Heater and thermal spraying device

Abstract

The heater comprises a base layer, a heating layer and a protective layer, the heating layer is located on at least one side, in the thickness direction of the heater, of the base layer, and the protective layer is arranged on the side, away from the base layer, of the heating layer in the thickness direction of the heater. Wherein in the thickness direction of the heater, the protection layer is provided with a first end face facing the substrate layer, and the first end face is a plane. The protection layer is of the flat and straight structure and is not provided with an inclined section, in the magnetron sputtering forming process, the thicknesses of all positions of the protection layer of the flat and straight structure are uniform, the risk that cracks are generated due to the fact that the thickness of the protection layer on the inclined section is small is reduced, and therefore the risk that the protection layer loses efficacy due to the fact that the protection layer is eroded by liquid is reduced; therefore, the failure risk of the heating layer on the inner side of the protective layer is reduced, and the service life of the heater is prolonged.

Description

Technical Field

[0001] The present application relates to the field of thermal spraying technology, and in particular to a heater and a thermal spraying device. Background Art

[0002] The thermal jet unit is used in a printing device. The thermal jet unit generally includes a heater and a body. The body has a chamber inside and is provided with a spray hole. The heater includes a protective layer in contact with the liquid inside the chamber and a heating layer located inside the protective layer. The heating layer can generate heat after being energized. When the thermal jet unit is working, the heater generates instantaneous high temperature, vaporizes the liquid in the chamber near the protective layer, generates bubbles, and sprays droplets through the spray hole to achieve printing. In the thermal jet device, the protective layer is used to protect the heating layer. When cracks exist in the protective layer, the protective effect of the protective layer is poor, causing the heating layer to be easily corroded, thereby reducing the service life of the thermal jet device. Utility Model Content

[0003] The present application provides a heater and a thermal spray device, which are used to solve the problem that cracks are easily generated in the protective layer, resulting in the heating layer being easily corroded.

[0004] In a first aspect, an embodiment of the present application provides a heater, the heater comprising a base layer, a heating layer and a protective layer, the heating layer being located on at least one side of the base layer along the thickness direction of the heater. Along the thickness direction of the heater, the protective layer is disposed on a side of the heating layer away from the base layer. Wherein, along the thickness direction of the heater, the protective layer has a first end surface facing the base layer, and the first end surface is a plane.

[0005] In this embodiment, the protective layer is a straight structure without an inclined section. During the magnetron sputtering molding process, the thickness of the protective layer at each position of the straight structure is relatively uniform, thereby reducing the risk of cracks in the protective layer due to the smaller thickness of the inclined section, thereby reducing the risk of liquid erosion of the protective layer and causing the protective layer to fail, thereby reducing the risk of failure of the heating layer located inside the protective layer and increasing the life of the heater.

[0006] In the embodiment of the present application, the heating layer has a second end face connected to the first end face, and the second end face is a plane. That is, the end face of the heating layer facing the protective layer is the second end face, and since the second end face is a plane, the first end face connected thereto is also a plane, and thus the protective layer is a straight structure, which is beneficial to improving the reliability of the protective layer and thus improving the life of the heater.

[0007] In an embodiment of the present application, the heating layer includes a resistor layer and a wire layer connected to the resistor layer, the resistor layer includes a heating area and a connection area, the resistor layer and the wire layer are connected in the connection area. The heating layer also includes a protrusion, and the wire layer is located at the periphery of the protrusion so that the second end surface is a plane.

[0008] Therefore, by setting the raised portion, a second end face of the heating layer for connecting to the protective layer is formed, and the second end face is made flat, so that the first end face of the protective layer connected to the second end face is flat, and the protective layer formed on the second end face is a straight structure, thereby improving the stability of the protective layer and reducing the risk of failure caused by cracks in the protective layer during the molding and heating processes.

[0009] In an embodiment of the present application, the heating layer has a recessed portion, and the raised portion fills the recessed portion so that the second end face is a plane, so that the protective layer formed on the second end face is a flat structure, thereby improving the reliability of the protective layer and reducing the risk of failure caused by cracks in the protective layer during the molding process and the heating process.

[0010] In an embodiment of the present application, the wire layer and the raised portion are connected along the circumference of the heater, and their profiles are complementary. The raised portion is flush with the end face of the wire layer that is away from the base layer to form a planar second end face. The raised portion can fill the recessed portion between the wire layer and the heating zone, thereby improving the flatness of the second end face of the heating layer, thereby improving the flatness of the first end face of the protective layer, further making the thickness of the protective layer at each position uniform and improving its reliability.

[0011] In an embodiment of the present application, the connecting area includes a first section and a second section, the second section connects the heating area and the first section, along the thickness direction of the heater, the first section is located between the base layer and the wire layer, along the circumference of the heater, the second section is located between the protrusion and the wire layer, the end surfaces of the heating area and the wire layer facing away from the base layer are flush, and the protective layer is arranged on the end surfaces of the heating area and the wire layer facing away from the base layer.

