High-temperature-resistant paper card based on interface enhancement process
Through the interface enhancement process and multi -layer paper structure, combined with the use of high temperature sticky glue and resin, the problem of poor high temperature resistance of paper cards is solved, and higher temperature resistance and practicality are achieved.
Patent Information
- Application Number
- CN202421089605.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-20
AI Technical Summary
Most paper cards have poor high temperature resistance and are susceptible to deformation or damage caused by high temperatures.
Through the interface enhancement process, high temperature -resistant synthetic paper, ceramic limit paper and silicate heat thermal insulation paper are adopted, and adhesion and protection are adhesive and protected through high temperature sticky glue and resin, and finally suppressed the molding through the hydraulic machine.
It significantly improves the high temperature resistance of paper cards, enhances its surface waterproof and oil -proof performance, as well as the insulation function at the bottom, thereby improving practicality.
Smart Images
Figure CN222412445U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of paper card accessory devices, in particular to a high temperature resistant paper card based on an interface enhancement process. Background Art
[0002] As we all know, paper cards are a new type of environmentally friendly paper cards, which are gradually replacing PVC material cards. They are mostly used in fast-moving consumer goods and cultural and entertainment industries, such as games, audio-visual, etc. Its low cost and simple production advantages are widely accepted and used by all sectors of society. Paper cards can be made of imported coated paper with various thicknesses such as 250g, 300g, 350g, 400g, and 450g. It has the characteristics of low cost, strong confidentiality, environmental protection and energy saving. Paper cards use double-sided coated paper with a printing gloss of up to 95%. The front and back of the card body are made of varnish or lamination technology to protect the printed surface images.
[0003] However, most paper cards have poor high temperature resistance. During the use of paper cards, they are easily deformed or damaged by high temperatures. Utility Model Content
[0004] In order to solve the above technical problems, the utility model provides a high temperature resistant card made by an interface enhancement process, thereby solving the problem of poor high temperature resistance, and thus enhancing the practicality of a high temperature resistant paper card based on an interface enhancement process.
[0005] The utility model discloses a high temperature resistant paper card based on an interface enhancement process. The paper card body comprises high temperature resistant synthetic paper, ceramic limiting paper and aluminum silicate thermal insulation paper. The top end of the high temperature resistant synthetic paper is bonded to the ceramic limiting paper by a high temperature resistant adhesive, and the bottom end of the high temperature resistant synthetic paper is bonded to the aluminum silicate thermal insulation paper by a high temperature resistant adhesive.
[0006] Preferably, the surface of the high temperature resistant synthetic paper is coated with an interface enhancer.
[0007] Preferably, the top and bottom of the high temperature resistant synthetic paper, ceramic limiting paper, and aluminum silicate insulation paper are coated with high temperature resistant resin.
[0008] Preferably, the high temperature resistant adhesive is ZS-1071 high temperature resistant inorganic adhesive.
[0009] Preferably, the surface dye of the ceramic limiting paper and the aluminum silicate insulation paper is a special high temperature resistant ink.
[0010] Preferably, a polyimide film is provided on the top of the ceramic limiting paper and the bottom of the aluminum silicate insulation paper respectively.
[0011] Preferably, the paper card body is press-formed.
[0012] Compared with the prior art, the beneficial effects of the utility model are as follows: when making paper cards, an interface enhancer is first applied to the high-temperature resistant synthetic paper, and then the ceramic limiting paper and the aluminum silicate thermal insulation paper are respectively adhered to the high-temperature resistant synthetic paper through high-temperature resistant adhesive, and then pressed and formed by a hydraulic press, so as to enhance the strength of the high-temperature resistant synthetic paper base layer through the interface enhancer, and enhance the waterproof and oil-proof properties of the upper surface of the paper card and the thermal insulation function of the bottom through the ceramic limiting paper and the aluminum silicate thermal insulation paper, thereby enhancing the practicality. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the connection structure of the utility model;
[0014] Figure 2 It is a schematic diagram of the paper card explosion structure of the utility model;
[0015] Markings in the attached drawings: 1. high temperature resistant synthetic paper; 2. ceramic fiber paper; 3. aluminum silicate insulation paper; 4. polyimide (PI) film; 30. paper card body. DETAILED DESCRIPTION
[0016] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0017] like Figure 1 to Figure 2 As shown, the utility model is a high temperature resistant paper card based on the interface enhancement process, including a high temperature resistant synthetic paper 1, a ceramic limiting paper 2 and an aluminum silicate thermal insulation paper 3, the top of the high temperature resistant synthetic paper 1 is bonded to the ceramic limiting paper 2 by a high temperature resistant adhesive, and the bottom of the high temperature resistant synthetic paper 1 is bonded to the aluminum silicate thermal insulation paper 3 by a high temperature resistant adhesive; when making the paper card, the interface enhancer is first applied to the high temperature resistant synthetic paper, and then the ceramic limiting paper and the aluminum silicate thermal insulation paper are respectively attached to the high temperature resistant synthetic paper by the high temperature resistant adhesive, and then the paper card is pressed and formed by a hydraulic press, so that the strength of the base layer of the high temperature resistant synthetic paper is enhanced by the interface enhancer, and the waterproof and oil-proof properties of the upper surface of the paper card and the thermal insulation function of the bottom are respectively enhanced by the ceramic limiting paper and the aluminum silicate thermal insulation paper, thereby enhancing the practicality.
