Fan module structure for improving air flow heat dissipation efficiency

Abstract

The utility model relates to a fan module structure capable of improving the heat dissipation efficiency of air flow, which comprises a plurality of heat dissipation fan modules, a plurality of heat dissipation fan modules and a plurality of heat dissipation fan modules, the heat dissipation fan modules comprise fan hubs, and the peripheries of the fan hubs are provided with a plurality of blades; the fan shell is arranged on the periphery of the plurality of cooling fan modules, the fan shell is provided with a peripheral frame edge and a plurality of fan accommodating spaces in the frame edge, each fan accommodating space comprises an inner frame part, and a circulation opening channel and frame end connecting parts on the two sides of the circulation opening channel are arranged between every two adjacent inner frame parts; the frame end connecting part comprises a frame end peripheral part, a penetrating hole is formed in the inner side part of the frame end peripheral part, and the penetrating hole is provided with the fan accommodating space communicated with the lower part; therefore, through the configuration optimization design of the circulation opening channel and the frame end connecting part of the fan shell between the two adjacent fan bodies, the flow field of the fan is optimized, the air pressure and the air volume of the fan are improved, meanwhile, the noise can be reduced, and the heat dissipation efficiency and the quiet texture in use are greatly improved.

Description

Technical Field

[0001] The utility model relates to a fan module structure, and in particular to a fan module structure which optimizes the frame structure of a fan, can increase the wind pressure and air volume of the fan and reduce the noise, and provides a practical fan module structure for improving the wind flow heat dissipation efficiency. Background Art

[0002] The electronic components in existing electronic products are gradually becoming more functionally centralized and powerful. For example, the display adapter device is used to meet the needs of higher-level graphics functions, e-sports games, AI functions, etc., which will generate more heat when the display adapter device (or other electronic components) is in operation. If this heat cannot be removed in time, it will lead to problems with the stability of the performance and shortened life of the electronic products. Therefore, in order to maintain the operating temperature of such electronic components within an appropriate range, effective heat dissipation technology is critical. Therefore, using heat dissipation devices to effectively dissipate heat from electronic components and electronic components has become a normal focus of the industry.

[0003] Conventional fan module heat dissipation technology, such as Figure 1 As shown, a fan module for heat dissipation of a display adapter device (or other electronic component devices), the heat dissipation fan module 90 includes a circuit board 91, the circuit board 91 is provided with an electronic component device 92 related to the display adapter, the electronic component device 92 is provided with a heat dissipation fin device 93 and cooperates with a plurality of fan modules 94 to perform forced heat dissipation, so that the heat source (such as a processor, chip, etc.) of the electronic component device 92 completes the heat dissipation operation; the fan module 94 is arranged in a fan housing 95, the fan housing 95 has a plurality of fan frame seats 961, which are used to respectively accommodate the plurality of fan modules 94, and a middle partition frame 962 is provided between two adjacent fan frame seats 961, which is used to separate the two fan frame seats 961. The conventional heat dissipation fan module 90 technology is fixedly arranged on the heat dissipation fin device 93 to be forced to dissipate heat, and the fan module 94 sends airflow to the heat dissipation fin device 93 through a fan to achieve the effect of forced heat dissipation.

[0004] Although the conventional fan module heat dissipation technology can achieve the effect of sending out airflow and forced heat dissipation, it still has its shortcomings. For example, the two adjacent fan frame seats 961 are disconnected by the middle partition frame 962 and are not connected, so that the two fan modules 94 do not have a complementary function, so the wind pressure and air volume of the fan module 94 cannot be increased, and the noise cannot be effectively reduced. As a result, the overall heat dissipation effect is still limited, especially for the current display adapter device (or other electronic components, electronic component devices) and other functions The heat generation is becoming more and more powerful, it is more difficult to meet the actual operation The heat dissipation requirements, there is indeed a need for further improvement and breakthroughs.

[0005] Therefore, the inventor of this case has learned about the shortcomings of the fan module technology and the fact that its structural design is not ideal, and has started to develop its solution, especially optimizing the fan frame configuration, hoping to develop a fan module structure with better airflow efficiency to serve the public and promote the development of this industry. After a long period of thinking, the present utility model was created. And through this shape, the fan can increase the wind pressure and air volume and greatly reduce the noise after assembly. Utility Model Content

[0006] The purpose of the utility model is to provide a fan module structure that improves the heat dissipation efficiency of wind flow. It can optimize the fan casing configuration design between two adjacent fan bodies and remove the partition / retaining wall between the two adjacent fan bodies, so as to further optimize the fan flow field and improve its wind pressure and air volume effects.

