Combined electronic component shell

Abstract

The utility model discloses a combined electronic component housing, comprising a first housing, a second housing, a passive heat radiation assembly and an active heat radiation assembly, the first housing and the second housing are connected through a separator plate, the first housing is a trapezoid housing, the front side of the first housing is provided with a housing cover, and the inner side of the cavity of the first housing is provided with the passive heat radiation assembly; the passive heat dissipation assembly is provided with an adjusting stud, a circuit board, a heat dissipation folded plate, a nut and a heat conduction base plate, the heat conduction base plate is attached to the partition plate, and the heat dissipation folded plate is installed on the upper side of the heat conduction base plate; open holes are formed in the four corners of the circuit board, the adjusting studs can penetrate through the open holes and are connected with the heat conduction base plate, and nuts used for locking and limiting the circuit board are arranged on the adjusting studs. According to the utility model, the first shell and the second shell are utilized to form a combined structure, and the structure is respectively used as a passive heat dissipation carrier and an active heat dissipation carrier, so that more efficient heat dissipation can be realized.

Description

Technical Field

[0001] The utility model relates to the field of electronic component housings, in particular to a combined electronic component housing. Background Art

[0002] Electronic components are basic elements in electronic circuits, usually individually packaged and having two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with a specific function, such as an amplifier, a radio receiver, an oscillator, etc. One of the common ways to connect electronic components is to solder them to a printed circuit board. Electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.), or groups of varying complexity, such as integrated circuits (operational amplifiers, resistor arrays, logic gates, etc.).

[0003] Common electronic component housings, such as a combined electronic instrument plastic housing disclosed in Chinese patent CN202320429565.6, on the one hand, achieve stability between the two housings through a hidden snap mechanism, and on the other hand, the heat sink and the heat dissipation hole dissipate heat to ensure the normal operation of the component. However, due to the limited heat dissipation methods of the heat sink and the heat dissipation hole, the heat is accumulated in the housing and cannot be dissipated, affecting the normal operation of the component. Based on this, the utility model proposes a combined electronic component housing, which uses a first housing and a second housing to form a combined structure, which is used as a carrier for passive heat dissipation and active heat dissipation, respectively, wherein the passive heat dissipation adopts a heat dissipation folding plate and a heat conductive pad, and the heat dissipation folding plate can be in an extended or folded state when the circuit board moves upward or downward along the adjustment stud. When it is in an extended state, the heat dissipation path of the heat dissipation folding plate increases, and the heat dissipation folding plate can use the extended folding plate to export the heat and discharge it from the heat dissipation window. When it is in a contracted state, the heat dissipation path of the heat dissipation folding plate is shortened, and the heat dissipation folding plate can conduct the heat to the heat conductive pad, and the water cooling pipe on the back of the heat conductive pad quickly takes away the heat to ensure efficient heat dissipation. Utility Model Content

[0004] The purpose of the utility model is to provide a combined electronic component housing to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a combined electronic component housing, comprising a first housing, a second housing, a passive heat dissipation component and an active heat dissipation component, wherein the first housing and the second housing are connected by a partition, the first housing is a trapezoidal housing, a shell cover is provided on the front side of the first housing, and a passive heat dissipation component is installed on the inner side of the cavity of the first housing; the passive heat dissipation component comprises an adjusting stud, a circuit board, a heat dissipation folding plate, a nut and a thermally conductive pad, wherein the thermally conductive pad is attached to the partition, and a heat dissipation folding plate is installed on the upper side of the thermally conductive pad; openings are provided at the four corners of the circuit board, the adjusting studs can pass through the openings and be connected to the thermally conductive pad, and nuts for locking and limiting the circuit board are provided on the adjusting studs.

[0006] Preferably, the heat dissipation folding plate is formed by folding a plurality of metal panels with good heat dissipation properties, the panel at the upper end of the heat dissipation folding plate is attached to the heat dissipation surface of the circuit board, and the heat dissipation folding plate can be in an extended or folded state when the circuit board is moved upward or downward along the adjusting studs.

[0007] Preferably, the first shell is made of transparent acrylic material, and a plurality of heat dissipation windows are arranged on the outer side of the first shell.

[0008] Preferably, the partition is a heat-conducting partition, and an active heat dissipation component is arranged on the lower side of the partition.

[0009] Preferably, the active heat dissipation component is installed in the second shell, and the active heat dissipation component includes an S-shaped water cooling pipe, a water inlet joint and a water outlet joint, wherein the S-shaped water cooling pipe is distributed along the lower side of the partition, and the water inlet joint and the water outlet joint are installed on both sides of the side end of the second shell and are connected to the input side and output side of the S-shaped water cooling pipe.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] The utility model utilizes a first shell and a second shell to form a combined structure, and the structures are used as carriers for passive heat dissipation and active heat dissipation respectively. The passive heat dissipation adopts a heat dissipation folding plate and a thermally conductive pad. The heat dissipation folding plate can be in an extended or folded state when the circuit board is moved upward or downward along the adjustment stud. When it is in the extended state, the heat dissipation path of the heat dissipation folding plate increases, and the heat dissipation folding plate can use the extended folding plate to conduct heat and discharge it through the heat dissipation window. When it is in the contracted state, the heat dissipation path of the heat dissipation folding plate is shortened, and the heat dissipation folding plate can conduct heat to the thermally conductive pad, and the water-cooling pipe on the back of the thermally conductive pad quickly takes away the heat to ensure efficient heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 It is a structural schematic diagram of the passive heat dissipation component of the utility model.

