Rectangular wafer spin-coating bearing device

Abstract

The utility model provides a rectangular wafer spin-coating bearing device which comprises a rack, a motor is arranged on the rack, a vacuum adsorption platform is arranged on one side of an output shaft of the motor, the vacuum adsorption platform comprises a lifting device connected with one end of the output shaft of the motor and an adsorption table arranged at one end, far away from the motor, of the lifting device, and a locking mechanism is arranged on the side edge of the adsorption table. The locking mechanism comprises locking assemblies arranged in an array mode and a supporting frame for fixing and supporting the locking assemblies, one end of the supporting frame is axially and fixedly connected with an output shaft of the motor, the lifting device is fixed to the supporting frame, and each locking assembly comprises a locking air cylinder fixed to the supporting frame and a clamping block fixedly connected with an output shaft of the locking air cylinder. According to the rectangular wafer spin-coating bearing device disclosed by the utility model, the rectangular wafer with the same size can be locked under the pushing of the locking cylinder, the locking mechanism and the wafer integrally rotate, so that the rectangular wafer is spin-coated more uniformly, and the back cleaning device is also arranged at the lower end of the wafer and is used for cleaning a small amount of colloid on the side edge of the rectangular wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a rectangular wafer spin coating carrying device. Background Art

[0002] During the wafer manufacturing process, a layer of photoresist needs to be spin-coated on the wafer surface in order to achieve pattern transfer and define circuit structure.

[0003] In the prior art, most semiconductor wafers are round, so the carrier used for photoresist spin coating is mostly a circular vacuum adsorption carrier, which is installed on a rotating motor and has a vacuum adsorption hole in the center. After the wafer is placed on the carrier, the vacuum is turned on to adsorb the wafer and then it can be rotated at high speed. In MEMS sensor manufacturing, most wafers are rectangular. If this carrier is directly used for photoresist spin coating on rectangular wafers, it will cause the following shortcomings:

[0004] 1. Poor uniformity of photoresist film formation: Since the angular velocity of each corner of the rectangle is different during the rotation process, the amount of photoresist thrown out is unstable, which will lead to poor uniformity of the overall film thickness of the rectangular wafer;

[0005] 2. After spin coating, photoresist will remain on the side of the wafer. Utility Model Content

[0006] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a rectangular wafer spin coating support device, aiming to solve the technical problems in the prior art of poor uniformity of photoresist film spin coating and residual photoresist on the side of the wafer after spin coating.

[0007] In order to achieve the above-mentioned purpose, the utility model is implemented through the following technical scheme: a rectangular wafer spin coating supporting device includes a stand, the stand is provided with a motor, a vacuum adsorption platform is provided on one side of the output shaft of the motor, the vacuum adsorption platform includes a lifting device connected to one end of the motor output shaft, and an adsorption platform is arranged at one end of the lifting device away from the motor, a locking mechanism is provided on the side of the adsorption platform, the locking mechanism includes a locking assembly arranged in an array, and a support frame fixedly supporting the locking assembly, one end of the support frame is axially fixedly connected to the motor output shaft, the lifting device is fixed on the support frame, the locking assembly includes a locking cylinder fixed on the support frame, and a clamping block fixedly connected to the output shaft of the locking cylinder.

[0008] According to one aspect of the above technical solution, the lifting device includes a hydraulic rod and a support rod axially connected to the hydraulic rod. The lifting device also includes a cylindrical synchronous sleeve nested on the outside of the support rod, and the support frame is fixedly connected to the synchronous sleeve.

[0009] According to one aspect of the above technical solution, the inner wall of the synchronous sleeve near one end of the hydraulic rod extends radially in an array to form a key pin, the support rod near one end of the hydraulic rod is provided with a slide groove matching the key pin, and the slide groove is provided with a groove matching the key pin at one end away from the hydraulic rod.

[0010] According to one aspect of the above technical solution, the slide groove and the groove are in communication.

[0011] According to one aspect of the above technical solution, a rectangular cavity for accommodating wafers is provided on the upper side of the adsorption platform, and the cavity is formed by enclosing four clamping blocks.

[0012] According to one aspect of the above technical solution, a tapered roller bearing is provided between the motor and the support frame, and the support frame is axially fixedly connected to the motor through the tapered roller bearing.

[0013] According to one aspect of the above technical solution, a plurality of back cleaning devices are provided on the support frame, and the back cleaning devices are located on one side of the adsorption platform.

[0014] According to one aspect of the above technical solution, a motor bracket for fixing the motor is fixed on the stand.