[0012] The raised portion complements the heating area and the second section contour of the resistance layer, thereby filling the recessed portion of the resistance layer, improving the flatness of the second end face of the heating layer, thereby improving the flatness of the first end face of the protective layer, and further making the thickness of each position of the protective layer uniform, thereby improving its reliability.

[0013] In the embodiment of the present application, the material of the protrusion is silicon or silicon dioxide. Since silicon or silicon dioxide has good insulation properties and has good stability and high temperature resistance, it can reduce the risk of damage to the protrusion caused by the high temperature generated by the resistance layer.

[0014] In the embodiment of the present application, the protrusion is integrally formed with the base layer, and the integrally formed processing method is beneficial to reducing the processing steps of heater molding, which is beneficial to reducing production costs.

[0015] In an embodiment of the present application, the heater also includes a heat conductor, the protrusion is the heat conductor, the heat conductor connects the heating area and the protective layer, the heat conductor can fill the recessed portion formed in the heater, improve the flatness of the second end face of the heating layer, thereby improving the flatness of the first end face of the protective layer, further making the thickness of each position of the protective layer uniform, and improving its reliability.

[0016] In addition, the heat conducting element connects the heating area of ​​the resistance layer and the protective layer, so that the heat of the resistance layer can be conducted to the protective layer, thereby heating the liquid above the protective layer.

[0017] In the embodiment of the present application, the cross-section of the raised portion is trapezoidal. The raised portion of this shape is convenient for actual production and helps to improve production efficiency.

[0018] In an embodiment of the present application, the protective layer includes a first protective layer, a second protective layer and a third protective layer stacked along the thickness direction of the heater, the third protective layer is connected to the heating layer, the second protective layer is located on a side of the third protective layer away from the heating layer, and the first protective layer is located on a side of the second protective layer away from the third protective layer. The material of the first protective layer is tantalum or tantalum oxide, the material of the second protective layer is silicon carbide, and the material of the third protective layer is silicon nitride.

[0019] In this embodiment, the material of the first protective layer can be tantalum or tantalum oxide, which has good corrosion resistance and impact resistance, reducing the risk of the first protective layer being damaged by the impact of bubbles in the liquid after bursting, which is beneficial to improving the reliability of the protective layer. The material of the second protective layer can be silicon carbide, which has good corrosion resistance and high rigidity, further improving the corrosion resistance and impact resistance of the heater. The material of the third protective layer can be silicon nitride, which has good high temperature resistance and high hardness, so that the third protective layer has good protection effect and buffering capacity, which is beneficial to improving the service life of the heater.

[0020] The second aspect of the embodiment of the present application provides a thermal spray device, which includes a feed box, a spray chip and a heater, wherein the heater is the heater described above, wherein the heater is installed on the spray chip, and the spray chip is connected to the feed box.

[0021] When the heater is used in a thermal injection device, the protective layer of the heater has a buffering and shock-absorbing effect, reducing the risk of liquid impact and erosion on the inside of the heater, which is beneficial to increasing the life of the heater and further increasing the life of the thermal injection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Description of reference numerals:

[0023] Figure 1 A schematic diagram of the structure of a thermal spray device provided in an embodiment of the present application in a specific embodiment;

[0024] Figure 2 for Figure 1 A structural diagram from another perspective;

[0025] Figure 3 A cross-sectional view of a heater of a thermal spray device in a specific embodiment;

[0026] Figure 4 A schematic diagram of forming the first protective layer by a magnetron sputtering process;

[0027] Figure 5 A cross-sectional view of a heater provided in the present application in a specific embodiment;

[0028] Figure 6 is a cross-sectional view of another specific embodiment of the heater provided in the present application, wherein the protrusion is integrally formed with the base layer;

[0029] Figure 7 A cross-sectional view of a heater provided in the present application in yet another specific embodiment;

[0030] Figure 8 is a cross-sectional view of a heater provided in the present application in another specific embodiment, wherein the protrusion is integrally formed with the base layer;

[0031] Fig. 9 is a cross-sectional view of another specific embodiment of the heater provided in the present application, wherein the protrusion is integrally formed with the resistance layer;

[0032] Fig.10 is a cross-sectional view of another specific embodiment of the heater provided in the present application, wherein the protrusion and the resistance layer are integrally formed;

[0033] Fig.11 It is a cross-sectional view of another specific embodiment of the heater provided by the present application, wherein the protrusion is a heat conducting member;

[0034] Fig.12 It is a cross-sectional view of another specific embodiment of the heater provided by the present application, wherein the protrusion is a heat conducting member;

[0035] Fig.13 This is a schematic structural diagram of a liquid circulation pump system provided in the present application in a specific embodiment.

