Novel PCBA (Printed Circuit Board Assembly) semiconductor assembly equipment

Abstract

The utility model discloses novel PCBA (Printed Circuit Board Assembly) semiconductor assembling equipment, which comprises a product feeding device used for positioning and conveying PCBA; the printing device is arranged corresponding to the product feeding device and is used for printing solder paste on the PCBA; the fine adjustment ball mounting device is arranged corresponding to the product feeding device and is used for carrying out position adjustment and ball mounting operation on the PCBA and the semiconductor; and the detecting and discharging device is arranged corresponding to the product feeding device and is used for detecting and discharging good products and defective products. According to the utility model, the printing device, the fine tuning and ball mounting device and the detection and discharge device are arranged in a matched manner, so that the operations of solder paste printing, semiconductor position adjustment and ball mounting, and detection and discharge are completed in a limited operation space, and the welding accuracy and reliability of semiconductors are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of assembly equipment, in particular to a novel PCBA semiconductor assembly equipment. Background Art

[0002] The existing new PCBA semiconductor assembly equipment has the following disadvantages:

[0003] (1) During the solder paste printing process, a rigid scraper is usually used to transfer the solder paste to the PCBA. Due to the lack of a device to adjust the scraper pressure, problems such as unbalanced scraper pressure and uneven solder paste printing occur.

[0004] (2) During the welding process, due to the lack of a device to fine-tune the position of the semiconductor, there is a positioning deviation, which in turn leads to problems such as poor welding and poor welding accuracy, and cannot meet the precision welding requirements of micro and small parts;

[0005] (3) The quality inspection of solder balls adopts the traditional manual visual inspection method, which has low work efficiency and poor detection accuracy. When there are tolerances in the product, it will lead to a high rate of missed detection of small defects. Utility Model Content

[0006] In order to overcome the above technical problems, the utility model discloses a novel PCBA semiconductor assembly equipment.

[0007] The technical solution adopted by the utility model to achieve the above-mentioned purpose is:

[0008] A new type of PCBA semiconductor assembly equipment, comprising:

[0009] Product loading device, used to position and convey PCBA;

[0010] A printing device, corresponding to the product feeding device, is used for printing solder paste on the PCBA;

[0011] A fine-tuning ball implanting device, corresponding to the product feeding device, is used to adjust the position and implant the ball of the PCBA and the semiconductor;

[0012] A detection and discharging device, arranged corresponding to the product feeding device, is used to detect and discharge good and defective products;

[0013] Wherein, the fine-tuning ball implantation device comprises an identification mechanism, a fourth translation mechanism, and a mounting ball implantation mechanism arranged on the fourth translation mechanism;

[0014] The identification mechanism includes a first rotating cylinder and an identification seat driven to rotate by the first rotating cylinder. A second positioning hole identification mechanism and a solder ball position identification mechanism are arranged on the identification seat. The second positioning hole identification mechanism is electrically connected to the fourth translation mechanism. The solder ball position identification mechanism is electrically connected to the mounting ball implantation mechanism. The second positioning hole identification mechanism is used to identify the positioning holes in the area to be mounted on the PCBA, and the solder ball position identification mechanism is used to identify the position of the printed solder balls.

[0015] The above-mentioned novel PCBA semiconductor assembly equipment, wherein the product loading device comprises a conveyor belt with a plurality of product fixing bases installed at equal intervals, the product fixing base is provided with a product fixing cavity, and the product fixing base is provided with a peripheral fixing mechanism and a surface fixing mechanism;

[0016] The circumferential fixing mechanism includes a first side fixing seat, a middle fixing seat and a second side fixing seat arranged around the product fixing cavity. The first side fixing seat is integrally formed with the product fixing base. A first translation mechanism and a second translation mechanism perpendicular to the driving direction are arranged on the product fixing base. The middle fixing seat and the second side fixing seat are respectively arranged on the first translation mechanism and the second translation mechanism.

[0017] The above-mentioned new PCBA semiconductor assembly equipment, wherein the surface fixing mechanism includes a first clamping block and a second clamping block respectively arranged between the first side fixing seat and the middle fixing seat, and between the middle fixing seat and the second side fixing seat, a first positioning rod driven to rotate by a first motor is arranged on the first clamping block, and a second positioning rod driven to rotate by a second motor is arranged on the second clamping block, and the first positioning rod and the second positioning rod are both arranged corresponding to the product fixing cavity and parallel to the product fixing base.

