Cooling device and electrical equipment

Abstract

The utility model relates to a cooling device and electrical equipment, the cooling device is used for cooling a light source chip, and the cooling device comprises a P-type semiconductor and an N-type semiconductor. The P-type semiconductor is provided with a first cold end and a first hot end which are opposite, the N-type semiconductor is provided with a second cold end and a second hot end which are opposite, and the first hot end and the second end are respectively used for being connected with positive and negative electrodes of a power supply; the first cold end is used for being in contact with the first side of the light source chip and electrically connected with the light source chip, and the second cold end is used for being in contact with the second side of the light source chip and electrically connected with the light source chip, so that the P-type semiconductor, the light source chip, the N-type semiconductor and the power supply form an electric loop. According to the cooling device, the heat conduction path is shortened, and heat resistance is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic and electrical equipment, and in particular to a cooling device and electrical equipment. Background Art

[0002] Semiconductor laser light sources have many advantages in terms of optoelectronic performance and are gradually being adopted in large quantities in various products, such as projection products, lighting products, optical communication products, etc. The optical performance of lasers is greatly affected by temperature. At the same time, semiconductor lasers are usually small in size, have high heat generation power, and high heat flux density. In order to meet the optical performance, higher requirements are placed on the temperature and temperature stability performance of semiconductor lasers.

[0003] In the existing heat dissipation method used by the light source chip, the heat conduction between the light source chip and the heat sink needs to be achieved through a special heat conduction boss. The heat conduction path is long, the thermal resistance is large, and the heat dissipation effect is not ideal. Utility Model Content

[0004] Embodiments of the present application provide a cooling device and electrical equipment.

[0005] In a first aspect, an embodiment of the present application provides a cooling device, which is used to cool a light source chip, and includes a P-type semiconductor and an N-type semiconductor. The P-type semiconductor has a first cold end and a first hot end opposite to each other, and the N-type semiconductor has a second cold end and a second hot end opposite to each other, and the first hot end and the second hot end are respectively used to connect to the positive and negative electrodes of a power source; the first cold end is used to contact the first side of the light source chip and be electrically connected to the light source chip, and the second cold end is used to contact the second side of the light source chip and be electrically connected to the light source chip, so that the P-type semiconductor, the light source chip, the N-type semiconductor and the power source form an electrical circuit.

[0006] In some optional embodiments, the P-type semiconductor includes a first body and a first cold end conductor, the first cold end and the first hot end are respectively located at two ends of the first body, and the first cold end conductor is connected to the first cold end; the P-type semiconductor is used to be electrically connected to the light source chip through the first cold end conductor, and the first cold end conductor is used to adhere to the light source chip.

[0007] In some optional embodiments, the N-type semiconductor includes a second body and a second cold end conductor, the second cold end and the second hot end are respectively located at two ends of the second body, and the second cold end conductor is connected to the second cold end; the N-type semiconductor is used to be electrically connected to the light source chip through the second cold end conductor, and the second cold end conductor is used to fit the light source chip.

[0008] In some optional embodiments, the cooling device further includes a heat conducting member, two ends of which contact the first hot end and the second hot end respectively to conduct heat from the first hot end and the second hot end.

[0009] In some optional embodiments, the heat conductor includes a heat conductive body, a first insulating surface and a second insulating surface, the first insulating surface and the second insulating surface are both arranged on the heat conductive body, the heat conductor is insulated from the first hot end through the first insulating surface, and the heat conductor is insulated from the second hot end through the second insulating surface.

[0010] In some optional embodiments, the first insulating surface is an insulating sheet connected to the surface of the heat-conducting body or an insulating film layer attached to the surface of the heat-conducting body; the second insulating surface is an insulating sheet connected to the surface of the heat-conducting body or an insulating film layer attached to the surface of the heat-conducting body.

[0011] In some optional embodiments, the cooling device further includes a heat sink connected to the heat-conducting body to diffuse the heat of the heat-conducting body.

[0012] In some optional embodiments, the heat sink includes at least one of the following structures: a heat conducting plate, an air-cooled heat sink, and a liquid-cooled heat sink.

[0013] In a second aspect, an embodiment of the present application further provides an electrical device, comprising any one of the above-mentioned cooling devices and a light source chip, wherein the light source chip is electrically connected between the first cold end and the second cold end.

[0014] In some optional embodiments, the light source chip has a first surface and a second surface opposite to each other, the first surface contacts the first cold end, the second surface contacts the second cold end, and the first cold end, the first surface, the second surface and the second cold end are arranged in sequence along the same direction.