[0036] 1-basal layer;

[0037] 2- Heating layer;

[0038] 21-resistance layer;

[0039] 211-heating zone;

[0040] 212-connection area;

[0041] 213-1st paragraph;

[0042] 214-Second paragraph;

[0043] 215- third paragraph;

[0044] 216-4th paragraph;

[0045] 22-conductor layer;

[0046] 3- Protective layer;

[0047] 31- first protective layer;

[0048] 32- second protective layer;

[0049] 33- the third protective layer;

[0050] 34- inclined segment;

[0051] 35-straight section;

[0052] 4- raised part;

[0053] 5-heat conducting parts;

[0054] 6- cathode;

[0055] 7- target material;

[0056] 8- Radiator;

[0057] 81- ejector;

[0058] 9-feeding box;

[0059] 91-jet chip;

[0060] 92-installation part;

[0061] 93-Spray hole. DETAILED DESCRIPTION

[0062] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0063] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0064] It should be noted that the directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0065] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In a specific embodiment, the present application is further described in detail below through a specific embodiment and in conjunction with the accompanying drawings.

[0066] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of a thermal spray device provided in an embodiment of the present application in a specific embodiment. Figure 2 for Figure 1 The thermal jet device comprises a feed box 9, a jet chip 91, a mounting portion 92 and a heater, wherein the jet chip 91 is mounted on the feed box 9 through the mounting portion 92, and a plurality of nozzle holes 93 are provided on the jet chip 91. When the thermal jet device is working, the heater mounted on the jet chip 91 generates instantaneous high temperature, liquefies the liquid near the heater, generates bubbles, and ejects droplets through the nozzle holes 93, completing the printing.

[0067] In a specific embodiment, Figure 3 As shown, Figure 3The figure is a cross-sectional view of a heater of a thermal injection device in a specific embodiment. The heater generally includes a heating layer 2, a base layer 1 and a protective layer 3. Along the thickness direction of the heater, a resistor layer 21 is located between the base layer 1 and the protective layer 3. The protective layer 3 has a buffering and shock absorbing effect, which reduces the risk of liquid impact and erosion on the inside of the heater, and is beneficial to improving the life of the heater. Among them, the heating layer 2 includes a resistor layer 21 and a wire layer 22 connected to each other, and the wire layer 22 is used to be electrically connected to an external power source, so that the resistor layer 21 is powered by the wire layer 22, so that the resistor layer 21 heats up.

[0068] like Figure 3 In the illustrated embodiment, the wire layer 22 connected to the resistor layer 21 occupies the space of the heater in the thickness direction, so that a recessed portion is formed between the wire layers 22, that is, the heating layer 2 has a recessed portion that is recessed toward the substrate layer 1. Along the thickness direction of the heater, the protective layer 3 includes a first protective layer 31 for contacting with the liquid. The first protective layer 31 is most susceptible to erosion by the liquid, so the reliability of the first protective layer 31 directly determines the life of the heater.

[0069] In a specific embodiment, the first protective layer 31 can be formed by a magnetron sputtering process. Figure 4 As shown, Figure 4 The schematic diagram of the first protective layer 31 formed by the magnetron sputtering process is shown in FIG. The magnetron sputtering process mainly involves the collision of electrons with argon atoms in the process of flying toward the heating layer 2 under the action of an electric field, ionizing the electrons to generate argon ions and new electrons. The new electrons fly toward the heating layer 2, and the argon ions are accelerated to fly toward the cathode 6 under the action of the electric field, and bombard the surface of the target material 7 with high energy, causing the target material 7 to be sputtered. Among the sputtered particles, neutral target atoms or molecules are deposited on the heating layer 2 to form a thin film, which is the first protective layer 31.

[0070] Since the heating layer 2 has a recessed portion that is recessed toward the base layer 1, the first protective layer 31 also forms a recessed portion during the magnetron sputtering process, that is, the first protective layer 31 includes a straight section 35 and an inclined section 34. The first protective layer 31 formed by sputtering is thinner at the inclined section 34, causing the inclined section 34 to become a weak point of the first protective layer 31. The position where the inclined section 34 connects with the straight section 35 is often prone to cracks during molding. Under the mechanical impact and chemical corrosion of the working liquid, the cracks are prone to rapid expansion, increasing the risk of failure of the first protective layer 31, and further increasing the risk of failure of the heater, thereby reducing the life of the heater.

[0071] In order to solve this technical problem, the present application embodiment provides a heater, such as Figure 5 As shown, Figure 5This is a cross-sectional view of a heater provided in the present application in a specific embodiment. The heater comprises a base layer 1, a heating layer 2 and a protective layer 3, wherein the heating layer 2 is located on at least one side of the base layer 1 along the thickness direction of the heater. Along the thickness direction of the heater, the protective layer 3 is arranged on the side of the heating layer 2 away from the base layer 1. Among them, along the thickness direction of the heater, the protective layer 3 has a first end surface facing the base layer 1, and the first end surface is a plane.

