Fan module structure for improving wind flow benefit

Abstract

The utility model relates to a fan module structure capable of improving wind flow benefit, which comprises an electronic device, a fan module, a fan module and a fan module, wherein the electronic device comprises a circuit board which is provided with an electronic composition device; the at least one radiating fin group is assembled on the electronic composition device; the plurality of heat dissipation fan modules are arranged on the heat dissipation fin group; the fan shell is arranged on the periphery of the cooling fan modules, the fan shell is provided with frame edges on the periphery and a plurality of fan containing spaces in the frame edges, each fan containing space comprises an inner frame part, a circulation opening channel is formed between every two adjacent inner frame parts, and the two sides of each circulation opening channel are respectively provided with a frame end connecting part; therefore, through the optimization design of the configuration of the fan shell between the two adjacent fan bodies, the flow field of the fan can be optimized, the air pressure and the air volume of the fan can be improved, and meanwhile, through the design of the flow channel of the fan shell between the two adjacent fan bodies, the noise can be greatly reduced, and the heat dissipation efficiency and the quiet feeling in use can be greatly improved.

Description

Technical Field

[0001] The utility model relates to a fan module structure, and in particular to a fan module structure which optimizes the frame structure of a fan, can increase the wind pressure and air volume of the fan and reduce the noise, and provides a practical fan module structure for improving the wind flow efficiency. Background Art

[0002] The electronic components in electronic products are gradually becoming more functionally centralized and powerful. For example, the display adapter device is designed to meet the needs of higher-level graphics functions, e-sports games, AI functions, etc., which will generate more heat when the display adapter device (or other electronic components) is in operation. If this heat cannot be removed in time, it will lead to problems with the stability of the performance and shortened life of the electronic products. Therefore, in order to maintain the operating temperature of such electronic components within an appropriate range, effective heat dissipation technology is critical. Therefore, using heat dissipation devices to effectively dissipate heat from electronic components and electronic components has become a normal focus of the industry.

[0003] Related fan module heat dissipation technologies are known, such as Figure 1 As shown, a fan module for heat dissipation of a display adapter device (or other electronic component devices), the heat dissipation fan module 90 includes a circuit board 91, the circuit board 91 is provided with an electronic component device 92 related to the display adapter, the electronic component device 92 is provided with a heat dissipation fin device 93 and cooperates with a plurality of fan modules 94 to perform forced heat dissipation, so that the heat source (such as a processor, chip, etc.) of the electronic component device 92 completes the heat dissipation operation; the fan module 94 is arranged in a fan housing 95, the fan housing 95 has a plurality of fan frame seats 961, which are used to respectively accommodate the plurality of fan modules 94, and a middle partition frame 962 is provided between two adjacent fan frame seats 961, which is used to separate the two fan frame seats 961. The conventional heat dissipation fan module 90 technology is fixedly arranged on the heat dissipation fin device 93 to be forced to dissipate heat, and the fan module 94 sends airflow to the heat dissipation fin device 93 through a fan to achieve the effect of forced heat dissipation.

[0004] Although the aforementioned fan module heat dissipation technology can achieve the effect of sending out airflow and forced heat dissipation, it still has its shortcomings. For example, the two adjacent fan frame seats 961 are disconnected by the middle partition frame 962 and are not connected, so that the two fan modules 94 do not have a complementary function, so the wind pressure and air volume of the fan module 94 cannot be increased, and the noise cannot be effectively reduced. As a result, the overall heat dissipation effect is still limited, especially for the current display adapter device (or other electronic components, electronic component devices) and other functions The heat generation is becoming more and more powerful, it is increasingly difficult to meet the heat dissipation requirements of actual operation, and it is indeed necessary to make further improvements and breakthroughs.

[0005] Therefore, the creator of this case has learned about the shortcomings of the fan module technology and the fact that its structural design is not ideal, so he started to develop a solution, especially optimizing the fan frame structure, hoping to develop a fan module structure with better airflow efficiency to serve the public and promote the development of this industry. After a long period of thinking, the present utility model was created. And through this shape, the fan can increase the wind pressure and air volume and greatly reduce the noise after assembly. Utility Model Content

[0006] The purpose of the utility model is to provide a fan module structure for improving wind flow efficiency. The fan module structure can optimize the fan housing configuration between two adjacent fan bodies and remove the partition / retaining wall between the two adjacent fan bodies, so as to optimize the fan flow field and improve the wind pressure and air volume. At the same time, the fan housing flow channel design between the two adjacent fan bodies can greatly reduce noise, thereby greatly improving the heat dissipation efficiency and the quietness of use.