[0015] Compared with the prior art, the beneficial effect of the utility model lies in: by adding a locking mechanism around the vacuum adsorption platform, the rectangular wafer is locked in the cavity, and then the rectangular wafer and the locking mechanism form a circular whole and rotate together, thereby simulating the spin coating of the circular wafer to achieve a uniform effect of spin coating of the circular wafer, and the key pin in the lifting device can be used to connect with the slide groove and the groove, so that the vacuum adsorption platform can rotate independently, and cooperate with the back cleaning device to achieve the side cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a rectangular wafer spin coating carrying device in one embodiment of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of a vacuum adsorption platform in one embodiment of the utility model;

[0018] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of part A;

[0019] Figure 4 This is a schematic diagram of the locking mechanism structure in one embodiment of the utility model;

[0020] Description of main component symbols:

[0021] 1- vacuum adsorption platform, 11- adsorption platform;

[0022] 12-lifting device, 121-support rod, 122 hydraulic rod, 123-synchronous sleeve, 124-key pin, 125-slide groove, 126-groove;

[0023] 2-locking mechanism, 21-locking assembly, 211-locking cylinder, 212-clamping block;

[0024] 22-support frame, 221-tapered roller bearing;

[0025] 3-motor, 31-motor bracket;

[0026] 4-stand;

[0027] 5-Back cleaning device;

[0028] 6- Cavity;

[0029] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] See also Figure 1, shown is a rectangular wafer spin coating carrying device in an embodiment of the utility model, including a stand 4, a motor 3 is provided on the stand 4, a vacuum adsorption platform 1 is provided on one side of the output shaft of the motor 3, the vacuum adsorption platform 1 includes a lifting device 12 connected to one end of the output shaft of the motor 3, and an adsorption platform 11 arranged at one end of the lifting device 12 away from the motor 3, the lifting device 12 is vertically arranged at the center of the adsorption platform 11, the lifting device 12 is perpendicular to the stand 4, a locking mechanism 2 is provided on the side of the adsorption platform 11, the locking mechanism 2 includes a locking assembly 21 arranged in an array, and a support frame 22 fixedly supporting the locking assembly 21, one end of the support frame 22 is axially fixedly connected to the output shaft of the motor 3, the support frame 22 is connected to the lifting device 12 away from the motor 3, the locking assembly 21 includes a locking cylinder 211 fixed on the support frame 22, and a clamping block 212 fixedly connected to the output shaft of the locking cylinder 211.

[0034] Among them, the clamping block 212 can perform axial reciprocating motion under the action of the push rod of the locking cylinder 211. When the clamping blocks 212 are against each other, a rectangular cavity 6 that can hold rectangular wafers is formed in the middle, and rectangular wafers of different sizes can be stored. A wafer adsorption platform 11 and a lifting device 12 that supports and can push the adsorption platform 11 to rise and fall are provided at the lower end of the cavity 6. The lifting device 12 includes a support rod 121 vertically connected to the adsorption platform 11, and a hydraulic rod 122 radially connected to the support rod 121, and the hydraulic rod 122 is controlled to extend and retract through an electronic control. The lifting device 12 also includes a synchronous sleeve 123 in a cylindrical tube shape nested on the outside of the support rod 121, and the outer side of the synchronous sleeve 123 is connected to the support frame 22 of the locking mechanism 2;

[0035] In this embodiment, a driving motor 3 is provided at one end of the lifting device 12, and the motor 3 is fixed to a motor bracket 31 by bolts. Meanwhile, the motor bracket 31 is fixedly connected to the stand 4, so that the entire spin coating device transfers gravity to the stand 4 through the motor bracket 31.

[0036] See also Figure 4 It should be supplemented that a tapered roller bearing 221 is installed between the motor bracket 31 and the hydraulic rod 122 . The tapered roller bearing 221 is connected to one end of the support frame 22 for fixing and supporting the entire locking mechanism 2 .

[0037] See also Figures 2 to 4In specific implementation, when it is necessary to place a rectangular wafer, the locking assembly 21 of the locking mechanism 2 is released, and the hydraulic rod 122 pushes the support rod 121 and the adsorption platform 11 to the highest position through the piston rod. At this time, an external robotic arm or manual operation places the rectangular wafer that needs to be coated with glue on the center of the rectangular adsorption platform 11. At the same time, the rectangular adsorption platform 11 starts the adsorption function, and the adsorption platform 11 adsorbs the wafer to complete a fixation. Then the lifting device 12 is recovered to the low position. When it is in the low position, the upper surface of the rectangular wafer is level with the upper surface of the clamping block 212. Then the locking cylinder 211 pushes the clamping block 212. The four clamping blocks 212 move closer to the center, and the middle is surrounded to form a rectangular cavity 6 for accommodating the wafer. The wafer is located in the empty In the cavity 6, the wafer is locked to complete the secondary fixation. After the fixation is completed, the motor 3 is started to drive the entire vacuum adsorption platform 1 to rotate at high speed; in order to simultaneously drive the entire locking mechanism 2 to rotate, the inner wall radial array of the synchronous sleeve 123 close to one end of the hydraulic rod 122 extends to form a key pin 124, and the outer side is fixedly connected to the support frame 22, and the support rod 121 is provided with a slide groove 125 matching the key pin 124 at one end close to the hydraulic rod 122, and the slide groove 125 is provided with a groove 126 matching the key pin 124 at one end away from the hydraulic rod 122. Through the limiting of the key pin 124 and the slide groove 125, the locking mechanism 2 rotates together with the vacuum adsorption platform 1.