[0072] In this embodiment, the protective layer 3 is a straight structure without an inclined section 34. During the magnetron sputtering forming process, the thickness of the straight structured protective layer 3 at each position is relatively uniform, thereby reducing the risk of cracks in the protective layer 3 due to the small thickness of the inclined section 34, thereby reducing the risk of liquid erosion of the protective layer 3, causing the protective layer 3 to fail, thereby reducing the risk of failure of the heating layer 2 located inside the protective layer 3, and increasing the life of the heater.

[0073] In a specific embodiment, the protective layer 3 may include a first protective layer 31, a second protective layer 32 and a third protective layer 33 stacked along the thickness direction of the heater, the third protective layer 33 is connected to the heating layer 2, the second protective layer 32 is located on the side of the third protective layer 33 away from the heating layer 2, and the first protective layer 31 is located on the side of the second protective layer 32 away from the third protective layer 33. The side of the first protective layer 31 away from the base layer 1 is in direct contact with the liquid. The material of the first protective layer 31 may be tantalum or tantalum oxide, which has good corrosion resistance and impact resistance, reducing the risk of damage to the first protective layer 31 caused by the impact of bubbles in the liquid after bursting, which is conducive to improving the reliability of the protective layer 3. The material of the second protective layer 32 may be silicon carbide, which has good corrosion resistance and high rigidity, further improving the corrosion resistance and impact resistance of the heater. The material of the third protective layer 33 may be silicon nitride, which has good high temperature resistance and high hardness, so that the third protective layer 33 has good protection effect and buffering capacity, which is conducive to improving the service life of the heater.

[0074] The first protective layer 31 , the second protective layer 32 and the third protective layer 33 can be formed in sequence by electroplating, rolling, etc. In addition, polishing and cleaning processes can be added before the first protective layer 31 , the second protective layer 32 and the third protective layer 33 are formed.

[0075] In a specific embodiment, the first end face of the protective layer 3 is the end face of the third protective layer 33 facing the heating layer 2. When the third protective layer 33 is a straight structure, the second protective layer 32 formed on the third protective layer 33 may also be a straight structure, and the first protective layer 31 formed on the second protective layer 32 may also be a straight structure. The first protective layer 31 may be formed by the magnetron sputtering process, and in the process of magnetron sputtering, the thickness of each position of the first protective layer 31 is made uniform, reducing the risk of cracks in the first protective layer 31 caused by the formation of a thinner inclined section 34 on the first protective layer 31, thereby increasing the service life of the heater.

[0076] In a specific embodiment, Figure 5 As shown, the heating layer 2 has a second end face connected to the first end face, and the second end face is a plane. That is, the end face of the heating layer 2 facing the protective layer 3 is the second end face. Since the second end face is a plane, the first end face connected thereto is also a plane, and the protective layer 3 is a straight structure, which is beneficial to improve the reliability of the protective layer 3 and thus improve the life of the heater.

[0077] The specific method of making the second end surface of the heating layer 2 a plane is described in detail below.

[0078] In a specific embodiment, Figure 5 As shown, the heating layer 2 includes a resistor layer 21 and a wire layer 22 connected to the resistor layer 21, the resistor layer 21 includes a heating area 211 and a connection area 212, and the resistor layer 21 and the wire layer 22 are connected in the connection area 212. Among them, the resistor layer 21 has at least two connection areas 212, and at least two connection areas 212 are located on both sides of the resistor layer 21 along the thickness direction of the heater. The heating layer 2 has at least two wire layers 22, and at least two wire layers 22 are respectively located on both sides of the heating area 211 of the resistor layer 21, and are respectively connected to the two connection areas 212. One of the two wire layers 22 is used to connect to the positive pole of the power supply, and the other is used to connect to the negative pole of the power supply. In addition, because the resistance of the resistor layer 21 located in the connection area 212 is larger than the resistance of the wire layer 22, the current flows to the heating area 211 through the wire layer 22 first, so that the resistance of the heating area 211 is heated.

[0079] The conductor layer 22 may be made of copper material, and the copper layer is formed into the conductor layer 22 through a series of processes such as exposure, development, and etching. The resistor layer 21 may be a thin film resistor, specifically, an aluminum-tantalum alloy material or a tungsten alloy material.