[0007] In order to achieve the technical means adopted for the above-mentioned purpose, the utility model provides a fan module structure for improving wind flow efficiency, including: a plurality of heat dissipation fan modules, the heat dissipation fan module including a fan hub, the fan hub having a plurality of blades around it; a fan housing, arranged around the plurality of heat dissipation fan modules, the fan housing having a frame edge around it and a plurality of fan accommodating spaces inside the frame edge, the fan accommodating space including an inner frame portion, and a flow opening is provided between two adjacent inner frame portions, and a frame terminal portion is provided on both sides of the flow opening.

[0008] In this embodiment, the two adjacent inner frame parts are connected to form the two frame end connecting parts, and the lower part of the frame end connecting part is a frame end bottom inclined surface inclined inward.

[0009] In this embodiment, a frame end substrate portion is connected to the lower portion of the two frame end bottom inclined surfaces, and the upper portion of the frame end substrate portion is used to form the flow channel.

[0010] In this embodiment, there is no partition / retaining wall between the adjacent inner frame parts, so that the flow channel is presented.

[0011] In this embodiment, it further includes at least one heat dissipation fin group, and the heat dissipation fan module is arranged on the heat dissipation fin group.

[0012] In this embodiment, it further includes an electronic device, which includes a circuit board. The circuit board is provided with an electronic component device. The heat sink fin group is provided on the electronic component device, and the electronic component device is a display adapter device.

[0013] In this embodiment, a positioning frame set is further disposed on the heat dissipation fin set. The positioning frame set includes a structure composed of a plurality of longitudinal and transverse positioning plates for supporting and positioning the plurality of heat dissipation fan modules.

[0014] The advantages of the present invention are that the position below the flow channel can increase the wind pressure and air volume of the cooling fan module when it rotates, which is helpful for the cooling effect / efficiency and has the advantage of reducing the noise of the rotating operation of the cooling fan module.

[0015] In order to enable a further understanding and recognition of the technical features and effects achieved by the utility model, a preferred embodiment diagram and a detailed description are provided as follows: BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional exploded schematic diagram of a conventional fan module heat dissipation technology.

[0017] Figure 2 It is a three-dimensional combination schematic diagram of the utility model.

[0018] Figure 3 It is a three-dimensional exploded schematic diagram of the utility model.

[0019] Figure 4 This is a schematic diagram of the application of the fan housing of the utility model.

[0020] Figure 5 for Figure 4 A partial enlarged schematic diagram of .

[0021] Figure 6 It is a schematic diagram of the fan flow field operation of the utility model.

[0022] Explanation of the reference numerals: electronic device 10; circuit board 11; electronic component device 12; heat sink fin device 20; heat sink fin assembly 21; positioning frame assembly 22; fan device 30; heat sink fan module 31; fan hub 311; blades 312; fan housing 40; frame edge 41; fan accommodating space 42; inner frame portion 421; flow channel 422; frame terminal portion 423; frame end substrate portion 424; frame end bottom inclined surface 425. DETAILED DESCRIPTION

[0023] See also Figures 2 to 5 , which is used to illustrate an embodiment of the fan module structure of the utility model for improving airflow efficiency. The fan device disclosed in the utility model includes an electronic device 10, a heat dissipation fin device 20, a fan device 30 and a fan housing 40.

[0024] The electronic device 10 may be a display adapter device or other electronic component device. The electronic device 10 includes a circuit board 11, on which a display adapter or other electronic component-related electronic component device 12 is disposed. The heat sink fin device 20 includes at least one heat sink fin group 21. The heat sink fin group 21 (heat sink fin device 20) is disposed on the electronic component device 12, mainly to enable the heat source of the electronic component device 12 (such as a processor, chip, etc.) to obtain sufficient heat dissipation. The heat sink fin group 21 is a combination of a plurality of heat sink fins arranged with a gap distance, so that a heat dissipation channel is formed between adjacent heat sink fins. In this embodiment, the heat sink fin device 20 is composed of two heat sink fin groups 21 (see Figure 3 ), but the number of each heat dissipation fin assembly 21 is not limited, and as shown in the figure, the heat dissipation fin assembly 20 can also be provided with a plurality of heat pipes (not numbered) vertically penetrating therethrough. Furthermore, the heat dissipation fin assembly 20 is further provided with a positioning frame assembly 22, which includes a structure composed of a plurality of vertical and horizontal positioning plates for supporting and positioning the fan assembly 30.

[0025] The fan device 30 includes a plurality of cooling fan modules 31, which are disposed on the cooling fin assembly 21 (cooling fin device 20) and are fixed in place by the positioning frame assembly 22. The cooling fan module 31 includes a fan hub 311, and the fan hub 311 has a plurality of blades 312 around it. In this embodiment, the fan device 30 discloses three cooling fan modules 31, and the rotation relationship between adjacent cooling fan modules 31 is not set or restricted.