[0007] Another object of the present invention is to provide a fan module structure that improves the heat dissipation efficiency of airflow. The fan module structure can have an anti-turbulence effect through the optimized design of the air permeability at the top of the intersection of two adjacent fan inner frames, thereby further improving the wind pressure and air volume effects of the fan. The fan housing between the two adjacent fan bodies can also be designed to greatly reduce noise, thereby greatly improving the heat dissipation efficiency and the quiet texture of use.

[0008] The technical means adopted by the utility model to achieve the above-mentioned purpose are as follows: the utility model provides a fan module structure for improving the heat dissipation efficiency of airflow, including: a plurality of heat dissipation fan modules, the heat dissipation fan module including a fan hub, the fan hub having a plurality of blades around it; a fan housing, arranged around the plurality of heat dissipation fan modules, the fan housing having a frame edge around it and a plurality of fan accommodating spaces inside the frame edge, the fan accommodating space including an inner frame portion, and a flow passage and frame terminal portions on both sides of the flow passage are provided between the two adjacent inner frame portions, the frame terminal portion including a frame end peripheral portion, the inner side portion of the frame end peripheral portion is formed with a through hole, and the through hole is connected to the fan accommodating space below.

[0009] In this embodiment, the inner frame portion is located below the through hole to form an anti-turbulence space.

[0010] In this embodiment, the front end of the frame end peripheral portion has a front frame end, and one side of the front frame end is provided with a baffle plate that expands outward and obliquely from top to bottom, and the flow channel is formed between the two baffle plates.

[0011] In this embodiment, a flow-blocking inner frame portion is provided at a position of the inner frame portion adjacent to the flow-blocking plate, and the flow-blocking inner frame portion is located at the anti-turbulence space.

[0012] In this embodiment, the flow-blocking inner frame portion has a larger diameter, width and arc design than the inner frame portion.

[0013] In this embodiment, it further includes at least one heat dissipation fin group, and the heat dissipation fan module is arranged on the heat dissipation fin group.

[0014] In this embodiment, it further includes an electronic device, which includes a circuit board. The circuit board is provided with an electronic component device, and the heat dissipation fin group is provided on the electronic component device.

[0015] In this embodiment, the electronic component device is a display adapter device.

[0016] In this embodiment, a plurality of positioning frames are further disposed on the heat dissipation fin assembly, and the plurality of positioning frames are used to support and position the plurality of heat dissipation fan modules.

[0017] The advantages of the utility model are that the anti-turbulence space below the through hole can increase the wind pressure and air volume of the cooling fan module when it rotates, which is helpful for the cooling effect / efficiency and has an excellent effect of reducing noise in the rotating operation of the cooling fan module.

[0018] In order to enable a better understanding and recognition of the technical features and the effects achieved by the utility model, a preferred embodiment diagram and a detailed description are provided as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional exploded schematic diagram of a conventional fan module heat dissipation technology.

[0020] Figure 2 It is a three-dimensional schematic diagram of the application of the fan housing of the utility model.

[0021] Figure 3 It is a three-dimensional exploded schematic diagram of the utility model.

[0022] Figure 4 It is a three-dimensional combination schematic diagram of the utility model.

[0023] Figure 5 for Figure 4 A partial enlarged schematic diagram of .

[0024] Figure 6 It is a partially enlarged schematic diagram of the utility model.

[0025] Figure 7 It is a schematic diagram of the fan flow field operation of the utility model.

[0026] Explanation of the reference numerals: fan device 1; electronic device 10; circuit board 11; electronic component device 12; heat sink fin device 20; heat sink fin group 21; positioning frame 22; positioning frame 23; fan device 30; heat sink fan module 31; fan hub 311; blades 312; fan housing 40; frame edge 41; fan accommodating space 42; inner frame portion 421; inner frame portion 421A; inner frame portion 421B; flow opening 422; frame terminal portion 43; frame end peripheral portion 430; front frame end 431; through hole 432; baffle plate 433; anti-turbulence space 434; baffle inner frame portion 435. DETAILED DESCRIPTION

[0027] See also Figures 2 to 4 , used to illustrate an embodiment of the fan module structure of the utility model for improving the airflow heat dissipation efficiency. The fan device 1 in the embodiment disclosed by the utility model includes an electronic device 10, a heat dissipation fin device 20, a fan device 30 and a fan housing 40.