[0080] like Figure 5In the embodiment shown, the connection area 212 includes a first section 213 and a second section 214, the second section 214 connects the first section 213 and the heating area 211, along the thickness direction of the heater, the first section 213 is located between the wire layer 22 and the base layer 1, and the heating area 211 is connected to the protective layer 3, that is, the first section 213 and the heating area 211 in the resistance layer 21 are distributed along the thickness direction of the heater, so that the second section 214 connected to the two is inclined along the thickness direction of the heater, so that the heating area 211 and the second section 214 of the resistance layer 21 form a concave portion. At the same time, along the thickness direction perpendicular to the heater, the connection area 212 is located between the base layer 1 and the wire layer 22. The heater in this embodiment also includes a raised portion 4 located between the base layer 1 and the resistor layer 21, and the raised portion 4 fills the recessed portion of the resistor layer 21, so that the heating area 211 of the resistor layer 21 is supported by the raised portion 4, so that the end face of the wire layer 22 facing the protective layer 3 is flush with the end face of the connecting area 212 facing the protective layer 3, forming a second end face of the heating layer 2 for connecting to the protective layer 3, and making the second end face a plane, thereby making the first end face of the protective layer 3 connected to the second end face a plane, and the protective layer 3 formed on the second end face a straight structure, thereby improving the stability of the protective layer 3 and reducing the risk of failure caused by cracks in the protective layer 3 during the molding process and the heating process.

[0081] In a specific embodiment, Figure 5 In the illustrated embodiment, the raised portion 4 complements the contours of the heating area 211 and the second section 214 of the resistance layer 21, thereby filling the recessed portion of the resistance layer 21, improving the flatness of the second end face of the heating layer 2, thereby improving the flatness of the first end face of the protective layer 3, and further making the thickness of each position of the protective layer 3 uniform, thereby improving its reliability.

[0082] In a possible implementation, Figure 5 As shown, the material of the protrusion 4 can be silicon or silicon dioxide. Since silicon or silicon dioxide has good insulation properties and good stability and high temperature resistance, the risk of damage to the protrusion 4 caused by the high temperature generated by the resistance layer 21 can be reduced.

[0083] like Figure 5 In the embodiment shown, the base layer 1 is made of silicon material. At this time, the protrusion 4 is formed by oxidizing and etching the base layer 1, that is, the material of the protrusion 4 is silicon oxide.

[0084] The material of the protrusion 4 in this embodiment may also be other materials with good insulation performance and high temperature resistance. The present application does not limit the material of the protrusion 4.

[0085] In a possible implementation, Figure 5As shown, the cross section of the protrusion 4 may be trapezoidal, and the protrusion 4 of this shape is convenient for actual production and helps to improve production efficiency.

[0086] Of course, the cross section of the protrusion 4 can also be one of regular shapes such as a rectangle or a square, and the shape at least has a flat end face facing the protective layer 3 .

[0087] In another specific embodiment, Figure 6 As shown, Figure 6 This is a cross-sectional view of another specific embodiment of the heater provided in the present application. In this embodiment, the material of the protrusion 4 and the base layer 1 can be silicon material, and the protrusion 4 and the base layer 1 are integrally formed. The integral forming processing method is conducive to reducing the processing steps of the heater molding and is conducive to reducing the production cost.

[0088] The one-piece molding process may be to form the base layer 1 by laser or stamping to form a protruding portion 4 protruding toward the protective layer 3 .

[0089] Figure 6 The embodiment shown is similar to Figure 5 The embodiments shown are the same and will not be described again here.

[0090] In such Figure 7 In the embodiment shown, Figure 7 This is a cross-sectional view of another specific embodiment of the heater provided in the present application. In this embodiment, along the thickness direction of the heater, the wire layer 22 is located between the connection area 212 of the resistor layer 21 and the base layer 1. Since the wire layer 22 occupies a certain space along the thickness direction of the heater, the heating area 211 of the resistor layer 21 and the wire layer 22 form a recessed portion. The heater in this embodiment also includes a protrusion 4 located between the base layer 1 and the resistor layer 21, and the protrusion 4 fills the recessed portion surrounded by the wire layer 22, the heating zone 211 and the base layer 1, so that the heating zone 211 of the resistor layer 21 is supported by the protrusion 4, so that the end surface of the wire layer 22 facing the protective layer 3 is flush with the end surface of the protrusion 4 facing the protective layer 3, and the resistor layer 21 formed on the protrusion 4 and the wire layer 22 is a straight structure, that is, the end surface of the heating zone 211 facing the protective layer 3 is flush with the end surface of the connecting zone 212 facing the protective layer 3, forming a second end surface of the heating layer 2 for connecting with the protective layer 3, and making the second end surface a plane, thereby making the first end surface of the protective layer 3 connected to the second end surface a plane, and the protective layer 3 formed on the second end surface is a straight structure, thereby improving the stability of the protective layer 3 and reducing the risk of cracks in the protective layer 3 during the molding process and the heating process, resulting in failure.

