Wafer taking and placing device

Abstract

The utility model relates to the technical field of wafer taking devices, and provides a wafer taking and placing device. The bearing assembly is partially arranged on the holding assembly, and the bearing assembly is used for bearing a wafer; the ejection assembly is arranged on the holding assembly and connected with the bearing assembly, the ejection assembly can be driven by external force to drive the bearing assembly to move relative to the holding assembly, the part, located outside the holding assembly, of the bearing assembly is made to be matched with the outer end face of the holding assembly, and clamping and releasing of the peripheral edge of the wafer are achieved. According to the wafer taking and placing device provided by the invention, marks are prevented from being formed on the surfaces of the wafers, and extra excessive equipment does not need to be introduced, so that the interference of taking and placing positions in a manual wafer taking and placing process is relieved or avoided.

Description

Technical Field

[0001] The present application relates to the technical field of wafer fetching devices, and in particular to a wafer fetching and placing device. Background Art

[0002] The third-generation semiconductor material silicon carbide (SiC) is known for its large bandgap, strong thermal stability, high thermal conductivity, strong radiation resistance and other advantages. It is known for its resistance to high temperature, high pressure and high frequency. It has broad application prospects in the field of power semiconductors and has become the forefront of semiconductor material technology research and the focus of industry competition.

[0003] Surface quality is extremely important in the epitaxy process of SiC. The current clamping method for taking wafers out of the cartridge is to manually use a suction pen to suck the C surface, that is, the suction pen used when taking the wafer is to suck the wafer substrate tightly by negative pressure. This method of taking the wafer will inevitably cause the suction pen to contact the SiC surface and leave a suction pen mark. The suction pen mark will cause defects such as step bunching in the subsequent crystal epitaxy. The current compromise method is to use a suction pen to suck the C (carbon) surface, and then use a cleaning process to clean the suction pen mark. However, the cleaning process cannot completely eliminate the suction pen mark. If the brushing process is used, scratches may be introduced, and unskilled use of the suction pen will cause friction and scratches. Utility Model Content

[0004] The present application provides a wafer picking and placing device, which is used to solve the defect in the prior art that the suction pen easily leaves marks on the wafer surface, and achieves clamping of the outer edge of the wafer to facilitate transportation.

[0005] The present application provides a wafer placement device, comprising:

[0006] Grip assembly;

[0007] A supporting component, partly disposed on the holding component, and used for carrying a wafer;

[0008] The ejection assembly is arranged on the holding assembly and connected to the supporting assembly. The ejection assembly can drive the supporting assembly to move relative to the holding assembly under the drive of an external force, so that the part of the supporting assembly located outside the holding assembly cooperates with the outer end surface of the holding assembly to achieve clamping and release of the outer peripheral edge of the wafer.

[0009] According to an embodiment provided by the present application, the ejection assembly includes a connecting member and a driving member, wherein the connecting member is disposed in the holding assembly and connected to one end of the supporting assembly;

[0010] The driving member is exposed outside the holding assembly, and is suitable for driving the connecting member to move under the driving of an external force.

[0011] According to an embodiment provided by the present application, the gripping assembly is formed with a receiving cavity, a portion of the supporting assembly extends into the receiving cavity through a limiting hole, and the connecting member is located in the receiving cavity;

[0012] The wafer placement device also includes an elastic member located in the accommodating cavity, one end of the elastic member is limited to the holding assembly, and the other end is limited to the connecting member; the connecting member is suitable for switching between a clamping position and a release position, and the connecting member deforms the elastic member under the drive of the driving member and switches to the clamping position.

[0013] According to an embodiment provided by the present application, the driving member extends into the accommodating cavity through a through hole and is connected to the connecting member, and the through hole is arranged opposite to the limiting hole;

[0014] Alternatively, the holding assembly is configured with a clearance channel communicating with the accommodating cavity, and the driving member is disposed through the clearance channel.

[0015] According to an embodiment provided by the present application, the grip assembly includes a first shell and a second shell, the first shell is detachably connected to the second shell, and the accommodating cavity is formed after the first shell and the second shell are connected;

[0016] A clamping groove is configured at one end of the first shell and / or the second shell facing the supporting assembly, and the clamping groove is suitable for clamping the wafer together with the supporting assembly.

[0017] According to an embodiment provided in the present application, the clamping groove is adapted to the curvature of the outer peripheral edge of the wafer.