[0018] In the above-mentioned novel PCBA semiconductor assembly equipment, the printing device includes a first positioning hole recognition mechanism, a third translation mechanism, a first scraper mechanism and a second scraper mechanism which are electrically connected, the third translation mechanism is used to drive the first scraper mechanism and the second scraper mechanism to move synchronously, and the first positioning hole recognition mechanism is used to identify the positioning holes in the PCBA to be mounted area.

[0019] The above-mentioned novel PCBA semiconductor assembly equipment, wherein the first scraper mechanism includes a first printing seat, and a first positioning member extended from the first printing seat, the first positioning member is used to position the positioning hole of the PCBA to be mounted area, and the first printing seat is provided with a first printing scraper, a first longitudinal drive assembly for driving the first printing scraper to move longitudinally, and a first transverse drive assembly for driving the first printing scraper to move transversely, the driving direction of the first transverse drive assembly is perpendicular to the driving direction of the third translation mechanism, and a first pressure regulating assembly for adjusting the scraping paste pressure of the first printing scraper is provided between the first longitudinal drive assembly and the first printing scraper;

[0020] The second scraper mechanism includes a second printing seat and a second positioning member extending from the second printing seat, the second positioning member is used to position the positioning hole of the PCBA to be mounted area, and a second printing scraper, a second longitudinal movement driving component for driving the second printing scraper to move longitudinally, and a second transverse movement driving component for driving the second printing scraper to move transversely are arranged on the second printing seat, the driving direction of the second transverse movement driving component is perpendicular to the driving direction of the third translation mechanism, and a second pressure regulating component for adjusting the scraping paste pressure of the second printing scraper is arranged between the second longitudinal movement driving component and the second printing scraper.

[0021] The novel PCBA semiconductor assembly equipment mentioned above, wherein the fine-tuning ball implantation device comprises an identification mechanism, a fourth translation mechanism, and a placement ball implantation mechanism disposed on the fourth translation mechanism;

[0022] The identification mechanism includes a first rotating cylinder and an identification seat driven to rotate by the first rotating cylinder. A second positioning hole identification mechanism and a solder ball position identification mechanism are arranged on the identification seat. The second positioning hole identification mechanism is electrically connected to the fourth translation mechanism. The solder ball position identification mechanism is electrically connected to the mounting ball implantation mechanism. The second positioning hole identification mechanism is used to identify the positioning holes in the area to be mounted on the PCBA, and the solder ball position identification mechanism is used to identify the position of the printed solder balls.

[0023] The above-mentioned novel PCBA semiconductor assembly equipment, wherein the mounting and ball implanting mechanism comprises a mounting seat, and a second positioning member extending from the mounting seat, the second positioning member is used to locate the positioning hole of the PCBA to be mounted area, and a fine-tuning component and a clamping component are arranged on the mounting seat;

[0024] The fine-tuning component includes a first rotary cylinder arranged on the mounting seat, and an adjustment rotary seat sleeved on the driving shaft of the first rotary cylinder, and a first paddle and a second paddle for adjusting the position of the semiconductor are correspondingly arranged on both sides of the adjustment rotary seat, the first paddle and the second paddle are arranged corresponding to the product fixing cavity, and the first rotary cylinder is electrically connected to the solder ball position identification mechanism.

[0025] The above-mentioned novel PCBA semiconductor assembly equipment, wherein the clamping assembly includes a clamping assembly arranged on the mounting seat, and a third longitudinal movement driving assembly for driving the clamping assembly to move longitudinally, a third pressure regulating assembly for adjusting the pressing pressure of the clamping assembly is arranged between the third longitudinal movement driving assembly and the clamping assembly, and the pressing surface of the clamping assembly is provided with a component fixing groove for positioning the semiconductor, a PCBA fixing seat for positioning the PCBA, and a laser welding head for heating and melting the solder balls.

[0026] The above-mentioned novel PCBA semiconductor assembly equipment, wherein the detection and discharge device comprises an electrically connected detection mechanism and a discharge mechanism, and the detection mechanism is arranged corresponding to the product fixing cavity;

[0027] The detection mechanism includes a ball missing detection component for detecting whether a solder ball is missing, and a solder ball welding detection component for detecting the solder ball welding quality;

[0028] The missing ball detection component includes a correspondingly arranged detection light source and an optical signal sensor, and the detection light source is arranged corresponding to the product fixing cavity;

[0029] The solder ball welding detection assembly includes a first image detection unit for detecting welding point size defects, a second image detection unit for detecting welding point scratch defects, and a third image detection unit for detecting welding point offset defects.

