Fluid heater for wafer production

By designing the shell in the fluid heater of the wafer production equipment and connecting to nitrogen, maintaining positive pressure, thereby preventing the IPA steam from entering the heater body, solving the hidden dangers of the burning or explosion of IPA steam at high temperature, and improving the safety of the equipment Essence

CN222417970UActive Publication Date: 2025-01-28WUXI ASIA ELECTRONICS INTELLIGENT EQUIP CO LTD
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Patent Information

Application Number
CN202420926372.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-29
Publication Date
2025-01-28
Estimated Expiration
2034-04-29

AI Technical Summary

Technical Problem

The fluid heaters in existing wafer production equipment are prone to cause IPA vapor to burn or explode at high temperatures, which poses safety risks.

Method used

The layer of the wafer production is designed. The heater body is placed in the shell, and the nitrogen is continuously passed through the nitrogen interface to keep the shell in the positive pressure, thereby preventing the IPA steam from entering the heater body.

Benefits of technology

By maintaining the positive pressure in the shell, the IPA steam is effectively prevented from entering the heater body, avoiding burning or explosion caused by high temperature, and improving the safety of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a fluid heater for wafer production, which comprises a shell and a heater body, the heater body is placed in the shell and is surrounded and protected by the shell, a nitrogen interface continuously introduces nitrogen into the shell, the interior of the shell is in positive pressure, and nitrogen flows out of a gap or an opening in the shell. IPA steam is prevented from entering the periphery of the heater body, and combustion explosion of the IPA steam caused by the high temperature of the periphery of the heater body is effectively prevented.
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Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular, relates to a fluid heater for wafer production. Background Art

[0002] During the wafer production process, IPA (dimethyl alcohol) is needed to dry the wafer. IPA has a strong water absorption effect and a good drying effect, but IPA is flammable and explosive, and is more risky at higher temperatures. Although the wafer production equipment is equipped with exhaust equipment to extract the volatile IPA for treatment, it is inevitable that some IPA vapor will remain in the equipment. At the same time, a fluid heater is needed in the wafer production equipment, such as: Chinese utility model patent document CN212930912U, a nitrogen heater used in the wafer drying process, or Chinese utility model patent document CN209819883U, a high-purity nitrogen heater used in the wafer drying process, or Chinese utility model patent document CN213546274U, a nitrogen heater.

[0003] The above heater is used to heat nitrogen. Since the heater needs to heat the fluid to a relatively high temperature, if IPA is leaked into the fluid heater under high temperature conditions, there is a risk of explosion and combustion. Utility Model Content

[0004] The technical problem to be solved by the utility model is: to solve the deficiencies in the prior art, thereby providing a fluid heater for wafer production which can prevent explosion or combustion due to IPA leakage.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A fluid heater for wafer production, comprising:

[0007] The housing comprises a main body and a cover mounted on the main body;

[0008] The heater body is arranged in the shell, and has an outlet joint and an inlet joint at both ends. The fluid flows into the heater body through the inlet joint and then flows out from the outlet joint. The outlet joint and the inlet joint extend from the through holes at both ends of the body;

[0009] The shell is provided with a nitrogen interface, which is connected to a nitrogen storage tank for introducing nitrogen into the shell to maintain a positive pressure inside the shell.

[0010] Preferably, in the fluid heater for wafer production of the present invention, the heater body is a nitrogen heater.

[0011] Preferably, in the wafer production fluid heater of the present invention, the nitrogen supply pipeline is connected to the inlet joint and the nitrogen interface at the same time.

[0012] Preferably, in the fluid heater for wafer production of the present invention, the heater body is fixed in the housing by a clamp.

[0013] Preferably, in the fluid heater for wafer production of the utility model, a through hole is provided on the side wall of the shell, and the wires and cables led out of the lead hole are led out of the shell through the through hole.

[0014] Preferably, in the fluid heater for wafer production of the present invention, the cover is fixed to the body by screws.

[0015] Preferably, in the fluid heater for wafer production of the present invention, a handle is also provided on the cover.