[0015] Compared with the prior art, the cooling device provided in the embodiment of the present application is applied to an electrical device. When the electrical device is running, the light source chip generates heat, and the first cold end and the second cold end directly cool the light source chip, and the heat is released at the first hot end and the second hot end. The two sides of the light source chip are in contact with the first cold end and the second cold end for cooling, which reduces the number of parts between the light source chip and the cooling device, shortens the heat conduction path, reduces the thermal resistance, and improves the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation manner will be briefly introduced below. Obviously, the drawings described below are only some implementation manners of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a simplified schematic diagram of a partial structure of an electrical device provided in one embodiment of the present application.

[0018] Figure 2 yes Figure 1 Schematic diagram of the enlarged structure of part A.

[0019] Figure 3 yes Figure 1 A schematic structural diagram of an implementation scheme of a light source chip of an electrical device is shown.

[0020] Figure 4 yes Figure 1 The cooling device of the electrical equipment shown is a schematic structural diagram for reflecting the heat conducting component and the heat dissipating component.

[0021] Marking description: 100, cooling device; 10, P-type semiconductor; 12, first cold end; 13, first body; 14, first hot end; 15, first cold end conductor; 17, first hot end conductor; 30, N-type semiconductor; 32, second cold end; 33, second body; 34, second hot end; 35, second cold end conductor; 50, heat conducting element; 52, heat conducting body; 54, first insulating surface; 56, second insulating surface; 70, heat dissipation element; 90, heat sink; 200, electrical equipment; 201, light source chip; 2012, chip semiconductor; 2014, first surface conductor; 2016, second surface conductor; 2013, first surface; 2015, second surface. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0023] If certain words are used in the specification and claims to refer to specific components, those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use differences in names as a way to distinguish components, but use differences in components' functions as the criteria for distinction. For example, "including" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to"; "substantially" means that those skilled in the art can solve technical problems within a certain error range and basically achieve technical effects.

[0024] See also Figure 1 An embodiment of the present application provides a cooling device 100 , which is applied to an electrical device 200 and is used to dissipate heat from a light source chip 201 of the electrical device 200 .

[0025] This specification does not limit the specific type of the electrical device 200. For example, the electrical device 200 may be a projection device, a lamp (such as a taillight), an optical communication product (such as a transmission chip), etc. In this embodiment, the electrical device 200 may include a light source chip 201 and the above-mentioned cooling device 100. The light source chip 201 is connected to the cooling device 100. When the electrical device 200 is running, the light source chip 201 generates heat. The cooling device 100 is used to dissipate heat from the light source chip 201, thereby improving the operating stability of the electrical device 200.

[0026] In this application, unless otherwise clearly specified or limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be internal communication between two elements, or it can be only surface contact. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] Please also see Figure 1 and Figure 2 In this embodiment, the cooling device 100 may include a P-type semiconductor 10 and an N-type semiconductor 30. The P-type semiconductor 10 has a first cold end 12 and a first hot end 14 opposite to each other, and the N-type semiconductor 30 has a second cold end 32 and a second hot end 34 opposite to each other. The first hot end 14 and the second hot end 34 are respectively connected to the positive and negative electrodes of the power supply. For example, the first hot end 14 is connected to the positive electrode of the external power supply, and the second hot end 34 is connected to the negative electrode of the power supply. The first cold end 12 contacts the first side of the light source chip 201, and the first cold end 12 is electrically connected to the light source chip 201. The second cold end 32 contacts the second side of the light source chip 201 (the side of the light source chip 201 away from the first cold end 12), and the second cold end 32 is electrically connected to the light source chip 201, so that the P-type semiconductor 10, the light source chip 201, the N-type semiconductor 30 and the power supply form an electrical circuit.

[0028] When the electrical device 200 is running, the light source chip 201 generates heat, and the first cold end 12 and the second cold end 32 directly cool the light source chip 201, and the heat is released at the first hot end 14 and the second hot end 34. Both sides of the light source chip 201 are in contact with the first cold end 12 and the second cold end 32 for cooling, which reduces the number of parts between the light source chip 201 and the cooling device 100, shortens the heat conduction path, reduces thermal resistance, and improves the heat dissipation effect.

[0029] The light source chip 201 may have a first surface 2013 and a second surface 2015 facing each other, the first surface 2013 contacts the first cold end 12, the second surface 2015 contacts the second cold end 32, and the first cold end 12, the first surface 2013, the second surface 2015 and the second cold end 32 are arranged in sequence along the same direction. The first surface 2013 and the second surface 2015 increase the contact area between the light source chip 201 and the first cold end 12 and the second cold end 32, thereby improving the heat transfer efficiency. The "end" of the aforementioned "first cold end 12 and the second cold end 32" does not only refer to the tip. In this embodiment, in the description of this specification, the "end" is a part with a certain spatial volume, such as having a surface area for contact.

