Printed circuit board (PCB) anti-skip printing test structure

Abstract

The utility model discloses a printed circuit board (PCB) anti-skip printing test structure, which comprises a PCB main body, the surface of the PCB main body is provided with three grooves, the three grooves comprise a CP groove, an OC groove and an SA groove, copper molds are arranged in the three grooves, and the three grooves are communicated with one another. According to the utility model, the PCB can be conveniently tested in the printing process, and the phenomenon of skip printing of the PCB is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, in particular to a PCB board anti-leaking printing test structure. Background Art

[0002] PCB, Chinese name for printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component, the support of electronic components, and the provider of electrical connections for electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board.

[0003] During the production process, PCB boards need to be printed with green ink and white ink text. However, due to the deviation of the PCB board placement during the printing process / collision during transportation, a certain PCB board will skip the printing process and can only be discovered through visual inspection by employees. The probability of detection is low, and defective products are easily delivered to the client. Utility Model Content

[0004] The present application provides a PCB board anti-missing printing test structure, which is convenient for testing the PCB board during the printing process to prevent the PCB board from missing printing.

[0005] The present application provides a PCB board leak prevention test structure, which adopts the following technical solutions:

[0006] A PCB board leak-proof testing structure comprises a PCB board body, wherein the surface of the PCB board body is provided with three grooves, wherein the three grooves comprise a CP groove, an OC groove and an SA groove, wherein copper molds are arranged in the three grooves, and the three grooves are interconnected.

[0007] By adopting the above technical scheme, the utility model designs a PCB board missing printing test structure, by opening a groove in the PCB board, setting three copper molds in the groove, the three copper molds are connected to each other, the OC point in the OC groove is used to attach the green oil layer, the SA point in the SA groove is used to attach the white oil layer, and the CP point in the CP groove is used to expose the copper mold. When the PCB board skips printing / misses printing, the copper molds of the OC point and the SA point will leak out, and the circuit states of the CP point and the OC point, and the CP point and the SA point are measured respectively, so as to determine whether the PCB board has missed printing.

[0008] Preferably, through holes are provided between the CP slot and the OC slot, and between the OC slot and the SA slot, and copper blocks for connecting the three copper molds are provided in the through holes.

[0009] By adopting the above technical solution, the through hole is provided for the copper block connected to the three copper molds to pass through, so that the current passes through to form a loop when measuring the circuit.

[0010] Preferably, a plurality of springs are arranged in the CP groove, the OC groove and the SA groove, the springs are fixedly connected to the inner sides of the three grooves, and the side of the spring away from the groove abuts against the copper block.

[0011] By adopting the above technical solution, the springs are provided to apply force to the three copper blocks in the CP slot, OC slot and SA slot, so that the three copper molds remain stable and prevent the copper molds from shifting during printing and affecting the printing process.

[0012] Preferably, an adhesive layer is provided at the bottom of the groove, and the bottom of the copper mold is bonded above the adhesive layer.

[0013] By adopting the above technical solution, the provided adhesive layer makes it easier to adhere the copper mold in the groove, further preventing the copper mold from shifting during the printing process.

[0014] Preferably, the outer and inner sides of the 0C groove and the SA groove are both rectangular, the length of the outer side is slightly larger than the inner side, and a bevel is formed between the outer and inner sides.

[0015] By adopting the above technical solution, the length of the outer sides of the 0C groove and the SA groove is set to be slightly larger than the inner sides, which is convenient for improving the covering effect of the green oil and the white oil, and is also convenient for setting the spring for abutting the copper mold.

[0016] Preferably, the copper molds in the CP groove and the SA groove protrude from the top of the groove, and the copper mold in the OC groove maintains the same height as the groove.

[0017] By adopting the above technical solution, the copper mold protruding from the CP groove is easy to be exposed for circuit testing, and when the heights of the copper mold in the OC groove are inconsistent with those in the SA groove, different oil layers can be covered.

[0018] Preferably, a layer of ink adsorbent is coated on the outer side of the copper mold in the OC groove and the SA groove.

[0019] By adopting the above technical solution, the ink adsorbent is provided to facilitate better printing of the green oil layer and the white oil layer on the copper mold in the OC slot and the SA slot, thereby improving the coverage effect of the green oil and the white oil.

[0020] Preferably, a silicone layer is provided around the CP groove copper mold.

[0021] By adopting the above technical solution, a silicone layer is arranged around the CP groove copper mold. Since silicone and ink are not easily bonded, the CP groove copper mold can be prevented from being covered with green oil and white oil.

[0022] In summary, this application has the following beneficial effects:

[0023] 1. The spring is used to apply force to the three copper blocks in the CP slot, OC slot and SA slot to keep the three copper molds stable and prevent the copper molds from shifting during printing, which would affect the printing process;

[0024] 2. The adhesive layer is set to facilitate bonding the copper mold in the groove, further preventing the copper mold from shifting during the printing process;

[0025] 3. A silicone layer is set around the CP slot copper mold. Since silicone and ink are not easy to adhere, it can prevent the CP slot copper mold from being covered with green oil and white oil. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A top view of an embodiment;

[0027] Figure 2 A cross-sectional view showing the inside of a groove in an embodiment;

