Wafer chuck

Abstract

The utility model discloses a wafer chuck. The wafer chuck specifically comprises a tray suitable for bearing a wafer; the driving part can drive the tray to rotate; the connecting piece is used for connecting the tray and the driving piece, and the driving piece can drive the connecting piece to drive the tray to rotate; wherein the tray comprises an outlet communicated with an external adsorption device, a plurality of adsorption ports communicated with the outlet and an adsorption channel communicated with the outlet and the plurality of adsorption ports, the adsorption channel is arranged in the tray, the plurality of adsorption ports are in contact with the edge part of the wafer, and the lengths of the adsorption channels between the adsorption ports and the outlet are the same. According to the wafer chuck, the adsorption channels are arranged in the tray, the overall structure of the wafer chuck is simplified, the lengths of the adsorption channels between the adsorption ports and the outlets communicated with the external device are the same, the uniform adsorption force is ensured, the risk of wafer fragmentation is reduced, and the production cost is further reduced.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor processing, and in particular relates to a wafer chuck. Background Art

[0002] In the semiconductor field, the wafer is a carrier that integrates thousands of electronic components, but its size is extremely narrow. The manufacturing process involves etching processes, deposition processes, heat treatment processes and many other manufacturing processes. Therefore, a chuck to fix or transfer the wafer is needed in the semiconductor manufacturing process. Chucks are divided into mechanical chucks, electrostatic chucks and vacuum chucks. Different chucks need to be selected in the face of different sizes and shapes, as well as different ways of transporting wafers. Now, for a hollow wafer with micropores in the central area, the existing chuck structure is complex, and the cleaning effect of the hollow wafer is poor. In addition, in the prior art, the arrangement of the adsorption channels easily leads to uneven adsorption force, resulting in wafer fragments. Summary of the invention

[0003] In view of the above technical problem, the utility model provides an improved wafer chuck.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A wafer chuck, comprising:

[0006] A tray, suitable for carrying wafers;

[0007] A driving member capable of driving the tray to rotate;

[0008] A connecting member, used to connect the tray and the driving member, wherein the driving member can drive the connecting member to drive the tray to rotate;

[0009] Among them, the tray includes an outlet connected to an external adsorption device, a plurality of adsorption ports connected to the outlet, and an adsorption channel connecting the outlet and the plurality of adsorption ports, the adsorption channel is arranged inside the tray, the plurality of adsorption ports are in contact with the edge of the wafer, and the length of the adsorption channel from each adsorption port to the outlet is the same.

[0010] Preferably, the tray comprises a middle portion and an adsorption portion surrounding the outside of the middle portion, and the adsorption portion is suitable for adsorbing the edge portion of the wafer;

[0011] The adsorption portion includes the adsorption port and an adsorption groove arranged on the upper surface of the tray, the adsorption port is communicated with the adsorption groove, and the distance between every two adjacent adsorption ports is the same.

[0012] Furthermore, the tray further comprises a separator arranged on the adsorption groove to separate the adsorption groove into an annular inner groove and an annular outer groove, and a suction port is arranged between every two adjacent separators.

[0013] Furthermore, in the height direction, the middle portion is lower than the adsorption portion, and the tray further comprises at least one liquid-spinning portion which is arranged on the middle portion and passes through from top to bottom.

[0014] Furthermore, the liquid-spinning portion is a strip-shaped hole that is inclined from inside to outside and from top to bottom.

[0015] Preferably, the connecting member includes a hollow shaft having a conveying channel and a connecting seat sleeved on the outside of the hollow shaft, one end of the conveying channel is connected to the driving member, the other end of the conveying channel is communicated with the outlet, a sealing cavity is provided between the connecting seat and the hollow shaft, the hollow shaft has at least one exhaust hole, the connecting seat is provided with an exhaust valve, and the sealing cavity is respectively communicated with at least one exhaust hole and the exhaust valve.

[0016] Furthermore, the connecting seat includes an outer shell and a first seal and a second seal arranged in the outer shell, the first seal and the second seal are respectively sleeved on the outer side of the hollow shaft, and the sealing cavity is formed between the first seal, the second seal and the outer shell.

[0017] Furthermore, the wafer chuck also includes a tray base arranged between the tray and the connecting member, the tray base includes a circular supporting portion fixedly connected to the tray, a fixing portion located below the supporting portion, and a ventilation duct running through the supporting portion, the ventilation duct is suitable for connecting the outlet with the conveying channel, and the fixing portion is detachably connected to the hollow shaft.

