Coating device and lithographic apparatus

Abstract

The utility model provides a coating device and photoetching equipment. The coating device comprises a spraying unit, a bearing unit and a device body, the bearing unit is arranged in the device body and is used for loading a wafer; the spraying unit comprises a coating assembly and a flushing assembly, and the coating assembly is located outside the device body and used for spraying a chemical reagent to the surface of the wafer; the flushing assembly is arranged on the side, close to the bearing unit, of the wafer and used for spraying a chemical liquid agent to the back face of the wafer for cleaning; and an absorbing piece is arranged on the inner wall, close to the coating assembly, of the device body and used for absorbing the chemical liquid sprayed out through the flushing assembly. According to the configuration, the absorbing part is arranged on the inner wall, close to the coating assembly, of the device body, and the chemical liquid splashing to the inner wall of the device body is absorbed, so that the probability that the chemical liquid is splashed back to the surface of the wafer is reduced, and the product yield is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a coating device and photolithography equipment. Background Art

[0002] The photoresist coating in the photolithography process is completed by the coating device in the photolithography equipment. There are three steps involving chemical coating, including: RRC (Reduced Resist Consumption) coating on the wafer surface, photoresist coating and rinsing on the back of the wafer. The main purpose of the existing coating cup is to prevent chemicals from splashing and contaminating the coating device during the spraying process.

[0003] However, in the actual spraying process, due to the influence of factors such as differences in spraying pressure, spraying speed, and cup height, it is possible that during the coating process, chemicals may splash back onto the wafer through the coating cup, causing defects in the wafer and affecting the product yield. Utility Model Content

[0004] The utility model aims to provide a coating device and a photolithography device to solve the problem that in the spraying process of the existing coating device, chemicals are easily splashed back onto the wafer surface, thereby affecting the product yield.

[0005] In order to achieve the above-mentioned object, the utility model provides a coating device, comprising: a spraying unit, a carrying unit and a device body;

[0006] The carrying unit is arranged inside the device body and is used for loading wafers;

[0007] The spray unit includes a coating component and a flushing component. The coating component is located outside the device body and is used to spray chemical reagents onto the surface of the wafer. The flushing component is arranged on a side of the wafer close to the carrying unit and is used to spray chemical liquid onto the back of the wafer for cleaning.

[0008] An absorber is arranged on the inner wall of the device body close to the coating component, and the absorber is used to absorb the chemical liquid sprayed by the flushing component.

[0009] Optionally, the absorbent is arranged along the circumference of the device body.

[0010] Optionally, the device body is provided with a narrowing section on a side away from the carrying unit, and the absorbent is provided in the narrowing section.

[0011] Optionally, the device body gradually narrows in a direction away from the carrying unit to form an opening, and the wafer is located between the opening and the flushing assembly in the axial direction of the device body.

[0012] Optionally, the coating device further comprises a first driving unit, the first driving unit being connected to the coating assembly, and the first driving unit being capable of moving along its own axial direction to drive the coating assembly to move along the axial direction of the first driving unit toward or away from the device body.

[0013] Optionally, the coating assembly includes a first nozzle and a second nozzle, the first nozzle and the second nozzle are respectively connected to the first driving unit, and the first nozzle and the second nozzle are used to spray different chemical reagents.

[0014] Optionally, the coating device further comprises a second driving unit, which is connected to the bearing unit and can rotate around an axis and move along its own axial direction to drive the bearing unit to rotate and / or move along the axial direction of the second driving unit.

[0015] Optionally, the flushing assembly includes a third nozzle, and the extension direction of the third nozzle is arranged at an angle with the axial direction of the device body.

[0016] Optionally, the coating device further comprises a plurality of delivery pipelines, which are respectively connected to the coating component and the flushing component and are used for delivering the chemical reagent and the chemical liquid.

[0017] In order to achieve the above object, the utility model also provides a photolithography device, including the coating device as described above.

