Slide glass tray for ion cleaning machine

Abstract

The utility model discloses a slide glass tray for an ion cleaning machine, which comprises a bottom plate, a slide glass frame is arranged at the top of the bottom plate, clamping sleeves are arranged at the two ends of the bottom plate on the left side and the right side of the slide glass frame, and the slide glass frame comprises two first placing plates which are parallel to each other. One ends of the two first placing plates are flush with the edge of the front side of the bottom plate, a second placing plate is arranged between the other ends of the first placing plates, the second placing plate is a semicircular placing plate, and the two first placing plates and the second placing plate are closed to form a U shape; first limiting strips which are parallel to each other are arranged on the edges of the outer sides of the tops of the two first placing plates, a second limiting strip is connected between the two first limiting strips located on the top of the second placing plate, the second limiting strip is a semicircular limiting strip, and the two first limiting strips and the second limiting strip are closed to form a U shape.

Description

Technical Field

[0001] The utility model relates to the technical field of ion cleaning machines, in particular to a wafer carrier tray used for ion cleaning machines. Background Art

[0002] Wafer cleaning is very important as the foundation of the semiconductor industry. The cleaning effect directly affects the final performance, efficiency and stability of electronic products. Cleaning wafers not only removes impurities on the surface of the wafer, but also passivates the surface of the wafer, thereby reducing the adsorption capacity of the wafer surface. High-specification wafers have very strict requirements on the cleanliness of the surface. In theory, no particles, metal ions, organic adhesion, water vapor, or oxide layer are allowed to exist, and the wafer surface is required to have atomic-level flatness.

[0003] A plasma cleaning machine uses high-energy plasma to bombard the surface of an object to be cleaned to achieve cleaning of the object surface. The object to be cleaned is generally placed on a tray, and the tray is then placed in a sealed plasma cleaning machine. The tray in the prior art is generally a flat plate on which multiple objects to be cleaned are placed. When the objects to be cleaned are being cleaned, the objects to be cleaned are prone to move along the plane of the flat plate. The movement of the objects to be cleaned may cause multiple objects to be cleaned to overlap and block each other, thereby affecting the final cleaning effect. In addition, when the objects to be cleaned move and contact the electrode plate in the plasma cleaning machine, it is easy to cause the plasma cleaning machine to malfunction.

[0004] In this regard, a wafer carrier tray for an ion cleaning machine is proposed to solve the above problems. Summary of the invention

[0005] The utility model aims to provide a wafer carrier tray for an ion cleaning machine, so as to solve the problems mentioned in the background technology.

[0006] In order to achieve the above object, the technical solution of the utility model is:

[0007] A wafer carrier tray for an ion cleaning machine comprises a base plate, a wafer carrier is arranged on the top of the base plate, and sleeves are arranged at both ends of the base plate located on the left and right sides of the wafer carrier, the wafer carrier comprises two mutually parallel first placement plates, one end of the two first placement plates is flush with the front edge of the base plate, a second placement plate is arranged between the other ends of the first placement plates, the second placement plate is a semicircular placement plate, the two first placement plates and the second placement plates are closed to form a U-shape, the outer edges of the tops of the two first placement plates are respectively provided with mutually parallel first limit strips, a second limit strip is connected between the two first limit strips located on the tops of the second placement plates, the second limit strip is a semicircular limit strip, and the two first limit strips and the second limit strip are closed to form a U-shape.

[0008] Furthermore, a plurality of first positioning holes penetrating to the outside of the first placement plate are formed on the top of the first limiting strip, and a plurality of second positioning holes penetrating to the outside of the second placement plate are formed on the top of the second limiting strip.

[0009] Furthermore, the top of the base plate is provided with a plurality of third positioning holes corresponding to the first positioning holes and the second positioning holes, and both sides of the top of the base plate located outside the slide rack are provided with a plurality of through grooves extending upward and downward, and the top of the base plate is provided with a through hole extending upward and downward and corresponding to the inner diameter of the second placement plate, and the front side of the base plate is provided with a groove connected by the through holes, and the width of the opening of the groove is the same as the distance between the two first placement plates.

