Heat dissipation device and server

Abstract

The utility model relates to a heat dissipation device and a server. The heat dissipation device is used for conducting heat dissipation on the hard disk assembly, and comprises a liquid separator which is provided with a liquid separation outlet allowing low-temperature cooling liquid to flow out and a liquid return inlet allowing high-temperature cooling liquid to flow back; the cold plate assembly comprises a sub liquid cooling plate and multiple contact cold plates, the multiple contact cold plates are used for being in contact with the multiple hard disk assemblies for heat exchange, the sub liquid cooling plate is provided with a liquid inlet allowing low-temperature cooling liquid to flow in and a liquid outlet allowing high-temperature cooling liquid to flow out, and the low-temperature cooling liquid flowing into the sub liquid cooling plate through the liquid inlet can flow into the contact cold plates; the high-temperature cooling liquid in each contact cold plate can flow into the corresponding sub liquid cooling plate; the liquid distribution pipe group comprises a first pipeline and a second pipeline which can elastically stretch out and draw back; one end of the first pipeline is communicated with the separated liquid outlet, and the other end is communicated with the liquid inlet; one end of the second pipeline is communicated with the liquid outlet, and the other end is communicated with the return liquid inlet. The heat dissipation device can carry out liquid cooling heat dissipation on the hard disk uninterruptedly when the hard disk assembly is pulled out of the case for maintenance.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a heat dissipation device and a server. Background Art

[0002] The hard disk in the hard disk assembly is a storage medium and one of the important components in the server. In order to ensure that the hard disk has excellent performance during operation, it is usually equipped with a cooling mechanism such as a cold plate radiator for liquid cooling to prevent it from overheating after long-term operation. In related technologies, if a hard disk fails, the hard disk assembly needs to be pulled out of the chassis for maintenance and testing, resulting in the inability to continuously exchange coolant with the cooling mechanism, interrupting the heat dissipation, and the hard disk is prone to overheating during the maintenance and testing process. Utility Model Content

[0003] Based on this, it is necessary to provide a heat dissipation device and a server that can perform uninterrupted liquid cooling on the hard disk when the hard disk assembly is pulled out of the chassis for maintenance and testing, so that the hard disk is not easily overheated during the maintenance and testing process.

[0004] A heat dissipation device is used to dissipate heat from a hard disk assembly, wherein the hard disk assembly includes a hard disk, and the heat dissipation device includes:

[0005] A liquid distributor having a liquid distributor outlet for the low-temperature coolant to flow out, and a liquid return inlet for the high-temperature coolant to return;

[0006] A cold plate assembly, comprising a liquid separation cold plate and a plurality of contact cold plates, wherein the plurality of contact cold plates are used for contact heat exchange with the plurality of hard disk assemblies, the liquid separation cold plate having a liquid inlet for low-temperature coolant to flow in, and a liquid outlet for high-temperature coolant to flow out, the low-temperature coolant flowing into the liquid separation cold plate through the liquid inlet can flow into each of the contact cold plates, and the high-temperature coolant in each of the contact cold plates can flow into the liquid separation cold plate; and

[0007] The liquid dispensing tube group includes a first pipe and a second pipe that can be elastically extended and retracted; one end of the first pipe is connected to the liquid dispensing outlet, and the other end is connected to the liquid inlet; one end of the second pipe is connected to the liquid outlet, and the other end is connected to the liquid return inlet.

[0008] In one embodiment, both the first pipe and the second pipe are spiral pipes.

[0009] In one embodiment, a partition plate is provided between the first pipe and the second pipe.

[0010] In one embodiment, the liquid separation cold plate has a plurality of pairs of first outlets and first inlets, each of the contact cold plates has a second outlet and a second inlet, each of the second inlets is connected to the corresponding first outlet, and each of the second outlets is connected to the corresponding first inlet;

[0011] The low-temperature coolant flowing into the liquid separation cold plate through the liquid inlet can flow into the contact cold plate through the first outlet and the second inlet in sequence, and the high-temperature coolant in the contact cold plate can flow back into the liquid separation cold plate through the second outlet and the first inlet in sequence.

