Phase-locked loop quartz crystal oscillator with frequency difference close to high suppression

Abstract

The utility model relates to a phase-locked loop quartz crystal oscillator with close frequency difference and high suppression, which belongs to the technical field of quartz crystal oscillators and comprises an oscillator base, connecting weld legs are arranged at the bottom of the oscillator base, and electrodes are arranged in the oscillator base. According to the phase-locked loop quartz crystal oscillator with the frequency difference close to high suppression, the ceramic base is sleeved with the insertion frame, the positioning piece is controlled by the rotary control piece to move downwards, so that the IC chip is firmly positioned in the ceramic base through the positioning piece, a traditional welding mode is replaced with a slot insertion mode, and the frequency difference close to high suppression is achieved. And after the packaging cover plate is connected with the oscillator base, the crystal mounting seat is sleeved by using the packaging frame, so that the quartz crystal in the crystal mounting seat is packaged, the step of assembling the oscillator is more convenient, the labor intensity of a worker in assembling work is reduced, and the working efficiency is improved. And the production efficiency of the quartz crystal oscillator is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of quartz crystal oscillators, in particular to a quartz crystal oscillator with a frequency difference close to a high-suppression phase-locked loop. Background Art

[0002] A quartz crystal oscillator is an electronic device that uses the piezoelectric effect of a quartz crystal to generate a stable frequency. The structural principle of a quartz crystal oscillator is that when the frequency of an electrical signal is equal to the natural frequency of a quartz crystal chip, the chip resonates due to the piezoelectric effect, and after passing through a frequency conversion circuit, it outputs a signal with a stable frequency. A quartz crystal oscillator is a key component of crystal oscillators and narrowband filters, and is widely used in various electronic devices such as computers, communications equipment, radars, navigation systems, etc., as a reference clock or signal source to provide a stable and accurate frequency reference for the equipment.

[0003] In the current prior art, when a quartz crystal oscillator is produced, it is necessary to fix the IC chip on a ceramic base through a pad and solder, then seal the IC chip with bonding glue, and use silver glue to fix the quartz crystal on the crystal mounting seat, and package the crystal mounting seat through a metal cover plate, which makes the quartz crystal oscillator assembly process extremely complicated, resulting in low production efficiency and high labor intensity for the staff. Therefore, a quartz crystal oscillator with a frequency difference close to a high-suppression phase-locked loop is proposed to solve the above problems. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a quartz crystal oscillator with a frequency difference close to a high-suppression phase-locked loop, which has the advantage of being easy to assemble and solves the problem that when producing a quartz crystal oscillator, an IC chip needs to be fixed on a ceramic base through a pad and solder, then bonding glue is sealed around the IC chip, and the quartz crystal is fixed on a crystal mounting seat with silver glue, and the crystal mounting seat is packaged with a metal cover plate, thereby making the assembly process of the quartz crystal oscillator extremely complicated, resulting in low production efficiency and high labor intensity for the staff.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a frequency difference close to high suppression phase-locked loop quartz crystal oscillator, comprising an oscillator base, the bottom of the oscillator base is provided with a connecting solder pin, the interior of the oscillator base is provided with an electrode, and the oscillator base is provided with a chip mounting structure and a crystal mounting structure;

[0006] The chip mounting structure includes a ceramic base fixedly mounted on the inner bottom wall of the oscillator base, an IC chip is plugged into the top of the ceramic base, a packaging cover plate for packaging is provided on the oscillator base, a plug-in frame sleeved on the outer surface of the ceramic base is fixedly mounted on the bottom of the packaging cover plate, a positioning piece for fixing the IC chip is slidably mounted inside the plug-in frame, and a control piece for controlling the up and down movement of the positioning piece is provided on the packaging cover plate.

[0007] Furthermore, the crystal mounting structure includes a crystal mounting seat, which is fixedly mounted on the inner bottom wall of the oscillator base, and a quartz crystal is mounted on the crystal mounting seat. One side of the quartz crystal and the inner bottom wall of the crystal mounting seat are coated with silver glue, and a packaging frame that is sleeved on the crystal mounting seat is fixedly mounted on the bottom of the packaging cover.

