Insulated epoxy board

Abstract

The utility model relates to an insulating epoxy board, which comprises an epoxy board body, the epoxy board body comprises a first outer layer, a first heat dissipation layer, a first buffer layer, a base layer, a second buffer layer, a second heat dissipation layer, a second outer layer and a bonding layer, the first outer layer is arranged on the top of the first heat dissipation layer, and the first heat dissipation layer and the second buffer layer are arranged on two sides of the base layer. The heat dissipation performance of the epoxy board body is conveniently improved through the heat dissipation holes in the first heat dissipation layer and the second heat dissipation layer, the situation that the insulation performance is reduced due to the fact that the temperature of the epoxy board body is too high is avoided, and the use effect is improved; the impact strength of the epoxy board body is improved through the buffer springs in the first buffer layer and the second buffer layer, the buffer plates are driven to slide in the buffer grooves through the buffer T-shaped columns, the damping effect is generated through the damping liquid, it is guaranteed that the buffer springs can return to the static balance state, the epoxy board body is prevented from being damaged due to impact force, and the use effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of epoxy boards, in particular to an insulating epoxy board. Background Art

[0002] Epoxy board usually refers to a board made of epoxy resin composite material, which has excellent insulation properties. Epoxy resin is a polymer material with good insulation properties, chemical corrosion resistance and mechanical strength, so it is often used to make insulation materials;

[0003] After searching, the Chinese patent with announcement number: CN205862907U discloses an insulating epoxy board, including a glass fiber board, wherein: a layer of adhesive film containing epoxy resin and rubber is arranged on the glass fiber board, and the adhesive film is tightly bonded to the surface of the glass fiber board; the insulating epoxy board of the utility model is a layer of adhesive film arranged on the glass fiber, the adhesive film has excellent bonding performance, is not easy to fall off at a low temperature of -50 to -10 degrees, and has good insulation performance, and a plurality of holes are arranged on the epoxy board, so that the two sides of the epoxy board have good electrical conductivity.

[0004] When this patent is actually used, it has the following defects:

[0005] This patent only has a single insulation performance during use and does not have good heat dissipation performance. In a high temperature environment, the insulation performance of the epoxy board will be reduced, affecting the use effect. It also has poor impact resistance and is easily damaged by impact, affecting normal use. Utility Model Content

[0006] In view of the technical problems in the existing patents, which only have a single insulation performance and do not have good heat dissipation performance, the insulation performance of the epoxy board will be reduced in a high temperature environment, affecting the use effect, and the impact resistance is poor, and it is easy to be damaged by impact force, affecting normal use. The utility model provides an insulating epoxy board.

[0007] The technical solution adopted by the utility model is: an insulating epoxy board, including an epoxy board body, the epoxy board body including a first outer layer, a first heat dissipation layer, a first buffer layer, a base layer, a second buffer layer, a second heat dissipation layer, a second outer layer and an adhesive layer, the first outer layer is installed on the top of the first heat dissipation layer, the first heat dissipation layer and the second buffer layer are installed on both sides of the base layer, the second outer layer is installed on the bottom of the second heat dissipation layer, and the adhesive layer corresponds to the first outer layer, the first heat dissipation layer, the first buffer layer, the base layer, the second buffer layer, the second heat dissipation layer and the second outer layer respectively.

[0008] Furthermore, the first outer layer is bonded to the top of the first heat dissipation layer through the adhesive layer, and the second outer layer is bonded to the bottom of the second heat dissipation layer through the adhesive layer. The first heat dissipation layer and the second heat dissipation layer are both made of epoxy resin and are both provided with heat dissipation holes. The first outer layer and the second outer layer are both made of epoxy resin and wear-resistant material layer, and the adhesive layer is made of adhesive material layer, which is convenient for improving the heat dissipation performance of the epoxy board body.

[0009] Furthermore, the first buffer layer is respectively bonded to the bottom of the first heat dissipation layer and the top of the base layer through the adhesive layer, and the second buffer layer is respectively bonded to the top of the second heat dissipation layer and the bottom of the base layer through the adhesive layer, so as to conveniently improve the impact resistance of the epoxy board body.

[0010] Furthermore, the first buffer layer and the second buffer layer are both made of epoxy resin and have a buffer cavity inside. A buffer structure is installed inside the buffer cavity to improve the buffer performance.