[0012] In one embodiment, the heat dissipation device includes multiple groups of cold plate assemblies and multiple groups of liquid distribution pipe groups, the liquid distributor has multiple pairs of liquid distribution outlets and liquid return inlets, the liquid inlets of the multiple groups of cold plate assemblies and the multiple liquid distribution outlets are connected one-to-one through multiple first pipes, and the liquid outlets of the multiple groups of cold plate assemblies and the multiple liquid return inlets are connected one-to-one through multiple second pipes.

[0013] A server, comprising the above-mentioned heat dissipation device, and also comprising a chassis and the hard disk assembly;

[0014] The liquid distributor, the liquid distributor tube set and the cold plate assembly are all installed in the chassis, the hard disk assembly is installed on the cold plate assembly, and the cold plate assembly is slidably connected to the chassis.

[0015] In one embodiment, a plurality of the contact cold plates are arranged at intervals along a first direction, and a hard disk assembly for heat exchange with the contact cold plates is installed between any two adjacent contact cold plates, wherein the first direction is the length direction of the liquid separation cold plate.

[0016] In one of the embodiments, of any two adjacent contact cold plates, one has a first plug-in portion and the other has a second plug-in portion, the hard disk assembly includes a hard disk thermal conductive structure connected to the hard disk, the hard disk thermal conductive structure has a third plug-in portion and a fourth plug-in portion arranged at intervals along the first direction, the first plug-in portion is plugged into the third plug-in portion, and the second plug-in portion is plugged into the fourth plug-in portion.

[0017] In one embodiment, the first plug-in portion and the second plug-in portion are both slots extending along the second direction, the third plug-in portion and the fourth plug-in portion are both plug-in blocks extending along the second direction, the plug-in blocks are inserted into the corresponding slots, and the second direction is the width direction of the liquid separation cold plate.

[0018] In one of the embodiments, in the insertion direction of the inserting block into the corresponding slot, the inserting block is a wedge-shaped block with a gradually decreasing size, and the slot is a wedge-shaped groove with a gradually decreasing size.

[0019] In one embodiment, a plurality of hard disk assemblies are installed between any two adjacent contact cold plates for heat exchange therewith, and the plurality of hard disk assemblies are arranged along a third direction, which is the thickness direction of the liquid separation cold plate.

[0020] In the above-mentioned heat dissipation device and server, in the heat dissipation device, the low-temperature coolant can flow out through the liquid outlet of the liquid distributor, flow through the first pipeline, flow into the liquid distributor cold plate from the liquid inlet, and flow into each contact cold plate from the liquid distributor cold plate. The contact cold plate exchanges heat with the hard disk assembly, absorbs the heat of the hard disk, and heats the low-temperature coolant in the contact cold plate to become a high-temperature coolant. The high-temperature coolant in each contact cold plate flows back into the liquid distributor cold plate, and then is discharged from the liquid outlet of the liquid distributor cold plate, flows through the second pipeline, and flows into the liquid distributor from the return liquid inlet. The coolant circulates continuously according to the above-mentioned flow path, and can continuously take away the heat of the hard disk and dissipate the heat. Since one end of the first pipe is connected to the liquid separation outlet, and the other end is connected to the liquid inlet; one end of the second pipe is connected to the liquid outlet, and the other end is connected to the liquid return inlet; and the first pipe and the second pipe can be elastically retracted; during the process of pulling the hard disk assembly out of the chassis for maintenance and testing, the cold plate assembly is pulled out synchronously. At this time, the first pipe and the second pipe can be stretched to adapt to the position change of the hard disk assembly and the cold plate assembly, so that the supply of low-temperature coolant between the liquid separation outlet and the liquid inlet, and the reflux of high-temperature coolant between the liquid outlet and the liquid return inlet will not be blocked, thereby realizing uninterrupted liquid cooling of the hard disk, making it less likely for the hard disk to overheat during the maintenance and testing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure of a server in one embodiment of the present application (the hard disk component is not shown).

