Wafer angle adjusting mechanism
By designing a wafer angle adjustment mechanism that contains the base, adjust the motor, the turntable, and the reflective sensor, the problem of the wafer position offset is solved, the automatic detection and angle adjustment of the wafer position is realized, and the accuracy is improved.
Patent Information
- Application Number
- CN202323327655.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-07
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2033-12-07
AI Technical Summary
During the process of wafer processing and testing, the wafer is prone to position deviation, resulting in the need to manually adjust the position for operation, affecting the accuracy.
Design a wafer angle adjustment mechanism, including base, adjustment motor, turntable, and reflective sensor. The gap position on the wafer is detected by the sensor to control the adjustment of the motor to drive the turntable to achieve the automatic position detection and angle adjustment of the wafer of the wafer.
The automatic detection and recognition and angle adjustment of the wafer position is realized, the accuracy of the wafer position is improved, and the need for manual adjustment has been reduced.
Smart Images
Figure CN222421933U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a wafer angle adjustment mechanism and belongs to the technical field of wafer testing. Background Art
[0002] Currently, during the processing and testing of wafers, a transport mechanism is required to move the wafers between different processes. However, during the process of transporting the wafers, the wafers are prone to position shift, and the position of the wafers needs to be adjusted to the corresponding position before operation can be performed. Utility Model Content
[0003] The utility model aims to provide a wafer angle adjustment mechanism, which can realize automatic detection and identification of the wafer position, and adjust the circumferential angle of the wafer through the rotation of a turntable, thereby improving the position accuracy of the wafer.
[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a wafer angle adjustment mechanism, comprising: a base and an adjustment motor installed below one end of the base, the output shaft of the adjustment motor extends vertically upward and is connected to a turntable arranged above the base, the upper surface of the turntable is used to overlap and contact with the lower surface of the wafer, and at least one sensor is installed on the upper surface of the other end of the base and located on the outside of the turntable, a notch corresponding to the sensor is formed on the wafer, and the sensor is electrically connected to the adjustment motor.
[0005] The further improved scheme in the above technical scheme is as follows:
[0006] 1. In the above solution, the sensor is a reflective sensor. When the sensor receives a reflection signal from the wafer, the motor is controlled to drive the turntable to rotate.
[0007] 2. In the above scheme, there are two sensors, which are arranged at intervals along the radial direction of the turntable.
[0008] 3. In the above solution, a straight-edge notch is formed on the circular wafer.
[0009] 4. In the above solution, the sensor is mounted on the upper surface of the base through a support and the upper end surface of the sensor is lower than the upper surface of the turntable.
[0010] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:
[0011] The utility model provides a wafer angle adjustment mechanism, wherein the output shaft of the adjustment motor extends vertically upward and is connected to a turntable arranged above a base, the upper surface of the turntable is used for overlapping contact with the lower surface of the wafer, at least one sensor is installed on the upper surface of the other end of the base and located on the outer side of the turntable, a notch corresponding to the sensor is formed on the wafer, the sensor is electrically connected to the adjustment motor, automatic detection and identification of the wafer position can be realized, and the circumferential angle of the wafer can be adjusted by rotating the turntable, thereby improving the position accuracy of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Attached Figure 1 This is a schematic diagram of the structure of the wafer angle adjustment mechanism of the utility model;
[0013] Attached Figure 2 It is a partial structural schematic diagram of the wafer angle adjustment mechanism of the utility model.
[0014] In the above drawings: 100, wafer; 101, notch; 1, adjustment motor; 2, turntable; 3, sensor; 31, support; 4, base. DETAILED DESCRIPTION
[0015] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.
[0016] Embodiment 1: A wafer angle adjustment mechanism comprises: a base 4 and an adjustment motor 1 installed below one end of the base 4, wherein the output shaft of the adjustment motor 1 extends vertically upward and is connected to a turntable 2 arranged above the base 4, wherein the upper surface of the turntable 2 is used to overlap and contact with the lower surface of a wafer 100, and at least one sensor 3 is installed on the upper surface of the other end of the base 4 and located outside the turntable 2, wherein a notch 101 corresponding to the sensor 3 is formed on the wafer 100, and the sensor 3 is electrically connected to the adjustment motor 1;
[0017] First, the wafer is placed on the upper surface of the turntable by an external pick-up assembly;
[0018] Since the position of the wafer may be shifted during the wafer transportation process, a sensor is used to send out a sensing signal to detect the position of the notch on the wafer.
