mica sheets (3).

Citation Information

Patent Citations

  • Mica composite board structure

    CN218948633U