[0022] Figure 2 Schematic diagram of the structure of a liquid dispensing tube group in one embodiment of the present application.

[0023] Figure 3 This is a schematic diagram of a hard disk assembly installed between two adjacent contact cold plates in an embodiment of the present application.

[0024] Figure 4 It is a partial schematic diagram of a contact cold plate in one embodiment of the present application.

[0025] Figure 5 Schematic diagram of the structure of a hard disk assembly in one embodiment of the present application.

[0026] Reference numerals:

[0027] 100, liquid distributor; 110, liquid distributor outlet; 120, liquid return inlet; 130, liquid inlet connector; 140, liquid discharge connector; 200, liquid distributor cold plate; 210, liquid inlet; 220, liquid outlet; 310, first contact cold plate; 311, first protrusion; 312, first slot; 320, second contact cold plate; 321, second protrusion; 322, second slot; 410, first pipe; 420, second pipe; 510, chassis; 520, hard disk bay; 600, hard disk assembly; 610, hard disk; 620, hard disk thermal conductive structure; 621, first plug-in block; 622, second plug-in block; 630, thermal pad. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0030] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0032] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0034] See also Figures 1 to 3, a heat dissipation device provided in one embodiment of the present application is used to dissipate heat for a hard disk assembly 600, and the hard disk assembly 600 includes a hard disk 610. The heat dissipation device in one embodiment of the present application includes a liquid dispenser 100, a cold plate assembly, and a liquid dispenser tube group. The cold plate assembly includes a liquid dispenser cold plate 200, and multiple contact cold plates (such as a first contact cold plate 310, a second contact cold plate 320, etc.), and the multiple contact cold plates are used to contact and exchange heat with multiple hard disk assemblies 600. The liquid dispenser tube group includes a first pipe 410 and a second pipe 420. The liquid dispenser 100 has a liquid dispenser outlet 110 for low-temperature coolant to flow out, and a liquid return inlet 120 for high-temperature coolant to return. The liquid dispenser cold plate 200 has a liquid inlet 210 for low-temperature coolant to flow in, and a liquid outlet 220 for high-temperature coolant to flow out. The low-temperature coolant flowing into the liquid dispenser cold plate 200 through the liquid inlet 210 can flow into each contact cold plate, and the high-temperature coolant in each contact cold plate can flow into the liquid dispenser cold plate 200. One end of the first pipe 410 is connected to the liquid outlet 110, and the other end is connected to the liquid inlet 210; one end of the second pipe 420 is connected to the liquid outlet 220, and the other end is connected to the liquid return inlet 120. The first pipe 410 and the second pipe 420 can be elastically retractable.

[0035] In the above heat dissipation device, the low-temperature coolant can flow out through the liquid separation outlet 110 of the liquid separator 100, flow through the first pipe 410, flow into the liquid separation cold plate 200 from the liquid inlet 210, and flow into each contact cold plate from the liquid separation cold plate 200. The contact cold plate contacts and exchanges heat with the hard disk assembly 600, absorbs the heat of the hard disk 610, and heats the low-temperature coolant in the contact cold plate to become a high-temperature coolant. The high-temperature coolant in each contact cold plate flows back into the liquid separation cold plate 200, and then is discharged from the liquid outlet 220 of the liquid separation cold plate 200, flows through the second pipe 420, and flows into the liquid separator 100 from the liquid return inlet 120. The coolant circulates continuously according to the above flow path, so that it can continuously take away the heat of the hard disk 610 in each hard disk assembly 600 and dissipate the heat. Since one end of the first pipe 410 is connected to the liquid separation outlet 110, and the other end is connected to the liquid inlet 210; one end of the second pipe 420 is connected to the liquid outlet 220, and the other end is connected to the liquid return inlet 120; and the first pipe 410 and the second pipe 420 can be elastically retracted; during the hard disk assembly 600 being pulled out for maintenance and testing, the cold plate assembly is pulled out synchronously, and at this time, the first pipe 410 and the second pipe 420 can be stretched to adapt to the position change of the hard disk assembly 600 and the cold plate assembly, so that the low-temperature coolant supply between the liquid separation outlet 110 and the liquid inlet 210, and the high-temperature coolant reflux between the liquid outlet 220 and the liquid return inlet 120 will not be blocked, thereby achieving uninterrupted liquid cooling of the hard disk 610, making it less likely for the hard disk 610 to overheat during the maintenance and testing process.