[0030] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] See also Figure 3 The light source chip 201 may generally include a chip semiconductor 2012, a first surface conductor 2014 and a second surface conductor 2016. The first surface conductor 2014 is connected to the first surface 2013, and the second surface conductor 2016 is connected to the second surface 2015. The first surface conductor 2014 and the second surface conductor 2016 are respectively connected to the positive and negative electrodes of the power supply.

[0032] Please also see Figure 1 and Figure 2 In this embodiment, the P-type semiconductor 10 may include a first body 13 and a first cold end conductor 15. The first cold end 12 and the first hot end 14 are respectively located at the two ends of the first body 13, and the first cold end conductor 15 is connected to the first cold end 12. The first cold end conductor 15 serves as a cold end conductor of the P-type semiconductor 10. The P-type semiconductor 10 is electrically connected to the light source chip 201 through the first cold end conductor 15. The first cold end conductor 15 is attached to the chip semiconductor 2012. At this time, the P-type semiconductor 10 is electrically connected to the chip semiconductor 2012 through the first cold end conductor 15. The first cold end conductor 15 replaces the first surface conductor 2014 (such as Figure 3 In some other embodiments, the P-type semiconductor 10 may not include the first cold end conductor 15, and the first cold end 12 of the P-type semiconductor 10 is directly electrically connected to the chip semiconductor 2012 through the first surface conductor 2014.

[0033] The P-type semiconductor 10 may further include a first hot end conductor 17 for connecting to the positive or negative pole of a power source. The first hot end conductor 17 is connected to the first hot end 14 . The P-type semiconductor 10 is electrically connected to the positive or negative pole of the power source through the first hot end conductor 17 .

[0034] In this embodiment, the N-type semiconductor 30 may include a second body 33 and a second cold end conductor 35, the second cold end 32 and the second hot end 34 are respectively located at the two ends of the second body 33, and the second cold end conductor 35 is connected to the second cold end 32. The second cold end conductor 35 serves as a cold end conductor of the N-type semiconductor 30, and the N-type semiconductor 30 is electrically connected to the light source chip 201 through the second cold end conductor 35, and the second cold end conductor 35 is attached to the chip semiconductor 2012. At this time, the N-type semiconductor 30 is electrically connected to the chip semiconductor 2012 through the second cold end conductor 35, and the second cold end conductor 35 replaces the second surface conductor 2016 (such as Figure 3 In other embodiments, the N-type semiconductor 30 may not include the second cold end conductor 35, and the second cold end 32 of the N-type semiconductor 30 is directly electrically connected to the chip semiconductor 2012 through the second surface conductor 2016.

[0035] The N-type semiconductor 30 may further include a second hot end conductor 37 for connecting to the positive or negative pole of the power supply. The second hot end conductor 37 is connected to the second hot end 34 . The N-type semiconductor 30 is electrically connected to the positive or negative pole of the power supply through the second hot end conductor 37 .

[0036] The conductive material (first cold end conductor 15) of the first cold end 12 of the P-type semiconductor 10 and the conductive material (first surface conductor 2014) of the first side of the light source chip 201 are combined and shared, and the conductive material (second cold end conductor 35) of the second cold end 32 of the N-type semiconductor 30 and the conductive material (second surface semiconductor 2016) of the second side of the light source chip 201 are combined and shared. The P-type semiconductor 10, the light source chip 201, and the N-type semiconductor 30 are connected in series with the external power supply to form a complete electric circuit. The current on the light source chip 201 is the same as that on the P-type semiconductor 10 and the N-type semiconductor 30. The specific power supply parameters of the cooling device 100 need to be determined in combination with the performance parameters of the light source chip 201 and the P-type semiconductor 10 and the N-type semiconductor 30. In this embodiment, the specific dimensions (length, width, height) of the P-type semiconductor 10 and the N-type semiconductor 30 can be set according to the performance requirements of the light source chip 201.

