Wafer corrector
By designing a wafer corrector that includes camgunal units, substrates, slave wheel units, active wheel units, plural straight modules, and gap detection units, the problem that the traditional optical sensor system cannot detect special wafers. The accurate correction of the wafer position.
Patent Information
- Application Number
- CN202420308103.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-20
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-02-20
AI Technical Summary
Traditional optical sensor systems cannot effectively detect transparent wafers or special wafers that have surface changes or contaminated after multiple processes, resulting in the inability to accurately obtain their location.
Design a wafer correctioner, including cam, substrates, slave wheel units, active wheel units, plural straight modules, and gap detection units. The edge of the circle, realize position correction.
Effectively detect and correct the location of special wafers, solve the problem that the traditional optical sensor system cannot be perceived, and realizes the accurate location of the wafer after transparent or process processing.
Smart Images
Figure CN222421935U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a wafer calibration technology, and in particular to a device suitable for calibrating special wafers such as transparent wafers or wafers that have undergone multiple process treatments and have changed surfaces or various contaminations, which cannot be sensed by traditional optical sensor systems. Background Art
[0002] In the process of semiconductor wafer processing, many processes are involved. Many of these processes require the accurate position of the wafer to be acquired in advance. As one of the key components of semiconductor equipment, the wafer pre-alignment device usually uses an optical sensor system and a rotating table to detect the edge notch information of the wafer to achieve wafer calibration.
[0003] However, for special wafers, such as transparent wafers or wafers that have undergone multiple process treatments and whose surface has changed or has various contaminations, the optical sensor system cannot perceive them. Therefore, traditional methods such as optical detection cannot accurately obtain the position of such special wafers. Utility Model Content
[0004] Therefore, the main purpose of the utility model is to provide a wafer corrector to support the detection of edge notches of such special wafers and simultaneously complete the position calibration of the wafer.
[0005] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a wafer corrector is provided, which includes: a cam unit, a substrate, a driven wheel unit, a driving wheel unit, a plurality of linear modules, and a notch detection unit, wherein each linear module is arranged in a ring shape on the substrate, and the driven wheel unit and the driving wheel unit are respectively connected to the moving end of each linear module to define at least three detection support positions to form a corresponding annular support trajectory. The cam unit is arranged in the middle of the substrate, and its transmission end is respectively connected to the driven wheel unit and the driving wheel unit to drive the driven wheel unit and the driving wheel unit to move along the guiding direction of each linear module to change the relative distance between each detection support position. The notch detection unit is arranged on the driving wheel unit, and the detection end of the notch detection unit extends into the range of the annular support trajectory.
[0006] Preferably, the driving wheel unit includes: a first fixed plate, a first driver, and a first clamping member, wherein the first driver is connected to the fixed plate, the driving end of the first driver passes through the first fixed plate and is drivingly connected to the first clamping member, the moving end of the linear module is carried on both ends of the first fixed plate, a shift groove is provided on the substrate corresponding to the moving path of the first driver, the transmission end of the cam unit is connected to the first fixed plate, and the notch detection unit is arranged on the first fixed plate near the first clamping member.
[0007] Preferably, the gap detection unit includes: a first sensor, a first trigger member, a detection column, a detection block, and an elastic member, wherein the first sensor is arranged on a first fixed plate, a movable groove is provided on the first fixed plate near the first clamping member, the elastic member and the detection block are abutted against each other in the movable groove to allow the elastic member to elastically displace in the movable groove, the detection column is arranged on the upper part of the detection block and elastically extends into the range of the annular support track, the first trigger member is fixed on the side of the detection block to elastically extend and retract toward the detection end of the first sensor, and the first sensor is control-connected to the first driver.
[0008] Preferably, the first sensor is any one of a micro switch and a through-beam sensor.
[0009] Preferably, the driven wheel unit includes: a second fixed plate, a wheel shaft member, and a second clamping member, wherein the movable end of the linear module carries the second fixed plate, one end of the wheel shaft member is fixed on the second fixed plate, and the other end is rotationally connected to the second clamping member, and the transmission end of the cam unit is connected to the second fixed plate.