[0018] Furthermore, a locking hole is provided on the side wall of the fixing portion, and a avoiding hole corresponding to the position of the locking hole is provided on the hollow shaft;

[0019] The wafer chuck also includes a locking pin, which can be inserted and pulled relative to the tray base under the action of external force to have a locked state and a disengaged state. When the locking pin is in the locked state, the locking pin passes through the locking hole and the avoidance hole in sequence to fix the tray base and the hollow shaft, and the locking pin and the locking hole are blocked; when the locking pin is in the disengaged state, the tray base and the hollow shaft can move relative to each other.

[0020] Furthermore, the wafer chuck further comprises a first sealing ring and a second sealing ring, wherein the first sealing ring is arranged between the tray base and the tray, and the second sealing ring is arranged between the hollow shaft and the tray base.

[0021] The utility model adopts the above solution, which has the following advantages compared with the prior art:

[0022] In the utility model, the overall structure of the wafer chuck is simplified by arranging an adsorption channel inside the tray, and the length of the adsorption channel between each adsorption port and the outlet connected to the external device is the same, which ensures uniform adsorption force, reduces the risk of wafer fragments, and thus reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A cross-sectional view of a wafer chuck in an embodiment of the utility model;

[0025] Figure 2 for Figure 1 A local enlarged schematic diagram of the middle A;

[0026] Figure 3 This is a three-dimensional exploded schematic diagram of a part of a wafer chuck in an embodiment of the present utility model;

[0027] Figure 4 A partial side view of a wafer chuck in an embodiment of the utility model;

[0028] Figure 5 for Figure 4 Sectional view along AA direction;

[0029] Figure 6 Another cross-sectional view of a part of a wafer chuck in an embodiment of the utility model;

[0030] Figure 7 This is a schematic diagram of the three-dimensional structure of a tray in an embodiment of the utility model;

[0031] Figure 8 A side view of a tray in an embodiment of the utility model;

[0032] Fig. 9 for Figure 8 The cross-sectional view along the BB direction;

[0033] Among them, 1. tray; 11. outlet; 12. adsorption port; 13. adsorption channel; 14. middle part; 15. adsorption part; 16. adsorption groove; 161. annular inner groove; 162. annular outer groove; 17. separator; 18. liquid throwing part; 2. driving part; 3. connecting part; 31. conveying channel; 32. hollow shaft; 321. exhaust hole; 33. connecting seat; 331. exhaust valve; 332. outer shell; 333. first sealing member; 334. second sealing member; 34. sealing chamber; 4. tray base; 41. circular supporting part; 42. fixing part; 43. ventilation duct; 44. locking hole; 45. avoidance hole; 5. locking pin; 6. first sealing ring; 7. second sealing ring. DETAILED DESCRIPTION

[0034] In the description of the present utility model, Figure 1 In the figure, the upper direction is “up”, the lower direction is “down”, the left direction is “left”, the right direction is “right”, and the directions perpendicular to the paper are “front” and “back”. The directions of “front”, “back”, “left”, “right”, “up” and “down” are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] like Figures 1 to 9 As shown, this embodiment provides a wafer chuck, which is suitable for carrying and fixing a wafer for various process treatments of the wafer, such as etching, deposition, cleaning or drying. In this embodiment, the wafer is a hollow wafer with 0.2 mm micro-holes in the central area.

[0036] In the present application, the wafer chuck includes a tray 1, a driving member 2 and a connecting member 3. The tray 1 is suitable for carrying wafers, the driving member 2 can drive the tray 1 to rotate, the connecting member 3 is used to connect the tray 1 and the driving member 2, the driving member 2 can drive the connecting member 3 to drive the tray 1 to rotate, and the driving member 2 is specifically a driving motor. Figure 2 and Fig. 9 As shown, the tray 1 includes an outlet 11 connected to an external adsorption device, a plurality of adsorption ports 12 connected to the outlet 11, and an adsorption channel 13 connecting the outlet 11 and the plurality of adsorption ports 12. The adsorption channel 13 is arranged inside the tray 1, and the plurality of adsorption ports 12 are in contact with the edge of the wafer. The length of the adsorption channel 13 between each adsorption port 12 and the outlet 11 is the same. Fig. 9As shown, the adsorption channels 13 in this embodiment specifically include two vertically arranged ones, and the two ends of each adsorption channel 13 are respectively connected to two oppositely arranged adsorption ports 12, and the intersection of the two adsorption channels 13 is the outlet 11 or is connected to the outlet 11. The length of the adsorption channel 13 is substantially consistent with the length of the diameter of the tray 1 and is vertically distributed, and can be more evenly distributed inside the tray 1, simplifying the overall structure of the wafer chuck while ensuring uniform adsorption force and reducing the risk of wafer fragments. In other embodiments, the number of adsorption channels 13 is not specifically limited and can be determined according to actual conditions.