[0028] The electronic device 10 may be a display adapter device or other electronic component device. The electronic device 10 includes a circuit board 11, on which a display adapter or other electronic component-related electronic component device 12 is disposed. The heat sink fin device 20 includes at least one heat sink fin group 21, and the present embodiment shows two heat sink fin groups 21. The heat sink fin group 21 (heat sink fin device 20) is disposed on the electronic component device 12, mainly to enable the heat source (such as a processor, chip, etc.) of the electronic component device 12 to obtain sufficient heat dissipation. The heat sink fin group 21 is a combination of several heat sink fins arranged with a gap distance, so that a heat dissipation channel is formed between adjacent heat sink fins. In the present utility model, the number of each heat sink fin group 21 is not limited, and as shown in the figure, the heat sink fin device 20 may also be provided with several heat pipes (not numbered) that penetrate vertically. Furthermore, the heat dissipation fin device 20 further includes a plurality of positioning frames 22 and 23 respectively disposed on the side and the inner side for supporting and positioning the fan device 30 .

[0029] The fan device 30 includes a plurality of cooling fan modules 31, which are disposed on the cooling fin group 21 (cooling fin device 20) and are fixed to the cooling fin group 21 (cooling fin device 20) by the positioning frames 22 and 23. The cooling fan module 31 includes a fan hub 311, and the fan hub 311 has a plurality of blades 312 around it. In this embodiment, the fan device 30 discloses three cooling fan modules 31, and the rotation relationship between adjacent cooling fan modules 31 is not set or restricted.

[0030] The fan housing 40 is disposed around the fan device 30. The fan housing 40 has a frame edge 41 around the periphery and a plurality of fan accommodating spaces 42 inside the frame edge 41. The frame edge 41 around the periphery is used to maintain the plurality of heat dissipation fan modules 31. Furthermore, the fan accommodating space 42 includes an inner frame portion 421, and a flow passage 422 is provided between two adjacent inner frame portions 421, and a frame terminal portion 43 is provided at the intersection of the two adjacent inner frame portions 421. That is, the flow passage 422 is provided between the two adjacent inner frame portions 421 and the frame terminal portions 43 on both sides of the flow passage 422, which indicates that the connection of the two adjacent inner frame portions 421 forms the frame terminal portions 43 on the left and right sides.

[0031] Please also read Figure 5 , Figure 6 The frame end connection portion 43 includes a frame end peripheral portion 430 located at the top, and a through hole 432 is formed in the inner part of the frame end peripheral portion 430, that is, the frame end peripheral portion 430 is formed around the through hole 432; the frame end peripheral portion 430 and the through hole 432 are configured in an irregular geometric shape when viewed from above, but are not limited thereto, and the inner frame portion 421 is located below the through hole 432 to form an anti-turbulence space 434. If the inner frame portion 421 of the fan accommodating space 42 located at the central position defines an inner frame portion 421A, and the inner frame portions 421 of the fan accommodating spaces 42 on both sides define an inner frame portion 421B, that is, the inner frame portions 421B are respectively located on both sides of the inner frame portion 421A located at the central position. The front end of the frame end peripheral portion 430 is a front frame end 431. A baffle plate 433 is provided on a side of the front frame end 431 adjacent to the inner frame portion 421A. The baffle plate 433 is inclined outward from top to bottom, that is, it forms an outward slope toward the frame edge 41 on the same side, and the flow passage 422 is formed between the left and right opposite baffle plates 433. A baffle inner frame portion 435 is provided adjacent to the baffle plate 433 of the inner frame portion 421B. The baffle inner frame portion 435 is located at the position of the anti-disturbance space 434, and the baffle inner frame portion 435 and the inner frame portion 421B are arranged with different diameters, widths and arcs. In a preferred embodiment, the baffle inner frame portion 435 has a larger diameter, width and arc design than the inner frame portion 421B. Obviously, the inner frame portion 421 does not have a partition or retaining wall between the fan device 30 , that is, it is a configuration of the flow channel 422 .

