Semiconductor plastic package mold runner structure

Abstract

The utility model relates to the technical field of plastic package molds, in particular to a runner structure of a semiconductor plastic package mold. The runner mold comprises a runner mold body, openings are formed in the four edges, close to the bottom, of the runner mold body, and a plurality of sliding assemblies are movably connected to the positions, close to the openings in the two sides, in the runner mold body; the sliding assembly penetrates out of the runner mold body and is fixedly connected with a dismounting assembly. Different numbers of sliding assemblies are installed in the runner mold body through the dismounting assembly, the sliding assemblies are driven by the dismounting assembly to move in the runner mold body, the distance between the multiple sliding assemblies is adjusted, and the sliding assemblies can stretch out and draw back on the outer walls of the sliding assemblies through the telescopic assembly. The distance between the two opposite sliding assemblies is adjusted, so that the shape of a flow channel in the flow channel mold body is expanded and contracted, and the flow channel between the two telescopic assemblies is blocked by moving the blocking assembly in the telescopic assemblies, so that the flowing speed of liquid in the flow channel mold body is influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of plastic packaging molds, and more specifically to a semiconductor plastic packaging mold flow channel structure. Background Art

[0002] Semiconductor plastic encapsulation mold is a mold specially used to manufacture semiconductor packaging carriers. Its main function is to encapsulate microchips in organic or inorganic materials to achieve the effect of protecting and fixing the chips, and it also facilitates the setting and connection of the chips. This mold is a key component in the semiconductor packaging process. Through encapsulation, it can protect the chip from external interference and improve the working stability and reliability of the chip. Semiconductor plastic encapsulation mold is also called IC, chip plastic encapsulation mold, and sometimes also called semiconductor molding plastic encapsulation mold. This mold is a fixed feeding cavity thermosetting plastic die-casting mold, which is specially used for plastic encapsulation of integrated circuits, semiconductors, and chips, and is usually used in conjunction with semiconductor device molding and encapsulation machines.

[0003] There are many existing technologies for internal heating rotary furnace activated coke, such as:

[0004] Chinese patent publication number CN211440961U discloses a semiconductor plastic encapsulation mold and its flow channel. The semiconductor plastic encapsulation flow channel includes an injection sleeve and a flow channel tube. The injection sleeve is provided with a glue channel, and the glue channel is used for glue injection; the flow channel tube is provided with a channel, and the channel is connected to the glue channel, and the colloid enters the channel from the glue channel; the channel is provided with a damping boss, and the damping boss is fixedly connected to the flow channel tube to form a barrier to the flow of the colloid in the channel. The semiconductor plastic encapsulation mold includes a semiconductor plastic encapsulation flow channel. By providing a damping boss, the flow of the colloid in the channel is blocked, and while ensuring the amount of glue injection, the flow rate of the colloid flowing into the mold cavity is reduced, so that the line punching phenomenon will not occur.

[0005] At present, the shape of the flow channel of the existing semiconductor plastic packaging mold is usually a straight line or a simple curve, and the flow channel shape is fixed, which makes it inconvenient to design the flow channel to bend, expand or shrink, and it is inconvenient to control the flow speed and pressure distribution of the plastic. At the same time, it is inconvenient to clean and maintain the inside of the mold flow channel. If it is not cleaned for a long time, it is easy to increase the downtime and maintenance cost of the mold.

[0006] In view of this, the utility model provides a semiconductor plastic packaging mold flow channel structure. Utility Model Content

[0007] The utility model provides a semiconductor plastic encapsulation mold flow channel structure, which includes a flow channel mold body, the flow channel mold body has openings on four sides near the bottom, and the flow channel mold body has multiple sliding components movably connected near the openings on both sides;

[0008] The sliding component passes through the flow channel mold body and is fixedly connected with a disassembly component. A telescopic component is movably connected between the inside of the sliding component and the outer wall. A plurality of blocking components are movably connected near both sides of the telescopic component.

