Circuit board assembly and electronic equipment

Abstract

The utility model relates to a circuit board assembly and electronic equipment. The circuit board assembly comprises a PCB and a shielding plate. The PCB comprises a first board surface, a second board surface and a ground layer, wherein the first board surface and the second board surface are arranged in the thickness direction, the ground layer is located between the first board surface and the second board surface, and the first board surface is provided with signal pins. The shielding plate is located above the first plate face, the shielding plate comprises a shielding layer made of metal materials, the shielding layer is located over the signal pins, and the shielding layer is insulated from the signal pins and connected with the ground layer. According to the scheme, electromagnetic interference of the signal pins can be shielded.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] In some electronic products, PCB (Printed Circuit Board) mainly serves as an electrical connection and a carrier. For sandwich-structured circuit boards, the bottom PCB board will be provided with some signal pins and ground pins for connecting to the adapter board in the middle. However, in some application scenarios, when the adapter board is not connected to the PCB board, these original signal pins will be exposed on the PCB board, which will cause electromagnetic interference to other devices. Summary of the invention

[0003] The present application provides a circuit board assembly and an electronic device, which can shield electromagnetic interference of signal pins.

[0004] A circuit board assembly, comprising:

[0005] The PCB board comprises a first board surface, a second board surface and a ground layer between the first board surface and the second board surface in a thickness direction, wherein the first board surface is provided with a signal pin;

[0006] A shielding plate is located above the first plate surface, and the shielding plate includes a shielding layer made of a metal material. The shielding layer is located directly above the signal pin, and the shielding layer is insulated from the signal pin and connected to the ground layer.

[0007] Optionally, the shielding plate further includes an insulating layer made of insulating material, and the insulating layer is located between the signal pin and the shielding layer.

[0008] Optionally, the shielding layer is attached to the insulating layer.

[0009] Optionally, the shielding plate is provided with a through hole penetrating along the thickness direction, the through hole penetrates the insulating layer and the shielding layer, and the shielding layer is connected to the ground layer via the through hole.

[0010] Optionally, the through hole is filled with a conductive material, and the conductive material connects the ground layer and the shielding layer.

[0011] Optionally, the first board surface is further provided with an outer grounding pin closer to the outer edge of the first board surface than the signal pin, and the outer grounding pin is connected to the ground layer and the shielding layer.

[0012] Optionally, the signal pins are provided in plurality and arranged in a circle, the outer ground pins are provided in plurality and arranged in a circle, the plurality of outer ground pins are arranged around the periphery of the plurality of signal pins, and the plurality of outer ground pins are all connected to the ground layer and the shielding layer.

[0013] Optionally, the first board surface is further provided with an inner ground pin which is closer to the center of the first board surface than the signal pin, and the inner ground pin is connected to the ground layer and the shielding layer.

[0014] Optionally, the signal pins are provided in plurality and arranged in a circle, the inner ground pins are provided in plurality and arranged in a circle, the plurality of signal pins are arranged around the periphery of the plurality of inner ground pins, and the plurality of inner ground pins are connected to the ground layer and the shielding layer.

[0015] An electronic device comprises any one of the circuit board components described above.

[0016] The present application provides a circuit board assembly and an electronic device, wherein a shielding layer is located directly above a signal pin and is connected to a ground layer, thereby shielding the signal pin directly above the signal pin through the shielding layer, preventing the signal pin from being exposed to the outside, thereby preventing the signal pin from causing electromagnetic interference to the electronic devices above. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a cross-sectional view of a partial structure of a circuit board assembly shown in an exemplary embodiment of the present application;

[0018] Figure 2 is a schematic diagram of a shielding plate shown in an exemplary embodiment of the present application;

[0019] Figure 3 It is a schematic diagram of a partial structure of a first board surface of a circuit board shown in an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0020] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application.

[0021] The terms used in this application are only for the purpose of describing specific embodiments, and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The "first", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not indicate quantity restrictions, but indicate that there is at least one, and will be separately described if only "one" is referred to. "Multiple" or "several" means two or more. Unless otherwise specified, similar words such as "front", "rear", "lower" and / or "upper", "top", "bottom" are only for the convenience of explanation, and are not limited to one position or one spatial orientation. Similar words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" cover the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. The words "connected" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0022] Please refer to Figure 1 , Figure 1 It is a cross-sectional view of a part of the structure of a circuit board assembly 100 according to an exemplary embodiment of the present application.

[0023] The present application provides a circuit board assembly 100, which includes a PCB board 10 and a shielding board 20. The PCB board 10 includes a first board surface 11, a second board surface 12 and a ground layer 13 located between the first board surface 11 and the second board surface 12 in the thickness direction, the first board surface 11 is provided with a signal pin 14, the signal pin 14 is insulated from the ground layer 13, and the number of the signal pins 14 is not limited, and a plurality of signal pins 14 may be provided.