[0010] Preferably, the cam unit comprises: a cam member, a second driver, and a plurality of cam connecting rods, wherein the cam member is provided with a plurality of curved grooves, the second driver is fixed on a substrate, and a driving end thereof is drivingly connected to the cam member, the connecting end of the cam connecting rod is matched with the curved groove on the cam member to form a cam mechanism, and the transmission end of the cam connecting rod is transmission-connected to the driven wheel unit and the driving wheel unit respectively.
[0011] Preferably, the wafer corrector further includes: a second sensor and a second trigger member, wherein the second trigger member is arranged on the driving wheel unit, the second sensor is arranged on the substrate, close to the driving wheel unit, and is controlled and connected to the second driver, and when the driving wheel unit is displaced to a position where the wafer can be clamped, the second trigger member triggers the detection end of the second sensor.
[0012] Preferably, the wafer corrector also includes: a lifting unit, a base, the base is connected to the substrate via a support column to define a mezzanine space to accommodate the lifting unit, wherein the lifting unit includes: a third driver, a plurality of bearing members, a plurality of support rods, and a fixed frame, wherein each of the support rods is arranged on the fixed frame, the bearing member is connected to the end of each support rod and extends out onto the substrate to define at least three pick-up and place support positions around the annular support track, the third driver is connected to the base, and its lifting end is connected to the fixed frame to lift the bearing member to cooperate with the detection support position to take over / deliver the wafer.
[0013] Preferably, the lifting unit also includes: a limit member, which is arranged in the interlayer space and connected to at least one of the base / substrate, wherein the limit member is provided with an ascending limit block and a descending limit recess, and the fixed frame is provided with an ascending stop block at a position corresponding to the ascending limit block of the limit member, and the descending limit recess of the limit member corresponds to the descending path of the support rod.
[0014] Preferably, the wafer corrector also includes: a main controller, a third sensor, wherein the third sensor is arranged on a substrate and connected to the main controller, and the sensing end of the third sensor is arranged within the range of the annular support track, and the main controller is respectively controlled and connected to the cam unit, the driving wheel unit, the notch detection unit, and the lifting unit.
[0015] Through the wafer corrector provided by the utility model, a mechanical structure wafer notch detection solution is cleverly designed, which is connected to the driven wheel unit and the driving wheel unit through the cam unit to construct three adjustable detection support positions on the substrate to hold the wafer in place and rotate, thereby allowing the detection column of the notch detection unit to rest against the edge of the wafer, sensing the change in the outer diameter of the wafer to detect the wafer notch position and trigger the driving wheel unit to stop to maintain the current wafer rotation position, thereby completing the correction of the wafer position, thereby detecting special wafers through the mechanical structure solution to solve the problem that the traditional optical sensor system solution cannot perceive. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:
[0017] Figure 1 It is a schematic diagram of the structure of the wafer corrector of the utility model when carrying a wafer;
[0018] Figure 2 It is a schematic diagram of the structure of the cam unit and the main and driven wheel units in the wafer corrector of the utility model;
[0019] Figure 3 A schematic diagram of an annular support track defined on a wafer corrector of the present invention;
[0020] Figure 4 It is a structural schematic diagram of the driving wheel unit and the notch detection unit in the wafer corrector of the utility model;
[0021] Figure 5 It is a structural schematic diagram of the driving wheel unit in the wafer corrector of the utility model;
[0022] Figure 6It is a structural schematic diagram of a driven wheel unit in a wafer corrector of the utility model;
[0023] Figure 7 It is a partial structural schematic diagram of a cam unit in a wafer corrector of the utility model;
[0024] Figure 8 It is a structural schematic diagram of the lifting unit in the wafer corrector of the present utility model.
[0025] Description of Reference Numerals
[0026] Cam unit 1, substrate 2, driven wheel unit 3, driving wheel unit 4, multiple linear modules 5, notch detection unit 6, annular support track 7, lifting unit 8, base 9, third sensor 10, cam member 11, second driver 12, cam connecting rod 13, support column 21, second fixed plate 31, wheel shaft member 32, second clamping member 33, first fixed plate 41, first driver 42, first clamping member 43, second sensor 44, second trigger member 45, first sensor 61, first trigger member 62, detection column 63, detection block 64, elastic member 65, moving groove 66, third driver 81, bearing member 82, support rod 83, fixing frame 84, limit member 85, wafer 99, curved groove 111, rising block 841, rising limit block 851, falling limit recess 852. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0030] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. The terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.