[0008] Furthermore, the connecting solder pin is fixedly mounted on the bottom of the oscillator base, and the electrode is fixedly mounted inside the oscillator base and forms a passage with the connecting solder pin.

[0009] Furthermore, the packaging cover includes a packaging plate and two locking bolts, the two locking bolts are respectively threadedly installed on the left and right sides of the oscillator base, the packaging plate is plugged into the top of the oscillator base, and one end of the two locking bolts penetrates and extends into the interior of the packaging plate.

[0010] Furthermore, the positioning member includes a positioning plate and two guide rods, the two guide rods are fixedly installed on the top of the positioning plate, two connecting holes are opened on the top of the packaging cover plate, the outer surface of the guide rod is slidably connected to the inner wall of the connecting hole and penetrates into the interior of the plug-in frame.

[0011] Furthermore, the control component includes a straight-mouth circular plate and a threaded column, the straight-mouth circular plate is fixedly mounted on the top of the threaded column, the threaded column is connected to the internal thread of the packaging cover plate, and the bottom of the threaded column is rotatably connected to the top of the positioning plate.

[0012] Furthermore, the crystal mounting seat includes a rectangular mounting frame and a crystal oscillator seat, the rectangular mounting frame is fixedly mounted on the inner bottom wall of the oscillator base, the crystal oscillator seat is fixedly mounted inside the rectangular mounting frame, and the quartz crystal is located on the crystal oscillator seat.

[0013] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0014] The frequency difference is close to the high-suppression phase-locked loop quartz crystal oscillator. By providing a chip mounting structure and a crystal mounting structure, a ceramic base is sleeved by a plug-in frame, and a rotary control part is used to control the positioning part to move downward, so that the IC chip is firmly positioned inside the ceramic base by the positioning part, so that the slot insertion method is used to replace the traditional welding method, thereby simplifying the installation steps of the IC chip, and only after the packaging cover plate is connected to the oscillator base, the crystal mounting seat is sleeved by the packaging frame, so as to achieve the packaging of the quartz crystal in the crystal mounting seat, thereby making the steps of assembling the oscillator more convenient, thereby reducing the labor intensity of the staff's assembly work, and further improving the efficiency of quartz crystal oscillator production. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the utility model Figure 1 A in the enlarged view;

[0017] Figure 3 It is a three-dimensional schematic diagram of the structural packaging cover plate and the plug-in frame of the utility model.

[0018] In the figure: 1, oscillator base; 2, connecting solder pins; 3, electrodes; 41, ceramic base; 42, IC chip; 43, packaging cover; 44, plug-in frame; 45, positioning piece; 46, control piece; 47, crystal mounting seat; 48, quartz crystal; 49, silver glue; 50, packaging frame. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3 In this embodiment, a frequency difference close to a high-suppression phase-locked loop quartz crystal oscillator includes an oscillator base 1, a connecting solder pin 2 is provided at the bottom of the oscillator base 1, an electrode 3 is provided inside the oscillator base 1, a chip mounting structure and a crystal mounting structure are provided on the oscillator base 1, the connecting solder pin 2 is fixedly installed at the bottom of the oscillator base 1, and the electrode 3 is fixedly installed inside the oscillator base 1 and forms a passage with the connecting solder pin 2.