[0024] The shielding plate 20 is located above the first board surface 11, and is used to shield the electromagnetic interference of the signal pin 14 to other electronic devices. The shielding plate 20 includes a shielding layer 21 made of a metal material, and the shielding layer 21 is located directly above the signal pin 14. The shielding layer 21 is insulated from the signal pin 14 and connected to the ground layer 13 to achieve grounding of the shielding layer 21. For example, a hole can be opened on the first board surface 11 to expose the ground layer 13, and then connected to the shielding layer 21. In this embodiment, the first board surface 11 is also provided with a grounding pin 15, and the shielding layer 21 can be connected to the ground layer 13 through the grounding pin 15.

[0025] According to the above description, the shielding layer 21 is located directly above the signal pin 14 and is connected to the ground layer 13. The shielding layer 21 shields the signal pin 14 directly above, thereby preventing the signal pin 14 from being exposed to the outside, thereby preventing the signal pin 14 from causing electromagnetic interference to the electronic devices above.

[0026] In one embodiment, the shielding layer 21 may face the first board surface 11 . In this case, sufficient electrical clearance and creepage distance should be set between the shielding layer 21 and the signal pins 14 to ensure insulation between the shielding layer 21 and the signal pins 14 .

[0027] In this embodiment, the space reserved between the shielding layer 21 and the signal pin 14 can be reduced by providing an insulating material between the two to achieve compactness and miniaturization of the structure. Specifically, the shielding plate 20 also includes an insulating layer 22 made of an insulating material, and the insulating layer 22 is located between the signal pin 14 and the shielding layer 21. In this way, the shielding layer 21 and the signal pin 14 can be insulated by the insulating layer 22, thereby saving space above the signal pin 14. For example, the insulating layer 22 can also contact the signal pin 14 to minimize the gap reserved above the signal pin 14. The material of the insulating layer 22 is not limited, and ceramics, rubber, or the same as the substrate of the PCB board 10 can be used.

[0028] In one embodiment, the shielding layer 21 is attached to the insulating layer 22. That is, the insulating layer 22 can be used as a substrate, and the shielding layer 21 can be formed on the insulating layer 22 by spraying, printing, and other processes, which can reduce the overall thickness of the shielding plate 20 and achieve miniaturization of the shielding plate 20. The shielding layer 21 can be set as a copper layer.

[0029] Please refer to Figure 2 , Figure 2 FIG. 2 is a schematic diagram of a shielding plate 20 exemplarily shown in the present application.

[0030] In one embodiment, the shielding plate 20 is provided with a through hole 220 penetrating in the thickness direction, the through hole 220 penetrates the insulating layer 22 and the shielding layer 21, and the shielding layer 21 is connected to the ground layer 13 via the through hole 220. The through hole 220 can provide a avoidance, so that the connection path between the shielding layer 21 and the ground layer 13 is shorter. In an optional embodiment, a wire can be passed through the through hole 220, one end of the wire is connected to the shielding layer 21, and the other end is connected to the ground pin 15.

[0031] Please combine Figure 1 and Figure 2In this embodiment, the through hole 220 is filled with a conductive material 16, and the conductive material 16 connects the stratum 13 and the shielding layer 21. In this way, the stratum 13 and the shielding layer 21 can be directly connected through the conductive material 16. Compared with the connection using a wire, the connection structure is simpler. For example, the conductive material 16 can be filled in the through hole 220 by electroplating, and the conductive material 16 can be copper. The through hole 220 can be a machined hole or a laser-processed hole.

[0032] In some other embodiments, a wire may be used to directly connect the shielding layer 21 and the ground pin 15. In this case, there is no need to open a through hole in the insulating layer 22. However, compared with opening a through hole, the above method requires a longer wire and a wiring path for the wire.

[0033] exist Figure 2 In the illustrated embodiment, the shielding plate 20 is configured as a hollow square plate, that is, the area on the shielding plate 20 corresponding to the PCB board 10 where the signal pins 14 are not provided can be hollowed out, thereby reducing the weight of the shielding plate 20. The shape of the shielding plate 20 is not limited, and can be configured to match the shape of the area on the PCB board 10 where the signal pins 14 are located.

[0034] Please refer to Figure 3 , Figure 3 It is a schematic diagram of a partial structure of the first board surface 11 of the PCB board 10 shown in an exemplary embodiment of the present application.

[0035] The first board surface 11 is further provided with an outer ground pin 151 which is closer to the outer edge of the first board surface 11 than the signal pin 14, and the outer ground pin 151 is connected to the ground layer 13 and the shielding layer 21. In this way, the outer ground pin 151 connected to the shielding layer 21 can shield the electromagnetic interference emitted by the signal pin 14 to the outer peripheral electronic devices, thereby protecting the outer peripheral electronic devices of the signal pin 14 from electromagnetic interference.