[0030] In the above-mentioned novel PCBA semiconductor assembly equipment, the detection and discharging device further includes a good product discharging mechanism and a bad product discharging mechanism;

[0031] The discharging mechanism includes a fifth translation mechanism and a translation seat arranged on the fifth translation mechanism, a good product picking mechanism and a defective product picking mechanism are arranged in parallel on the translation seat, the good product picking mechanism goes back and forth between the product feeding device and the good product discharging mechanism, and the defective product picking mechanism goes back and forth between the product feeding device and the defective product discharging mechanism;

[0032] The good product picking mechanism includes a first lifting mechanism and a first picking seat arranged on the first lifting mechanism, and a plurality of first air nozzles are arranged on the first picking seat, and the first air nozzles are arranged corresponding to the product fixing cavity;

[0033] The defective product picking mechanism includes a second lifting mechanism and a second picking seat arranged on the second lifting mechanism. A plurality of groups of second air nozzles are arranged on the second picking seat. The second air nozzles are arranged corresponding to the product fixing cavity.

[0034] The beneficial effects of the utility model include the following points:

[0035] (1) The utility model is equipped with the printing device, the fine-adjusting ball planting device and the detecting and discharging device, so as to complete the operations of solder paste printing, semiconductor position adjustment and ball planting, and detecting and discharging in a limited operating space, thereby greatly improving the welding accuracy and reliability of semiconductors;

[0036] (2) The structure of the product feeding device is optimized, and the lateral side fixation and the rotating upper surface fixation are combined to effectively position and fix PCBAs of different sizes, thereby preventing the PCBA from shaking left and right or up and down and affecting the subsequent operation accuracy, and improving the fixation reliability of the PCBA;

[0037] (3) The printing device adopts a dual scraper mechanism to improve the solder ball printing efficiency, wherein the first pressure regulating component and the second pressure regulating component are optimized to effectively control the scraping paste pressure when the first printing scraper and the second printing scraper contact the PCBA, thereby solving the problem of uneven solder ball printing thickness and improving the solder ball printing quality;

[0038] (4) The fine-tuning ball planting device is provided in conjunction with the second positioning hole recognition mechanism and the solder ball position recognition mechanism to improve the lateral movement accuracy of the mounting ball planting mechanism and the semiconductor welding accuracy; wherein the fine-tuning component compensates the position of the semiconductor according to the recognition result of the solder ball position recognition mechanism, and during welding, the semiconductor and PCBA are positioned and fixed respectively by using the component fixing groove and the PCBA fixing seat, and the solder ball is heated and melted by using a laser welding head in the form of small-scale laser heating, so that the semiconductor is welded on the PCBA, thereby improving the semiconductor welding accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0040] Figure 1 It is a schematic diagram of the structure of the utility model. DETAILED DESCRIPTION

[0041] The present invention is further described below through specific embodiments to make the technical solution of the present invention easier to understand and grasp, rather than to limit the present invention.

[0042] Example: See Figure 1, this embodiment provides a new type of PCBA semiconductor assembly equipment, which includes:

[0043] Product feeding device 1, used for positioning and conveying PCBA;

[0044] A printing device 2, arranged corresponding to the product feeding device 1, for printing solder paste on the PCBA;

[0045] A fine-tuning ball implanting device 3 is provided corresponding to the product feeding device 1 and is used for adjusting the position and performing ball implanting operations on the PCBA and the semiconductor;

[0046] The detection and discharging device 4 is arranged corresponding to the product feeding device 1, and is used for detecting and discharging good products and defective products.

[0047] Preferably, the product loading device 1 comprises a conveyor belt with a plurality of product fixing bases installed at equal intervals, the product fixing base is provided with a product fixing cavity, and a peripheral fixing mechanism and a surface fixing mechanism are provided on the product fixing base;

[0048] The circumferential fixing mechanism includes a first side fixing seat, a middle fixing seat and a second side fixing seat arranged around the product fixing cavity, the first side fixing seat is integrally formed with the product fixing base, and a first translation mechanism and a second translation mechanism whose driving directions are perpendicular are arranged on the product fixing base, and the middle fixing seat and the second side fixing seat are respectively arranged on the first translation mechanism and the second translation mechanism; specifically, when the PCBA is placed in the product fixing cavity, at this time, one end of the PCBA abuts against the first side fixing seat to achieve pre-positioning, and the first translation mechanism and the second translation mechanism respectively drive the middle fixing seat and the second side fixing seat to approach the PCBA to achieve circumferential fixing of the PCBA, thereby preventing the PCBA from shaking left and right and affecting the subsequent operation accuracy, and is suitable for circumferential fixing of PCBAs of different sizes, thereby increasing the application range of the device.