[0021] In the implementation of this example, the chip mounting structure includes a ceramic base 41 fixedly mounted on the inner bottom wall of the oscillator base 1, an IC chip 42 is plugged into the top of the ceramic base 41, and a packaging cover plate 43 for packaging is provided on the oscillator base 1. The packaging cover plate 43 includes a packaging plate and two locking bolts, and the two locking bolts are respectively threadedly mounted on the left and right sides of the oscillator base 1. The packaging plate is plugged into the top of the oscillator base 1, and one end of the two locking bolts penetrates and extends to the inside of the packaging plate, which is convenient for fixing the packaging cover plate 43 and the oscillator base 1. The bottom of the packaging cover plate 43 is fixedly mounted with a sleeve on the outer surface of the ceramic base 41. The plug-in frame 44 has a slidable interior with a positioning member 45 for fixing the IC chip 42, so as to fix the position of the IC chip 42. The positioning member 45 includes a positioning plate and two guide rods, and the two guide rods are fixedly installed on the top of the positioning plate. The top of the packaging cover plate 43 is provided with two connecting holes. The outer surface of the guide rod is slidably connected to the inner wall of the connecting hole and passes through the interior of the plug-in frame 44, so as to limit the positioning member 45 to move only inside the plug-in frame 44. The packaging cover plate 43 is provided with a control member 46 for controlling the up and down movement of the positioning member 45, so as to facilitate the control of the movement of the positioning member 45.

[0022] Among them, the control part 46 includes a straight-mouthed circular plate and a threaded column. The straight-mouthed circular plate is fixedly installed on the top of the threaded column. The threaded column is connected to the internal thread of the packaging cover plate 43, and the bottom of the threaded column is rotatably connected to the top of the positioning plate, so that the straight-mouthed circular plate in the control part 46 can be rotated by a flat-blade screwdriver, so that the threaded column drives the positioning plate in the positioning part 45 to move downward.

[0023] By adopting the above technical scheme, the IC chip 42 is inserted into the interior of the ceramic base 41, and then the packaging cover 43 is inserted into the top of the oscillator base 1, and the locking bolts on both sides are rotated to fix the position of the packaging cover 43 and the oscillator base 1. The ceramic base 41 is sleeved by the plug-in frame 44, and then the straight-mouthed circular plate in the control part 46 is rotated by a flat-blade screwdriver, so that the threaded column drives the positioning plate in the positioning part 45 to move downward, thereby realizing the use of the movable positioning plate to stably fix the IC chip 42 in the ceramic base 41.

[0024] In the implementation of this example, the crystal mounting structure includes a crystal mounting seat 47, which is fixedly mounted on the inner bottom wall of the oscillator base 1. A quartz crystal 48 is mounted on the crystal mounting seat 47. One side of the quartz crystal 48 and the inner bottom wall of the crystal mounting seat 47 are coated with silver glue 49 to facilitate the installation of the quartz crystal 48. A packaging frame 50 that is sleeved on the crystal mounting seat 47 is fixedly mounted on the bottom of the packaging cover plate 43 to package the quartz crystal 48.

[0025] Among them, the crystal mounting seat 47 includes a rectangular mounting frame and a crystal oscillator seat. The rectangular mounting frame is fixedly mounted on the inner bottom wall of the oscillator base 1, and the crystal oscillator seat is fixedly mounted inside the rectangular mounting frame. The quartz crystal 48 is located on the crystal oscillator seat, which is convenient for protecting and packaging the quartz crystal 48.

[0026] By adopting the above technical solution, the quartz crystal 48 is installed on the crystal oscillator seat in the crystal mounting seat 47 through the silver glue 49, and then the packaging cover 43 is inserted into the top of the oscillator base 1, and the locking bolts on both sides are rotated to fix the position of the packaging cover 43 and the oscillator base 1, and the packaging frame 50 at the bottom of the packaging cover 43 is used to sleeve the crystal mounting seat 47, so as to realize the packaging of the quartz crystal 48.