[0032] Please also read Figure 7As shown, it is an application description of the first embodiment of the fan module structure for improving the airflow heat dissipation efficiency of the utility model. As shown in the figure, since the flow passage 422 is provided between the two adjacent inner frame parts 421, and the frame terminal parts 43 on both sides of the flow passage 422 are provided with the through holes 432, when the two adjacent heat dissipation fan modules 31 of the fan device 30 rotate and operate, the external local air will enter the fan accommodating space 42 to which the inner frame part 421B belongs through the through holes 432, and the air entering the inner frame part 421B is just located at the flow baffle inner frame part 435 in the baffle plate 433, so that the turbulence phenomenon located at the flow passage 422 when the two adjacent heat dissipation fan modules 31 rotate and operate can be resolved in advance, and the wind pressure, wind volume, etc. during the operation of the fan can be improved, which is helpful for its heat dissipation effect / efficiency, and the rotation operation of the heat dissipation fan module 31 also has an excellent effect of reducing noise. In other words, the utility model can avoid the conflict and turbulence of wind flow in the middle by designing it in this way, and can optimize the fan flow field, so that the increase of wind pressure and air volume is helpful for its heat dissipation efficiency and the reduction of temperature.

[0033] The utility model discloses a fan module structure for improving the heat dissipation efficiency of wind flow. Through the above-mentioned structure, it can optimize the fan shell configuration design between two adjacent fan bodies, and remove the partition / retaining wall between the two adjacent fan bodies, so as to optimize the fan flow field and improve its wind pressure and air volume effects. At the same time, the utility model further optimizes the air permeability design at the top of the intersection of the inner frames of the two adjacent fans, so that it has an imported anti-disturbance effect, and further improves the wind pressure and air volume effects of the fan. It can also greatly reduce noise by the frame end connection part design between the two adjacent fan bodies, so as to greatly improve the heat dissipation efficiency and the quiet texture in use.

[0034] The present invention has been described in more detail through the above preferred specific embodiments, but the present invention is not limited to the above exemplified embodiments. Within the scope of the technical idea disclosed in the present invention, various changes and modifications to the structures still fall within the patent scope of the present invention.

Claims

1. A fan module structure for improving airflow heat dissipation efficiency, characterized in that: Included are: A plurality of cooling fan modules, each cooling fan module comprising a fan hub, and a plurality of blades are arranged around the fan hub; A fan housing is arranged around the plurality of cooling fan modules, the fan housing having a frame edge around the periphery and a plurality of fan accommodating spaces inside the frame edge, the fan accommodating space including an inner frame portion, a flow passage and frame terminal portions on both sides of the flow passage between two adjacent inner frame portions, the frame terminal portion including a frame end peripheral portion, a through hole being formed on the inner side of the frame end peripheral portion, the through hole being connected to the fan accommodating space below.

2. The fan module structure for improving airflow heat dissipation efficiency according to claim 1, characterized in that: The inner frame forms an anti-turbulence space below the penetration hole.

3. The fan module structure for improving airflow heat dissipation efficiency according to claim 2, characterized in that: The front end of the frame end peripheral portion has a front frame end, and one side of the front frame end is provided with a baffle plate which is inclined and expands outward from top to bottom, and the flow passage is formed between the two baffle plates.

4. The fan module structure for improving airflow heat dissipation efficiency according to claim 3, characterized in that: A flow-blocking inner frame portion is provided at the inner frame portion adjacent to the flow-blocking plate, and the flow-blocking inner frame portion is located at the anti-turbulence space.

5. The fan module structure for improving airflow heat dissipation efficiency according to claim 4, characterized in that: The flow-blocking inner frame portion has a larger radial width arc than the inner frame portion.

6. The fan module structure for improving airflow heat dissipation efficiency according to claim 1, characterized in that: It also includes at least one heat dissipation fin group, and the heat dissipation fan module is arranged on the heat dissipation fin group.

7. The fan module structure for improving airflow heat dissipation efficiency according to claim 6, characterized in that: The invention also comprises an electronic device, which comprises a circuit board, an electronic component device is arranged on the circuit board, and the heat dissipation fin group is arranged on the electronic component device.

8. The fan module structure for improving airflow heat dissipation efficiency according to claim 7, characterized in that: The electronic component device is a display adapter device.

9. The fan module structure for improving airflow heat dissipation efficiency according to claim 6, characterized in that: The heat dissipation fin group is also provided with a plurality of positioning frames, and the plurality of positioning frames are used for supporting and positioning the plurality of heat dissipation fan modules.

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