[0049] Furthermore, the surface fixing mechanism includes a first clamping block and a second clamping block respectively arranged between the first side end fixing seat and the middle fixing seat, and between the middle fixing seat and the second side end fixing seat; a first positioning rod driven to rotate by a first motor is arranged on the first clamping block, and a second positioning rod driven to rotate by a second motor is arranged on the second clamping block; the first positioning rod and the second positioning rod are both arranged corresponding to the product fixing cavity and parallel to the product fixing base; specifically, when the first side end fixing seat, the middle fixing seat and the second side end fixing seat fix the PCBA, the first motor and the second motor respectively drive the first positioning rod and the second positioning rod to rotate to press against the surface of the PCBA, thereby fixing the upper surface of the PCBA, avoiding the PCBA from shaking up and down and affecting the subsequent operation accuracy, and is suitable for fixing the upper surface of PCBAs of different sizes, thereby increasing the application range of the device.

[0050] Preferably, the printing device 2 comprises a first positioning hole recognition mechanism, a third translation mechanism, a first scraper mechanism and a second scraper mechanism which are electrically connected, wherein the third translation mechanism is used to drive the first scraper mechanism and the second scraper mechanism to move synchronously, and the first positioning hole recognition mechanism is used to recognize the positioning holes of the area to be mounted on the PCBA; the solder ball printing efficiency is improved by adopting a double scraper mechanism;

[0051] The first scraper mechanism includes a first printing seat and a first positioning member extending from the first printing seat, the first positioning member is used to position the positioning hole of the PCBA to be mounted area, the first printing seat is provided with a first printing scraper, a first longitudinal movement driving assembly for driving the first printing scraper to move longitudinally, and a first transverse movement driving assembly for driving the first printing scraper to move transversely, the driving direction of the first transverse movement driving assembly is perpendicular to the driving direction of the third translation mechanism, and a first pressure regulating assembly for adjusting the scraping paste pressure of the first printing scraper is provided between the first longitudinal movement driving assembly and the first printing scraper; specifically, when the first positioning hole recognition mechanism recognizes the positioning hole of the PCBA to be mounted area, the third translation mechanism drives the first scraper mechanism to approach the PCBA, at which time the first positioning member is inserted into the positioning hole of the PCBA to be mounted area to achieve precise positioning, the first printing scraper prints solder balls on the PCBA, and the first pressure regulating assembly effectively controls the scraping paste pressure when the first printing scraper contacts the PCBA, thereby solving the problem of uneven solder ball printing thickness and improving solder ball printing quality;

[0052] The second scraper mechanism includes a second printing seat and a second positioning member extended from the second printing seat, the second positioning member is used to position the positioning hole of the PCBA to be mounted area, the second printing scraper, the second longitudinal movement driving component for driving the second printing scraper to move longitudinally, and the second transverse movement driving component for driving the second printing scraper to move transversely are arranged on the second printing seat, the driving direction of the second transverse movement driving component is perpendicular to the driving direction of the third translation mechanism, and a second pressure regulating component for adjusting the scraping paste pressure of the second printing scraper is arranged between the second longitudinal movement driving component and the second printing scraper; specifically, when the first positioning hole recognition mechanism recognizes the positioning hole of the PCBA to be mounted area, the third translation mechanism drives the second scraper mechanism to approach the PCBA, at which time the second positioning member is inserted into the positioning hole of the PCBA to be mounted area to achieve precise positioning, the second printing scraper prints solder balls on the PCBA, and the second pressure regulating component effectively controls the scraping paste pressure when the second printing scraper contacts the PCBA, thereby solving the problem of uneven solder ball printing thickness and improving solder ball printing quality.

[0053] Preferably, the fine-tuning ball implantation device 3 comprises an identification mechanism, a fourth translation mechanism, and a ball implantation mechanism disposed on the fourth translation mechanism;

[0054] The identification mechanism includes a first rotating cylinder and an identification seat driven to rotate by the first rotating cylinder, and a second positioning hole identification mechanism and a solder ball position identification mechanism are arranged on the identification seat, the second positioning hole identification mechanism is electrically connected to the fourth translation mechanism, the solder ball position identification mechanism is electrically connected to the mounting and ball planting mechanism, the second positioning hole identification mechanism is used to identify the positioning holes in the area to be mounted on the PCBA, and the solder ball position identification mechanism is used to identify the position of the printed solder balls; specifically, the first rotating cylinder drives the identification seat to rotate close to the PCBA, the second positioning hole identification mechanism identifies the positioning holes in the area to be mounted on the PCBA, and the solder ball position identification mechanism identifies the position of the solder balls printed on the PCBA;