[0027] The working principle of the above embodiment is:

[0028] This frequency difference is close to a high-suppression phase-locked loop quartz crystal oscillator. During assembly, the IC chip 42 is inserted into the interior of the ceramic base 41, and the quartz crystal 48 is mounted on the crystal oscillator seat in the crystal mounting seat 47 through the silver glue 49, and then the packaging cover 43 is inserted into the top of the oscillator base 1, and the locking bolts on both sides are rotated to fix the position of the packaging cover 43 and the oscillator base 1, and the packaging frame 50 at the bottom of the packaging cover 43 is used to sleeve the crystal mounting seat 47, so as to realize the packaging of the quartz crystal 48, and the plug-in frame 44 is used to sleeve the ceramic base 41, and then the straight-mouthed circular plate in the control part 46 is rotated by a flat-blade screwdriver, so that the threaded column drives the positioning plate in the positioning part 45 to move downward, so that the IC chip 42 is stably fixed in the ceramic base 41 by the movable positioning plate, thereby completing the assembly of the quartz crystal oscillator.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A quartz crystal oscillator with a frequency difference close to a high-suppression phase-locked loop, comprising an oscillator base (1), characterized in that: The bottom of the oscillator base (1) is provided with a connecting solder pin (2), the interior of the oscillator base (1) is provided with an electrode (3), and the oscillator base (1) is provided with a chip mounting structure and a crystal mounting structure; The chip mounting structure comprises a ceramic base (41) fixedly mounted on the inner bottom wall of an oscillator base (1); an IC chip (42) is plugged into the top of the ceramic base (41); a packaging cover plate (43) for packaging is provided on the oscillator base (1); a plug-in frame (44) sleeved on the outer surface of the ceramic base (41) is fixedly mounted on the bottom of the packaging cover plate (43); a positioning member (45) for fixing the IC chip (42) is slidably mounted inside the plug-in frame (44); and a control member (46) for controlling the upward and downward movement of the positioning member (45) is provided on the packaging cover plate (43).

2. The frequency difference close to high suppression phase-locked loop quartz crystal oscillator according to claim 1, characterized in that: The crystal mounting structure comprises a crystal mounting seat (47), the crystal mounting seat (47) is fixedly mounted on the inner bottom wall of the oscillator base (1), a quartz crystal (48) is mounted on the crystal mounting seat (47), one side of the quartz crystal (48) and the inner bottom wall of the crystal mounting seat (47) are coated with silver glue (49), and a packaging frame (50) sleeved on the crystal mounting seat (47) is fixedly mounted on the bottom of the packaging cover plate (43).

3. The frequency difference close to high suppression phase-locked loop quartz crystal oscillator according to claim 1, characterized in that: The connecting solder pin (2) is fixedly mounted on the bottom of the oscillator base (1), and the electrode (3) is fixedly mounted inside the oscillator base (1) and forms a passage with the connecting solder pin (2).

4. The frequency difference close to high suppression phase-locked loop quartz crystal oscillator according to claim 1, characterized in that: The packaging cover plate (43) includes a packaging plate and two locking bolts, wherein the two locking bolts are respectively threadedly installed on the left and right sides of the oscillator base (1), and the packaging plate is plugged into the top of the oscillator base (1), and one end of the two locking bolts penetrates and extends into the interior of the packaging plate.

5. The frequency difference close to high suppression phase-locked loop quartz crystal oscillator according to claim 1, characterized in that: The positioning member (45) includes a positioning plate and two guide rods, the two guide rods are fixedly mounted on the top of the positioning plate, the top of the packaging cover plate (43) is provided with two connection holes, the outer surface of the guide rod is slidably connected to the inner wall of the connection hole and penetrates into the interior of the plug-in frame (44).

6. The frequency difference close to high suppression phase-locked loop quartz crystal oscillator according to claim 5, characterized in that: The control member (46) comprises a straight-mouth circular plate and a threaded column, wherein the straight-mouth circular plate is fixedly mounted on the top of the threaded column, the threaded column is connected to the internal thread of the packaging cover plate (43), and the bottom of the threaded column is rotatably connected to the top of the positioning plate.

7. The frequency difference close to high suppression phase-locked loop quartz crystal oscillator according to claim 2, characterized in that: The crystal mounting seat (47) comprises a rectangular mounting frame and a crystal oscillator seat, the rectangular mounting frame is fixedly mounted on the inner bottom wall of the oscillator base (1), the crystal oscillator seat is fixedly mounted inside the rectangular mounting frame, and the quartz crystal (48) is located on the crystal oscillator seat.

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