[0037] The P-type semiconductor 10 is also called a hole-type semiconductor, which is a semiconductor that mainly conducts electricity through positively charged holes. The N-type semiconductor 30 is also called an electron-type semiconductor, which is an impurity semiconductor in which the concentration of free electrons is much greater than the concentration of holes. The main working principle of the P-type semiconductor 10 and the N-type semiconductor 30 is that the charge carriers are at different energy levels in different materials. Under the action of an external electric field, when the charge carriers move from a high-energy-level material to a low-energy-level material, they release excess energy. Conversely, when the charge carriers move from a low-energy-level material to a high-energy-level material, they need to absorb energy from the outside. Energy is released or absorbed in the form of heat at the interface between different materials.

[0038] Please also see Figure 1 and Figure 4 In this embodiment, the cooling device 100 may further include a heat conducting member 50, the two ends of which are in contact with the first hot end 14 and the second hot end 34 respectively, so as to conduct the heat of the first hot end 14 and the second hot end 34. The heat conducting member 50 may include a heat conducting body 52, a first insulating surface 54 and a second insulating surface 56, and the first insulating surface 54 and the second insulating surface 56 are both arranged on the heat conducting body 52. ​​The heat conducting member 50 is insulated from contacting the first hot end 14 through the first insulating surface 54, and the heat conducting member 50 is insulated from contacting the second hot end 34 through the second insulating surface 56. The heat conducting body 52 is used to conduct the heat of the first hot end 14 and the second hot end 34, and the first insulating surface 54 and the second insulating surface 56 ensure the insulation between the heat conducting member 50 and the P-type semiconductor 10 and the N-type semiconductor 30, thereby effectively preventing the short circuit phenomenon.

[0039] The present specification does not limit the specific material of the heat-conducting body 52. ​​For example, the material of the heat-conducting body 52 can be copper, aluminum, and other metals and alloys. The present specification does not limit the specific types of the first insulating surface 54 and the second insulating surface 56. For example, the first insulating surface 54 can be an insulating sheet connected to the surface of the heat-conducting body 52 (for example, a frosted insulating sheet, a flame-retardant insulating sheet, a polyester resin insulating sheet, etc.). Alternatively, the first insulating surface 54 can also be an insulating film layer attached to the surface of the heat-conducting body 52 (for example, a polyimide film, a fluoroplastic film, a polyamide film). Similarly, the second insulating surface 56 can be an insulating sheet connected to the surface of the heat-conducting body 52, or the second insulating surface 56 can also be an insulating film layer attached to the surface of the heat-conducting body 52.

[0040] In this embodiment, the cooling device 100 may further include a heat sink 70, which is connected to the heat-conducting body 52 to diffuse the heat of the heat-conducting body 52. ​​This specification does not limit the specific structure of the heat sink 70. For example, the heat sink 70 may include at least one of the following structures: a heat-conducting plate, an air-cooled heat sink, and a liquid-cooled heat sink. As an example, the heat sink 70 is a heat-conducting plate (for example, a plate made of a material with high thermal conductivity such as metal), which can not only achieve the purpose of increasing heat dissipation, but also save the internal space of the electrical device 200. If there is spare space in the internal space of the electrical device 200, the heat sink 70 can also be designed as an air-cooled or liquid-cooled heat sink to make full use of the space in the electrical device 200 and increase the heat dissipation efficiency of the light source chip 201. In this embodiment, the heat sink 70 is designed as a heat-conducting plate. This specification does not limit the specific material of the heat-conducting plate. The heat-conducting plate can be made of a material with a high thermal conductivity coefficient. For example, the heat-conducting plate can be made of metals such as copper, aluminum, and silver.

[0041] As another example, the heat sink 70 includes a liquid cooling plate, which is attached to the heat conducting body 52. ​​The liquid cooling plate has a water inlet and a water outlet, and has multiple water channels inside. The water channels are filled with water or cooling medium such as antifreeze, ethanol, etc. The power generated by the pump drives the closed liquid circulation to quickly remove heat. The radiator 90 can also be a temperature absorbing plate that uses a phase change of the cooling medium to absorb heat.

[0042] As another example, the heat sink 70 may also include an air-cooled heat sink, for example, the heat sink 70 may include a mounting bracket and a fan disposed on the mounting bracket, the mounting bracket may be used for heat conduction, the air inlet side and the air outlet side of the fan are opposite to each other, and the air outlet side faces the heat conducting body 52. ​​The fan accelerates the flow of air, converting natural convection into forced convection, so as to dissipate the heat of the heat conducting body 52.