[0055] The mounting ball implanting mechanism includes a mounting seat and a second positioning member extending from the mounting seat, the second positioning member is used to locate the positioning hole of the area to be mounted on the PCBA, and a fine-tuning component and a clamping component are arranged on the mounting seat; the fine-tuning component is used to adjust the position and angle of the semiconductor, and the clamping component is used to install and weld the semiconductor on the PCBA;

[0056] The fine-tuning component includes a first rotary cylinder disposed on the mounting seat, and an adjustment rotary seat sleeved on the driving shaft of the first rotary cylinder, and a first paddle and a second paddle for adjusting the position of the semiconductor are correspondingly disposed on both sides of the adjustment rotary seat, and the first paddle and the second paddle are disposed corresponding to the product fixing cavity, and the first rotary cylinder is electrically connected to the solder ball position identification mechanism; specifically, the semiconductor is picked up and fed by an existing feeding manipulator and placed on the PCBA to be mounted area, the fourth translation mechanism drives the mounting ball implantation mechanism to approach the PCBA, and after the solder ball position identification mechanism identifies the position of the solder ball, the first rotary cylinder synchronously drives the first paddle and the second paddle to rotate, thereby moving the semiconductor to perform position adjustment compensation, so as to achieve precise adjustment of the position of the semiconductor and the solder ball, and further improve the installation accuracy of the semiconductor;

[0057] The clamping assembly includes a clamping assembly arranged on the mounting seat, and a third longitudinal movement driving assembly for driving the clamping assembly to move longitudinally. A third pressure regulating assembly for adjusting the pressing pressure of the clamping assembly is arranged between the third longitudinal movement driving assembly and the clamping assembly. The pressing surface of the clamping assembly is provided with a component fixing groove for positioning the semiconductor, a PCBA fixing seat for positioning the PCBA, and a laser welding head for heating and melting the solder balls. Specifically, when the fine-tuning assembly completes the position adjustment of the semiconductor, the third longitudinal movement driving assembly drives the clamping assembly to descend. At this time, the PCBA fixing seat fixes the PCBA, and the component fixing groove fixes the semiconductor. The laser welding head heats and melts the solder balls to weld the semiconductor on the PCBA, thereby improving the welding accuracy of the semiconductor.

[0058] Preferably, the detection and discharging device 4 comprises an electrically connected detection mechanism and a discharging mechanism, and the detection mechanism is arranged corresponding to the product fixing cavity;

[0059] The detection mechanism includes a ball missing detection component for detecting whether a solder ball is missing, and a solder ball welding detection component for detecting the solder ball welding quality;

[0060] The missing ball detection component includes a correspondingly arranged detection light source and an optical signal sensor, and the detection light source is arranged corresponding to the product fixing cavity; specifically, the detection light source is used to illuminate the solder ball welding point of the PCBA, and the optical signal sensor is used to collect whether there is light leakage at the solder ball welding point to determine whether the solder ball is missing, that is, the detection light source emits light to the solder ball welding point of the PCBA, and when the optical signal sensor does not collect an optical signal at the solder ball welding point corresponding to the solder ball welding point, it is determined that the PCBA does not have a defect of missing solder balls, otherwise it is determined to have a defect of missing solder balls;

[0061] The solder ball welding detection component includes a first image detection unit for detecting soldering point size defects, a second image detection unit for detecting soldering point scratch defects, and a third image detection unit for detecting soldering point offset defects; specifically, the first image detection unit, the second image detection unit, and the third image detection unit perform image acquisition and analysis on the solder ball soldering points of the PCBA, and when the first image detection unit detects that the diameter size of the soldering point does not meet the preset size standard, it is determined as a soldering point size defect, when the second image detection unit detects that there are scratches on the surface of the soldering point, it is determined as a soldering point scratch defect, and when the third image detection unit detects that the center position of the soldering point does not meet the preset center standard, it is determined as a soldering point offset defect, wherein the preset size standard and the preset center standard are set according to the actual process.

[0062] Preferably, the detection and discharging device 4 further includes a good product discharging mechanism and a bad product discharging mechanism;

[0063] The discharging mechanism includes a fifth translation mechanism and a translation seat arranged on the fifth translation mechanism, a good product picking mechanism and a defective product picking mechanism are arranged in parallel on the translation seat, the good product picking mechanism moves back and forth between the product feeding device 1 and the good product discharging mechanism, and the defective product picking mechanism moves back and forth between the product feeding device 1 and the defective product discharging mechanism; specifically, the fifth translation mechanism drives the good product picking mechanism and the defective product picking mechanism to move horizontally synchronously, when the detection mechanism detects that the PCBA is a good product, the good product picking mechanism picks up the PCBA and moves it out, and when the detection mechanism detects that the PCBA is a defective product, the defective product picking mechanism picks up the PCBA and moves it out;