[0026] The fan housing 40 is arranged at the periphery of the fan device 30. The fan housing 40 has a frame edge 41 on all sides and a plurality of fan accommodating spaces 42 inside the frame edge 41. The frame edge 41 on all sides is used to maintain the plurality of heat dissipation fan modules 31. Furthermore, the fan accommodating space 42 includes an inner frame portion 421, and a flow passage 422 is provided between two adjacent inner frame portions 421. That is, the flow passage 422 and the frame terminal connection portions 423 on both sides of the flow passage 422 are provided between the two adjacent inner frame portions 421. This indicates that the connection between the two adjacent inner frame portions 421 forms the left and right frame terminal connection portions 423, and the lower part of the frame terminal connection portion 423 is a frame end bottom inclined surface 425 inclined inwardly, and the lower part of the left and right frame end bottom inclined surfaces 425 is connected with a frame end substrate portion 424, and the upper part of the frame end substrate portion 424 forms the flow passage 422. Obviously, the inner frame portion 421 does not have a partition or retaining wall between the fan device 30 , that is, it is a configuration of the flow channel 422 .

[0027] Please also read Figure 6As shown, it is an application description of the first embodiment of the fan module structure for improving the wind flow efficiency of the utility model. As shown in the figure, due to the setting of the flow channel 422 between the two adjacent inner frame parts 421, when the two adjacent heat dissipation fan modules 31 of the fan device 30 rotate, the positions on both sides below the flow channel 422 (frame end substrate part 424) will assist the blades 312 of the heat dissipation fan module 31 in rotating, which will increase the wind pressure, wind volume, etc. of the fan, which is helpful for its heat dissipation effect / efficiency, and also has an excellent effect of reducing noise for the rotation operation of the heat dissipation fan module 31. In other words, the design of the utility model can avoid the conflict of wind flow in the middle, and can optimize the fan flow field, so that the increase of wind pressure and wind volume is helpful for its heat dissipation efficiency and temperature reduction.

[0028] The utility model discloses a fan module structure for improving wind flow efficiency. By means of the above-mentioned structure, the partition / retaining wall between the two adjacent fan bodies can be removed by optimizing the fan casing configuration design between the two adjacent fan bodies, so as to further optimize the fan flow field and improve the wind pressure and air volume. At the same time, the flow channel design of the fan casing between the two adjacent fan bodies can be used to greatly reduce noise, thereby greatly improving the heat dissipation efficiency and the quiet texture during use.

[0029] The present invention has been described in more detail through the above preferred specific embodiments, but the present invention is not limited to the above exemplified embodiments. Any changes and modifications to the structures within the technical concept disclosed in the present invention still fall within the patent scope of the present invention.

Claims

1. A fan module structure for improving wind flow efficiency, characterized in that: Included are: A plurality of cooling fan modules, each cooling fan module comprising a fan hub having a plurality of blades around the fan hub; A fan housing is arranged around the plurality of cooling fan modules. The fan housing has a frame edge around all four sides and a plurality of fan accommodating spaces inside the frame edge. The fan accommodating space includes an inner frame portion, and a flow passage is provided between two adjacent inner frame portions. The flow passage has a frame terminal portion on both sides.

2. The fan module structure for improving airflow efficiency according to claim 1, characterized in that: The connection of the two adjacent inner frame parts forms two frame end connection parts, and the lower part of the frame end connection part is a frame end bottom inclined surface inclined toward the inner side.

3. The fan module structure for improving airflow efficiency according to claim 2, characterized in that: The lower parts of the two frame end bottom inclined surfaces are connected with a frame end base plate part, and the upper part of the frame end base plate part is used to form the flow channel.

4. The fan module structure for improving airflow efficiency according to claim 1, characterized in that: There is neither a partition nor a retaining wall between adjacent inner frame parts.

5. The fan module structure for improving airflow efficiency according to claim 1, characterized in that: It also includes at least one heat dissipation fin group, and the heat dissipation fan module is arranged on the heat dissipation fin group.

6. The fan module structure for improving airflow efficiency according to claim 5, characterized in that: The invention also comprises an electronic device, which comprises a circuit board, an electronic component device is arranged on the circuit board, the heat dissipation fin group is arranged on the electronic component device, and the electronic component device is a display adapter device.

7. The fan module structure for improving airflow efficiency according to claim 5, characterized in that: A positioning frame group is also arranged on the heat dissipation fin group. The positioning frame group includes a framework composed of a plurality of longitudinal and transverse positioning plates for supporting and positioning the plurality of heat dissipation fan modules.

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