[0018] According to an embodiment provided in the present application, the supporting assembly includes at least two supporting arms and a support arm, one end of the support arm is connected to the ends of the at least two supporting arms, and the other end of the support arm is connected to the connecting member.

[0019] According to an embodiment provided by the present application, at least two of the supporting arms are provided with positioning blocks at their ends away from the supporting arms, and the positioning blocks are configured with guide grooves adapted to the outer peripheral edges of the wafers;

[0020] The guide groove and the clamping groove are located on the same horizontal plane.

[0021] According to an embodiment provided by the present application, a limit block is provided at one end of the support arm facing the connecting member;

[0022] The connecting member comprises a docking block adapted to the shape of the accommodating cavity, the docking block is structured with a limiting groove, and the limiting block can be connected to the docking block through the limiting groove.

[0023] According to an embodiment provided by the present application, the shape of the limiting hole includes at least one of a triangle, a rectangle, an ellipse and a polygon;

[0024] The portion of the supporting component that passes through the limiting hole is adapted to the shape of the limiting hole.

[0025] The wafer fetching and placing device provided by the present application is configured by placing an ejection assembly and a part of a supporting assembly connected to the ejection assembly on a holding assembly, manually holding the holding assembly and providing external force to the ejection assembly, and driving the supporting assembly to move through the ejection assembly, thereby forming a clamping area or a release area between the external supporting assembly and the outer end surface of the holding assembly, so that the wafer can be conveniently taken or placed in the release area, and the outer peripheral edge of the wafer can be conveniently clamped in the clamping area, thereby facilitating the rotation of the wafer. This configuration not only avoids the formation of marks on the surface of the wafer, but also does not require the introduction of additional excessive equipment, thereby alleviating or avoiding interference with the placement position during the manual wafer fetching and placing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 It is a schematic cross-sectional structural diagram of a wafer pick-and-place device provided in one embodiment of the present disclosure;

[0028] Figure 2 is a front view structural schematic diagram of a wafer pick-and-place device provided by the present disclosure;

[0029] Figure 3 It is a complete structural schematic diagram of the wafer pick-and-place device provided by the present disclosure;

[0030] Figure 4 is a schematic diagram of a wafer handling device provided by the present disclosure clamping a wafer;

[0031] Figure 5 It is a cross-sectional structural schematic diagram of another disclosed wafer handling device provided by an embodiment of the present application;

[0032] Figure 6 It is a complete structural schematic diagram of the wafer pick-and-place device provided by the present disclosure;

[0033] Figure 7 It is a schematic diagram of the assembly structure of the supporting component and the ejection component provided by the present invention.

[0034] Reference numerals:

[0035] 100, grip assembly; 101, first shell; 102, second shell; 1021, snap-fit ​​groove; 103, limit hole; 104, perforation; 105, rubber ring; 106, clearance channel; 107, accommodating cavity;

[0036] 200, supporting assembly; 201, supporting arm; 202, supporting arm; 2021, limiting block; 203, positioning block; 2031, guide groove;

[0037] 300, ejector assembly; 301, connector; 3011, docking block; 3011-1, limit groove; 302, drive member;

[0038] 400, elastic parts;

[0039] 500. Wafer. DETAILED DESCRIPTION

[0040] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0041] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0042] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0043] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0044] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0045] Surface quality is extremely important in the epitaxy process of SiC. The current manual clamping method is to use a suction pen to suck the C surface, which will inevitably leave a suction pen mark on the SiC surface. In addition, the traditional suction pen needs to be connected to negative pressure to form suction, and the negative pressure needs to be connected to each suction pen. Pipes and vacuum generators, etc., limit the position for manual placement of wafers.

[0046] Based on the above-mentioned problems, an embodiment of the present application provides a wafer placement device, which adopts manual drive to enable the placement device to clamp the outer edge of the wafer and facilitate the clamping and release of the wafer.

[0047] Figure 1 is a schematic cross-sectional structural diagram of a wafer pick-and-place device according to an embodiment of the present disclosure; Figure 5 It is a schematic cross-sectional structural diagram of a wafer handling device according to another embodiment of the present disclosure.

[0048] Reference Figure 1 and Figure 5 As shown, this exemplary embodiment provides a wafer 500 pick-and-place device, which may include a gripping assembly 100 , a supporting assembly 200 , and an ejecting assembly 300 .