[0036] The length direction of the liquid separation cold plate 200 is defined as a first direction, that is, the left-right direction in the perspective of the accompanying drawing; the width direction of the liquid separation cold plate 200 is defined as a second direction, that is, the up-down direction in the perspective of the accompanying drawing; the thickness direction of the liquid separation cold plate 200 is defined as a third direction, that is, the front-back direction in the perspective of the accompanying drawing.

[0037] From the perspective of the attached figure, the liquid distributor 100 is located on the left side of the cold plate assembly, and the liquid distributor tube group is connected between the two. The first pipe 410 and the second pipe 420 can be elastically extended in the left and right directions. The hard disk assembly 600 is pulled out to the right for maintenance and testing, and the cold plate assembly is pulled out simultaneously.

[0038] See also Figure 1 and Figure 2 In some embodiments, both the first pipe 410 and the second pipe 420 are spiral pipes. In this way, when the hard disk assembly 600 is pulled out for maintenance and testing, the spiral pipe can be elastically deformed and stretched to adapt to the position change of the hard disk assembly 600 and the cold plate assembly, so that after the cold plate assembly is pulled out with the hard disk assembly 600, the low-temperature coolant supply between the liquid separation outlet 110 and the liquid inlet 210 and the high-temperature coolant return between the liquid outlet 220 and the liquid return inlet 120 will not be blocked, thereby achieving uninterrupted liquid cooling of the hard disk 610, making it difficult for the hard disk 610 to overheat during the maintenance and testing process.

[0039] In some embodiments, a partition plate is disposed between the first pipe 410 and the second pipe 420 .

[0040] It is understandable that when the hard disk assembly 600 is repaired and reset, the first pipe 410 and the second pipe 420 shrink and reset under the action of their own resilience. Since the first pipe 410 and the second pipe 420 are spiral pipes, they are easily entangled after shrinking. In the above embodiment, by setting a partition plate to separate the first pipe 410 and the second pipe 420, the entanglement between the two can be suppressed, so that the next time the hard disk assembly 600 is pulled out, the stretching and lengthening of the first pipe 410 and the second pipe 420 is not easily hindered by mutual entanglement.

[0041] In other embodiments, the first pipe 410 and the second pipe 420 may also be configured as straight pipes, and both are made of elastic materials so that both can be elastically expanded and contracted.

[0042] See also Figures 1 to 3In some embodiments, the liquid separation cold plate 200 has a plurality of first outlets and first inlets arranged in pairs, each contact cold plate has a second outlet and a second inlet, each second inlet is connected to the corresponding first outlet, and each second outlet is connected to the corresponding first inlet. The low-temperature coolant flowing into the liquid separation cold plate 200 through the liquid inlet 210 can flow into the contact cold plate through the first outlet and the second inlet in sequence, and the high-temperature coolant in the contact cold plate can flow back into the liquid separation cold plate 200 through the second outlet and the first inlet in sequence.

[0043] Specifically, the number of groups of first outlets and first inlets arranged in pairs on the liquid-separating cold plate is equal to the number of contact cold plates, that is, a group of first outlets and first inlets are arranged on the liquid-separating cold plate corresponding to each contact cold plate. The first outlet on the liquid-separating cold plate is used for the low-temperature coolant in the liquid-separating cold plate to flow out, and the first inlet is used for the high-temperature coolant to flow back into the liquid-separating cold plate. The second inlet on the contact cold plate is used for the low-temperature coolant flowing out of the first outlet to flow into the contact cold plate, and the second outlet is used for the high-temperature coolant in the contact cold plate that absorbs the heat of the hard disk assembly 600 and heats up to flow out of the contact cold plate.