[0010] Furthermore, the sleeve includes a connecting plate that is sleeved on the side of the base plate, and a slot for embedding the base plate is provided on the side of the connecting plate close to the base plate, and a plurality of fourth positioning holes that pass through the connecting plate from top to bottom are provided on the connecting plate at the upper and lower sides of the slot, and a plurality of fifth positioning holes corresponding to the fourth positioning holes are provided on the top of the base plate.

[0011] Furthermore, the wafer carrier is entirely made of ceramic material.

[0012] Furthermore, the entire ferrule is made of ceramic material.

[0013] The beneficial effects of the utility model are:

[0014] When the utility model is in use, the two connecting plates are respectively sleeved on both sides of the bottom plate, and then the fourth positioning hole and the fifth positioning hole are fixed with bolts, the wafer carrier is placed on the bottom plate, and after the first positioning hole, the second positioning hole and the third positioning hole are fixed by bolts, the wafer to be cleaned is placed on the first placement plate and the second placement plate and can be put into the ion cleaning machine for cleaning. Since the second placement plate is configured as a semicircular placement plate, and a second limiting strip which is also a semicircular ring is configured at the top edge of the second placement plate, the position of the wafer during ion cleaning can be fixed, thereby improving the cleaning quality; at the same time, the wafer carrier and the ferrule are made of ceramic material as a whole, and ceramic, as an insulating material, can prevent damage to the wafer while reducing the contamination of the wafer by other impurity metals; a through hole and a groove intersecting the through hole are provided on the top of the bottom plate, and a plurality of through grooves are provided on the top of the bottom plate outside the wafer carrier, so that the entire device is hollow inside, and circulating water can be connected, and an external chiller can be connected to realize water cooling function, thereby controlling the temperature in the production process and improving the process stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a structural schematic diagram of the utility model combination;

[0017] Figure 3 It is a structural schematic diagram of the slide carrier of the utility model. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation methods.

[0019] like Figure 1-3 As shown, a wafer carrier tray for an ion cleaning machine includes a base plate 1, a wafer carrier 2 is arranged on the top of the base plate 1, and a clamping sleeve 3 is arranged at both ends of the base plate 1 located on the left and right sides of the wafer carrier 2, and the wafer carrier 2 includes two first placing plates 21 parallel to each other, one end of the two first placing plates 21 is flush with the front edge of the base plate 1, and a second placing plate 25 is arranged between the other ends of the first placing plates 21, and the second placing plate 25 is a semicircular placing plate, and the two first placing plates 21 and the second placing plates 25 are closed to form a U-shape, and the outer edges of the tops of the two first placing plates 21 are provided with first limiting strips 26 parallel to each other, and a second limiting strip 23 is connected between the two first limiting strips 26 located on the tops of the second placing plates 25, and the second limiting strip 23 is a semicircular limiting strip, and the two first limiting strips 26 and the second limiting strip 23 are closed to form a U-shape.

[0020] A plurality of first positioning holes 22 are formed on the top of the first limiting strip 26 and extend to the outside of the first placement plate 21 . A plurality of second positioning holes 24 are formed on the top of the second limiting strip 23 and extend to the outside of the second placement plate 25 .

[0021] The top of the base plate 1 is provided with a plurality of third positioning holes 15 corresponding to the first positioning holes 22 and the second positioning holes 24, and both sides of the top of the base plate 1 located outside the slide rack 2 are provided with a plurality of through grooves 11 penetrating upward and downward, and the top of the base plate 1 is provided with a through hole 12 penetrating upward and downward and corresponding to the inner diameter of the second placement plate 25, and the front side of the base plate 1 is provided with a groove 13 intersecting the through hole 12, and the width of the opening of the groove 13 is the same as the distance between the two first placement plates 21.

[0022] The sleeve 3 includes a connecting plate 33 that is sleeved on the side of the base plate 1, and a slot 31 for embedding the base plate 1 is opened on the side of the connecting plate 33 close to the base plate 1, and a plurality of fourth positioning holes 32 that pass through the connecting plate 33 from top to bottom are opened on the upper and lower sides of the slot 31, and a plurality of fifth positioning holes 14 corresponding to the fourth positioning holes 32 are opened on the top of the base plate 1.

[0023] The wafer carrier 2 is made entirely of ceramic material, and the ferrule 3 is made entirely of ceramic material.