[0049] The supporting assembly 200 is partially arranged on the holding assembly 100, and the supporting assembly 200 is used to carry the wafer 500; the ejection assembly 300 is arranged on the holding assembly 100 and is connected to the supporting assembly 200. The ejection assembly 300 can drive the supporting assembly 200 to move relative to the holding assembly 100 under the drive of an external force, so that the part of the supporting assembly 200 located outside the holding assembly 100 cooperates with the outer end surface of the holding assembly 100, thereby realizing the clamping and release of the outer edge of the wafer 500.

[0050] It is understandable that the support assembly 200 partially extends into the gripping assembly 100, and is used to connect with the ejection assembly 300, so that the ejection assembly 300 drives the support assembly 200 to move under the drive of external force, so as to form an area larger than the wafer 500 between the support assembly 200 and the gripping assembly 100, so as to facilitate the placement of the wafer 500 on the support assembly 200, and then the ejection assembly 300 acts on the support assembly 200, so that the support assembly 200 and the gripping assembly 100 cooperate to clamp the outer peripheral edge of the wafer 500 placed on the support assembly 200, thereby facilitating the movement of the wafer 500. After moving into place, the ejection assembly 300 can drive the support assembly 200 to move by external force, and a region larger than the wafer 500 is formed between the support assembly 200 and the gripping assembly 100, so as to facilitate the release of the wafer 500 to the target position.

[0051] More specifically, regarding the clamping or releasing of the wafer 500 through the cooperation between the supporting component 200 and the holding component 100, the ejection component 300 can be pushed by external force to drive the supporting component 200 and the holding component 100 to move relative to each other, for example, move away from the holding component 100, thereby increasing the area between the external supporting component 200 and the holding component 100, and facilitating the placement of the wafer 500 or the removal of the wafer 500; in the process of transporting the wafer 500, part of the supporting component 200 can be moved into the holding component 100, so that the area between the external supporting component 200 and the holding component 100 is reduced, that is, the outer edge of the wafer 500 is clamped to avoid the risk of the wafer 500 falling during transportation.

[0052] Of course, it is also possible to set an elastic mechanism in the holding component 100 and the ejection component 300. When the wafer 500 is taken or placed, the ejection component 300 is pushed by external force, thereby driving the relative movement of the supporting component 200 and the holding component 100, increasing the area between the external supporting component 200 and the holding component 100, and facilitating the taking or placing of the wafer 500. During the transportation of the wafer 500, the external supporting component 200 and the holding component 100 are maintained in a clamping state through the action of the elastic mechanism, and no external force is required at this time, which not only avoids manual fatigue caused by continuous force application during the transportation of the wafer 500, causing the wafer 500 to fall, but also allows the elastic mechanism to be set with a better clamping force to avoid damage to the wafer 500 caused by excessive clamping force.

[0053] In addition, the ejection assembly 300 can be arranged inside the holding assembly 100, or on the outer wall of the holding assembly 100. Of course, in order to facilitate manual holding of the holding assembly 100, the ejection assembly 300 can be arranged in the space inside the holding assembly 100. Then, the part of the supporting assembly 200 connected to the ejection assembly 300 can also be arranged in the space inside the holding assembly 100. This arrangement can not only reasonably utilize the space inside the holding assembly 100, but also will not cause the problem of excessive size of the wafer 500 placement device.

[0054] In this embodiment, the ejection assembly 300 and the part of the supporting assembly 200 connected to the ejection assembly 300 are arranged on the holding assembly 100, the holding assembly 100 is manually held, and an external force is provided to the ejection assembly 300, and the supporting assembly 200 is driven to move by the ejection assembly 300, so that a clamping area or a release area is formed between the external supporting assembly 200 and the outer end surface of the holding assembly 100, and the wafer 500 can be conveniently taken or placed in the release area, and the outer peripheral edge of the wafer 500 can be conveniently clamped in the clamping area, so as to facilitate the rotation of the wafer 500. This arrangement not only avoids the formation of marks on the surface of the wafer 500, but also does not require the introduction of excessive additional equipment, thereby reducing or avoiding interference with the placement position during the manual placement of the wafer.

[0055] The following will refer to Figures 1 to 7 The structures of the various parts of the wafer 500 pick-and-place device in this exemplary embodiment are described in more detail.