[0019] The sensor 3 is a reflection type sensor. When the sensor 3 receives a reflection signal from the wafer 100 , the sensor 3 controls the adjustment motor 1 to drive the turntable 2 to rotate.
[0020] There are two sensors 3 , which are arranged at intervals along the radial direction of the turntable 2 .
[0021] Embodiment 2: A wafer angle adjustment mechanism comprises: a base 4 and an adjustment motor 1 installed below one end of the base 4, wherein the output shaft of the adjustment motor 1 extends vertically upward and is connected to a turntable 2 arranged above the base 4, wherein the upper surface of the turntable 2 is used to overlap and contact with the lower surface of the wafer 100, and at least one sensor 3 is installed on the upper surface of the other end of the base 4 and located outside the turntable 2, wherein a notch 101 corresponding to the sensor 3 is formed on the wafer 100, and the sensor 3 is electrically connected to the adjustment motor 1;
[0022] If the notch on the wafer is directly above the sensor, it means that the wafer is in the correct position; otherwise, the wafer will block the sensor. At this time, the sensor will send the received sensing signal to the PLC to control the motor to rotate a certain angle, thereby achieving angle adjustment of the wafer on the turntable that rotates with the motor output shaft.
[0023] The sensor 3 is a reflection type sensor. When the sensor 3 receives a reflection signal from the wafer 100 , the sensor 3 controls the adjustment motor 1 to drive the turntable 2 to rotate.
[0024] The wafer 100 having a circular body is provided with a straight-edge notch 101 .
[0025] The sensor 3 is mounted on the upper surface of the base 4 via a support 31 , and the upper end surface of the sensor 3 is lower than the upper surface of the turntable 2 .
[0026] The working principle of the utility model is as follows:
[0027] First, the wafer is placed on the upper surface of the turntable by an external pick-up assembly;
[0028] Since the position of the wafer may be shifted during the wafer transportation process, the sensor sends a sensing signal to detect the position of the notch on the wafer;
[0029] If the notch on the wafer is directly above the sensor, it means that the wafer is in the correct position; otherwise, the wafer will block the sensor. At this time, the sensor will send the received sensing signal to the PLC to control the motor to rotate a certain angle, thereby achieving angle adjustment of the wafer on the turntable that rotates with the motor output shaft.
[0030] When the above wafer angle adjustment mechanism is used, it can realize automatic detection and identification of the wafer position, and adjust the circumferential angle of the wafer by rotating the turntable, thereby improving the position accuracy of the wafer.
[0031] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.
Claims
1. A wafer angle adjustment mechanism, comprising: A base (4) and an adjusting motor (1) installed below one end of the base (4), characterized in that: the output shaft of the adjusting motor (1) extends vertically upward and is connected to a turntable (2) arranged above the base (4), the upper surface of the turntable (2) is used to overlap and contact with the lower surface of the wafer (100), at least one sensor (3) is installed on the upper surface of the other end of the base (4) and located outside the turntable (2), the wafer (100) is formed with a notch (101) corresponding to the sensor (3), and the sensor (3) is electrically connected to the adjusting motor (1).
2. The wafer angle adjustment mechanism according to claim 1, characterized in that: The sensor (3) is a reflection type sensor. When the sensor (3) receives a reflection signal from the wafer (100), the control adjustment motor (1) drives the turntable (2) to rotate.
3. The wafer angle adjustment mechanism according to claim 1, characterized in that: Two sensors (3) are provided and are arranged at intervals along the radial direction of the rotating disk (2).
4. The wafer angle adjustment mechanism according to claim 1, characterized in that: A straight-edge notch (101) is formed on the circular wafer (100).
5. The wafer angle adjustment mechanism according to claim 1, characterized in that: The sensor (3) is mounted on the upper surface of the base (4) via a support (31), and the upper end surface of the sensor (3) is lower than the upper surface of the turntable (2).