[0037] The tray 1 includes a middle portion 14 and an adsorption portion 15 surrounding the middle portion 14. In this embodiment, the wafer is a hollow wafer including a central area and an edge portion, the adsorption portion 15 is suitable for adsorbing the edge portion of the wafer, and the central area corresponds to the middle portion of the tray.

[0038] The adsorption portion 15 includes an adsorption port 12 and an adsorption groove 16 disposed on the upper surface of the tray 1. The adsorption port 12 is connected to the adsorption groove 16, and the distance between each two adjacent adsorption ports 12 is the same. Fig. 9 As shown, the tray 1 also includes a partition 17 arranged on the adsorption groove 16 to divide the adsorption groove 16 into an annular inner groove 161 and an annular outer groove 162, and an adsorption port 12 is arranged between each two adjacent partitions 17. In this embodiment, the number of adsorption ports 12 is four and the adsorption ports 12 are evenly distributed on the upper surface of the tray 1. Correspondingly, the number of partitions 17 is also four and the partitions 17 are arc-shaped. By providing a partition, an annular inner groove and an annular outer groove can be formed, so that the adsorption area of ​​the edge of the wafer is increased, a better adsorption effect is achieved, and the local force on the edge of the wafer is reduced, which can reduce the fragmentation of the wafer; on the other hand, due to the provision of a partition, when the wafer is placed on the tray, the partition plays a certain supporting role on the edge of the wafer, further reducing the fragmentation of the wafer.

[0039] In other embodiments, the shape and number of the separators are not limited and can be arranged according to the situation of the adsorption ports.

[0040] like Figure 3 As shown, in the height direction, the middle part 14 of the tray 1 is lower than the adsorption part 15, so that there is no contact between the central area of ​​the wafer and the middle part of the tray, so as to prevent the used cleaning liquid from contacting the back of the wafer during the wafer cleaning process to form secondary contamination. When cleaning the wafer, the cleaning waste liquid leaking from the micropores in the central area of ​​the wafer can be collected in the middle part of the tray for one-time waste discharge.

[0041] The tray 1 further includes at least one liquid-spinning portion 18 disposed on the middle portion 14 and extending from top to bottom. Figure 5As shown, the liquid-spinning section 18 is a strip-shaped hole inclined from inside to outside and from top to bottom. Specifically, the liquid-spinning section 18 includes a liquid inlet and a liquid outlet located below the liquid inlet, and the liquid inlet is located on the inner side of the annular inner groove 161. In this embodiment, the number of liquid-spinning sections 18 is preferably multiple, and multiple liquid-spinning sections 18 are arranged around the tray 1 at equal intervals. By providing the liquid-spinning section 18, the cleaning waste liquid can be emptied through the liquid-spinning section 18 by centrifugal force while the wafer is rotating at a high speed, which can effectively clean and remove the residual cleaning waste liquid and improve the processing yield.

[0042] like Figure 2 As shown, the connecting member 3 includes a hollow shaft 32 having a conveying channel 31 and a connecting seat 33 sleeved on the outside of the hollow shaft 32. One end of the conveying channel 31 is connected to the driving member 2, and the other end of the conveying channel 31 is connected to the outlet 11. When the chuck is working, the driving member can drive the hollow shaft to rotate and then drive the tray and the wafer to rotate, and the external adsorption device can generate adsorption force through the outlet and a plurality of adsorption ports connected to the outlet, thereby adsorbing the wafer.

[0043] In this embodiment, the connecting seat 33 includes an outer shell 332 and a first seal 333 and a second seal 334 arranged in the outer shell 332. The first seal 333 and the second seal 334 are respectively sleeved on the outer side of the hollow shaft 32, and a sealed cavity 34 is formed between the first seal 333, the second seal 334 and the outer shell 332.