[0056] like Figure 1 and Figure 5 As shown, in some embodiments, the ejection assembly 300 includes a connecting member 301 and a driving member 302. The connecting member 301 is disposed in the holding assembly 100 and connected to one end of the supporting assembly 200; the driving member 302 is exposed from the holding assembly 100, and the driving member 302 is suitable for driving the connecting member 301 to move under the drive of an external force.

[0057] It is understandable that the connector 301 is mainly connected to the supporting assembly 200. In order to save space and make the volume of the wafer 500 placement device more compact, the connector 301 can be set inside the gripping assembly 100. Then, the part of the supporting assembly 200 connected to the connector 301 should also be set inside the gripping assembly 100. Since the wafer 500 placement device provided in the embodiment of the present application mainly takes and places the wafer 500 by manual hand-holding, in order to facilitate the application of external force to the ejection assembly 300 when taking and placing the wafer 500, the driving member 302 connected to the connector 301 is exposed to the gripping assembly 100, so that the movement of the supporting assembly 200 is indirectly achieved by manually turning / pressing the driving member 302, thereby achieving the adjustment of the distance between the external supporting assembly 200 and the outer end surface of the gripping assembly 100.

[0058] like Figure 1 As shown, in some embodiments, the holding component 100 is formed with a accommodating cavity 107, a portion of the supporting component 200 extends into the accommodating cavity 107 through the limiting hole 103, and the connecting member 301 is located in the accommodating cavity 107; the wafer 500 placement device also includes an elastic member 400, which is located in the accommodating cavity 107, one end of the elastic member 400 is limited to the holding component 100, and the other end is limited to the connecting member 301; the connecting member 301 is suitable for switching between a clamping position and a release position, and the connecting member 301 is driven by the driving member 302 to deform the elastic member 400 and switch to the clamping position, and the elastic force of the elastic member 400 is suitable for driving the connecting member 301 to reset to the release position.

[0059] It is understandable that the accommodating cavity 107 in the gripping assembly 100 is mainly used to place the connecting member 301 and part of the supporting assembly 200, and the connecting member 301 and the supporting assembly 200 connected thereto can move linearly in the accommodating cavity 107. In order to save more effort and ensure the clamping of the wafer 500 during the transfer of the wafer 500, an elastic member 400 is also provided in the accommodating cavity 107, and the elastic member 400 can be understood as a spring, which is not limited here.

[0060] The spring can be arranged at one end of the connecting member 301 facing the supporting assembly 200, that is, the spring is sleeved on the part of the supporting assembly 200 located in the accommodating cavity 107, and then one end abuts against the end of the connecting member 301, and the other end abuts against the inner wall of the holding assembly 100 in the accommodating cavity 107. When it is necessary to take or place the wafer 500, the driving member 302 drives the connecting member 301 to compress the spring, and moves the supporting assembly 200 to the outside of the holding assembly 100, so that there is a larger area between the outer end surfaces of the external supporting assembly 200 and the holding assembly 100. After the wafer 500 is placed on the supporting assembly 200, the driving member 302 is released, and the connecting member 301 is reset under the restoring elastic force of the spring, that is, the external supporting assembly 200 is moved closer to the holding assembly 100, so that the wafer 500 can be clamped between the supporting assembly 200 and the holding assembly 100, which is beneficial to the transfer of the wafer 500 and can prevent the wafer 500 from slipping off the wafer 500 placement device.

[0061] like Figure 2 As shown, in one example, the shape of the limiting hole 103 includes at least one of a triangle, a rectangle, an ellipse and a polygon; the part of the supporting component 200 passing through the limiting hole 103 is adapted to the shape of the limiting hole 103.

[0062] Specifically, the limiting hole 103 can be set to a rectangular shape, and the cross-section of the part of the supporting component 200 passing through the limiting hole 103 is also a rectangle. This setting not only facilitates the supporting component 200 to enter the accommodating cavity 107 and connect with the connecting member 301, and can also perform reciprocating linear motion with the connecting member 301, but also can avoid relative rotation between the supporting component 200 and the holding component 100.

[0063] In the embodiment of the present application, there are two ways to dispose the driving member 302 and the holding assembly 100.

[0064] As one of the settings, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, in one example, the driving member 302 extends into the accommodating cavity 107 through the through hole 104 to be connected with the connecting member 301 , and the through hole 104 is arranged opposite to the limiting hole 103 .