[0016] Preferably, in the fluid heater for wafer production of the present invention, both sides of the cover have bending parts facing the main body, which can play a role in positioning the cover and the main body, and can also occupy a certain space to prevent other components from being too close to the main body.

[0017] Preferably, in the fluid heater for wafer production of the present invention, the clearance holes at both ends of the body have openings located at the top of the body, so that the outlet connector and the inlet connector of the heater body can be placed in the housing through the openings.

[0018] Preferably, in the fluid heater for wafer production of the utility model, the four corners of the bottom of the body are provided with feet, which are fixed by bolts.

[0019] The beneficial effects of the utility model are:

[0020] The fluid heater for wafer production of the present application has a heater body that is placed in an outer shell and surrounded and protected by the outer shell. The nitrogen interface continuously introduces nitrogen into the outer shell. The inner shell is under positive pressure, and nitrogen flows out from the gaps or openings on the outer shell to prevent IPA vapor from entering around the heater body, thereby effectively preventing the combustion and explosion of IPA vapor caused by the higher temperature around the heater body. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0022] Figure 1 is a three-dimensional diagram of a fluid heater for wafer production according to an embodiment of the present application;

[0023] Figure 2 is a top view of the wafer production fluid heater according to an embodiment of the present application with the cover hidden;

[0024] Figure 3is a three-dimensional diagram of a fluid heater for wafer production according to an embodiment of the present application with a cover hidden;

[0025] Figure 4 is a side view of the wafer production fluid heater according to an embodiment of the present application with the cover hidden;

[0026] The reference numerals in the figure are:

[0027] 1 housing;

[0028] 2 Heater body;

[0029] 11 body;

[0030] 12 cover;

[0031] 13 Nitrogen interface;

[0032] 14 handles;

[0033] 15 give way hole;

[0034] 16 footing;

[0035] 17 vias;

[0036] 21 outlet connector;

[0037] 22 inlet connector;

[0038] 23 Isolation chamber;

[0039] 24 Heating cavity;

[0040] 25 lead holes;

[0041] 26 Clamp. DETAILED DESCRIPTION

[0042] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0043] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention of the present utility model, unless otherwise specified, "multiple" means two or more.

[0044] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0045] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0046] Example

[0047] This embodiment provides a fluid heater for wafer production, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, including:

[0048] The housing 1 comprises a main body 11 and a cover 12 mounted on the main body 11;

[0049] The heater body 2 is arranged in the housing 1, and has an outlet joint 21 and an inlet joint 22 at both ends. The fluid flows into the heater body 2 through the inlet joint 22 and then flows out from the outlet joint 21. The outlet joint 21 and the inlet joint 22 extend from the through holes 17 at both ends of the body 11. The heater body 2 uses a common heater, and specifically can use the patent CN213546274U previously applied for by the applicant. The inlet joint 22 is connected to the fluid storage tank through a pipeline.

[0050] The housing 1 is provided with a nitrogen interface 13 , which is connected to a nitrogen storage tank for introducing nitrogen into the housing 1 to maintain a positive pressure inside the housing 1 .

[0051] In the fluid heater for wafer production of the present embodiment, the heater body 2 is placed in the outer shell 1 and surrounded and protected by the outer shell 1. The nitrogen interface 13 continuously introduces nitrogen into the outer shell 1. The inner shell 1 is under positive pressure, and nitrogen flows out from the gaps or openings on the outer shell 1 to prevent IPA vapor from entering around the heater body 2, thereby effectively preventing the combustion and explosion of IPA vapor caused by the high temperature around the heater body 2.

[0052] Furthermore, the heater body 2 is a nitrogen heater. The fluid is a cleaning liquid and various gases, the most common of which is nitrogen.

[0053] Furthermore, the nitrogen supply pipeline is connected to the inlet connector 22 and the nitrogen interface 13 at the same time. The nitrogen storage tank passes through, and the nitrogen supply pipeline is connected to the inlet connector 22 and the nitrogen interface 13 at the same time (that is, the nitrogen storage tank is divided into two branches, which are respectively connected to the inlet connector 22 and the nitrogen interface 13). Since the nitrogen storage tank is not the key point to be protected in this application, its structure will not be described in detail.