[0064] The good product picking mechanism includes a first lifting mechanism and a first picking seat arranged on the first lifting mechanism, and a plurality of first air nozzles are arranged on the first picking seat, and the first air nozzles are arranged corresponding to the product fixing cavity; specifically, the first lifting mechanism drives the first air nozzle to descend to the PCBA good product, and the first air nozzle absorbs the PCBA good product;

[0065] The defective product picking mechanism includes a second lifting mechanism and a second picking seat arranged on the second lifting mechanism, and a plurality of groups of second air nozzles are arranged on the second picking seat, and the second air nozzles are arranged corresponding to the product fixing cavity; specifically, the second lifting mechanism drives the second air nozzle to descend to the defective PCBA product, and the second air nozzle absorbs the defective PCBA product.

[0066] The high-precision PCBA patch dispensing equipment of the utility model comprises the following steps when working:

[0067] (1) The product feeding device 1 conveys PCBA;

[0068] (2) The product loading device 1 drives the PCBA to move to the printing device 2;

[0069] The first positioning hole recognition mechanism recognizes the positioning holes in the area to be mounted on the PCBA, the third translation mechanism drives the first scraper mechanism and the second scraper mechanism to move laterally synchronously, and the first scraper mechanism and the second scraper mechanism print solder balls on the PCBA according to the recognition result of the first positioning hole recognition mechanism;

[0070] When the first positioning hole recognition mechanism recognizes the positioning hole of the PCBA to be mounted area, the third translation mechanism drives the first scraper mechanism to approach the PCBA. At this time, the first positioning member is inserted into the positioning hole of the PCBA to be mounted area to achieve precise positioning. The first pressure adjustment component controls the scraping paste pressure when the first printing scraper contacts the PCBA, and the first printing scraper prints solder balls on the PCBA.

[0071] At the same time, the second positioning member is inserted into the positioning hole of the PCBA to be mounted to achieve precise positioning, and the second pressure regulating component controls the scraping paste pressure when the second printing scraper contacts the PCBA, and the second printing scraper prints solder balls on the PCBA;

[0072] (3) After printing is completed, the product loading device 1 drives the PCBA to move to the fine-tuning ball implanting device 3;

[0073] The identification mechanism identifies the positioning holes and solder ball positions in the area to be mounted on the PCBA, and the mounting and ball implanting mechanism performs semiconductor position fine-tuning and soldering operations according to the identification results of the identification mechanism;

[0074] The first rotary cylinder drives the identification seat to rotate close to the PCBA, the second positioning hole identification mechanism identifies the positioning holes in the area to be mounted on the PCBA, and the solder ball position identification mechanism identifies the solder ball position printed on the PCBA;

[0075] The semiconductor is picked up by the existing feeding manipulator and placed on the PCBA to be mounted area. The fourth translation mechanism drives the mounting ball mechanism to approach the PCBA. According to the recognition result of the solder ball position recognition mechanism, the first rotary cylinder synchronously drives the first paddle and the second paddle to rotate, thereby moving the semiconductor to adjust the position and compensate, so as to achieve precise adjustment of the semiconductor and solder ball positions.

[0076] The third longitudinal driving assembly drives the clamping assembly to descend, at which time the PCBA fixing seat fixes the PCBA, and the component fixing groove fixes the semiconductor, and the laser welding head heats and melts the solder ball to weld the semiconductor on the PCBA;

[0077] (4) After the ball implantation is completed, the product loading device 1 drives the PCBA to move to the detection and discharging device 4;

[0078] The detection light source emits light to the solder ball welding point of the PCBA. When the light signal sensor does not collect light signals corresponding to the solder ball welding point, it is determined that the PCBA does not have a defect of lacking solder balls. Otherwise, it is determined to have a defect of lacking solder balls.

[0079] The first image detection unit, the second image detection unit, and the third image detection unit collect and analyze images of the solder ball welding points of the PCBA. When the first image detection unit detects that the diameter size of the welding point does not meet the preset size standard, it is determined to be a welding point size defect. When the second image detection unit detects that there are scratches on the surface of the welding point, it is determined to be a welding point scratch defect. When the third image detection unit detects that the center position of the welding point does not meet the preset center standard, it is determined to be a welding point offset defect.

[0080] If the PCBA is a good product, the good product picking mechanism picks up the PCBA and moves it out;

[0081] If the PCBA is a defective product, the defective product picking mechanism picks up the PCBA and moves it out.