[0065] It can be understood that a through hole 104 is constructed on the other side wall of the accommodating cavity 107 opposite to the limiting hole 103, and the through hole 104 is used to set the driving member 302. The driving member 302 is penetrated by the through hole 104, one end of which extends into the accommodating cavity 107 and is connected to the connecting member 301, and the other end is exposed to the holding assembly 100 for manual pressing.

[0066] During use, the driver 302 is manually pressed, and the driver 302 drives the connector 301 and compresses the spring, and causes the support assembly 200 to move to the outside of the grip assembly 100, so that there is a larger area between the outer end surfaces of the external support assembly 200 and the grip assembly 100, so that the wafer 500 can be placed on the support assembly 200. After the wafer 500 is placed on the support assembly 200, the driver 302 is released, and the connector 301 is driven to reset under the reset elastic force of the spring, that is, the external support assembly 200 is brought close to the grip assembly 100, so that the wafer 500 can be clamped between the support assembly 200 and the grip assembly 100, which is convenient for transporting the wafer 500. After the wafer 500 is rotated to the target position, the step of releasing the wafer 500 is the same as the step of taking the wafer 500, which will not be repeated here.

[0067] As another setting, Figure 5 and Figure 6 As shown, in one example, the gripping assembly 100 is configured with a clearance channel 106 communicating with the accommodating cavity 107 , and the driving member 302 is disposed through the clearance channel 106 .

[0068] It can be understood that, on the side wall of the holding component 100, that is, the side perpendicular to the connection direction of the through hole 104 and the limiting hole 103 in the first embodiment, there is a clearance channel 106 starting from the side wall with the same moving direction as the connecting member 301, and the clearance channel 106 is connected to the accommodating cavity 107, and the driving member 302 is penetrated by the clearance channel 106, one end of the driving member 302 extends into the accommodating cavity 107 and is connected with the connecting member 301, and the other end is exposed to the holding component 100 for manual manipulation.

[0069] During use, the driver 302 is manually moved toward the direction close to the supporting assembly 200, and the driver 302 drives the connector 301 and compresses the spring, and causes the supporting assembly 200 to move toward the outside of the gripping assembly 100, so that there is a larger area between the outer end surfaces of the external supporting assembly 200 and the gripping assembly 100, so that the wafer 500 can be placed on the supporting assembly 200. After the wafer 500 is placed on the supporting assembly 200, the driver 302 is released, and the connector 301 is driven to reset under the reset elastic force of the spring, that is, the external supporting assembly 200 is brought close to the gripping assembly 100, so that the wafer 500 can be clamped between the supporting assembly 200 and the gripping assembly 100, which is convenient for transporting the wafer 500. After the wafer 500 is rotated to the target position, the step of releasing the wafer 500 is the same as the step of taking the wafer 500, which will not be repeated here.

[0070] The above are two ways of setting the driving member 302 on the gripping assembly 100. The first embodiment is convenient for taking and placing the vertically placed wafer 500. By holding the gripping assembly 100 and pressing the driving member 302 with the thumb, the purpose of taking and placing and rotating the wafer 500 with one hand can be achieved. The second embodiment is more suitable for the horizontally placed wafer 500. By holding the gripping assembly 100 and pushing the driving member 302 forward with the thumb, the purpose of taking and placing and transporting the wafer 500 with one hand can be achieved. However, it is not limited to the above two methods. Any method that can drive the connecting member 301 to move by the driving member 302 is within the protection scope of this application.

[0071] like Figure 3 As shown, in some embodiments, the holding assembly 100 includes a first shell 101 and a second shell 102, the first shell 101 and the second shell 102 are detachably connected, and a accommodating cavity 107 is formed after the first shell 101 and the second shell 102 are connected; the first shell 101 and / or the second shell 102 are configured with a snap-in groove 1021 at one end facing the supporting assembly 200, and the snap-in groove 1021 is suitable for clamping the wafer 500 with the supporting assembly 200.

[0072] It can be understood that in order to facilitate the installation of the above-mentioned supporting assembly 200, connecting member 301 and driving member 302, the holding assembly 100 can be disassembled into a first shell 101 and a second shell 102. After the above-mentioned parts are installed, the second shell 102 and the first shell 101 can be combined and fastened together. A rubber ring 105 can be sleeved on the outer wall of the first shell 101 and the second shell 102, or the first shell 101 and the second shell 102 can be connected by gluing, bolting, etc., which is not limited here.