[0054] Furthermore, the heater body 2 is fixed in the housing 1 by a clamp 26 .

[0055] The heater body 2 is composed of an isolation cavity 23 and a heating cavity 24. The isolation cavity 23 has a wire connector for the heating coil and a connector for the temperature sensor. The wires and cables are led out from the lead holes 25 on the side wall of the isolation cavity 23. The heating cavity 24 has a fluid pipeline and a heating coil.

[0056] The side wall of the housing 1 is provided with a via 17, and the wires and cables led out of the lead hole 25 are led out of the housing 1 through the via 17. It should be noted that since the nitrogen introduced by the nitrogen interface 13 ensures the positive pressure in the housing 1, nitrogen will also overflow from the via 17.

[0057] Furthermore, the cover 12 is fixed to the body 11 by screws.

[0058] Furthermore, a handle 14 is provided on the cover body 12 to facilitate grasping the cover body 12 by hand.

[0059] Furthermore, both sides of the cover body 12 have bending portions facing the main body 11 , which can position the cover body 12 and the main body 11 , and can also occupy a certain space to prevent other components from being too close to the main body 11 .

[0060] Furthermore, the clearance holes 15 at both ends of the body 11 have openings located at the top of the body 11, so that the outlet connector 21 and the inlet connector 22 of the heater body 2 can be placed into the housing 1 through the openings. The two sides are respectively the first clearance hole and the second clearance hole.

[0061] Furthermore, the four corners of the bottom of the body 11 are provided with feet 16, which are fixed by bolts to the mounting plate of the wafer cleaning equipment.

[0062] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A fluid heater for wafer production, characterized in that: include: The housing (1) comprises a body (11) and a cover (12) mounted on the body (11); A heater body (2) is arranged in the housing (1) and has an outlet joint (21) and an inlet joint (22) at both ends. The fluid flows into the heater body (2) through the inlet joint (22) and then flows out from the outlet joint (21). The outlet joint (21) and the inlet joint (22) extend from the through holes (17) at both ends of the body (11); The housing (1) is provided with a nitrogen interface (13), which is connected to a nitrogen storage tank for introducing nitrogen into the housing (1) to maintain a positive pressure inside the housing (1).

2. The wafer production fluid heater according to claim 1, characterized in that: The heater body (2) is a nitrogen heater.

3. The wafer production fluid heater according to claim 2, characterized in that: The nitrogen supply pipeline is connected to the inlet connector (22) and the nitrogen interface (13) at the same time.

4. The wafer production fluid heater according to claim 1, characterized in that: The heater body (2) is fixed in the housing (1) via a clamp (26).

5. The wafer production fluid heater according to claim 1, characterized in that: A through hole (17) is provided on the side wall of the housing (1), and the wires and cables led out of the lead-in hole (25) are led out of the housing (1) through the through hole (17).

6. The wafer production fluid heater according to claim 1, characterized in that: The cover body (12) is fixed on the body (11) by means of screws.

7. The wafer production fluid heater according to claim 1, characterized in that: The cover body (12) is also provided with a handle (14).

8. The wafer production fluid heater according to claim 1, characterized in that: The two sides of the cover body (12) have bent portions facing the main body (11), and the bent portions can play a role in positioning the cover body (12) and the main body (11), and can also occupy a certain space to prevent other components from being too close to the main body (11).

9. The wafer production fluid heater according to claim 1, characterized in that: The clearance holes (15) at both ends of the body (11) have openings located at the top of the body (11), so that the outlet joint (21) and the inlet joint (22) of the heater body (2) can be placed in the housing (1) through the openings.

10. The wafer production fluid heater according to claim 1, characterized in that: The four corners of the bottom of the body (11) are provided with footings (16), and the footings (16) are fixed by bolts.

Citation Information

Patent Citations

  • High-purity nitrogen heater used in wafer drying process

    CN209819883U

  • Nitrogen heater used in wafer drying process

    CN212930912U

  • Nitrogen heater

    CN213546274U