[0009] As a further improvement of the present technical solution, the sliding assembly includes a bracket, which is movably connected to the inside of the flow channel mold body near the inner wall, and a slider is fixedly connected to the outer wall of one end of the bracket near the bottom, and the slider is movably connected to the inside of the flow channel mold body opening, and the end of the slider passing through the flow channel mold body is fixedly connected to a disassembly and assembly assembly, and a telescopic assembly is movably connected between the inside and the outer wall of the bracket, and the sliding assembly is used to adjust the position and number of flow outlets inside the flow channel mold body.

[0010] As a further improvement of the present technical solution, the disassembly and assembly component includes a screw, which is fixedly connected to the end of the slider passing through the runner mold body, and the outer wall of the screw is movably connected to a ball. The disassembly and assembly component is used to facilitate the installation of different numbers of sliding components inside the runner mold body.

[0011] As a further improvement of the present technical solution, the telescopic assembly includes a U-shaped frame, which is movably connected between the outer walls of the bracket, the U-shaped inner wall of the U-shaped frame is fixedly connected to a support rod, the support rod is movably connected to the inside of the bracket, the top of the support rod is fixedly connected to a convex rod near the end, the convex rod is movably connected to the inside of the bracket, the convex rod passes through the outer wall of the bracket and is movably connected to a nut, a plurality of blocking assemblies are movably connected inside the telescopic assembly, and the telescopic assembly is used to adjust the width of the flow channel inside the flow channel mold body.

[0012] As a further improvement of the present technical solution, the blocking assembly includes a support block, and a plurality of the support blocks are symmetrically and movably connected inside the U-shaped frame near both sides. A buckle rod is movably connected between the inside of the support block and the inside of the U-shaped frame, and an elastic part is fixedly connected to the end of the buckle rod and the inside of the support block. The blocking assembly is used to adjust the flow velocity.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] Different numbers of sliding components are installed inside the flow channel mold body by disassembling and assembling components, and the sliding components are driven to move inside the flow channel mold body by disassembling and assembling components to adjust the distance between multiple sliding components. The telescopic component is telescopically moved on the outer wall of the sliding component to adjust the distance between two relative sliding components, thereby expanding and contracting the flow channel shape inside the flow channel mold body. The blocking component is moved inside the telescopic component to block the flow channel between the two telescopic components, thereby affecting the flow rate of the liquid inside the flow channel mold body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is described in more detail below by way of example with reference to the accompanying drawings, in which:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the shunt structure of the utility model;

[0018] Figure 3 It is a schematic diagram of the telescopic structure of the utility model;

[0019] Figure 4 It is a schematic diagram of the blocking structure of the utility model.

[0020] The meanings of the numbers in the figure are as follows: 1. flow channel mold body; 11. sliding assembly; 110. bracket; 111. slider; 12. disassembly assembly; 120. ball; 121. screw; 13. telescopic assembly; 130. U-shaped frame; 131. support rod; 132. protruding rod; 14. blocking assembly; 140. support block; 141. buckle rod; 142. elastic member. DETAILED DESCRIPTION

[0021] like Figure 1-4 As shown, the device comprises a flow channel mold body 1, the flow channel mold body 1 has openings on four sides near the bottom, and a plurality of sliding components 11 are movably connected to the flow channel mold body 1 near the openings on both sides;

[0022] The sliding component 11 passes through the flow channel mold body 1 and is fixedly connected to the disassembly component 12. The inside of the sliding component 11 is movably connected to the outer wall with a telescopic component 13. The inside of the telescopic component 13 is movably connected to multiple blocking components 14 near both sides.