[0014] In the figure: 1. first shell; 2. second shell; 3. adjusting stud; 4. circuit board; 5. heat dissipation folding plate; 6. nut; 7. thermal conductive pad; 8. heat dissipation window; 9. water inlet joint; 10. water outlet joint. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0017] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] See also Figure 1-2 The utility model provides a technical solution: a combined electronic component housing, comprising a first housing 1, a second housing 2, a passive heat dissipation component and an active heat dissipation component, wherein the first housing 1 and the second housing 2 are connected by a partition, the first housing 1 is a trapezoidal housing, a shell cover is provided on the front side of the first housing 1, and a passive heat dissipation component is installed on the inner side of the cavity of the first housing 1; the passive heat dissipation component comprises an adjusting stud 3, a circuit board 4, a heat dissipation folding plate 5, a nut 6 and a thermal conductive pad 7, wherein the thermal conductive pad 7 is attached to the partition, and the heat dissipation folding plate 5 is installed on the upper side of the thermal conductive pad 7; openings are opened at the four corners of the circuit board 4, the adjusting stud 3 can pass through the openings and be connected to the thermal conductive pad 7, and a nut 6 for locking and limiting the circuit board 4 is provided on the adjusting stud 3.

[0019] In this embodiment, the heat dissipation folding plate 5 is formed by folding multiple metal panels with good heat dissipation properties. The panel at the upper end of the heat dissipation folding plate 5 is attached to the heat dissipation surface of the circuit board 4. The heat dissipation folding plate 5 can be in an extended or folded state when the circuit board 4 moves upward or downward along the adjustment stud 3.

[0020] In this embodiment, the first shell 1 is made of transparent acrylic material, and a plurality of heat dissipation windows 8 are disposed on the outer side of the first shell 1 .

[0021] In this embodiment, the partition is a heat-conducting partition, and an active heat dissipation component is arranged on the lower side of the partition.

[0022] In this embodiment, the active heat dissipation component is installed in the second shell 2, and the active heat dissipation component includes an S-shaped water cooling pipe, a water inlet joint 9 and a water outlet joint 10, wherein the S-shaped water cooling pipe is distributed along the lower side of the partition, and the water inlet joint 9 and the water outlet joint 10 are installed on both sides of the side ends of the second shell 2 and are connected to the input side and output side of the S-shaped water cooling pipe.

[0023] In this embodiment, the above-mentioned device uses the first shell 1 and the second shell 2 to form a combined structure, which serves as a carrier for passive heat dissipation and active heat dissipation respectively. The passive heat dissipation adopts a heat dissipation folding plate 5 and a thermal conductive pad 7. The heat dissipation folding plate 5 can be in an extended or folded state when the circuit board 4 moves upward or downward along the adjustment stud 3. When it is in the extended state, the heat dissipation path of the heat dissipation folding plate 5 increases, and the heat dissipation folding plate 5 can use the extended folding plate to conduct heat and discharge it through the heat dissipation window 8. When it is in the contracted state, the heat dissipation path of the heat dissipation folding plate 5 is shortened, and the heat dissipation folding plate 5 can conduct heat to the thermal conductive pad 7, and the water-cooling pipe on the back of the thermal conductive pad 7 quickly takes away the heat to ensure efficient heat dissipation.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A combined electronic component housing, characterized in that: The invention comprises a first shell (1), a second shell (2), a passive heat dissipation component and an active heat dissipation component, wherein the first shell (1) and the second shell (2) are connected via a partition, the first shell (1) is a trapezoidal shell, a shell cover is provided on the front side of the first shell (1), and the passive heat dissipation component is installed on the inner side of the cavity of the first shell (1); the passive heat dissipation component comprises an adjusting stud (3), a circuit board (4), a heat dissipation folding plate (5), a nut (6) and a heat conductive pad (7), wherein the heat conductive pad (7) is attached to the partition, and the heat dissipation folding plate (5) is installed on the upper side of the heat conductive pad (7); openings are opened at the four corners of the circuit board (4), the adjusting stud (3) can pass through the openings and be connected to the heat conductive pad (7), and a nut (6) for locking and limiting the circuit board (4) is provided on the adjusting stud (3).

2. The combined electronic component housing according to claim 1, characterized in that: The heat dissipation folding plate (5) is formed by folding a plurality of metal panels with good heat dissipation performance. The panel at the upper end of the heat dissipation folding plate (5) is attached to the heat dissipation surface of the circuit board (4). The heat dissipation folding plate (5) can be in an extended or folded state when the circuit board (4) is moved upward or downward along the adjustment stud (3).

3. The combined electronic component housing according to claim 1, characterized in that: The first shell (1) is made of a transparent acrylic material, and a plurality of heat dissipation windows (8) are arranged on the outer side surface of the first shell (1).

4. The combined electronic component housing according to claim 1, characterized in that: The partition is a heat-conducting partition, and an active heat dissipation component is arranged on the lower side of the partition.

5. The combined electronic component housing according to claim 4, characterized in that: The active heat dissipation component is installed in the second shell (2), and the active heat dissipation component includes an S-shaped water cooling pipe, a water inlet joint (9) and a water outlet joint (10), wherein the S-shaped water cooling pipe is distributed along the lower side of the partition, and the water inlet joint (9) and the water outlet joint (10) are installed on both sides of the side ends of the second shell (2) and are connected to the input side and the output side of the S-shaped water cooling pipe.

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