[0044] The hollow shaft 32 has at least one exhaust hole 321. In this embodiment, preferably, a plurality of exhaust holes 321 are provided in a circle around the hollow shaft 32 in the same plane. The connecting seat 33 is provided with an exhaust valve 331, and the sealing cavity 34 is respectively connected to the at least one exhaust hole 321 and the exhaust valve 331.

[0045] The wafer chuck also includes a tray base 4 disposed between the tray 1 and the connector 3. The tray base 4 includes a circular supporting portion 41 fixedly connected to the tray 1, a fixing portion 42 located below the supporting portion 41, and a ventilation duct 43 penetrating the supporting portion 41. The ventilation duct 43 is suitable for connecting the outlet 11 with the conveying channel 31, and the fixing portion 42 is detachably connected to the hollow shaft 32. The adsorption port 12, the adsorption channel 13, the outlet 11, the conveying channel 31, the exhaust hole 321, the sealing cavity 34 and the exhaust valve 331 constitute an exhaust channel connected in sequence.

[0046] In order to facilitate the maintenance of the entire chuck, in this embodiment, the upper surface of the tray base 4 is provided with a bolt locking hole for locking with the tray 1, as shown in FIG. Figure 3 As shown, a plurality of bolt locking holes are arranged around the upper surface of the tray base 4. The tray base 4 and the tray 1 can also be detachably connected, dividing the previous integrated chuck into two, which is convenient for replacement and maintenance and reduces the replacement cost.

[0047] Furthermore, if Figure 3 As shown, a locking hole 44 is provided on the side wall of the fixing portion 42, and an avoidance hole 45 corresponding to the position of the locking hole 44 is provided on the hollow shaft 32. The wafer chuck also includes a locking pin 5, which can be plugged in and out relative to the tray base 4 under the action of an external force to have a locked state and a disengaged state. When the locking pin 5 is in the locked state, the locking pin 5 passes through the locking hole 44 and the avoidance hole 45 in turn to fix the tray base 4 and the hollow shaft 32, and the locking pin 5 and the locking hole 44 are blocked to prevent air leakage. When the locking pin 5 is in the disengaged state, the tray base 4 and the hollow shaft 32 can move relative to each other, that is, the hollow shaft and the fixing portion are detachable. The tray base 4 and the hollow shaft 32 of the connector 3 are connected by the locking pin 5, which is easy to disassemble and install, and can be replaced in the later stage without disassembling the entire body, which greatly saves the later maintenance cost.

[0048] The wafer chuck also includes a first sealing ring 6 and a second sealing ring 7. A first sealing groove for placing the first sealing ring 6 is provided on at least one of the upper surface of the supporting portion 41 and the lower surface of the tray, and a second sealing groove for placing the second sealing ring 7 is provided on at least one of the inner wall of the fixing portion 42 and the outer wall of the hollow shaft. The first sealing ring 6 is arranged between the tray base 4 and the tray 1, and the second sealing ring 7 is arranged between the hollow shaft 32 and the tray base 4. In this embodiment, one first sealing ring 6 is provided and two second sealing rings 7 are provided, which can ensure the sealing of the inside of the chuck and increase the friction between the tray base and the tray and between the tray base and the hollow shaft to prevent the tray base from being separated from the chuck when the chuck rotates at high speed.

[0049] The wafer chuck in this embodiment can be specifically applied to wafer cleaning equipment.

[0050] In summary, the wafer chuck in this embodiment has at least the following advantages:

[0051] 1. By setting an adsorption channel inside the tray, the overall structure of the wafer chuck is simplified, and the length of the adsorption channel between each adsorption port and the outlet connected to the external device is the same, which ensures uniform adsorption force, reduces the risk of wafer fragments, and thus reduces production costs;

[0052] 2. By setting up the liquid-spinning part, the cleaning liquid can be emptied through the liquid-spinning part by centrifugal force while the wafer is rotating at high speed, which can effectively clean and remove the residual washing liquid and improve the processing yield;

[0053] 3. The tray base and the tray can also be connected detachably, which divides the previous integrated chuck into two parts, making it easy to replace and repair, and reducing the replacement cost; the tray base and the hollow shaft of the connector are connected by a locking pin, which is easy to disassemble and install, and can be replaced in the later stage without disassembling the entire part, greatly saving the later maintenance cost;

[0054] 4. The adsorption port, adsorption channel, outlet, conveying channel, exhaust hole, sealing cavity and exhaust valve constitute an exhaust channel connected in sequence, and the locking pin and the locking hole are sealed, which has good sealing performance and improves the adsorption force on the wafer.