[0036] exist Figure 3 In the illustrated embodiment, the first board surface 11 is provided with a plurality of signal pins 14 and a plurality of outer ground pins 151, the plurality of signal pins 14 are arranged in a circle with intervals between them, and the plurality of signal pins 14 are arranged in a circle with intervals between them. The plurality of outer ground pins 151 are arranged around the periphery of the signal pins 14, and the plurality of outer ground pins 151 are connected to the ground layer 13 and the shielding layer 21. With such an arrangement, the electromagnetic interference signals generated by the respective signal pins 14 at different locations can be shielded by the respective outer ground pins 151 adjacent thereto, thereby improving the ability to prevent electromagnetic interference.

[0037] exist Figure 3In the illustrated embodiment, the first board surface 11 is further provided with an inner ground pin 152 which is closer to the center of the first board surface 11 than the signal pin 14, and the inner ground pin 152 is connected to the ground layer 13 and the shielding layer 21. In this way, the inner ground pin 152 connected to the shielding layer 21 can shield the electromagnetic interference emitted by the signal pin 14 to the inner peripheral electronic devices, thereby protecting the electronic devices in the inner peripheral of the signal pin 14 from electromagnetic interference.

[0038] exist Figure 3 In the illustrated embodiment, a plurality of inner ground pins 152 are provided, the plurality of inner ground pins 152 are arranged in a circle, a plurality of signal pins 14 are arranged around the periphery of the plurality of inner ground pins 152, and the plurality of inner ground pins 152 are connected to the ground layer 13 and the shielding layer 21. With such an arrangement, the electromagnetic interference generated by each signal pin 14 at different locations can be shielded by each inner ground pin 152 adjacent thereto, thereby improving the ability to prevent electromagnetic interference.

[0039] Please combine Figure 2 There are multiple through holes 220, and the multiple through holes 220 are arranged in a one-to-one correspondence with the multiple outer grounding pins 151 and the multiple inner grounding pins 152. The multiple through holes 220 can be filled with conductive material 16, and the shielding layer 21 is connected to the multiple outer grounding pins 151 and the multiple inner grounding pins 152 in a one-to-one correspondence through the conductive material 16 in each through hole 220.

[0040] The circuit board assembly 100 provided in the present application is connected to the shielding layer 21 through multiple outer grounding pins 151 and multiple inner grounding pins 152, so that a shielding cavity is formed between the PCB board 10 and the shielding plate 20, and the signal pin 14 is shielded in the shielding cavity. In one embodiment, in order to obtain a better shielding effect, a board edge electroplating process can also be used to electroplate a metal layer on the outer contour surface of the shielding plate 20, including but not limited to copper.

[0041] The present application also provides an electronic device, which includes the above-described circuit board assembly 100. The electronic device includes but is not limited to a mobile phone, a tablet computer, a watch, and the like.

[0042] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A circuit board assembly, characterized in that: include: The PCB board comprises a first board surface, a second board surface and a ground layer between the first board surface and the second board surface in a thickness direction, wherein the first board surface is provided with a signal pin; A shielding plate is located above the first plate surface, and the shielding plate includes a shielding layer made of a metal material. The shielding layer is located directly above the signal pin, and the shielding layer is insulated from the signal pin and connected to the ground layer.

2. The circuit board assembly according to claim 1, characterized in that: The shielding plate further includes an insulating layer made of insulating material, and the insulating layer is located between the signal pin and the shielding layer.

3. The circuit board assembly according to claim 2, characterized in that: The shielding layer is attached to the insulating layer.

4. The circuit board assembly according to claim 3, characterized in that: The shielding plate is provided with a through hole penetrating along the thickness direction, the through hole penetrates the insulating layer and the shielding layer, and the shielding layer is connected to the ground layer via the through hole.

5. The circuit board assembly according to claim 4, characterized in that: The through hole is filled with a conductive material, and the conductive material connects the ground layer and the shielding layer.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The first board surface is further provided with an outer grounding pin which is closer to the outer edge of the first board surface than the signal pin, and the outer grounding pin is connected to the ground layer and the shielding layer.

7. The circuit board assembly according to claim 6, characterized in that: There are multiple signal pins arranged in a circle, there are multiple outer ground pins arranged in a circle, multiple outer ground pins are arranged around the periphery of the multiple signal pins, and the multiple outer ground pins are all connected to the ground layer and the shielding layer.

8. The circuit board assembly according to claim 6, characterized in that: The first board surface is further provided with an inner ground pin which is closer to the center of the first board surface than the signal pin, and the inner ground pin is connected to the ground layer and the shielding layer.

9. The circuit board assembly according to claim 8, characterized in that: There are multiple signal pins arranged in a circle, and there are multiple inner ground pins arranged in a circle. The multiple signal pins are arranged around the periphery of the multiple inner ground pins, and the multiple inner ground pins are connected to the ground layer and the shielding layer.

10. An electronic device, characterized in that: A circuit board assembly comprising the circuit board assembly as claimed in any one of claims 1 to 9.

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