[0044] The liquid distributor 100 is provided with a liquid inlet joint 130 and a liquid discharge joint 140. The liquid inlet joint 130 is used to supply low-temperature coolant to flow into the liquid distributor 100, and the liquid discharge joint 140 is used to supply high-temperature coolant in the liquid distributor 100 to flow out. The heat dissipation device includes a heat exchanger. The liquid inlet joint 130 and the liquid discharge joint 140 are both connected to the heat exchanger, so that the high-temperature coolant flowing out through the liquid discharge joint 140 is cooled to become low-temperature coolant after heat exchange with the heat exchanger, and flows into the liquid distributor 100 through the liquid inlet joint 130.

[0045] The entire heat exchange process is as follows: the low-temperature coolant after heat exchange and temperature reduction in the heat exchanger flows into the liquid distributor 100 through the liquid inlet joint 130, and then flows into the first pipe 410 from the liquid distribution outlet 110, flows into the liquid distribution cold plate 200 from the liquid inlet 210 after flowing through the first pipe 410, and then flows out from each first outlet, and flows into the corresponding contact cold plate through the second inlet connected thereto. Each contact cold plate contacts the hard disk assembly 600, absorbs the heat generated by the hard disk 610 in the hard disk assembly 600, and raises the temperature of the low-temperature coolant in the contact cold plate to become a high-temperature coolant. The high-temperature coolant flows out of each contact cold plate from the second outlet, and flows back into the liquid separator cold plate 200 through the first inlet connected to the second outlet, so that the high-temperature coolant is collected in the liquid separator cold plate 200, and then discharged into the second pipe 420 from the liquid outlet 220, and flows back into the liquid separator 100 from the liquid return inlet 120 after flowing through the second pipe 420, and then flows out to the heat exchanger through the liquid discharge joint 140, and the high-temperature coolant exchanges heat with the heat exchanger to cool down, and the low-temperature coolant after cooling flows into the liquid separator 100 again through the liquid inlet joint 130. The coolant circulates continuously according to the above flow path, so that the hard disk 610 can be continuously cooled.

[0046] See also Figures 1 to 3 In some embodiments, the heat dissipation device includes multiple groups of cold plate assemblies and multiple groups of liquid pipe groups, the liquid distributor 100 has multiple pairs of liquid distribution outlets 110 and liquid return inlets 120, the liquid inlets 210 of the multiple groups of cold plate assemblies are connected to the multiple liquid distribution outlets 110 in a one-to-one correspondence through multiple first pipes 410, and the liquid outlets 220 of the multiple groups of cold plate assemblies are connected to the multiple liquid return inlets 120 in a one-to-one correspondence through multiple second pipes 420.

[0047] Specifically, in the embodiment shown in the drawings, two groups of cold plate assemblies are arranged in the front-to-back direction, and correspondingly, the liquid distributor 100 has two pairs of liquid distribution outlets 110 and liquid return inlets 120 arranged in the front-to-back direction, and the liquid inlet 210 of the liquid distribution cold plate 200 in each group of cold plate assemblies is connected to the corresponding liquid distribution outlet 110 through a first pipe 410, and the liquid outlet 220 of the liquid distribution cold plate 200 in each group of cold plate assemblies is connected to the corresponding liquid return inlet 120 through a second pipe 420. In this way, a liquid distributor 100 can be used to provide cooling liquid for multiple groups of cold plate assemblies, and at the same time, when each group of cold plate assemblies is pulled out for maintenance with the hard disk assembly 600, the cooling liquid can be kept flowing through the corresponding liquid distribution pipe group, so as to continuously dissipate heat for the hard disk 610.

[0048] In other embodiments, the number of cold plate assemblies and liquid dispensing tube assemblies may be further increased, and the number of liquid dispensing outlets 110 and liquid return inlets 120 arranged in pairs on the liquid dispenser 100 may be increased accordingly.