[0073] Since the outer end surface of the gripping assembly 100 needs to cooperate with the external supporting assembly 200 to clamp the outer edge of the wafer 500, in order to avoid damage to the outer edge of the wafer 500 during the clamping process, a clamping groove 1021 adapted to the outer edge of the wafer 500 can be constructed at the end of the first shell 101 or the second shell 102. In one example, the clamping groove 1021 is adapted to the curvature of the outer edge of the wafer 500. Specifically, the curvature of the clamping groove 1021 is the same as the curvature of the outer edge of the wafer 500, and a buffer pad can also be set in the clamping groove 1021 to better protect the edge of the wafer 500 from damage during the clamping process.

[0074] like Figure 7 As shown, in some embodiments, the supporting assembly 200 includes at least two supporting arms 201 and a support arm 202 , one end of the support arm 202 is connected to the ends of at least two supporting arms 201 , and the other end of the support arm 202 is connected to the connecting member 301 .

[0075] It can be understood that in order to achieve stability in clamping the wafer 500, the supporting assembly 200 of this example can be provided with two supporting arms 201, and the ends of the two supporting arms 201 are connected to the end of the support arm 202, that is, the two supporting arms 201 and the support arm 202 are arranged in a Y shape, and the support arm 202 and one end of the supporting arm 201 extend into the accommodating cavity 107 through the limiting hole 103 and are connected to the connecting piece 301.

[0076] like Figure 7 As shown, in some embodiments, at least two supporting arms 201 are provided with positioning blocks 203 at their ends away from the supporting arms 202, and the positioning blocks 203 are constructed with guide grooves 2031 adapted to the outer peripheral edges of the wafer 500; the guide grooves 2031 are on the same horizontal plane as the clamping grooves 1021.

[0077] Specifically, in order to form a clamping position with the outer end of the holding assembly 100, a positioning block 203 is provided at the end of the two supporting arms 201 and the supporting arm 202, and a guide groove 2031 adapted to the outer edge of the wafer 500 is provided on the positioning block 203, that is, the curvature of the guide groove 2031 is the same as the curvature of the outer edge of the wafer 500, and a buffer pad may be further provided on the guide groove 2031 to reduce or avoid damage to the edge of the wafer 500 when clamping the wafer 500.

[0078] In addition, the guide groove 2031 protrudes from the support arm 202 by a preset distance, but it is necessary to ensure that the guide groove 2031 and the clamping groove 1021 are in the same horizontal plane to avoid damage to the wafer 500 when clamping the wafer 500.

[0079] During use, the connecting piece 301 drives the support arm 202 to move outward, and the two supporting arms 201 move away from the holding assembly 100, and the positioning block 203 cooperates with the guide groove 2031 to hook the wafer 500. When the supporting arm 201 is reset along with the elastic piece 400, the wafer 500 moves toward the clamping groove 1021 along with the guide groove 2031 until the wafer 500 is clamped by the guide groove 2031 and the clamping groove 1021, and then the wafer 500 is lifted along with the wafer 500 picking and placing device until the transfer of the wafer 500 is completed.

[0080] This example uses a three-point clamping method to clamp and transfer the wafer 500. This can be achieved through a simple combination of mechanical parts. It is not easy to damage, has strong reusability, does not require additional equipment, and provides more space for taking and placing the wafer 500.

[0081] like Figure 7As shown, in some embodiments, a limiting block 2021 is provided at one end of the support arm 202 toward the connecting member 301; the connecting member 301 includes a docking block 3011 adapted to the shape of the accommodating cavity 107, and the docking block 3011 is configured with a limiting groove 3011-1, and the limiting block 2021 can be connected to the docking block 3011 through the limiting groove 3011-1.