[0091] In a specific embodiment, Figure 7In the illustrated embodiment, the conductor layer 22 is located at the periphery of the raised portion 4, and the raised portion 4 is complementary to the contour of the conductor layer 22, so that the raised portion 4 fills the recessed portion formed by the conductor layer 22 and the heating zone 211, thereby improving the flatness of the second end face of the heating layer 2, thereby improving the flatness of the first end face of the protective layer 3, further making the thickness of each position of the protective layer 3 uniform, and improving its reliability.

[0092] In a possible implementation, Figure 7 As shown, the material of the protrusion 4 can be silicon or silicon dioxide. Since silicon or silicon dioxide has good insulation properties and good stability and high temperature resistance, the risk of damage to the protrusion 4 caused by the high temperature generated by the resistance layer 21 can be reduced.

[0093] like Figure 7 In the embodiment shown, the base layer 1 is made of silicon material. At this time, the protrusion 4 is formed by oxidizing and etching the base layer 1, that is, the material of the protrusion 4 is silicon oxide.

[0094] The material of the protrusion 4 in this embodiment may also be other materials with good insulation performance and high temperature resistance. The present application does not limit the material of the protrusion 4.

[0095] In another specific embodiment, Figure 8 As shown, Figure 8 This is a cross-sectional view of another specific embodiment of the heater provided in the present application. In this embodiment, the material of the protrusion 4 and the base layer 1 can be silicon material, and the protrusion 4 and the base layer 1 are integrally formed. The integral forming processing method is conducive to reducing the processing steps of the heater molding and is conducive to reducing the production cost.

[0096] The one-piece molding process may be to form the base layer 1 by laser or stamping to form a protruding portion 4 protruding toward the protective layer 3 .

[0097] Figure 8 The embodiment shown is similar to Figure 7 The embodiments shown are the same and will not be described again here.

[0098] In another specific embodiment, Fig. 9 As shown, Fig. 9It is a cross-sectional view of the heater provided in the present application in another specific embodiment. Along the thickness direction of the heater, the wire layer 22 is located between the protective layer 3 and the connection area 212, and the wire layer 22 and the protective layer 3 form a recessed portion. The heater in this embodiment also includes a protrusion 4, which fills the recessed portion between the wire layer 22 and the protective layer 3, so that the protective layer 3 is supported by the protrusion 4, that is, the heating area 211 in this embodiment is raised relative to the connection area 212 along the thickness direction of the heater and toward the protective layer 3, forming the above-mentioned protrusion 4, so that the end face of the wire layer 22 facing the protective layer 3 is flush with the end face of the heating area 211 facing the protective layer 3, forming the second end face of the heating layer 2 for connecting with the protective layer 3, and making the second end face a plane, thereby making the first end face of the protective layer 3 connected to the second end face a plane, and the protective layer 3 formed on the second end face a straight structure, thereby improving the stability of the protective layer 3, and reducing the risk of cracks in the protective layer 3 during the molding process and the heating process, resulting in failure.

[0099] In a specific embodiment, Fig. 9 In the embodiment shown, the protrusion 4 is a part of the heating layer 2, and when the heating layer 2 is energized, the protrusion 4 can generate heat. At this time, the heating area 211 of the heating layer 2 has a larger thickness and generates a larger amount of heat, which can improve the efficiency of the heater.

[0100] In a possible implementation, Fig. 9 As shown, the cross section of the protrusion 4 may be trapezoidal, and the protrusion 4 of this shape is convenient for actual production and helps to improve production efficiency.

[0101] Of course, the cross section of the protrusion 4 can also be one of regular shapes such as a rectangle or a square, and the shape at least has a flat end face facing the protective layer 3 .

[0102] In another specific embodiment, Fig.10 As shown, Fig.10This is a cross-sectional view of the heater provided in the present application in another specific embodiment. Along the thickness direction of the heater, the connection area 212 is located between the wire layer 22 and the protective layer 3. Since the wire layer 22 occupies a certain space along the thickness direction of the heater, the wire layer 22 and the base layer 1 form a recessed portion. The heater in this embodiment also includes a raised portion 4, which fills the recessed portion surrounded by the wire layer 22 and the base layer 1, that is, the heating area 211 of the heating layer 2 is raised relative to the connection area 212 along the thickness direction of the heater and toward one side of the base layer 1, forming a raised portion 4, and the end face of the raised portion 4 facing away from the protective layer 3 is supported on the base layer 1. In this embodiment, the end face of the heating layer 2 facing away from the base layer 1 is the second end face for connecting to the protective layer 3, and the second end face is a plane, so that the first end face of the protective layer 3 connected to the second end face is a plane, and the protective layer 3 formed on the second end face is a straight structure, thereby improving the stability of the protective layer 3 and reducing the risk of failure caused by cracks in the protective layer 3 during the molding process and the heating process.