[0049] See also Figures 1 to 3 In some embodiments, the server includes the heat dissipation device in any of the above embodiments, and further includes a chassis 510 and a hard disk assembly 600. The liquid dispenser 100, the liquid dispensing tube assembly and the cold plate assembly are all installed in the chassis 510, the hard disk assembly 600 is installed on the cold plate assembly, and the cold plate assembly is slidably connected to the chassis 510.

[0050] Specifically, the liquid dispenser 100 is fixedly installed in the chassis 510, and the cold plate assembly is fixedly installed in the U-shaped hard disk bay 520. The hard disk bay 520 and the chassis 510 are slidably connected by a slide rail slider, and the hard disk bay 520 can slide left and right relative to the chassis 510. When the hard disk bay 520 is pulled out of the chassis 510 to the right, the cold plate assembly fixed therein and the hard disk assembly 600 installed in the cold plate assembly are simultaneously pulled out of the chassis 510, so that the hard disk 610 in the hard disk assembly 600 can be repaired and tested. At this time, the first pipe 410 and the second pipe 420 are elongated to keep the coolant flowing between the liquid dispenser 100 and the liquid-dispensing cold plate 200, so as to achieve uninterrupted heat dissipation of the hard disk 610. When the maintenance is completed, the hard disk bay 520 is pushed to the left into the chassis 510 to reset.

[0051] See also Figures 1 to 3 In some embodiments, a plurality of contact cold plates are arranged at intervals along the first direction, and a hard disk assembly 600 for heat exchange with the contact cold plates is installed between any two adjacent contact cold plates.

[0052] Taking the two contact cold plates (the first contact cold plate 310 and the second contact cold plate 320) shown in the accompanying drawings as an example, the first contact cold plate 310 and the second contact cold plate 320 are arranged at intervals along the first direction, and a hard disk assembly 600 is placed therebetween. The hard disk assembly 600 is in contact with the first contact cold plate 310 and the second contact cold plate 320, so that the heat generated by the hard disk 610 can be conducted to the first contact cold plate 310 and the second contact cold plate 320 to achieve heat dissipation for the hard disk 610.

[0053] Specifically, the liquid separation cold plate 200 is fixedly installed in the U-shaped hard disk bay 520, and the plurality of contact cold plates are all fixedly installed in the hard disk bay 520 and are all fixedly connected to the liquid separation cold plate 200. The fixing method may be welding or clamping.

[0054] See also Figures 3 to 5 In some embodiments, one of any two adjacent contact cold plates has a first plug-in portion and the other has a second plug-in portion. The hard disk assembly 600 includes a hard disk thermal conductive structure 620 connected to the hard disk 610. The hard disk thermal conductive structure 620 has a third plug-in portion and a fourth plug-in portion arranged at intervals along the first direction. The first plug-in portion is plugged into the third plug-in portion, and the second plug-in portion is plugged into the fourth plug-in portion.

[0055] Specifically, the hard disk 610 is connected to one side of the hard disk heat conductive structure 620 along the third direction. The first plug-in portion and the second plug-in portion may be slots or plug-ins, and the third plug-in portion and the fourth plug-in portion may be plug-ins or slots corresponding thereto. Through the plug-in matching method, the hard disk heat conductive structure 620 is stably installed between two adjacent contact cold plates, and the heat of the hard disk 610 can be transferred to the hard disk heat conductive structure 620, and then transferred to the contact cold plate in contact with the hard disk heat conductive structure 620, thereby achieving uninterrupted heat dissipation of the hard disk 610.

[0056] Preferably, a thermal pad 630 is provided between the hard disk 610 and the hard disk heat conductive structure 620 to enhance the heat transfer efficiency between the hard disk 610 and the hard disk heat conductive structure 620 , thereby improving the heat dissipation efficiency of the hard disk 610 .

[0057] In some embodiments, the first plug-in portion and the second plug-in portion are both plug-in blocks extending along the second direction, the third plug-in portion and the fourth plug-in portion are both slots extending along the second direction, and the plug-in blocks are inserted into corresponding slots.

[0058] See also Figures 3 to 5In the embodiment shown in the drawings, the first plug-in portion and the second plug-in portion are both slots extending along the second direction, and the third plug-in portion and the fourth plug-in portion are both plug-in blocks extending along the second direction, and the plug-in blocks are inserted into the corresponding slots.