[0018] Compared with the existing coating device, the coating device provided by the present application has the following advantages:

[0019] During the process of spraying chemical liquid onto the back side of the wafer for cleaning, the chemical liquid sprayed by the flushing component flushes the edge of the wafer in a direction that is angled with the axial direction of the device body. During the spraying process, the wafer keeps rotating around its axis, and the chemical liquid is splashed toward the inner wall of the device body by the centrifugal force, and then splashed back to the surface of the wafer through the inner wall of the device body, thereby causing defects in the wafer and affecting the yield. The present application provides an absorber on the inner wall of the device body close to the coating component to absorb the chemical liquid splashed onto the inner wall of the device body, thereby reducing the probability of the chemical liquid splashing back to the wafer surface, thereby improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of chemical splashing back onto a wafer surface in the prior art;

[0021] Figure 2 Schematic diagram of defects formed after chemicals splash back onto the wafer surface;

[0022] Figure 3 A schematic diagram of the structure of a coating device proposed in an embodiment of the utility model;

[0023] Figure 4 A partial schematic diagram of the device body proposed in the embodiment of the utility model;

[0024] Figure 5 A schematic diagram of the working state of the device body proposed in the embodiment of the utility model;

[0025] The description of each reference numeral is as follows:

[0026] 1- spray unit; 11- coating assembly; 12- flushing assembly; 111- first nozzle; 112- second nozzle; 121- third nozzle;

[0027] 2-Carrying unit;

[0028] 3-device body; 31-narrowing section; 311-opening;

[0029] 4-absorber; 5-wafer; 6-temperature control unit;

[0030] X-axis direction of the device body. DETAILED DESCRIPTION

[0031] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

[0032] As used in this specification, the singular forms "a", "an" and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the term "at least two" is generally used to include the meaning of "two or more". In addition, the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" and "the proximal end" and "the distal end" generally refer to two corresponding parts, which include not only the endpoints, and the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. In addition, as used in this specification, an element disposed on another element generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements may be direct or indirect through an intermediate element, and it cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element may be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. The terms "upper", "lower", "top" and "bottom" are generally relative position relationships arranged in the direction of gravity; the terms "vertical, vertical direction" generally refer to the direction of gravity, which is generally perpendicular to the ground, and "horizontal, horizontal plane direction" generally refers to the direction parallel to the ground; for ordinary technicians in this field, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0033] The utility model aims to provide a coating device and a photolithography device to solve the problem that in the spraying process of the existing coating device, chemicals are easily splashed back onto the wafer surface, thereby affecting the product yield.

[0034] The following description is given with reference to the accompanying drawings.

[0035] Please refer to Figure 1 and Figure 2 Those skilled in the art will appreciate that, during the process of rinsing the back of the wafer 5, the chemical liquid sprayed by the rinsing assembly 12 cleans the edge of the wafer 5 in a direction that is angled with the axial direction of the device body 3 (in Figure 1The chemical liquid sprayed from the rinse component 12 splashes in the direction of the arrow), and the wafer 5 keeps rotating around its axis during the spraying process. The chemical liquid on the edge of the wafer 5 will splash outward onto the inner wall of the device body 3 due to the centrifugal force, and then splash back from the inner wall of the device body 3 to the surface of the wafer 5, causing defects on the wafer 5 and affecting the product yield. Figure 2 In the illustrated example, there is residual chemical liquid splashed back on the surface of the wafer 5, which causes particle defects in the wafer 5 and affects the product yield. Based on this, the present application provides a coating device, which absorbs the chemical liquid splashed on the inner wall of the device body 3 by arranging an absorber 4 on the inner wall of the device body 3, thereby reducing the probability of the chemical liquid splashing back to the surface of the wafer 5 and improving the product yield. It should be noted that the present application only takes the photoresist coating process in the etching process of the wafer 5 as an example, which does not mean that the coating device mentioned in the present application can only be used in this scenario. As long as the scenario needs to prevent liquid splashing, the above structure can be used, and the present application does not limit this.