[0028] Explanation of the accompanying drawings: 1. PCB board body; 2. groove; 3. CP groove; 4. OC groove; 5. SA groove; 6. copper mold; 7. through hole; 8. copper block; 9. spring; 10. adhesive layer; 11. ink adsorbent; 12. silicone layer. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the accompanying drawings. The same components are denoted by the same reference numerals. It should be noted that the terms "front", "rear", "left", "right", "upper", "lower", "bottom" and "top" used in the following description refer to directions in the accompanying drawings, and the terms "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0030] The utility model discloses a PCB board leak-proof testing structure, such as Figure 1 , Figure 2 As shown, it includes a PCB board body 1. The PCB board body 1 in the utility model is a part of the PCB board. Three grooves 2 are arranged on the surface of the PCB board body 1. The distances between two adjacent grooves 2 are the same. The three grooves 2 include a CP groove 3, an OC groove 4, and an SA groove 5. The three grooves 2 are arranged in the order of the CP groove 3, the OC groove 4, and the SA groove 5. Copper molds 6 are arranged in the three grooves 2. The size of the copper mold 6 is slightly smaller than the size of the groove 2. Through holes 7 are arranged between the CP groove 3 and the OC groove 4, and between the OC groove 4 and the SA groove 5. Copper blocks 8 for connecting the three copper molds 6 are arranged in the through holes 7. The three grooves 2 are connected to each other. The size of the copper block 8 is consistent with that of the through holes 7, and the copper block 8 is clamped in the through holes 7.

[0031] A plurality of springs 9 are arranged in the CP groove 3, the OC groove 4 and the SA groove 5. The springs 9 are fixedly connected to the inner sides of the three grooves 2. One side of the spring 9 is horizontally fixedly connected to the inner wall of the groove 2. The side of the spring 9 away from the groove 2 abuts against the copper block 8. The springs 9 are arranged to bear force on the three copper blocks 8 in the CP groove 3, the OC groove 4 and the SA groove 5 to keep the three copper molds 6 stable and prevent the copper molds 6 from shifting during the printing process, thereby affecting the printing process. An adhesive layer 10 is arranged at the bottom of the three grooves 2. The bottom of the copper mold 6 is bonded to the adhesive layer 10. The adhesive layer 10 is consistent with the size of the groove 2 and fills the entire bottom of the groove 2. The thickness of the adhesive layer 10 is maintained at about 2 mm. The adhesive layer 10 is arranged to facilitate bonding the copper mold 6 in the groove 2, thereby further preventing the copper mold 6 from shifting during the printing process.

[0032] The outer and inner sides of the OC groove 4 and the SA groove 5 are both rectangular, the length of the outer side is slightly greater than the inner side, a bevel is formed between the outer side and the inner side, the entire groove 2 is terraced inside, and a portion of the distance between the bevel and the copper mold 6 is left to facilitate the expansion and contraction of the spring 9. The copper mold 6 in the CP groove 3 and the SA groove 5 protrudes from the top of the groove 2, the height of the copper mold 6 in the OC groove 4 is consistent with that of the groove 2, and a layer of ink adsorbent 11 is applied to the outer side of the copper mold 6 in the OC groove 4 and the SA groove 5. A silicone layer 12 is arranged around the copper mold 6 of the CP groove 3, the silicone layer 12 is slightly larger than the CP groove 3, and the thickness is set to be about 2mm. The silicone layer 12 is arranged around the copper mold 6 of the CP groove 3, because silicone and ink are not easy to adhere, it can prevent the copper mold 6 of the CP groove 3 from being covered with green oil and white oil.

[0033] Working principle: The utility model designs a PCB board anti-missing printing test structure, firstly opens three grooves 2 CP, OC, SA points on the PCB board, and then places interconnected copper molds 6 in the three grooves 2. During the printing process, green oil and white oil will be brushed, the OC point is used to cover the green oil, and the SA point is used to cover the white oil. After the printing is completed, the conductivity of the copper mold 6 is used to perform circuit tests on the CP point and the OC point, and the CP point and the SA point. When the circuit test results of the two points are both open circuits, there is no missing printing phenomenon on the surface of the PCB board, and the PCB board is an OK board. When one of the two points does not have an open circuit, the PCB board is judged to be a bad board.

[0034] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A PCB board leak prevention test structure, characterized in that: The invention comprises a PCB board body (1), wherein three grooves (2) are arranged on the surface of the PCB board body (1), wherein the three grooves (2) comprise a CP groove (3), an OC groove (4), and an SA groove (5), wherein copper molds (6) are arranged in the three grooves (2), and the three grooves (2) are interconnected.

2. A PCB board leak prevention test structure according to claim 1, characterized in that: Through holes (7) are provided between the CP groove (3) and the OC groove (4), and between the OC groove (4) and the SA groove (5), and copper blocks (8) for connecting the three copper molds (6) are provided in the through holes (7).

3. A PCB board leak prevention test structure according to claim 1, characterized in that: A plurality of springs (9) are arranged in the CP groove (3), the OC groove (4) and the SA groove (5); the springs (9) are fixedly connected to the inner sides of the three grooves (2); and the side of the springs (9) away from the grooves (2) abuts against the copper block (8).

4. A PCB board leak prevention test structure according to claim 1, characterized in that: The bottom of the groove (2) is provided with an adhesive layer (10), and the bottom of the copper mold (6) is bonded above the adhesive layer (10).

5. A PCB board leak prevention test structure according to claim 1, characterized in that: The outer side and inner side of the OC groove (4) and the SA groove (5) are both rectangular, the length of the outer side is slightly greater than the inner side, and a bevel is formed between the outer side and the inner side.

6. A PCB board leak prevention test structure according to claim 1, characterized in that: The copper mold (6) in the CP groove (3) and the SA groove (5) protrudes from the top of the groove (2), and the copper mold (6) in the OC groove (4) is consistent in height with the groove (2).

7. A PCB board leak prevention test structure according to claim 1, characterized in that: A layer of ink adsorbent (11) is coated on the outer side of the copper mold (6) in the OC groove (4) and the SA groove (5).

8. A PCB board leak-proof testing structure according to claim 1, characterized in that: A silicone layer (12) is arranged around the copper mold (6) of the CP groove (3).

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