[0103] In a specific embodiment, Fig.10 In the illustrated embodiment, the heating area 211 of the resistor layer 21 is complementary to the contour of the conductor layer 22, thereby filling the recessed portion, improving the flatness of the second end face of the heating layer 2, thereby improving the flatness of the first end face of the protective layer 3, and further making the thickness of each position of the protective layer 3 uniform, thereby improving its reliability.

[0104] In a possible implementation, Fig.10 As shown, the protrusion 4 is integrally formed with the resistor layer 21. Therefore, it is beneficial to reduce the processing steps of separately forming the protrusion 4 and the resistor layer 21, and effectively improve the forming efficiency of the heater.

[0105] In a possible implementation, Fig.10 As shown, the cross section of the protrusion 4 may be trapezoidal, and the protrusion 4 of this shape is convenient for actual production and helps to improve production efficiency.

[0106] Of course, the cross section of the protrusion 4 can also be one of regular shapes such as a rectangle or a square, and the shape at least has a flat end face facing the protective layer 3 .

[0107] In another specific embodiment, Fig.11 As shown, Fig.11The cross-sectional view of the heater provided in the present application in another specific embodiment. The connection area 212 of the resistor layer 21 includes a third section 215 and a fourth section 216, and the fourth section 216 connects the third section 215 and the heating area 211. Along the thickness direction of the heater, the third section 215 is located between the wire layer 22 and the protective layer 3, and the heating area 211 is connected to the base layer 1, that is, the third section 215 and the heating area 211 in the resistor layer 21 are distributed along the thickness direction of the heater, so that the fourth section 216 connected to the two is inclined along the thickness direction of the heater, so that the heating area 211 and the fourth section 216 of the resistor layer 21 form a recessed portion. The heater in this embodiment also includes a heat conductive member 5 located between the base layer 1 and the resistor layer 21, and the heat conductive member 5 can fill the recessed portion surrounded by the heating area 211 and the fourth section 216. , and the end face of the heat conducting member 5 facing the protective layer 3 is flush with the end face of the third section 215 facing the protective layer 3, forming the second end face of the heating layer 2 for connecting with the protective layer 3, and the second end face is a plane, so that the first end face of the protective layer 3 connected with the second end face is a plane, and the protective layer 3 formed on the second end face is a straight structure, which improves the stability of the protective layer 3 and reduces the risk of cracks in the protective layer 3 during the molding process and the heating process, resulting in failure. At the same time, the heat conducting member 5 connects the heating area 211 of the resistance layer 21 and the protective layer 3, so that the heat of the resistance layer 21 can be transferred to the protective layer 3, so as to achieve the heating of the liquid on the protective layer 3.

[0108] In a specific embodiment, Fig.11 As shown, the heat conductor 5 complements the contours of the heating area 211 and the fourth section 216 of the resistance layer 21, thereby filling the recessed portion of the resistance layer 21, improving the flatness of the second end face of the heating layer 2, thereby improving the flatness of the first end face of the protective layer 3, and further making the thickness of each position of the protective layer 3 uniform, thereby improving its reliability.

[0109] In a possible implementation, Fig.11 As shown, the material of the heat conducting member 5 can be a material with good thermal conductivity and insulation properties such as alumina or ceramics. The present application does not limit the material of the heat conducting member 5.

[0110] In a possible implementation, Fig.11 As shown, the cross section of the heat conducting member 5 may be trapezoidal, and the heat conducting member 5 of this shape is convenient for actual production and helps to improve production efficiency.

[0111] Of course, the cross section of the heat conducting member 5 may also be one of regular shapes such as a rectangle or a square, and the shape at least has a flat end face facing the protective layer 3 .

[0112] In another specific embodiment, Fig.12 As shown, Fig.12It is a cross-sectional view of the heater provided in the present application in another specific embodiment. Along the thickness direction of the heater, the connection area 212 of the resistor layer 21 is located between the wire layer 22 and the base layer 1. Since the wire layer 22 occupies a certain space along the thickness direction of the heater, the heating area 211 of the resistor layer 21 and the wire layer 22 form a recess. The heater in this embodiment also includes a heat conductor 5 located between the protective layer 3 and the resistor layer 21. The heat conductor 5 fills the recess formed by the wire layer 22 and the heating area 211, and the end face of the heat conductor 5 facing the protective layer 3 is flush with the end face of the wire layer 22 facing the protective layer 3, forming a second end face of the heating layer 2 for connecting with the protective layer 3, and the second end face is a plane, thereby making the first end face of the protective layer 3 connected to the second end face a plane, and the protective layer 3 formed on the second end face a straight structure, thereby improving the stability of the protective layer 3 and reducing the risk of failure caused by cracks in the protective layer 3 during the molding process and the heating process. At the same time, the heat conducting member 5 connects the heating area 211 of the resistance layer 21 and the protective layer 3 , so that the heat of the resistance layer 21 can be conducted to the protective layer 3 , thereby heating the liquid on the protective layer 3 .