[0036] Please refer to Figures 3 to 5The utility model provides a coating device, comprising: a spraying unit 1, a carrying unit 2 and a device body 3; the carrying unit 2 is arranged inside the device body 3, and is used to load a wafer 5; the spraying unit 1 comprises a coating component 11 and a flushing component 12, the coating component 11 is located outside the device body 3, and is used to spray chemical reagents onto the surface of the wafer 5; the flushing component 12 is arranged on a side of the wafer 5 close to the carrying unit 2, and is used to spray chemical liquid onto the back of the wafer 5 for cleaning; an absorbent 4 is arranged on the inner wall of the device body 3 close to the coating component 11, and the absorbent 4 is used to absorb the chemical liquid sprayed by the flushing component 12. It should be noted that, in the present embodiment, the surface of the wafer 5 generally refers to the front side of the wafer 5, that is, the side of the wafer 5 away from the carrier unit 2, and the back side of the wafer 5 refers to the side of the wafer 5 close to the carrier unit 2; the absorber 4 can be a material with an absorption function such as a sponge, or an absorption coating (for example, it can be a coating made of a material that can react and neutralize with the corresponding chemical liquid); the carrier unit 2 can be a suction cup for adsorbing the wafer 5; the chemical reagent sprayed by the coating component 11 on the surface of the wafer 5 can be a photoresist, or other chemicals required for coating before photolithography or developing after photolithography, which are known in the art. As can be understood by technicians, photoresist is a key material in the processing and manufacturing of semiconductors, panels, PCBs and other fields. Photoresist is a mixed liquid photosensitive material composed of resin, photosensitive agent, solvent, photoinitiator, etc.; the chemical liquid sprayed by the washing component 12 to the back of the wafer 5 can be a mixed solvent of solvent, acid, surfactant and water, such as SC-1 cleaning solution (a mixed solution of ammonium hydroxide, hydrogen peroxide and deionized water), SC-2 cleaning solution (a mixed solution of hydrochloric acid, hydrogen peroxide and deionized water), SC-3 cleaning solution (a mixed solution of sulfuric acid, hydrogen peroxide and deionized water), hydrofluoric acid solvent, etc. Figure 3 In the illustrated example, the coating device further includes a temperature control unit 6 for providing a cold air flow or a hot air flow to the coating device, thereby controlling the ambient temperature in the coating device to a suitable temperature range to accommodate the spraying of chemical reagents.

[0037] Configured in this way, the absorber 4 disposed on the inner wall of the device body 3 close to the coating component 11 will absorb the chemical liquid splashed onto the inner wall of the device body 3 by the centrifugal force of the rotation of the wafer 5, thereby preventing it from splashing back onto the surface of the wafer 5 through the inner wall of the device body 3, reducing the probability of defects in the wafer 5 and improving the product yield.

[0038] Please refer to Figure 3 and Figure 4 As an optional embodiment, the absorber 4 is arranged along the circumference of the device body 3. Figure 3 and Figure 4In the illustrated example, the shell of the device body 3 is a cylindrical component with a variable diameter structure, and the absorber 4 is arranged along the circumference of the device body 3 and wrapped around to form an absorption ring, which can absorb the chemical liquid splashed onto the inner wall of the device body 3 from different directions. Of course, in some other examples, the device body 3 can also be a component of other shapes, such as a cuboid, and the absorber 4 can also be an absorption coating arranged along the circumference of the device body 3, and those skilled in the art can configure it according to actual conditions.