[0018] As a preferred embodiment of the above embodiment, the surface of the high temperature resistant synthetic paper 1 is coated with an interface enhancer; the interface enhancer has the function of enhancing the base strength, stability and durability of the paper card.
[0019] As a preferred embodiment of the above embodiment, the top and bottom of the high temperature resistant synthetic paper 1, the ceramic limiting paper 2, and the aluminum silicate insulation paper 3 are coated with high temperature resistant resin; the high temperature resistant resin can form a protective layer to enhance its heat and moisture resistance.
[0020] As a preferred embodiment of the above embodiment, the high temperature resistant adhesive is ZS-1071 high temperature resistant inorganic adhesive; ZS-1071 high temperature resistant inorganic adhesive can form a good protective coating on a high temperature substrate of 400-1000°C, and has excellent density and thermal shock resistance.
[0021] As a preferred embodiment of the above embodiment, the surface dye of the ceramic limiting paper 2 and the aluminum silicate insulation paper 3 is a special high-temperature resistant ink; it is an ink specially designed for high-temperature applications, such as silicone or inorganic silicone high-temperature resistant ink, which can withstand temperatures of 200-1200°C respectively and are suitable for printing needs in various high-temperature environments.
[0022] As a preferred embodiment of the above embodiment, a polyimide film 4 is provided on the top of the ceramic limiting paper 2 and the bottom of the aluminum silicate insulation paper 3 respectively; the PI film can withstand high temperatures and maintain good dimensional stability and mechanical properties.
[0023] As a preferred embodiment of the above embodiment, the high temperature resistant synthetic paper 1 is formed by pressing, so that the various groups of materials of the paper card can be closely attached together.
[0024] The utility model discloses a high temperature resistant paper card based on an interface enhancement process, and its working principle is as follows: when the paper card is working, an interface enhancer is firstly applied on the high temperature resistant synthetic paper, and then a high temperature resistant resin is respectively applied on three groups of papers, and then the ceramic limiting paper and the aluminum silicate thermal insulation paper are respectively attached to the high temperature resistant synthetic paper through a high temperature resistant adhesive, and then the paper card is pressed and formed by a hydraulic press, so as to enhance the strength of the base layer of the high temperature resistant synthetic paper through the interface enhancer, and enhance the waterproof and oil-proof performance of the upper surface of the paper card and the thermal insulation function of the bottom through the ceramic limiting paper and the aluminum silicate thermal insulation paper, and finally the polyimide film is respectively attached to the top of the ceramic limiting paper and the bottom of the aluminum silicate thermal insulation paper through the lamination technology, and then the paper card can be used.
[0025] The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
[0026] The “first”, “second” and “third” mentioned in the present invention do not represent specific quantities and orders, but are merely used to distinguish names.
[0027] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A high temperature resistant paper card based on interface enhancement technology, characterized in that: The paper card body (30) comprises high temperature resistant synthetic paper (1), ceramic limiting paper (2) and aluminum silicate thermal insulation paper (3); the top end of the high temperature resistant synthetic paper (1) is bonded to the ceramic limiting paper (2) via high temperature resistant adhesive, and the bottom end of the high temperature resistant synthetic paper (1) is bonded to the aluminum silicate thermal insulation paper (3) via high temperature resistant adhesive.
2. A high temperature resistant paper card based on interface enhancement technology as claimed in claim 1, characterized in that: An interface enhancer is applied to the surface of the high temperature resistant synthetic paper (1).
3. A high temperature resistant paper card based on interface enhancement process as claimed in claim 2, characterized in that: The top and bottom of the high-temperature resistant synthetic paper (1), the ceramic limiting paper (2), and the aluminum silicate thermal insulation paper (3) are coated with high-temperature resistant resin.
4. A high temperature resistant paper card based on interface enhancement technology as claimed in claim 1, characterized in that: The high temperature resistant adhesive is ZS-1071 high temperature resistant inorganic adhesive.
5. A high temperature resistant paper card based on interface enhancement process as claimed in claim 4, characterized in that: The surface dyes of the ceramic limiting paper (2) and the aluminum silicate thermal insulation paper (3) are special high temperature resistant inks.
6. A high temperature resistant paper card based on interface enhancement process as claimed in claim 5, characterized in that: The top of the ceramic limiting paper (2) and the bottom of the aluminum silicate thermal insulation paper (3) are respectively provided with a polyimide film (4).
7. A high temperature resistant paper card based on interface enhancement technology as claimed in claim 6, characterized in that: The paper card body (30) is formed by pressing.