[0031] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0032] In the description of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "layout", "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances and in combination with the prior art. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other without conflict. And one or more of the components in the diagram may be necessary or non-essential, and the relative position relationship between the components in the above diagram can be adjusted according to actual needs.
[0033] In order to support the detection of edge notches of special wafers and complete the position calibration of the wafer at the same time, such as Figures 1 to 8 As shown, the utility model provides a wafer corrector, which includes: a cam unit 1, a substrate 2, a driven wheel unit 3, a driving wheel unit 4, a plurality of linear modules 5, and a notch detection unit 6, wherein each linear module 5 is arranged in a ring shape on the substrate 2, and the driven wheel unit 3 and the driving wheel unit 4 are respectively connected to the moving end of each linear module 5 to define three detection support positions to form a corresponding annular support trajectory 7.
[0034] The cam unit 1 is arranged in the middle of the base plate 2, and its transmission end is respectively connected to the driven wheel unit 3 and the driving wheel unit 4 to drive the driven wheel unit 3 and the driving wheel unit 4 to move along the guiding direction of each linear module 5 to change the relative distance between each detection support position, and then adjust the diameter of its annular support track 7 until it matches the wafer diameter and can clamp the wafer 99.
[0035] The notch detection unit 6 is arranged on the driving wheel unit 4, and the detection end of the notch detection unit 6 extends into the range of the annular support track 7. At this time, when the driving wheel unit 4 rotates, the detection end of the notch detection unit 6 will move along the outer diameter of the wafer 99 to sense the notch position of the wafer 99.
[0036] Specifically, if Figures 2 to 5 As shown, in this example, the driving wheel unit 4 includes: a first fixed plate 41, a first driver 42, and a first clamping member 43, wherein the first driver 42 is preferably a rotary motor, which is connected to the first fixed plate 41 and suspended at the lower part of the first fixed plate 41, and the driving end of the first driver 42 passes through the first fixed plate 41 and is drivingly connected to the first clamping member 43, and the moving end of the linear module 5 is carried on both ends of the first fixed plate 41, and a shift groove is provided on the base plate 2 corresponding to the moving path of the first driver 42, and the transmission end of the cam unit 1 is connected to the first fixed plate 41, and the notch detection unit 6 is arranged on the first fixed plate 41 near the first clamping member 43. With such an arrangement, the first fixed plate 41 will be driven by the cam unit 1 to move toward the track direction of the linear module 5.
[0037] Further, such as Figures 2 to 4 As shown, in this example, the gap detection unit 6 includes: a first sensor 61, a first trigger member 62, a detection column 63, a detection block 64, and an elastic member 65, wherein the first sensor 61 can be any one of a micro switch and a through-beam sensor, which is arranged on the first fixed plate 41, and a movable groove 66 is provided on the first fixed plate 41 near the first clamping member 43, and the elastic member 65 is preferably a spring, which abuts against the detection block 64 in the movable groove 66 to allow the elastic member 65 to elastically displace in the movable groove 66, and the detection column 63 is arranged on the upper part of the detection block 64 and elastically extends into the range of the annular support track 7, and the first trigger member 62 is fixed on the side of the detection block 64 to elastically extend and retract toward the detection end of the first sensor 61, and the first sensor 61 is control-connected to the first driver 42.
[0038] Further, such as Figures 2 to 3 , Figure 6As shown, in this example, two driven wheel units 3 can be provided to form three detection support positions with the driving wheel unit 4, wherein the driven wheel unit 3 includes: a second fixed plate 31, a wheel shaft member 32, and a second clamping member 33, wherein the movable end of the linear module 5 carries the second fixed plate 31, one end of the wheel shaft member 32 is fixed on the second fixed plate 31, and the other end is rotatably connected to the second clamping member 33, and the transmission end of the cam unit 1 is connected to the second fixed plate 31.