[0023] First, the specific structure of the sliding component 11 is disclosed. The sliding component 11 includes a bracket 110, which is movably connected to the inner wall of the flow channel mold body 1. A slider 111 is fixedly connected to the outer wall of one end of the bracket 110 near the bottom. The slider 111 is movably connected to the inside of the opening of the flow channel mold body 1. The end of the slider 111 passing through the flow channel mold body 1 is fixedly connected to a disassembly component 12. A telescopic component 13 is movably connected between the inside and the outer wall of the bracket 110. The sliding component 11 is used to adjust the position and number of flow outlets inside the flow channel mold body 1. The slider 111 moves inside the opening of the flow channel mold body 1, thereby driving the bracket 110 to move inside the flow channel mold body 1. By adjusting the distance between multiple brackets 110, it is convenient to adjust the flow channel width and the number of flow channel outlets inside the flow channel mold body 1.

[0024] According to the above disclosure of the specific structure of the disassembly assembly 12, the disassembly assembly 12 includes a screw 121, the screw 121 is fixedly connected to the end of the slider 111 passing through the runner mold body 1, and the outer wall of the screw 121 is movably connected with a ball 120. The disassembly assembly 12 is used to facilitate the installation of different numbers of sliding assemblies 11 inside the runner mold body 1, and the bracket 110 is placed inside the runner mold body 1 so that the slider 111 is located inside the opening of the runner mold body 1, so that the slider 111 drives the screw 121 from the inside of the runner mold body 1 to the outside, and the ball 120 is tightened on the outer wall of the screw 121 to fix the position of the screw 121 relative to the runner mold body 1, so that the bracket 110 is installed inside the runner mold body 1, and the inside of the mold runner is convenient for cleaning and maintenance;

[0025] According to the above disclosure of the specific structure of the telescopic assembly 13, the telescopic assembly 13 includes a U-shaped frame 130, the U-shaped frame 130 is movably connected between the outer walls of the bracket 110, the U-shaped inner wall of the U-shaped frame 130 is fixedly connected with a support rod 131, the support rod 131 is movably connected to the inside of the bracket 110, the top of the support rod 131 is fixedly connected with a convex rod 132 near the end, the convex rod 132 is movably connected to the inside of the bracket 110, the convex rod 132 passes through the outer wall of the bracket 110 and is movably connected with a nut, and the telescopic assembly 13 is movably connected inside. There are multiple blocking components 14, and the telescopic component 13 is used to adjust the width of the flow channel inside the flow channel mold body 1. The convex rod 132 moves inside the bracket 110, thereby driving the support rod 131 to move inside the bracket 110. The support rod 131 drives the U-shaped frame 130 to move on the outer wall of the bracket 110, and the distance between the bracket 110 and the U-shaped frame 130 is adjusted, so that the distance between the U-shaped frames 130 on the two opposite brackets 110 is adjusted, which is convenient for adjusting the width of the flow channel inside the flow channel mold body 1;

[0026] According to the above disclosure of the specific structure of the blocking component 14, the blocking component 14 includes a support block 140, and a plurality of support blocks 140 are symmetrically and movably connected to the inside of the U-shaped frame 130 near both sides. A buckle rod 141 is movably connected between the inside of the support block 140 and the inside of the U-shaped frame 130, and an elastic member 142 is fixedly connected to the end of the buckle rod 141 and the inside of the support block 140. The blocking component 14 is used to adjust the flow speed, and the elastic member 142 is driven to shrink by pressing the buckle rod 141, so that the buckle rod 141 is retracted into the support block 140, and the support block 140 is moved outward from the inside of the U-shaped frame 130, and the buckle rod 141 is driven to move upward by the rebound of the elastic member 142, and the buckle rod 141 is rebounded to between the U-shaped frame 130 and the inside of the support block 140, and the position of the support block 140 is fixed, and the flow channel between the two sides of the U-shaped frame 130 is reduced and blocked by the support block 140, thereby affecting the liquid flow speed between the two U-shaped frames 130.

