Wafer packaging box

Abstract

The utility model belongs to the technical field of wafer packaging, and particularly relates to a wafer packaging box which comprises an outer shell, an inner box is arranged in the outer shell, a taking-out opening is formed in the surface of the outer shell, the inner wall of the outer shell is fixedly connected with an installation plate and a buckle respectively, and the surface of the installation plate is fixedly connected with a positioning ball. A storage box and reinforcing ribs are fixedly connected to the inner wall of the inner box, limiting plates are fixedly connected to the surfaces of the reinforcing ribs, and positioning holes and mounting holes are formed in the surfaces of the reinforcing ribs. According to the wafer packaging box, the outer shell is arranged to be matched with the inner box, the outer shell and the inner box slide to enable the taking-out opening to move to the position above the corresponding storage box, the wafer is taken out, the outer shell and the inner box are connected with the mounting holes in a clamped mode through the buckles, and the positioning balls are matched with the positioning holes, so that the situation that the wafer in the storage box is polluted due to movement in the transportation process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip packaging box. Background Art

[0002] In the process of integrated circuit manufacturing, the entire chip manufacturing process is usually completed by multiple process machines. Therefore, the wafers need to be transported to different process machines for processing or testing. During the transportation process, if the wafers are not protected or isolated, the particles in the air will settle on the surface of the wafers, causing wafer contamination, thereby reducing the yield of the wafers. Therefore, boxes are needed to carry and transport wafers to ensure safe storage and handling of the wafers to avoid damage and contamination;

[0003] The packaging box currently used generally consists of a base, which is generally made of plastic. The base is square, and groove structures are arranged on both sides. The groove structures are provided with bumps, and the bumps are regularly distributed on the groove surfaces. The wafers are often placed between the bumps and are stuck by the bumps. However, during transportation, due to the loose structure, the wafers are often stained with dust and are easily damaged. Utility Model Content

[0004] Based on the existing technical problem that wafers may be contaminated with dust and easily damaged during transportation, the utility model provides a wafer packaging box.

[0005] The utility model provides a wafer packaging box, comprising an outer shell, an inner box is arranged inside the outer shell, a take-out port is opened on the surface of the outer shell, a mounting plate and a buckle are fixedly connected to the inner wall of the outer shell, and a positioning bead is fixedly connected to the surface of the mounting plate;

[0006] The inner walls of the inner box are respectively fixedly connected with a storage box and a reinforcing rib, the surface of the reinforcing rib is fixedly connected with a limiting plate, and the surface of the reinforcing rib is respectively provided with a positioning hole and a mounting hole.

[0007] Preferably, the plurality of storage boxes are distributed in a circular array with the axis of the inner box as the center, the reinforcing rib is located between two adjacent storage boxes, and the positioning hole is located on the outer side of the limiting plate.

[0008] Preferably, the two buckles are symmetrically distributed with the axis of the shell as the center, and the plurality of positioning beads are distributed in a circular array with the axis of the shell as the center.

[0009] Preferably, the position of the taking-out port matches the position of the storage box, and the inner wall of the outer shell is slidably connected to the surface of the inner box.

[0010] Preferably, the surface of the buckle is snapped into engagement with the inner wall of the mounting hole, the surface of the mounting plate is slidably connected to the surface of the limiting plate, the surface of the positioning bead is slidably connected to the surface of the reinforcing rib, and the positioning bead is adapted to the positioning hole.

[0011] Preferably, the surface of the outer shell is provided with anti-slip grooves, the outer shell and the inner box are both made of transparent materials, and the outer shell and the inner box are both round.

[0012] The beneficial effects of the utility model are:

[0013] By setting the outer shell and the inner box to match, the outer shell and the inner box slide to move the removal port to the top of the corresponding storage box, and take out the wafer. The outer shell and the inner box are connected with the mounting hole through the buckle, and the positioning beads are matched with the positioning holes to avoid contamination of the wafers in the storage box caused by movement during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of a wafer packaging box proposed by the utility model;

[0015] Figure 2 This is a three-dimensional diagram of the limiting plate structure of a wafer packaging box proposed by the utility model;

[0016] Figure 3 This is a three-dimensional diagram of the reinforcing rib structure of a wafer packaging box proposed by the utility model;

[0017] Figure 4 This is a three-dimensional diagram of the buckle structure of a wafer packaging box proposed by the utility model.

[0018] In the figure: 1. outer shell; 2. inner box; 3. removal port; 4. mounting plate; 5. buckle; 6. positioning bead; 7. storage box; 8. reinforcing rib; 9. limit plate; 10. positioning hole; 11. mounting hole. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] Reference Figure 1-Figure 4 A wafer packaging box comprises an outer shell 1, an inner box 2 is arranged inside the outer shell 1, a take-out port 3 is opened on the surface of the outer shell 1, a mounting plate 4 and a buckle 5 are fixedly connected to the inner wall of the outer shell 1, and a positioning bead 6 is fixedly connected to the surface of the mounting plate 4;

[0021] The inner wall of the inner box 2 is fixedly connected with a storage box 7 and a reinforcing rib 8, and the surface of the reinforcing rib 8 is fixedly connected with a limiting plate 9. The surface of the reinforcing rib 8 is provided with a positioning hole 10 and a mounting hole 11.