[0113] In a specific embodiment, Fig.12 In the illustrated embodiment, the heat conductor 5 complements the contours of the heating area 211 of the resistance layer 21 and the wire layer 22, thereby filling the recessed portion formed by the wire layer 22 and the heating area 211, improving the flatness of the second end face of the heating layer 2, thereby improving the flatness of the first end face of the protective layer 3, further making the thickness of each position of the protective layer 3 uniform, and improving its reliability.

[0114] In a specific embodiment, Fig.12 As shown, the resistance layer 21 in this embodiment is a flat structure, thereby simplifying the structure of the resistance layer 21 and reducing its processing difficulty.

[0115] In a possible implementation, Fig.12 As shown, the material of the heat conducting member 5 can be a material with good thermal conductivity and insulation properties such as alumina or ceramics. The present application does not limit the material of the heat conducting member 5.

[0116] The heaters in the above examples can be used in graphic printing systems, such as Figure 1 Shown and Figure 2 As shown, the graphic printing system may include a feed box 9 and an injection chip 91, wherein the injection chip 91 is mounted on the feed box 9 via a mounting portion 92, wherein a plurality of nozzles 93 are provided on the injection chip 91, and a heater is located in a chamber directly below the nozzles 93, thereby completing printing by spraying ink outwards through a plurality of heaters.

[0117] The heaters in the above examples can also be used in liquid circulation pump systems, such as Fig.13As shown, the liquid circulation pump system may include a radiator 8 (or other components) and an ejector 81, which are connected by a pipeline. The ejector 81 includes a heater in any of the above examples.

[0118] Of course, the heater in the embodiment of the present application can also be applied to other fields, and the present application does not limit the application field of the heater.

Claims

1. A heater, characterized in that: The heater comprises: Basal layer; a heating layer, the heating layer being located on at least one side of the base layer along a thickness direction of the heater; A protective layer, along the thickness direction of the heater, the protective layer is arranged on a side of the heating layer away from the base layer; Wherein, along the thickness direction of the heater, the protective layer has a first end surface facing the base layer, and the first end surface is a plane.

2. The heater according to claim 1, characterized in that The heating layer has a second end surface connected to the first end surface, and the second end surface is a plane.

3. The heater according to claim 2, characterized in that The heating layer comprises a resistance layer and a wire layer connected to the resistance layer, the resistance layer comprises a heating area and a connection area, and the resistance layer and the wire layer are connected in the connection area; The heating layer further includes a protrusion, and the wire layer is located at the periphery of the protrusion, so that the second end surface is a plane.

4. The heater according to claim 3, characterized in that The heating layer has a concave portion, and the convex portion fills the concave portion so that the second end surface is a plane.

5. The heater according to claim 3, characterized in that The conductor layer and the protrusion are connected along the circumferential direction of the heater, and their profiles are complementary. The protrusion is flush with an end surface of the conductor layer on a side facing away from the base layer.

6. The heater according to claim 3, characterized in that The connecting area includes a first section and a second section, the second section connects the heating area and the first section, along the thickness direction of the heater, the first section is located between the base layer and the wire layer, along the circumference of the heater, the second section is located between the protrusion and the wire layer, the end surfaces of the heating area and the wire layer facing away from the base layer are flush, and the protective layer is arranged on the end surfaces of the heating area and the wire layer facing away from the base layer.

7. The heater according to any one of claims 3 to 6, characterized in that: The material of the protrusion is silicon or silicon dioxide.

8. The heater according to any one of claims 3 to 6, characterized in that: The protrusion is integrally formed with the base layer.

9. The heater according to claim 3, characterized in that The heater further comprises a heat conducting member, the protrusion is the heat conducting member, and the heat conducting member connects the heating area and the protective layer.

10. The heater according to any one of claims 4 to 6 and 9, characterized in that: The cross section of the protrusion is trapezoidal.

11. The heater according to any one of claims 1 to 6 and 9, characterized in that: The protective layer comprises a first protective layer, a second protective layer and a third protective layer stacked along the thickness direction of the heater, the third protective layer is connected to the heating layer, the second protective layer is located on a side of the third protective layer away from the heating layer, and the first protective layer is located on a side of the second protective layer away from the third protective layer; The material of the first protective layer is tantalum or tantalum oxide, the material of the second protective layer is silicon carbide, and the material of the third protective layer is silicon nitride.

12. A thermal spray device, characterized in that The thermal spray device comprises: Feed box; Injection chip; A heater, wherein the heater is the heater according to any one of claims 1 to 11; Wherein, the heater is installed on the injection chip, and the injection chip is connected to the feed box.

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