[0039] Further, as shown in Figure Figures 2 to 3 , Figures 5 to 7 As shown, in this example, the cam unit 1 includes: a cam member 11, a second driver 12, and a plurality of cam connecting rods 13, wherein the cam member 11 is provided with a plurality of curved grooves 111, the second driver 12 is preferably a rotary motor, which is fixed on the substrate 2, and its driving end is drivingly connected to the cam member 11 to drive the cam member 11 to rotate, and the cam connecting rods 13 correspond to the number of the curved grooves 111, and their linkage ends are in the shape of rollers or wheels, and a cam mechanism can be formed by matching the linkage end of the cam connecting rod 13 with the curved grooves 111 on the cam member 11, and the transmission ends of the cam connecting rods 13 are respectively drivingly connected to the driven wheel unit 3 and the driving wheel unit 4.
[0040] With this arrangement, when the second driver 12 rotates the cam member 11, the cam connecting rod 13 will gradually shift under the guidance of the curved groove 111, thereby driving the driven wheel unit 3 and the driving wheel unit 4 to move along the track direction of the linear module 5, thereby adjusting the relative position distance between the first clamping member 43 and the second clamping member 33, and then adjusting the diameter of the annular support track 7, until the three detection support positions can clamp the wafer 99, the detection column 63 of the notch detection unit 6 will also rest against the edge of the wafer 99, and then the first clamping member 43 of the driving wheel unit 4 will rotate under the drive of the first driver 42, thereby driving the wafer 99 and other second clamping members 33 to rotate.
[0041] At this time, since the detection column 63 of the notch detection unit 6 is in an elastic resistance state with the edge of the wafer 99, when the wafer 99 is rotated to a certain angle, the notch on the edge of the wafer 99 will definitely meet the detection column 63. At this time, due to the radial drop at the notch of the wafer 99, the detection column 63 will be guided into the recess, and driven by the elastic member 65, a series of displacements of the detection block 64 and the first trigger member 62 will be caused, thereby triggering the first sensor 61 to stop the first driver 42, thereby completing the correction of the position of the wafer 99.
[0042] Furthermore, in order to prevent the cam unit 1 from moving beyond the limit, as Figures 2 to 3As shown, the wafer corrector in this example also includes: a second sensor 44, a second trigger member 45, wherein the second sensor 44 can be any one of a micro switch and a beam sensor, wherein the second trigger member 45 is arranged on the first fixed plate 41 of the driving wheel unit 4, and the second sensor 44 is arranged on the substrate 2, close to the driving wheel unit 4, and is controlled and connected to the second driver 12, and when the driving wheel unit 4 is displaced to a position where the wafer 99 can be clamped, the second trigger member 45 extends into the detection end of the second sensor 44, thereby triggering the second sensor 44 to stop the second driver 12, thereby preventing the driving wheel unit 4 and the driven wheel unit 3 from moving beyond the limit and clamping the wafer 99.
[0043] Furthermore, in order to undertake the wafer pick-up / placement process between the wafer finger and the wafer corrector, e.g. Figures 2 to 3 , Figure 8 As shown, in this example, the wafer corrector also includes: a lifting unit 8, a base 9, the base 9 is connected to the substrate 2 via a support column 21 to define a mezzanine space to accommodate the lifting unit 8, wherein the lifting unit 8 includes: a third driver 81, a plurality of bearing members 82, a plurality of support rods 83, and a fixed frame 84, wherein each of the support rods 83 is arranged on the fixed frame 84, the bearing member 82 is connected to the end of each support rod 83, and extends above the substrate 2 to define three pick-up and placement support positions around the annular support track 7, wherein the third driver 81 in this example is preferably a lifting cylinder, whose base is fixed on the base 9, and whose lifting end is connected to the fixed frame 84, so as to lift the bearing member 82 to cooperate with the detection support position to take over / deliver the wafer 99.