[0043] As an example, the heat sink 70 is a heat conducting plate. In order to further improve the heat dissipation effect, in this embodiment, the cooling device 100 may also include a radiator 90, which is arranged on one side of the heat sink 70 to cool the heat sink 70. This specification does not limit the specific type of the radiator 90. The radiator 90 may include at least one of the following structures: heat sink fins, fans, heat pipes, and liquid cooling plates. If the radiator 90 includes heat sink fins and the heat sink 70 is a heat conducting plate, the heat sink fins may be processed or welded together with the heat conducting plate. If the radiator 90 includes a liquid cooling plate, the liquid cooling plate is attached to the heat sink 70. In this embodiment, the radiator 90 includes a fan, and the air outlet surface of the radiator 90 faces the heat sink 70.

[0044] When in use, the heat conductor 50 conducts the heat of the first hot end 14 and the second hot end 34 to the heat sink 70, and the airflow generated by the radiator 90 exchanges heat with the heat sink 70 to diffuse the heat into the air, thereby completing the transfer and diffusion of heat.

[0045] When the electrical device 200 provided in the embodiment of the present application is in operation, the light source chip 201 generates heat, and the first cold end 12 and the second cold end 32 directly cool the light source chip 201, and the heat is released at the first hot end 14 and the second hot end 34. The heat conductor 50 conducts the heat of the first hot end 14 and the second hot end 34 to the heat sink 70, and the airflow generated by the radiator 90 exchanges heat with the heat sink 70 to diffuse the heat into the air, completing the transfer and diffusion of heat. The two sides of the light source chip 201 are in contact with the first cold end 12 and the second cold end 32 for cooling, which reduces the parts between the light source chip 201 and the cooling device 100, shortens the heat conduction path, reduces the thermal resistance, and improves the heat dissipation effect.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A cooling device, characterized in that: The cooling device is used to cool the light source chip, and the cooling device includes: A P-type semiconductor, wherein the P-type semiconductor has a first cold end and a first hot end opposite to each other; and an N-type semiconductor, wherein the N-type semiconductor has a second cold end and a second hot end opposite to each other, the first hot end and the second hot end are respectively used to be connected to the positive and negative electrodes of a power source; the first cold end is used to contact a first side of the light source chip and be electrically connected to the light source chip, and the second cold end is used to contact a second side of the light source chip and be electrically connected to the light source chip, so that the P-type semiconductor, the light source chip, the N-type semiconductor and the power source form an electrical circuit.

2. The cooling device according to claim 1, characterized in that The P-type semiconductor includes a first body and a first cold end conductor, the first cold end and the first hot end are respectively located at two ends of the first body, and the first cold end conductor is connected to the first cold end; the P-type semiconductor is used to be electrically connected to the light source chip through the first cold end conductor, and the first cold end conductor is used to fit the light source chip.

3. The cooling device according to claim 1, characterized in that: The N-type semiconductor includes a second body and a second cold end conductor, the second cold end and the second hot end are respectively located at two ends of the second body, and the second cold end conductor is connected to the second cold end; the N-type semiconductor is used to be electrically connected to the light source chip through the second cold end conductor, and the second cold end conductor is used to fit the light source chip.

4. The cooling device according to claim 1, characterized in that: The cooling device further includes a heat conducting member, two ends of which are in contact with the first hot end and the second hot end respectively to conduct heat of the first hot end and the second hot end.

5. The cooling device according to claim 4, characterized in that The heat conducting member includes a heat conducting body, a first insulating surface and a second insulating surface, wherein the first insulating surface and the second insulating surface are both arranged on the heat conducting body, the heat conducting member is insulated and contacts the first hot end through the first insulating surface, and the heat conducting member is insulated and contacts the second hot end through the second insulating surface.

6. The cooling device according to claim 5, characterized in that: The first insulating surface is an insulating sheet connected to the surface of the heat-conducting body or an insulating film layer attached to the surface of the heat-conducting body; the second insulating surface is an insulating sheet connected to the surface of the heat-conducting body or an insulating film layer attached to the surface of the heat-conducting body.

7. The cooling device according to claim 5, characterized in that: The cooling device further comprises a heat sink connected to the heat-conducting body for diffusing the heat of the heat-conducting body.

8. The cooling device according to claim 7, characterized in that The heat sink includes at least one of the following structures: a heat conducting plate, an air-cooled heat sink, and a liquid-cooled heat sink.

9. An electrical device, characterized in that: include: A cooling device as claimed in any one of claims 1 to 8; as well as A light source chip is electrically connected between the first cold end and the second cold end.

10. The electrical device according to claim 9, characterized in that: The light source chip has a first surface and a second surface opposite to each other, the first surface contacts the first cold end, the second surface contacts the second cold end, and the first cold end, the first surface, the second surface and the second cold end are arranged in sequence along the same direction.

Images