[0038] When in the low position, the key pin 124 is located in the slide groove 125, and the synchronous sleeve 123 and the support rod 121 form a key pin 124 type connection. Because the support frame 22 is fixedly connected to the synchronous sleeve, and a tapered roller bearing 221 is installed between the motor 3 and the hydraulic rod 122, and the tapered roller bearing 221 is fixedly connected to the support frame 22, the locking mechanism 2 can be supported when it rotates with the vacuum adsorption platform 1. In this way, the vacuum adsorption platform 1 and the locking mechanism 2 form a whole and rotate with the motor 3. At this time, photoresist is sprayed at the center of the crystal. Since the locking mechanism 2 forms a whole with the rectangular wafer, it is similar to the glue coating of a circular wafer, so that the glue coating on the entire rectangular wafer surface is more uniform.

[0039] After the spin coating is completed, since some photoresist still remains on the edge of the rectangular wafer, it is necessary to clean the excess photoresist on the lower side, the locking cylinder 211 is loosened, the clamping block 212 is separated from the rectangular wafer, and the hydraulic rod 122 raises the support rod 121 and the adsorption platform 11 to the highest position, and the motor 3 is started. At this time, since the slide groove 125 is connected to the groove 126, the support rod 121 allows the key pin 124 to slide from the slide groove 125 to the groove 126, so that the synchronous sleeve 123 and the support rod 121 are disconnected from the key pin 124, and the vacuum adsorption platform 1 drives the rectangular wafer to rotate at a low speed, and the back cleaning device is started to rinse the back of the rectangular crystal and clean the colloid on the back and edge of the rectangular wafer through centrifugal force. It should be supplemented that two sets of back cleaning devices 5 are provided on the support frame 22, and the back cleaning device 5 is located on one side of the adsorption platform 11.

[0040] After cleaning is completed, the back cleaning device is turned off, and the rectangular wafer continues to rotate at a low speed until it is dry. After the motor 3 stops rotating, the vacuum adsorption platform 1 is turned off, and the rectangular wafer is taken out by a robot arm or manually.

[0041] In summary, the spin coating supporting device for rectangular wafers in the above-mentioned embodiments of the utility model is mainly to solve the problem that the rectangular wafers in the prior art are unevenly coated with photoresist, which is not as good as the spin coating effect of circular wafers. Therefore, a locking mechanism is installed in an array around the vacuum adsorption platform, and the rectangular wafer is fixed in the locking mechanism with a cavity in the middle for accommodating the rectangular wafer. The locking structure and the rectangular wafer are formed into a circular body as a whole to simulate the spin coating of the circular wafer so as to achieve a uniform effect of spin coating of the circular wafer.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0043] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the attached claims.

Claims

1. A rectangular wafer spin coating carrier, characterized in that: It includes a stand, on which a motor is provided, and a vacuum adsorption platform is provided on one side of the output shaft of the motor, the vacuum adsorption platform includes a lifting device connected to one end of the motor output shaft, and an adsorption platform arranged at an end of the lifting device away from the motor, a locking mechanism is provided on the side of the adsorption platform, the locking mechanism includes a locking assembly arranged in an array, and a support frame fixedly supporting the locking assembly, one end of the support frame is axially fixedly connected to the motor output shaft, the lifting device is fixed on the support frame, the locking assembly includes a locking cylinder fixed on the support frame, and a clamping block fixedly connected to the output shaft of the locking cylinder.

2. The rectangular wafer spin coating carrier according to claim 1, characterized in that: The lifting device includes a hydraulic rod and a support rod axially connected to the hydraulic rod. The lifting device also includes a cylindrical synchronous sleeve nested outside the support rod. The support frame is fixedly connected to the synchronous sleeve.

3. The rectangular wafer spin coating carrier according to claim 2, characterized in that: The inner wall of the synchronous sleeve near one end of the hydraulic rod extends radially in an array to form a key pin, the support rod near one end of the hydraulic rod is provided with a slide groove matching the key pin, and the slide groove is provided with a groove matching the key pin at one end away from the hydraulic rod.

4. The rectangular wafer spin coating carrying device according to claim 3, characterized in that: The slide groove is communicated with the groove.

5. The rectangular wafer spin coating carrier according to claim 1, characterized in that: A rectangular cavity for accommodating wafers is disposed on the upper side of the adsorption platform, and the cavity is surrounded by four clamping blocks.

6. The rectangular wafer spin coating carrying device according to claim 1, characterized in that: A tapered roller bearing is provided between the motor and the support frame, and the support frame is axially fixedly connected to the motor through the tapered roller bearing.

7. The rectangular wafer spin coating carrying device according to claim 1, characterized in that: The support frame is provided with a plurality of back cleaning devices, and the back cleaning devices are located at one side of the adsorption platform.

8. The rectangular wafer spin coating carrier according to claim 1, characterized in that: A motor bracket for fixing the motor is fixedly provided on the stand.

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