[0044] In addition, if Figure 8 As shown, in an optional example, in order to prevent the lifting unit 8 from moving beyond the limit, in a preferred example, the lifting unit 8 also includes: a limit member 85, which is arranged in the interlayer space and is connected to at least one of the base 9 / base plate 2, wherein the limit member 85 is provided with an upward limit block 851 and a downward limit recess 852, and the fixed frame 84 is provided with an upward stop block 841 at a position corresponding to the upward limit block 851 of the limit member 85, and the downward limit recess 852 of the limit member 85 corresponds to the downward path of the support rod 83.
[0045] With this arrangement, when the wafer finger delivers the wafer 99 to the wafer corrector, the supporting member 82 of the lifting unit 8 will be lifted to a predetermined height to receive the wafer 99. At this time, if the third driver 81 lifts the fixing frame 84 to the limit, it will abut against the rising stop block 841 of the limiting member 85 to limit the rising position. Thereafter, the supporting member 82 slowly descends to the same height as the first clamping member 43 and the second clamping member 33. At this time, if the third driver 81 descends to the limit position, the support rod 83 will be placed on the descending limit recess 852 to limit the descending position.
[0046] At the same time, when the wafer 99 is lowered into place, the cam unit 1 starts to start, driving the driven wheel unit 3 and the driving wheel unit 4 to move, so that the three detection support positions clamp the wafer 99, and then the correction process begins. After the correction is completed, the supporting member 82 of the lifting unit 8 rises again to receive the wafer 99. At this time, the cam unit 1 synchronously drives the driven wheel unit 3 and the driving wheel unit 4 to move, so that the three detection support positions release the wafer 99, thereby allowing the supporting member 82 to lift the wafer 99 into place, and then the wafer finger takes over and takes it away, thereby completing the entire receiving process.
[0047] Furthermore, in order to prevent the empty measurement problem, Figures 2 to 3 As shown, in an optional example, the wafer corrector further includes: a main controller (not shown in the figure), a third sensor 10, wherein the third sensor 10 can be a laser reflection sensor, which is arranged on the substrate 2 and connected to the main controller, and the sensing end of the third sensor 10 is arranged in the range facing the annular support track 7, wherein the main controller is respectively connected to the cam unit 1, the driving wheel unit 4, the notch detection unit 6, and the lifting unit 8 to coordinate and control each unit to cooperate according to the wafer correction process, and to stop the process operation according to the signal of the third sensor 10. Therefore, through the third sensor 10, it is possible to sense whether there is a wafer 99 on the current wafer corrector, thereby providing a control basis for whether the main controller controls the cam unit 1, the driving wheel unit 4, the notch detection unit 6, and the lifting unit 8 to work, so as to avoid the phenomenon of empty measurement.
[0048] In summary, through the wafer corrector provided by the utility model, a mechanical structure wafer notch detection solution is cleverly designed, through the cam unit 1, the driven wheel unit 3 and the driving wheel unit 4 are linked to construct three adjustable detection support positions on the substrate 2 to hold the wafer in place and rotate, thereby allowing the detection column 63 of the notch detection unit 6 to rest against the edge of the wafer, sensing the change in the outer diameter of the wafer to detect the wafer notch position, and triggering the driving wheel unit 4 to stop, so as to maintain the current wafer rotation position, thereby completing the correction of the wafer position, thereby detecting special wafers through a mechanical structure solution to solve the problem that the traditional optical sensor system solution cannot perceive.
[0049] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the contents of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can understand and use the utility model well. The utility model is only limited by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.
[0050] In addition, various implementations of the embodiments of the present utility model can also be arbitrarily combined, as long as they do not violate the concept of the embodiments of the present utility model, they should also be regarded as the contents disclosed in the embodiments of the present utility model.
Claims
1. A wafer corrector, characterized in that include: A cam unit, a substrate, a driven wheel unit, a driving wheel unit, a plurality of linear modules, and a notch detection unit, wherein the linear modules are arranged in a ring-shaped interval on the substrate, the driven wheel unit and the driving wheel unit are respectively connected to the moving end of each linear module to define at least three detection support positions to form a corresponding annular support trajectory, the cam unit is arranged in the middle of the substrate, and its transmission end is respectively connected to the driven wheel unit and the driving wheel unit to drive the driven wheel unit and the driving wheel unit to move along the guiding direction of each linear module to change the relative distance between each detection support position, and the notch detection unit is arranged on the driving wheel unit, and the detection end of the notch detection unit extends into the range of the annular support trajectory.