[0024] Working principle: When in use, the two connecting plates are respectively sleeved on both sides of the bottom plate, and then the fourth positioning hole and the fifth positioning hole are fixed with bolts, the wafer carrier is placed on the bottom plate, and after the first positioning hole, the second positioning hole and the third positioning hole are fixed by bolts, the wafer to be cleaned is placed on the first placement plate and the second placement plate, and then it can be put into the ion cleaning machine for cleaning. Since the second placement plate is configured as a semicircular placement plate, and a second limiting strip which is also a semicircular ring is provided at the top edge of the second placement plate, the position of the wafer during ion cleaning can be fixed to improve the cleaning quality; at the same time, the wafer carrier and the ferrule are made of ceramic material as a whole. Ceramics, as an insulating material, can prevent damage to the wafer while reducing the contamination of the wafer by other impurity metals; a through hole and a groove intersecting the through hole are provided on the top of the bottom plate, and a plurality of through grooves are provided on the top of the bottom plate outside the wafer carrier, so that the entire device is hollow inside, and circulating water can be connected, and an external chiller can be connected to realize water cooling function, thereby controlling the temperature in the production process and improving the process stability. The utility model has a simple structure and is easy to operate. It can fix the position of the wafer during ion cleaning, improve the cleaning quality, and at the same time prevent damage to the wafer and reduce the contamination of the wafer by other impurity metals.

[0025] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer carrier tray for an ion cleaning machine, comprising a bottom plate (1), a wafer carrier frame (2) being arranged on the top of the bottom plate (1), characterized in that: Both ends of the bottom plate (1) located on the left and right sides of the wafer carrier (2) are provided with a clamping sleeve (3), and the wafer carrier (2) comprises two mutually parallel first placement plates (21), one end of the two first placement plates (21) is flush with the front edge of the bottom plate (1), and a second placement plate (25) is arranged between the other ends of the first placement plates (21), and the second placement plate (25) is a semicircular ring placement plate. The two first placement plates (21) and the second placement plates (25) are closed to form a U-shape, and the top outer edges of the two first placement plates (21) are provided with mutually parallel first limiting strips (26), and a second limiting strip (23) is connected between the two first limiting strips (26) located on the top of the second placement plates (25), and the second limiting strip (23) is a semicircular ring limiting strip, and the two first limiting strips (26) and the second limiting strip (23) are closed to form a U-shape.

2. A wafer carrier tray for an ion cleaning machine according to claim 1, characterized in that: The top of the first limiting strip (26) is provided with a plurality of first positioning holes (22) extending through the first placement plate (21), and the top of the second limiting strip (23) is provided with a plurality of second positioning holes (24) extending through the second placement plate (25).

3. A wafer carrier tray for an ion cleaning machine according to claim 2, characterized in that: The top of the bottom plate (1) is provided with a plurality of third positioning holes (15) corresponding to the first positioning holes (22) and the second positioning holes (24); the top of the bottom plate (1) located outside the wafer carrier (2) is provided with a plurality of through grooves (11) extending vertically therethrough on both sides; the top of the bottom plate (1) is provided with a through hole (12) extending vertically therethrough and corresponding to the inner diameter of the second placement plate (25); the front side of the bottom plate (1) is provided with a groove (13) intersecting the through hole (12); the width of the opening of the groove (13) is the same as the distance between the two first placement plates (21).

4. A wafer carrier tray for an ion cleaning machine according to claim 1, characterized in that: The clamping sleeve (3) comprises a connecting plate (33) sleeved on the side of the base plate (1); a clamping groove (31) for embedding the base plate (1) is provided on the side of the connecting plate (33) close to the base plate (1); a plurality of fourth positioning holes (32) penetrating from top to bottom are provided on the connecting plate (33) at the upper and lower sides of the clamping groove (31); and a plurality of fifth positioning holes (14) corresponding to the fourth positioning holes (32) are provided on the top of the base plate (1).

5. A wafer carrier tray for an ion cleaning machine according to claim 1, characterized in that: The entire wafer carrier (2) is made of ceramic material.

6. A wafer carrier tray for an ion cleaning machine according to claim 1, characterized in that: The entire ferrule (3) is made of ceramic material.

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