[0082] It can be understood that the step of installing the support arm 202 and the connecting member 301 on the holding assembly 100 can be that the end of the support arm 202 having the limit block 2021 is connected to the end of the connecting member 301 having the limit groove 3011-1, the limit block 2021 can be set to a T-shape, and the limit groove 3011-1 is also set to a T-shape that matches the limit block 2021, with the small end facing the support arm 202, and the limit block 2021 slides into the limit groove 3011-1 through the openings on both sides of the limit groove 3011-1, thereby hanging the support arm 202 on the connecting block. After the support arm 202 and the connecting piece 301 are connected, the spring is put on the support arm 202 and is tightly attached to the end face of the connecting piece 301. Then the support arm 202, the connecting piece 301 and the elastic piece 400 are placed together in the first shell 101 or the second shell 102. Then the first shell 101 and the second shell 102 are closed. The installation of the entire wafer 500 placement device is completed. Not only is the structure simple, but it is also easy to repair and replace.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A wafer pick-and-place device, characterized in that: include: A grip assembly (100); A supporting component (200), partially disposed on the holding component (100), the supporting component (200) being used to carry a wafer (500); The ejection assembly (300) is arranged on the holding assembly (100) and connected to the supporting assembly (200). The ejection assembly (300) can drive the supporting assembly (200) to move relative to the holding assembly (100) under the drive of an external force, so that the part of the supporting assembly (200) located outside the holding assembly (100) cooperates with the outer end surface of the holding assembly (100), thereby clamping and releasing the outer peripheral edge of the wafer (500).

2. The wafer handling device according to claim 1, characterized in that: The ejection assembly (300) comprises a connecting member (301) and a driving member (302); the connecting member (301) is arranged in the holding assembly (100) and connected to one end of the supporting assembly (200); The driving member (302) is exposed outside the holding assembly (100), and the driving member (302) is suitable for driving the connecting member (301) to move under the driving of an external force.

3. The wafer handling device according to claim 2, characterized in that: The gripping assembly (100) is formed with a receiving cavity (107), a portion of the supporting assembly (200) extends into the receiving cavity (107) through a limiting hole (103), and the connecting member (301) is located in the receiving cavity (107); The wafer placement device further comprises: an elastic member (400) located in the accommodating cavity (107); one end of the elastic member (400) is limited to the holding assembly (100), and the other end is limited to the connecting member (301); the connecting member (301) is suitable for switching between a clamping position and a releasing position; the connecting member (301) is driven by the driving member (302) to deform the elastic member (400) and switch to the clamping position.

4. The wafer handling device according to claim 3, characterized in that: The driving member (302) extends into the accommodating cavity (107) through the through hole (104) to be connected to the connecting member (301), and the through hole (104) and the limiting hole (103) are arranged opposite to each other; Alternatively, the gripping assembly (100) is configured with a clearance channel (106) communicating with the accommodating cavity (107), and the driving member (302) is disposed through the clearance channel (106).

5. The wafer handling device according to claim 3, characterized in that: The grip assembly (100) comprises a first shell (101) and a second shell (102), the first shell (101) and the second shell (102) are detachably connected, and the accommodating cavity (107) is formed after the first shell (101) and the second shell (102) are connected; A clamping groove (1021) is configured at one end of the first shell (101) and / or the second shell (102) facing the supporting assembly (200), and the clamping groove (1021) is suitable for clamping the wafer (500) with the supporting assembly (200).

6. The wafer placing device according to claim 5, characterized in that: The clamping groove (1021) is adapted to the curvature of the outer peripheral edge of the wafer (500), and the curvature of the clamping groove (1021) is the same as the curvature of the outer peripheral edge of the wafer (500).

7. The wafer placing device according to claim 5, characterized in that: The supporting assembly (200) comprises at least two supporting arms (201) and a supporting arm (202), one end of the supporting arm (202) is connected to the ends of the at least two supporting arms (201), and the other end of the supporting arm (202) is connected to the connecting member (301).

8. The wafer handling device according to claim 7, characterized in that: At least two of the supporting arms (201) are provided with positioning blocks (203) at their ends away from the supporting arm (202), and the positioning blocks (203) are configured with guide grooves (2031) adapted to the outer peripheral edge of the wafer (500); The guide groove (2031) and the clamping groove (1021) are located on the same horizontal plane.

9. The wafer placing device according to claim 7, characterized in that: A limiting block (2021) is provided at one end of the support arm (202) facing the connecting member (301); The connecting member (301) comprises a docking block (3011) adapted to the shape of the accommodating cavity (107); the docking block (3011) is configured with a limiting groove (3011-1); and the limiting block (2021) can be connected to the docking block (3011) via the limiting groove (3011-1).

10. The wafer handling device according to any one of claims 3 to 9, characterized in that: The shape of the limiting hole (103) includes at least one of a triangle, a rectangle, an ellipse and a polygon; The portion of the supporting component (200) that passes through the limiting hole (103) is adapted in shape to the limiting hole (103).

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