[0059] Specifically, taking the first contact cold plate 310 and the second contact cold plate 320 as an example, the first contact cold plate 310 has a first slot 312 on one side close to the second contact cold plate 320, and the second contact cold plate 320 has a second slot 322 on one side close to the first contact cold plate 310. The hard disk heat conduction structure 620 has a first protruding plug 621 on one end face close to the first contact cold plate 310, and has a second protruding plug 622 on one end face close to the second contact cold plate 320. The first plug 621 is inserted into the first slot 312 from top to bottom, and is interference-fitted into the first slot 312; the second plug 622 is inserted into the second slot 322 from top to bottom, and is interference-fitted into the second slot 322. The first plug 621 and the second plug 622 can be made of a material with a certain elasticity so that they can elastically resist against the slot wall of the corresponding slot.

[0060] See also Figures 3 to 5 Further, in some embodiments, the first contact cold plate 310 has first bumps 311 arranged at intervals along the third direction on one side close to the second contact cold plate 320, and a first slot 312 is constructed between the two first bumps 311. The second contact cold plate 320 has second bumps 321 arranged at intervals along the third direction on one side close to the first contact cold plate 310, and a second slot 322 is constructed between the two second bumps 321.

[0061] Preferably, in some embodiments, the third plug-in portion and the fourth plug-in portion are both thermally conductive pads bonded to the hard disk thermal conductive structure 620. In this way, while achieving stable installation through plug-in matching, heat conduction can be further accelerated, thereby improving heat dissipation efficiency.

[0062] Specifically, taking the hard disk assembly 600 installed between the first contact cold plate 310 and the second contact cold plate 320 as an example, the first plug block 621 and the second plug block 622 are both thermally conductive gaskets bonded to the hard disk thermal conductive structure 620, and the thermally conductive gasket is made of a material with good elasticity and high thermal conductivity.

[0063] See also Figures 3 to 5 In some embodiments, in the insertion direction of the plug-in block into the corresponding slot, the plug-in block is a wedge-shaped block with a gradually decreasing size, and the slot is a wedge-shaped groove with a gradually decreasing size.

[0064] Specifically, the insertion direction is from top to bottom. In the insertion direction, the first plug block 621 and the second plug block 622 are both wedge-shaped blocks with gradually decreasing sizes, and the first slot 312 and the second slot 322 are both wedge-shaped grooves with gradually decreasing sizes. The wedge-shaped grooves and the corresponding wedge-shaped blocks can be matched to facilitate insertion and removal, and the difficulty of disassembly and assembly is lower.

[0065] See also Figures 1 to 4 In some embodiments, a plurality of hard disk assemblies 600 are installed between any two adjacent contact cold plates for heat exchange therewith, and the plurality of hard disk assemblies 600 are arranged along the third direction.

[0066] Specifically, taking the first contact cold plate 310 and the second contact cold plate 320 as an example, the first contact cold plate 310 has a plurality of first protrusions 311 arranged at intervals along the third direction on one side close to the second contact cold plate 320, and a first slot 312 is constructed between any two adjacent first protrusions 311. The second contact cold plate 320 has a plurality of second protrusions 321 arranged at intervals along the third direction on one side close to the first contact cold plate 310, and a second slot 322 is constructed between any two adjacent second protrusions 321. In each hard disk assembly 600, the first plug 621 at one end of the hard disk heat conductive structure 620 is inserted into a first slot 312, and the second plug 622 at the other end is inserted into a corresponding second slot 322. In the above manner, multiple hard disk assemblies 600 can be installed between two adjacent contact cold plates, thereby achieving simultaneous heat dissipation of multiple hard disk assemblies 600.