[0022] The plurality of storage boxes 7 are distributed in a circular array with the axis of the inner box 2 as the center, the reinforcing rib 8 is located between two adjacent storage boxes 7 , and the positioning hole 10 is located on the outer side of the limiting plate 9 .

[0023] Furthermore, a plurality of reinforcing ribs 8 strengthen the structural strength of the inner box 2 .

[0024] The two buckles 5 are symmetrically distributed with the axis of the housing 1 as the center, and the plurality of positioning beads 6 are distributed in a circular array with the axis of the housing 1 as the center.

[0025] Furthermore, positioning beads 6 are arranged on the surface of the mounting plate 4 .

[0026] The position of the taking-out port 3 matches the position of the storage box 7 , and the inner wall of the outer shell 1 is slidably connected to the surface of the inner box 2 .

[0027] Furthermore, the housing 1 is rotated to move the take-out port 3 to above the corresponding storage box 7 to take out the wafer.

[0028] The surface of the buckle 5 is snapped with the inner wall of the mounting hole 11 , the surface of the mounting plate 4 is slidably connected with the surface of the limiting plate 9 , the surface of the positioning bead 6 is slidably connected with the surface of the reinforcing rib 8 , and the positioning bead 6 is adapted to the positioning hole 10 .

[0029] Furthermore, the buckle 5 restricts the outer shell 1 and the inner box 2 from being separated, and the positioning beads 6 restrict the outer shell 1 and the inner box 2 from shaking.

[0030] The surface of the outer shell 1 is provided with anti-slip grooves. The outer shell 1 and the inner box 2 are both made of transparent materials. The outer shell 1 and the inner box 2 are both round.

[0031] Furthermore, the anti-slip pattern facilitates sliding of the housing 1, and the transparent material facilitates observation of the position of the chip.

[0032] By setting the outer shell 1 to match the inner box 2, the outer shell 1 and the inner box 2 slide to move the removal port 3 to the top of the corresponding storage box 7, and take out the wafer. The outer shell 1 and the inner box 2 are snapped into the mounting hole 11 through the buckle 5, and the positioning bead 6 is matched with the positioning hole 10 to prevent the wafer in the storage box 7 from being contaminated by movement during transportation.

[0033] Working principle:

[0034] Before use, the wafer is placed in the corresponding storage box 7, the outer shell 1 covers the inner box 2 from above, the buckle 5 is inserted into the mounting hole 11, and after being snapped into place, the bottom of the inner box 2 is held, the outer shell 1 and the inner box 2 are rotated in opposite directions, and the removal port 3 passes over the top of multiple storage boxes 7 in turn, and the wafers in the corresponding storage boxes 7 can be taken out, the positioning beads 6 are matched with the positioning holes 10, and the positioning removal port 3 is moved to the top of the storage box 7, and the buckle 5 is connected with the mounting hole 11, which is convenient for disassembly and assembly and not easy to fall off.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer packaging box, comprising a housing (1), characterized in that: An inner box (2) is arranged inside the outer shell (1), a removal port (3) is provided on the surface of the outer shell (1), a mounting plate (4) and a buckle (5) are fixedly connected to the inner wall of the outer shell (1), and a positioning bead (6) is fixedly connected to the surface of the mounting plate (4); The inner wall of the inner box (2) is respectively fixedly connected with a storage box (7) and a reinforcing rib (8); the surface of the reinforcing rib (8) is fixedly connected with a limiting plate (9); and the surface of the reinforcing rib (8) is respectively provided with a positioning hole (10) and a mounting hole (11).

2. A wafer packaging box according to claim 1, characterized in that: The plurality of storage boxes (7) are distributed in a circular array with the axis of the inner box (2) as the center, the reinforcing rib (8) is located between two adjacent storage boxes (7), and the positioning hole (10) is located on the outside of the limiting plate (9).

3. A wafer packaging box according to claim 1, characterized in that: The two buckles (5) are symmetrically distributed with the axis of the housing (1) as the center, and the plurality of positioning beads (6) are distributed in a circular array with the axis of the housing (1) as the center.

4. A wafer packaging box according to claim 1, characterized in that: The position of the taking-out port (3) matches the position of the storage box (7), and the inner wall of the outer shell (1) is slidably connected to the surface of the inner box (2).

5. The wafer packaging box according to claim 1, characterized in that: The surface of the buckle (5) is snap-fitted to the inner wall of the mounting hole (11), the surface of the mounting plate (4) is slidably connected to the surface of the limiting plate (9), the surface of the positioning bead (6) is slidably connected to the surface of the reinforcing rib (8), and the positioning bead (6) is adapted to the positioning hole (10).

6. A wafer packaging box according to claim 1, characterized in that: The surface of the outer shell (1) is provided with anti-slip grooves; the outer shell (1) and the inner box (2) are both made of transparent materials; and the outer shell (1) and the inner box (2) are both circular.

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