[0082] The new PCBA semiconductor assembly equipment of the utility model has the following advantages:

[0083] (1) The utility model is equipped with the printing device, the fine-adjusting ball planting device and the detecting and discharging device, so as to complete the operations of solder paste printing, semiconductor position adjustment and ball planting, and detecting and discharging in a limited operating space, thereby greatly improving the welding accuracy and reliability of semiconductors;

[0084] (2) The structure of the product feeding device is optimized, and the lateral side fixation and the rotating upper surface fixation are combined to effectively position and fix PCBAs of different sizes, thereby preventing the PCBA from shaking left and right or up and down and affecting the subsequent operation accuracy, and improving the fixation reliability of the PCBA;

[0085] (3) The printing device adopts a dual scraper mechanism to improve the solder ball printing efficiency, wherein the first pressure regulating component and the second pressure regulating component are optimized to effectively control the scraping paste pressure when the first printing scraper and the second printing scraper contact the PCBA, thereby solving the problem of uneven solder ball printing thickness and improving the solder ball printing quality;

[0086] (4) The fine-tuning ball planting device is provided in conjunction with the second positioning hole recognition mechanism and the solder ball position recognition mechanism to improve the lateral movement accuracy of the mounting ball planting mechanism and the semiconductor welding accuracy; wherein the fine-tuning component compensates the position of the semiconductor according to the recognition result of the solder ball position recognition mechanism, and during welding, the semiconductor and PCBA are positioned and fixed respectively by using the component fixing groove and the PCBA fixing seat, and the solder ball is heated and melted by using a laser welding head in the form of small-scale laser heating, so that the semiconductor is welded on the PCBA, thereby improving the semiconductor welding accuracy.

[0087] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any technician familiar with the field can make many possible changes and modifications to the technical solution of the utility model by using the technical means and technical contents disclosed above, without departing from the scope of the technical solution of the utility model, or modify it into an equivalent embodiment of equivalent changes. Therefore, all equivalent changes made according to the shape, structure and principle of the utility model without departing from the content of the technical solution of the utility model should be covered by the protection scope of the utility model.

Claims

1. A new type of PCBA semiconductor assembly equipment, characterized in that: It includes: Product loading device, used to position and convey PCBA; A printing device, corresponding to the product feeding device, is used for printing solder paste on the PCBA; A fine-tuning ball implanting device, corresponding to the product feeding device, is used to adjust the position and implant the ball of the PCBA and the semiconductor; A detection and discharging device, arranged corresponding to the product feeding device, is used to detect and discharge good and defective products; Wherein, the fine-tuning ball implantation device comprises an identification mechanism, a fourth translation mechanism, and a mounting ball implantation mechanism arranged on the fourth translation mechanism; The identification mechanism includes a first rotating cylinder and an identification seat driven to rotate by the first rotating cylinder. A second positioning hole identification mechanism and a solder ball position identification mechanism are arranged on the identification seat. The second positioning hole identification mechanism is electrically connected to the fourth translation mechanism. The solder ball position identification mechanism is electrically connected to the mounting ball implantation mechanism. The second positioning hole identification mechanism is used to identify the positioning holes in the area to be mounted on the PCBA, and the solder ball position identification mechanism is used to identify the position of the printed solder balls.

2. The novel PCBA semiconductor assembly equipment according to claim 1 is characterized in that: The product loading device comprises a conveyor belt with a plurality of product fixing bases installed at equal intervals, the product fixing base is provided with a product fixing cavity, and a peripheral fixing mechanism and a surface fixing mechanism are provided on the product fixing base.

3. The novel PCBA semiconductor assembly equipment according to claim 2 is characterized in that: The circumferential fixing mechanism includes a first side fixing seat, a middle fixing seat and a second side fixing seat arranged around the product fixing cavity. The first side fixing seat is integrally formed with the product fixing base. A first translation mechanism and a second translation mechanism perpendicular to the driving direction are arranged on the product fixing base. The middle fixing seat and the second side fixing seat are respectively arranged on the first translation mechanism and the second translation mechanism.

4. The novel PCBA semiconductor assembly equipment according to claim 3 is characterized in that: The surface fixing mechanism includes a first clamping block and a second clamping block, which are respectively arranged between the first side end fixing seat and the middle fixing seat and between the middle fixing seat and the second side end fixing seat. The first clamping block is provided with a first positioning rod driven to rotate by a first motor, and the second clamping block is provided with a second positioning rod driven to rotate by a second motor. The first positioning rod and the second positioning rod are both arranged corresponding to the product fixing cavity and are parallel to the product fixing base.