[0039] For further information, please refer to Figure 4 The device body 3 is provided with a narrowing section 31 on a side away from the carrying unit 2, and the absorber 4 is provided at the narrowing section 31. Furthermore, the device body 3 gradually narrows in a direction away from the carrying unit 2 and forms an opening 311, and the wafer 5 is located between the opening 311 and the washing assembly 12 in the axial direction X of the device body. As an alternative embodiment, the device body 3 is provided with a narrowing section 31 on the side away from the supporting unit 2, and gradually narrows in the direction away from the supporting unit 2 to finally form an opening 311. The wafer 5 is arranged between the opening 311 and the flushing component 12 in the axial direction X of the device body, and the absorber 4 is arranged in the narrowing section 31. With such a configuration, when the flushing component 12 sprays chemical liquid onto the back side of the wafer 5, the chemical liquid is splashed toward the inner wall of the device body 3 due to the centrifugal force of the rotation of the wafer 5. The splashed chemical liquid will most likely fall onto the narrowing section 31. Setting the absorber 4 on the narrowing section 31 can absorb most of the splashed chemical liquid, further reducing the probability of the chemical liquid splashing back onto the surface of the wafer 5.

[0040] As an optional embodiment, the coating device further includes a first drive unit (not shown in the figure), the first drive unit is connected to the coating assembly 11, and the first drive unit can move along its own axial direction to drive the coating assembly 11 to move along the axial direction of the first drive unit toward or away from the device body 3. It should be noted that the first drive unit can be a mechanical arm, and can be extended and retracted along its own axial direction through a motor. In this embodiment, the axial direction of the first drive unit is set parallel to the axial direction X of the device body. In some other embodiments, the axial direction of the first drive unit can also be set at an angle to the axial direction X of the device body. With such a configuration, the coating rate can be changed by adjusting the distance between the coating assembly 11 and the wafer 5.

[0041] Furthermore, the coating assembly 11 includes a first nozzle 111 and a second nozzle 112, the first nozzle 111 and the second nozzle 112 are respectively connected to the first driving unit, and the first nozzle 111 and the second nozzle 112 are used to spray different chemical reagents. It should be noted that in the present embodiment, the first nozzle 111 is an RRC nozzle, which is used to spray chemical reagents onto the surface of the wafer 5; the second nozzle 112 is a photoresist nozzle, which is used to spray photoresist onto the surface of the wafer 5. In other embodiments, the first nozzle 111 and the second nozzle 112 can also spray other chemical reagents, and those skilled in the art can configure this according to actual conditions.

[0042] In an alternative embodiment, the coating device further includes a second drive unit (not shown in the figure), the second drive unit is connected to the carrier unit 2, the second drive unit can rotate around the axis and can move along its own axial direction to drive the carrier unit 2 to rotate and / or move along the axial direction of the second drive unit. It should be noted that the second drive unit can be a motor, which can drive the carrier unit 2 to rotate around the axis and move along the axial direction of the second drive unit. In this embodiment, the axial direction of the second drive unit is set parallel to the axial direction X of the device body. In other embodiments, the axial direction of the second drive unit can also be set at an angle to the axial direction X of the device body. With such a configuration, the coating rate can be further adjusted by adjusting the distance between the wafer 5 and the coating assembly 11, thereby improving production efficiency.

[0043] As an optional embodiment, the rinse assembly 12 includes a third nozzle 121, and the extension direction of the third nozzle 121 is set at an angle to the axial direction X of the device body. It should be noted that the extension direction of the third nozzle 121 is set parallel to the axis A, and is set at an angle to the axial direction X of the device body, so that the chemical liquid sprayed from the third nozzle 121 can fall on the edge of the wafer 5, thereby reducing the probability of defects in the wafer 5.

[0044] In another optional embodiment, the coating device further includes a plurality of delivery pipelines (not shown in the figure), which are respectively connected to the coating assembly 11 and the flushing assembly 12 for delivering chemical reagents and chemical liquids. In this embodiment, the number of delivery pipelines is three, which are respectively connected to the first nozzle 111, the second nozzle 112 and the third nozzle 121 to deliver different chemical reagents and chemical liquids. In other embodiments, the number of delivery pipelines may also be two, four or even more, and those skilled in the art may configure this according to actual conditions.