[0067] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A heat dissipation device for dissipating heat from a hard disk assembly, wherein the hard disk assembly comprises a hard disk, characterized in that: The heat dissipation device comprises: A liquid distributor having a liquid distributor outlet for the low-temperature coolant to flow out, and a liquid return inlet for the high-temperature coolant to return; A cold plate assembly, comprising a liquid separation cold plate and a plurality of contact cold plates, wherein the plurality of contact cold plates are used for contact heat exchange with the plurality of hard disk assemblies, the liquid separation cold plate having a liquid inlet for low-temperature coolant to flow in, and a liquid outlet for high-temperature coolant to flow out, the low-temperature coolant flowing into the liquid separation cold plate through the liquid inlet can flow into each of the contact cold plates, and the high-temperature coolant in each of the contact cold plates can flow into the liquid separation cold plate; and The liquid dispensing tube group includes a first pipe and a second pipe that can be elastically extended and retracted; one end of the first pipe is connected to the liquid dispensing outlet, and the other end is connected to the liquid inlet; one end of the second pipe is connected to the liquid outlet, and the other end is connected to the liquid return inlet.

2. The heat dissipation device according to claim 1, characterized in that: The first pipe and the second pipe are both spiral pipes.

3. The heat dissipation device according to claim 2, characterized in that: A partition plate is provided between the first pipe and the second pipe.

4. The heat dissipation device according to claim 1, characterized in that: The liquid separation cold plate has a plurality of first outlets and first inlets arranged in pairs, each of the contact cold plates has a second outlet and a second inlet, each of the second inlets is connected to the corresponding first outlet, and each of the second outlets is connected to the corresponding first inlet; The low-temperature coolant flowing into the liquid separation cold plate through the liquid inlet can flow into the contact cold plate through the first outlet and the second inlet in sequence, and the high-temperature coolant in the contact cold plate can flow back into the liquid separation cold plate through the second outlet and the first inlet in sequence.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The heat dissipation device includes multiple groups of cold plate assemblies and multiple groups of liquid distribution pipe groups. The liquid distributor has multiple pairs of liquid distribution outlets and liquid return inlets. The liquid inlets of the multiple groups of cold plate assemblies are connected to the multiple liquid distribution outlets in a one-to-one correspondence through multiple first pipes, and the liquid outlets of the multiple groups of cold plate assemblies are connected to the multiple liquid return inlets in a one-to-one correspondence through multiple second pipes.

6. A server, characterized in that: The server comprises the heat dissipation device according to any one of claims 1 to 5, and further comprises a chassis and the hard disk assembly; The liquid distributor, the liquid distributor tube set and the cold plate assembly are all installed in the chassis, the hard disk assembly is installed on the cold plate assembly, and the cold plate assembly is slidably connected to the chassis.

7. The server according to claim 6, characterized in that: The plurality of contact cold plates are arranged at intervals along a first direction, and the hard disk assembly for heat exchange with any two adjacent contact cold plates is installed between them, wherein the first direction is the length direction of the liquid separation cold plate.

8. The server according to claim 7, characterized in that: Among any two adjacent contact cold plates, one has a first plug-in portion and the other has a second plug-in portion, the hard disk assembly includes a hard disk heat-conducting structure connected to the hard disk, the hard disk heat-conducting structure has a third plug-in portion and a fourth plug-in portion arranged at intervals along the first direction, the first plug-in portion is plugged into the third plug-in portion, and the second plug-in portion is plugged into the fourth plug-in portion.

9. The server according to claim 8, characterized in that: The first plug-in portion and the second plug-in portion are both slots extending along the second direction, the third plug-in portion and the fourth plug-in portion are both plug-in blocks extending along the second direction, the plug-in blocks are inserted into the corresponding slots, and the second direction is the width direction of the liquid separation cold plate.

10. The server according to claim 9, characterized in that In the insertion direction of the inserting block into the corresponding slot, the inserting block is a wedge-shaped block with a gradually decreasing size, and the slot is a wedge-shaped groove with a gradually decreasing size.

11. The server according to any one of claims 7 to 10, characterized in that: A plurality of hard disk assemblies are installed between any two adjacent contact cold plates for heat exchange with the hard disk assemblies, and the plurality of hard disk assemblies are arranged along a third direction, which is the thickness direction of the liquid separation cold plate.

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