5. The novel PCBA semiconductor assembly equipment according to claim 4 is characterized in that: The printing device includes a first positioning hole recognition mechanism, a third translation mechanism, a first scraper mechanism and a second scraper mechanism that are electrically connected. The third translation mechanism is used to drive the first scraper mechanism and the second scraper mechanism to move synchronously. The first positioning hole recognition mechanism is used to identify the positioning holes in the area to be mounted on the PCBA.

6. The novel PCBA semiconductor assembly equipment according to claim 5 is characterized in that: The first scraper mechanism includes a first printing seat and a first positioning member extending from the first printing seat, the first positioning member is used to position the positioning hole of the PCBA to be mounted area, the first printing seat is provided with a first printing scraper, a first longitudinal drive assembly for driving the first printing scraper to longitudinally move, and a first transverse drive assembly for driving the first printing scraper to transversely move, the driving direction of the first transverse drive assembly is perpendicular to the driving direction of the third translation mechanism, and a first pressure regulating assembly for adjusting the scraping paste pressure of the first printing scraper is provided between the first longitudinal drive assembly and the first printing scraper; The second scraper mechanism includes a second printing seat and a second positioning member extending from the second printing seat, the second positioning member is used to position the positioning hole of the PCBA to be mounted area, and a second printing scraper, a second longitudinal movement driving component for driving the second printing scraper to move longitudinally, and a second transverse movement driving component for driving the second printing scraper to move transversely are arranged on the second printing seat, the driving direction of the second transverse movement driving component is perpendicular to the driving direction of the third translation mechanism, and a second pressure regulating component for adjusting the scraping paste pressure of the second printing scraper is arranged between the second longitudinal movement driving component and the second printing scraper.

7. The novel PCBA semiconductor assembly equipment according to claim 4 is characterized in that: The mounting ball implanting mechanism includes a mounting seat and a second positioning member extending from the mounting seat, wherein the second positioning member is used to locate the positioning hole of the PCBA to be mounted area, and a fine-tuning component and a clamping component are arranged on the mounting seat; The fine-tuning component includes a first rotary cylinder arranged on the mounting seat, and an adjustment rotary seat sleeved on the driving shaft of the first rotary cylinder, and a first paddle and a second paddle for adjusting the position of the semiconductor are correspondingly arranged on both sides of the adjustment rotary seat, the first paddle and the second paddle are arranged corresponding to the product fixing cavity, and the first rotary cylinder is electrically connected to the solder ball position identification mechanism.

8. The novel PCBA semiconductor assembly equipment according to claim 7 is characterized in that: The clamping assembly includes a clamping assembly arranged on the mounting seat, and a third longitudinal movement driving assembly for driving the clamping assembly to move longitudinally, a third pressure regulating assembly for adjusting the pressing pressure of the clamping assembly is arranged between the third longitudinal movement driving assembly and the clamping assembly, and a pressing surface of the clamping assembly is provided with a component fixing groove for positioning a semiconductor, a PCBA fixing seat for positioning a PCBA, and a laser welding head for heating and melting solder balls.

9. The novel PCBA semiconductor assembly equipment according to claim 4, characterized in that: The detection and discharging device comprises a detection mechanism and a discharging mechanism which are electrically connected, and the detection mechanism is arranged corresponding to the product fixing cavity; The detection mechanism includes a ball missing detection component for detecting whether a solder ball is missing, and a solder ball welding detection component for detecting the solder ball welding quality; The missing ball detection component includes a correspondingly arranged detection light source and an optical signal sensor, and the detection light source is arranged corresponding to the product fixing cavity; The solder ball welding detection assembly includes a first image detection unit for detecting welding point size defects, a second image detection unit for detecting welding point scratch defects, and a third image detection unit for detecting welding point offset defects.

10. The novel PCBA semiconductor assembly equipment according to claim 9, characterized in that: The detection and discharging device also includes a good product discharging mechanism and a bad product discharging mechanism; The discharging mechanism includes a fifth translation mechanism and a translation seat arranged on the fifth translation mechanism, a good product picking mechanism and a defective product picking mechanism are arranged in parallel on the translation seat, the good product picking mechanism goes back and forth between the product feeding device and the good product discharging mechanism, and the defective product picking mechanism goes back and forth between the product feeding device and the defective product discharging mechanism; The good product picking mechanism includes a first lifting mechanism and a first picking seat arranged on the first lifting mechanism, and a plurality of first air nozzles are arranged on the first picking seat, and the first air nozzles are arranged corresponding to the product fixing cavity; The defective product picking mechanism includes a second lifting mechanism and a second picking seat arranged on the second lifting mechanism. A plurality of groups of second air nozzles are arranged on the second picking seat. The second air nozzles are arranged corresponding to the product fixing cavity.

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