[0011] Furthermore, the buffer structure includes a buffer spring, a buffer sleeve and a buffer T-shaped column. The buffer sleeve is arranged on the bottom wall of the buffer cavity, the buffer T-shaped column is installed on the top wall of the buffer cavity, and the buffer spring is welded between the inner side walls of the buffer cavity and is arranged on the outside of the buffer sleeve to facilitate buffering work.

[0012] Furthermore, a buffer groove is provided on the top of the buffer sleeve, damping fluid is installed inside the buffer groove, a buffer plate is fixedly welded to the bottom of the buffer T-shaped column, and the buffer plate is slidably connected to the inside of the buffer groove and corresponds to the damping fluid, so that the buffer spring can return to a static balance state.

[0013] The beneficial effects of the utility model are as follows: compared with the prior art, in the utility model,

[0014] 1. The heat dissipation performance of the epoxy board body can be improved through the heat dissipation holes on the first heat dissipation layer and the second heat dissipation layer, so as to avoid the reduction of insulation performance caused by excessive temperature of the epoxy board body and improve the use effect.

[0015] 2. The impact resistance of the epoxy board body is improved by the buffer springs in the first buffer layer and the second buffer layer. The buffer plate is driven to slide in the buffer groove by the buffer T-shaped column, and the damping effect is generated by the damping fluid to ensure that the buffer spring can return to a static equilibrium state, thereby avoiding damage to the epoxy board body due to impact force and improving the use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2It is a schematic diagram of the three-dimensional structure of the utility model after being disassembled;

[0018] Figure 3 It is a three-dimensional structural schematic diagram of the buffer structure in the utility model.

[0019] Marked in the figure are: 1. Epoxy board body; 2. First outer layer; 3. First heat dissipation layer; 4. First buffer layer; 5. Base layer; 6. Second buffer layer; 7. Second heat dissipation layer; 8. Second outer layer; 9. Adhesive layer; 10. Buffer structure; 11. Buffer spring; 12. Buffer sleeve; 13. Buffer T-shaped column. DETAILED DESCRIPTION

[0020] In the description of the present invention, it should be noted that the terms "front", "up", "down", "left", "right", "vertical", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] The following is combined with Figure 1-3 The utility model is further described.

[0023] In order to solve the problems existing in the background technology, the present application proposes the following technical solution: an insulating epoxy board.

[0024] In the specific technical scheme, it includes an epoxy board body 1, which includes a first outer layer 2, a first heat dissipation layer 3, a first buffer layer 4, a base layer 5, a second buffer layer 6, a second heat dissipation layer 7, a second outer layer 8 and an adhesive layer 9. The first outer layer 2 is installed on the top of the first heat dissipation layer 3, the first heat dissipation layer 3 and the second buffer layer 6 are installed on both sides of the base layer 5, the second outer layer 8 is installed on the bottom of the second heat dissipation layer 7, and the adhesive layer 9 corresponds to the first outer layer 2, the first heat dissipation layer 3, the first buffer layer 4, the base layer 5, the second buffer layer 6, the second heat dissipation layer 7 and the second outer layer 8 respectively.

[0025] Reference Figure 1-2The first outer layer 2 is bonded to the top of the first heat dissipation layer 3 through the adhesive layer 9, and the second outer layer 8 is bonded to the bottom of the second heat dissipation layer 7 through the adhesive layer 9. The first heat dissipation layer 3 and the second heat dissipation layer 7 are both made of epoxy resin and have heat dissipation holes. The first outer layer 2 and the second outer layer 8 are both made of epoxy resin and wear-resistant material layers. The adhesive layer 9 is made of an adhesive material layer. The heat dissipation performance of the epoxy board body 1 is conveniently improved through the heat dissipation holes on the first heat dissipation layer 3 and the second heat dissipation layer 7 to avoid the reduction of insulation performance due to excessive temperature of the epoxy board body 1. The first buffer layer 4 is respectively bonded to the bottom of the first heat dissipation layer 3 and the top of the base layer 5 through the adhesive layer 9, and the second buffer layer 6 is respectively bonded to the top of the second heat dissipation layer 7 and the bottom of the base layer 5 through the adhesive layer 9. The impact resistance of the epoxy board body 1 is improved through the first buffer layer 4 and the second buffer layer 6.