[0045] In another embodiment, the utility model further provides a photolithography device, including the coating device as described above. In this way, the photolithography device includes the coating device as described above, and by arranging an absorber 4 on the inner wall of the device body 3 to absorb the chemical liquid splashed from the edge of the wafer 5, it can ensure that the probability of defects in the process of coating the wafer 5 before photolithography is reduced, and the yield of the wafer 5 is further improved.

[0046] In summary, in the coating device and the lithography equipment provided in the embodiments of the utility model, the coating device includes: a spraying unit, a carrying unit and a device body; the carrying unit is arranged inside the device body, and is used to load the wafer; the spraying unit includes a coating component and a flushing component, the coating component is located outside the device body, and is used to spray chemical reagents onto the surface of the wafer; the flushing component is arranged on the side of the wafer close to the carrying unit, and is used to spray chemical liquid onto the back of the wafer for cleaning; an absorber is arranged on the inner wall of the device body close to the coating component, and the absorber is used to absorb the chemical liquid sprayed by the flushing component.

[0047] Configured in this way, when the flushing component sprays chemical liquid onto the back side of the wafer for cleaning, the chemical liquid sprayed by the flushing component flushes the edge of the wafer in a direction that is angled with the axial direction of the device body, and the wafer keeps rotating around its axis during the spraying process. The chemical liquid is splashed toward the inner wall of the device body due to the centrifugal force, and then splashed back to the surface of the wafer through the inner wall of the device body, causing defects in the wafer and affecting the yield. The present application provides an absorber on the inner wall of the device body close to the coating component to absorb the chemical liquid splashed onto the inner wall of the device body, thereby reducing the probability of the chemical liquid splashing back to the wafer surface, thereby improving the product yield.

[0048] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of the utility model. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A coating device, characterized in that: include: Spraying unit, carrying unit and device body; The carrying unit is arranged inside the device body and is used for loading wafers; The spray unit includes a coating component and a flushing component. The coating component is located outside the device body and is used to spray chemical reagents onto the surface of the wafer. The flushing component is arranged on a side of the wafer close to the carrying unit and is used to spray chemical liquid onto the back of the wafer for cleaning. An absorber is arranged on the inner wall of the device body close to the coating component, and the absorber is used to absorb the chemical liquid sprayed by the flushing component.

2. The coating device according to claim 1, characterized in that: The absorbent is arranged along the circumference of the device body.

3. The coating device according to claim 1, characterized in that: The device body is provided with a narrowing section at a side away from the carrying unit, and the absorbent is provided at the narrowing section.

4. The coating device according to claim 3, characterized in that: The device body gradually narrows in a direction away from the carrying unit to form an opening, and the wafer is located between the opening and the flushing component in the axial direction of the device body.

5. The coating device according to claim 1, characterized in that: The coating device further comprises a first driving unit, which is connected to the coating assembly and can move along its own axial direction to drive the coating assembly to move along the axial direction of the first driving unit toward or away from the device body.

6. The coating device according to claim 5, characterized in that: The coating assembly includes a first nozzle and a second nozzle, the first nozzle and the second nozzle are respectively connected to the first driving unit, and the first nozzle and the second nozzle are used to spray different chemical reagents.

7. The coating device according to claim 1, characterized in that: The coating device further comprises a second driving unit connected to the bearing unit, the second driving unit being capable of rotating about an axis and moving along its own axial direction to drive the bearing unit to rotate and / or move along the axial direction of the second driving unit.

8. The coating device according to claim 1, characterized in that: The flushing assembly comprises a third nozzle, and the extension direction of the third nozzle is arranged at an angle with the axial direction of the device body.

9. The coating device according to claim 1, characterized in that: The coating device further comprises a plurality of delivery pipelines, which are respectively connected to the coating component and the flushing component and are used for delivering the chemical reagent and the chemical liquid.

10. A lithography apparatus, characterized in that: The invention comprises a coating device as claimed in any one of claims 1 to 9.

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