2. The wafer corrector according to claim 1, characterized in that: The active wheel unit includes: a first fixed plate, a first driver, and a first clamping member, wherein the first driver is connected to the fixed plate, the driving end of the first driver passes through the first fixed plate and is drivingly connected to the first clamping member, the moving end of the linear module is carried on both ends of the first fixed plate, a shift groove is provided on the substrate corresponding to the moving path of the first driver, the transmission end of the cam unit is connected to the first fixed plate, and the notch detection unit is arranged on the first fixed plate near the first clamping member.
3. The wafer corrector according to claim 2, characterized in that: The gap detection unit includes: a first sensor, a first trigger member, a detection column, a detection block, and an elastic member, wherein the first sensor is arranged on a first fixed plate, a movable groove is provided on the first fixed plate near the first clamping member, the elastic member and the detection block are abutted against each other in the movable groove to allow the elastic member to elastically displace in the movable groove, the detection column is arranged on the upper part of the detection block and elastically extends into the range of the annular support track, the first trigger member is fixed on the side of the detection block to elastically extend and retract toward the detection end of the first sensor, and the first sensor is control-connected to the first driver.
4. The wafer corrector according to claim 3, characterized in that: The first sensor is any one of a micro switch and a through-beam sensor.
5. The wafer corrector according to claim 1, characterized in that: The driven wheel unit includes: a second fixed plate, a wheel shaft, and a second clamping member, wherein the movable end of the linear module carries the second fixed plate, one end of the wheel shaft is fixed on the second fixed plate, and the other end is rotationally connected to the second clamping member, and the transmission end of the cam unit is connected to the second fixed plate.
6. The wafer corrector according to claim 1, characterized in that: The cam unit includes: a cam member, a second driver, and a plurality of cam connecting rods, wherein the cam member is provided with a plurality of curved grooves, the second driver is fixed on a base plate, and a driving end thereof is drivingly connected to the cam member, a linkage end of the cam connecting rod is matched with the curved groove on the cam member to form a cam mechanism, and a transmission end of the cam connecting rod is drivingly connected to a driven wheel unit and a driving wheel unit respectively.
7. The wafer corrector according to claim 6, characterized in that: Also includes: A second sensor and a second triggering member, wherein the second triggering member is arranged on the driving wheel unit, the second sensor is arranged on the substrate, close to the driving wheel unit, and is controlled and connected with the second driver, and when the driving wheel unit is displaced to a position where the wafer can be clamped, the second triggering member triggers the detection end of the second sensor.
8. The wafer corrector according to claim 1, characterized in that: Also includes: A lifting unit, a base, the base and the substrate are connected via support columns to define a mezzanine space to accommodate the lifting unit, wherein the lifting unit includes: a third driver, a plurality of bearing members, a plurality of support rods, and a fixed frame, wherein each of the support rods is arranged on the fixed frame, the bearing member is connected to the end of each support rod and extends out onto the substrate to define at least three pick-and-place support positions around the annular support track, the third driver is connected to the base, and its lifting end is connected to the fixed frame to lift the bearing member to cooperate with the detection support position to take over / deliver the wafer.
9. The wafer corrector according to claim 8, characterized in that: The lifting unit also includes: a limit member, which is arranged in the interlayer space and connected to at least one of the base / base plate, wherein the limit member is provided with an ascending limit block and a descending limit recess, and the fixed frame is provided with an ascending stop block at a position corresponding to the ascending limit block of the limit member, and the descending limit recess of the limit member corresponds to the descending path of the support rod.
10. The wafer corrector according to claim 8, characterized in that: Also includes: A main controller, a third sensor, wherein the third sensor is arranged on a substrate and connected to the main controller, and a sensing end of the third sensor is arranged within the range of the annular support track, and the main controller is respectively controlled and connected with the cam unit, the driving wheel unit, and the notch detection unit.