[0026] Reference Figure 1 , Figure 3 The first buffer layer 4 and the second buffer layer 6 are both made of epoxy resin and have a buffer cavity inside. A buffer structure 10 is installed inside the buffer cavity. The buffer structure 10 includes a buffer spring 11, a buffer sleeve 12 and a buffer T-shaped column 13. The buffer sleeve 12 is installed on the bottom wall of the buffer cavity, and the buffer T-shaped column 13 is installed on the top wall of the buffer cavity. The buffer spring 11 is welded between the inner side walls of the buffer cavity and is sleeved on the outside of the buffer sleeve 12. The buffer spring 11 buffers the impact force to improve the impact strength of the epoxy board body 1. A buffer groove is opened on the top of the buffer sleeve 12, and damping liquid is installed in the buffer groove. A buffer plate is fixedly welded at the bottom of the buffer T-shaped column 13. The buffer plate is slidably connected to the inside of the buffer groove and corresponds to the damping liquid. The damping effect is generated by the damping liquid to ensure that the buffer spring 11 can return to a static equilibrium state, avoid damage to the epoxy board body 1 caused by impact force, and improve the use effect.

[0027] In order for those skilled in the art to fully understand the technical solution, this application makes the following overall summary:

[0028] When in use, the heat dissipation performance of the epoxy board body 1 is conveniently improved through the heat dissipation holes on the first heat dissipation layer 3 and the second heat dissipation layer 7, so as to avoid the epoxy board body 1 from being overheated and causing the insulation performance to be reduced, thereby improving the use effect. The buffer spring 11 in the first buffer layer 4 and the second buffer layer 6 is used to improve the impact resistance of the epoxy board body 1. The buffer T-shaped column 13 drives the buffer plate to slide in the buffer groove, and the damping effect is generated by the damping liquid to ensure that the buffer spring 11 can return to a static equilibrium state, thereby avoiding the epoxy board body 1 from being damaged by impact force, thereby improving the use effect.

[0029] The standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The content not described in detail in this specification belongs to the prior art known to professional and technical personnel in this field.

[0030] Although the embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An insulating epoxy board, characterized in that: The epoxy board body (1) comprises a first outer layer (2), a first heat dissipation layer (3), a first buffer layer (4), a base layer (5), a second buffer layer (6), a second heat dissipation layer (7), a second outer layer (8) and an adhesive layer (9), wherein the first outer layer (2) is arranged on the top of the first heat dissipation layer (3), the first heat dissipation layer (3) and the second buffer layer (6) are arranged on both sides of the base layer (5), the second outer layer (8) is arranged on the bottom of the second heat dissipation layer (7), and the adhesive layer (9) corresponds to the first outer layer (2), the first heat dissipation layer (3), the first buffer layer (4), the base layer (5), the second buffer layer (6), the second heat dissipation layer (7) and the second outer layer (8) respectively.

2. An insulating epoxy board according to claim 1, characterized in that: The first outer layer (2) is bonded to the top of the first heat dissipation layer (3) through the adhesive layer (9), and the second outer layer (8) is bonded to the bottom of the second heat dissipation layer (7) through the adhesive layer (9), and heat dissipation holes are provided on the first heat dissipation layer (3) and the second heat dissipation layer (7).

3. An insulating epoxy board according to claim 2, characterized in that: The first buffer layer (4) is respectively bonded to the bottom of the first heat dissipation layer (3) and the top of the base layer (5) through the adhesive layer (9), and the second buffer layer (6) is respectively bonded to the top of the second heat dissipation layer (7) and the bottom of the base layer (5) through the adhesive layer (9).

4. The insulating epoxy board according to claim 1, characterized in that: A buffer cavity is provided inside each of the first buffer layer (4) and the second buffer layer (6), and a buffer structure (10) is installed inside the buffer cavity.

5. An insulating epoxy board according to claim 4, characterized in that: The buffer structure (10) comprises a buffer spring (11), a buffer sleeve (12) and a buffer T-shaped column (13); the buffer sleeve (12) is mounted on the bottom wall of the buffer cavity, the buffer T-shaped column (13) is mounted on the top wall of the buffer cavity, and the buffer spring (11) is fused between the inner side walls of the buffer cavity and is sleeved on the outside of the buffer sleeve (12).

6. An insulating epoxy board according to claim 5, characterized in that: The top of the buffer sleeve (12) is provided with a buffer groove, and damping liquid is installed in the buffer groove. A buffer plate is fixedly welded to the bottom of the buffer T-shaped column (13), and the buffer plate is slidably connected to the inside of the buffer groove and corresponds to the damping liquid.

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