[0027] The improvement of this embodiment is that: different numbers of sliding components 11 are installed inside the flow channel die body 1 through the disassembly component 12, and the sliding components 11 are driven to move inside the flow channel die body 1 through the disassembly component 12 to adjust the distance between the multiple sliding components 11, and the telescopic component 13 is telescopically moved on the outer wall of the sliding component 11 to adjust the distance between two relative sliding components 11, thereby expanding and contracting the flow channel shape inside the flow channel die body 1, and the blocking component 14 is moved inside the telescopic component 13 to block the flow channel between the two telescopic components 13, thereby affecting the flow speed of the liquid inside the flow channel die body 1;

[0028] In summary, the working principle of this solution is as follows:

[0029] Different numbers of sliding components 11 are installed inside the flow channel die body 1 through the disassembly and assembly component 12, and the sliding components 11 are driven to move inside the flow channel die body 1 through the disassembly and assembly component 12 to adjust the distance between the multiple sliding components 11. The telescopic component 13 is telescopically moved on the outer wall of the sliding component 11 to adjust the distance between two relative sliding components 11, thereby expanding and contracting the flow channel shape inside the flow channel die body 1. The blocking component 14 moves inside the telescopic component 13 to block the flow channel between the two telescopic components 13, thereby affecting the flow rate of the liquid inside the flow channel die body 1.

[0030] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor plastic packaging mold flow channel structure, comprising a flow channel mold body (1), characterized in that: The flow channel mold body (1) has openings on four sides near the bottom, and a plurality of sliding components (11) are movably connected inside the flow channel mold body (1) near the openings on both sides; The sliding component (11) passes through the flow channel mold body (1) and is fixedly connected to a disassembly component (12); a telescopic component (13) is movably connected between the interior of the sliding component (11) and the outer wall; and a plurality of blocking components (14) are movably connected to the interior of the telescopic component (13) near both sides.

2. The semiconductor plastic encapsulation mold flow channel structure according to claim 1, characterized in that: The sliding assembly (11) comprises a bracket (110), the bracket (110) being movably connected to the inside of the flow channel die body (1) near the inner wall, a slider (111) being fixedly connected to the outer wall of one end of the bracket (110) near the bottom, the slider (111) being movably connected to the inside of the opening of the flow channel die body (1), the end of the slider (111) passing through the flow channel die body (1) being fixedly connected to a disassembly assembly (12), a telescopic assembly (13) being movably connected between the inside of the bracket (110) and the outer wall, and the sliding assembly (11) being used to adjust the position and number of flow outlets inside the flow channel die body (1).

3. The semiconductor plastic encapsulation mold flow channel structure according to claim 2, characterized in that: The disassembly assembly (12) comprises a screw (121), wherein the screw (121) is fixedly connected to the end of the sliding block (111) passing through the flow channel mold body (1), and the outer wall of the screw (121) is movably connected to a ball (120). The disassembly assembly (12) is used to facilitate the installation of different numbers of sliding assemblies (11) inside the flow channel mold body (1).

4. The semiconductor plastic packaging mold flow channel structure according to claim 2, characterized in that: The telescopic assembly (13) comprises a U-shaped frame (130), wherein the U-shaped frame (130) is movably connected between the outer walls of the bracket (110), a support rod (131) is fixedly connected to the U-shaped inner wall of the U-shaped frame (130), the support rod (131) is movably connected to the inside of the bracket (110), a convex rod (132) is fixedly connected to the top of the support rod (131) near the end, the convex rod (132) is movably connected to the inside of the bracket (110), and the convex rod (132) passes through the outer wall of the bracket (110) and is movably connected to a nut, and a plurality of blocking assemblies (14) are movably connected inside the telescopic assembly (13), and the telescopic assembly (13) is used to adjust the width of the flow channel inside the flow channel mold body (1).

5. The semiconductor plastic packaging mold flow channel structure as claimed in claim 4, characterized in that: The blocking assembly (14) comprises a support block (140), wherein a plurality of the support blocks (140) are symmetrically and movably connected to the inside of the U-shaped frame (130) near two sides, a buckle rod (141) is movably connected between the inside of the support block (140) and the inside of the U-shaped frame (130), and an elastic member (142) is fixedly connected at the end of the buckle rod (141) and the inside of the support block (140), and the blocking assembly (14) is used to adjust the flow speed.

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