[0055] As shown in this specification and claims, the terms "comprises" and "include" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the relevant listed items.

[0056] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the accompanying drawings.

[0057] The above embodiment is only for illustrating the technical concept and features of the utility model, and is a preferred embodiment. Its purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and it cannot be used to limit the protection scope of the utility model. Any equivalent transformation or modification made according to the principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A wafer chuck, characterized in that: include: A tray, suitable for carrying wafers; A driving member capable of driving the tray to rotate; A connecting member, used to connect the tray and the driving member, wherein the driving member can drive the connecting member to drive the tray to rotate; Among them, the tray includes an outlet connected to an external adsorption device, a plurality of adsorption ports connected to the outlet, and an adsorption channel connecting the outlet and the plurality of adsorption ports, the adsorption channel is arranged inside the tray, the plurality of adsorption ports are in contact with the edge of the wafer, and the length of the adsorption channel from each adsorption port to the outlet is the same.

2. The wafer chuck according to claim 1, characterized in that: The tray comprises a middle portion and an adsorption portion surrounding the outside of the middle portion, wherein the adsorption portion is suitable for adsorbing the edge portion of the wafer; The adsorption portion includes the adsorption port and an adsorption groove arranged on the upper surface of the tray, the adsorption port is communicated with the adsorption groove, and the distance between every two adjacent adsorption ports is the same.

3. The wafer chuck according to claim 2, characterized in that: The tray further comprises a separator arranged on the adsorption groove to separate the adsorption groove into an annular inner groove and an annular outer groove, and a suction port is arranged between every two adjacent separators.

4. The wafer chuck according to claim 2, characterized in that: In the height direction, the middle part is lower than the adsorption part, and the tray further comprises at least one liquid-spinning part which is arranged on the middle part and passes through from top to bottom.

5. The wafer chuck according to claim 4, characterized in that: The liquid-throwing portion is a strip-shaped hole inclined from inside to outside and from top to bottom.

6. The wafer chuck according to claim 1, characterized in that: The connecting member includes a hollow shaft having a conveying channel and a connecting seat sleeved on the outside of the hollow shaft, one end of the conveying channel is connected to the driving member, and the other end of the conveying channel is communicated with the outlet, a sealing cavity is provided between the connecting seat and the hollow shaft, the hollow shaft has at least one exhaust hole, the connecting seat is provided with an exhaust valve, and the sealing cavity is respectively communicated with at least one exhaust hole and the exhaust valve.

7. The wafer chuck according to claim 6, characterized in that: The connecting seat includes a shell and a first seal and a second seal arranged in the shell. The first seal and the second seal are respectively sleeved on the outside of the hollow shaft. The sealing cavity is formed between the first seal, the second seal and the shell.

8. The wafer chuck according to claim 7, characterized in that: The wafer chuck also includes a tray base arranged between the tray and the connecting member, the tray base includes a circular supporting portion fixedly connected to the tray, a fixing portion located below the supporting portion, and a ventilation duct running through the supporting portion, the ventilation duct is suitable for connecting the outlet with the conveying channel, and the fixing portion is detachably connected to the hollow shaft.

9. The wafer chuck according to claim 8, characterized in that: A locking hole is provided on the side wall of the fixing portion, and a avoiding hole corresponding to the position of the locking hole is provided on the hollow shaft; The wafer chuck also includes a locking pin, which can be inserted and pulled relative to the tray base under the action of external force to have a locked state and a disengaged state. When the locking pin is in the locked state, the locking pin passes through the locking hole and the avoidance hole in sequence to fix the tray base and the hollow shaft, and the locking pin and the locking hole are blocked; when the locking pin is in the disengaged state, the tray base and the hollow shaft can move relative to each other.

10. The wafer chuck according to claim 9, characterized in that: The wafer chuck further includes a first sealing ring and a second sealing ring, wherein the first sealing ring is arranged between the tray base and the tray, and the second sealing ring is arranged between the hollow shaft and the tray base.

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