Semiconductor chip packaging test fixture

Abstract

The utility model discloses a semiconductor chip packaging test clamp which comprises a bottom plate, the top of the bottom plate is fixedly connected with a stand column, the top of the stand column is fixedly connected with a base, the surface of the base is provided with a groove, the two sides of the top of the base are provided with limiting devices, and the two sides of the base and the two sides of the bottom plate are provided with guide wheels. The guide wheel is slidably connected with a traction rope. The utility model relates to the technical field of semiconductor packaging test. According to the semiconductor chip packaging test clamp, the groove is formed in the surface of the base and used for containing the semiconductor chip to be tested, the limiting device is arranged at the top of the base, the placed semiconductor chip can be clamped and limited conveniently, the installation stability of the semiconductor chip is improved, and therefore the semiconductor chip is detected; and the supporting device is arranged in the base, and when the limitation of the limiting device on the semiconductor chip is removed, the supporting device is convenient to jack up the semiconductor chip, so that a worker can conveniently take the semiconductor chip.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging and testing, and more specifically to a semiconductor chip packaging and testing fixture. Background Art

[0002] With the rapid development of the optical communication industry in recent years, optical modules and optical devices are also developing towards high integration and miniaturization. Semiconductor lasers are one of the core components of their applications. Due to the small size of semiconductor laser chips, the packaging and testing accuracy requirements are very high, especially for the aging and reliability tests of semiconductor lasers. The bare chip must be packaged and wired before testing. At present, the existing semiconductor chip packaging and testing fixtures are not convenient for staff to quickly install the whole, affecting work efficiency, and the installation stability is poor, which in turn affects the test accuracy and cannot meet the use requirements. Utility Model Content

[0003] 1. Technical issues to be solved

[0004] In view of the problem that the existing semiconductor chip packaging and testing fixture in the prior art is that it is not convenient for the staff to quickly install the whole, which affects the work efficiency, and the installation stability is poor, which further affects the test accuracy and cannot meet the use requirements, the purpose of the utility model is to provide a semiconductor chip packaging and testing fixture, which can realize that the bottom plate supports the base through the column, because the surface of the base is provided with a groove for placing the semiconductor chip to be tested, the top two sides of the base are provided with limiting devices, which are convenient for clamping and limiting the placed semiconductor chip, and improve the installation stability of the semiconductor chip, so as to detect the semiconductor chip, and the base is provided with a supporting device inside the base, which is convenient for supporting the semiconductor chip, when the restriction of the limiting device on the semiconductor chip is released, the supporting device is convenient for lifting the semiconductor chip, so as to facilitate the staff to take the semiconductor chip, improve the work efficiency and meet the use requirements.

[0005] 2. Technical solution

[0006] To solve the above problems, the utility model adopts the following technical solutions.

[0007] A semiconductor chip packaging test fixture comprises a bottom plate, a column is fixedly connected to the top of the bottom plate, a base is fixedly connected to the top of the column, a groove is provided on the surface of the base, limiting devices are provided on both sides of the top of the base, guide wheels are provided on both sides of the base and the bottom plate, a traction rope is slidably connected to the guide wheel, the traction rope is connected to the limiting device, a limiting frame is provided in the middle of the bottom plate, the traction rope is slidably connected to the bottom plate, one end of the traction rope located in the bottom plate limiting frame is fixedly connected to a pull ring, and a supporting device is provided inside the base.

[0008] Preferably, the limiting device includes a fixed block, a return spring, a clamping block, a pull rod and a pull block, the fixed block is fixedly connected to the top of the base, the side wall of the fixed block is fixedly connected with the return spring, the fixed block is fixedly connected to the clamping block through the return spring, the side wall of the clamping block is fixedly connected with the pull rod, the pull rod is sleeved with the return spring, the pull rod is slidably connected to the fixed block, the end of the pull rod away from the clamping block is fixedly connected with the pull block, and the pull block is connected to the traction rope.

[0009] Preferably, the cross section of the pull rod is rectangular.

[0010] Preferably, a rubber pad is provided at the bottom of the block.

[0011] Preferably, the supporting device includes a support plate, a push rod, a connecting plate and a supporting spring, the support plate is located in a groove of the base, the bottom of the support plate is fixedly connected to the push rod, the push rod is slidably connected to the base, the bottom of the push rod is fixedly connected to a connecting plate, the connecting plate is slidably connected to the column, the bottom of the connecting plate is fixedly connected to a supporting spring, and the support spring is sleeved on the column.

[0012] Preferably, a sponge pad is provided on the inner wall of the groove of the base.

[0013] 3. Beneficial effects

[0014] Compared with the prior art, the advantages of the present invention are:

[0015] The base is supported by the bottom plate through the columns. Since the surface of the base is provided with grooves for placing the semiconductor chip to be tested, limiting devices are provided on both sides of the top of the base to facilitate the clamping and limiting of the placed semiconductor chip, thereby improving the installation stability of the semiconductor chip and thus testing the semiconductor chip.

[0016] By arranging a supporting device inside the base, it is convenient to support the semiconductor chip. When the restriction of the limiting device on the semiconductor chip is released, the supporting device can lift up the semiconductor chip, thereby making it convenient for the staff to take the semiconductor chip and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall external structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the overall internal structure of the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the support device of the utility model;

[0020] Figure 4 For this utility model Figure 1 Schematic diagram of the local enlarged structure at A.

[0021] Description of the numbers in the figure:

[0022] 1. Bottom plate; 2. Upright column; 3. Base; 4. Limiting device; 41. Fixed block; 42. Reset spring; 43. Block; 44. Pull rod; 45. Pull block; 5. Guide wheel; 6. Traction rope; 7. Pull ring; 8. Support device; 81. Support plate; 82. Push rod; 83. Connecting plate; 84. Support spring; 9. Sponge pad. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1:

[0025] See also Figure 1-4 The utility model provides a technical solution: a semiconductor chip packaging test fixture, including a bottom plate 1, a column 2 is fixedly connected to the top of the bottom plate 1, a base 3 is fixedly connected to the top of the column 2, a groove is arranged on the surface of the base 3, limiting devices 4 are arranged on both sides of the top of the base 3, guide wheels 5 are arranged on both sides of the base 3 and the bottom plate 1, a traction rope 6 is slidably connected to the guide wheel 5, the traction rope 6 is connected to the limiting device 4, a limiting frame is arranged in the middle of the bottom plate 1, the traction rope 6 is slidably connected to the bottom plate 1, a pull ring 7 is fixedly connected to one end of the traction rope 6 located in the limiting frame of the bottom plate 1, and a supporting device 8 is arranged inside the base 3. The bottom plate 1 supports the base 3 through the column 2. Since the surface of the base 3 is provided with a groove for placing the semiconductor chip to be tested, limiting devices 4 are provided on both sides of the top of the base 3 to facilitate the clamping and limiting of the placed semiconductor chip, improve the installation stability of the semiconductor chip, and thus detect the semiconductor chip. A supporting device 8 is provided inside the base 3 to facilitate supporting the semiconductor chip. When it is necessary to release the restriction of the limiting device 4 on the semiconductor chip, the pull ring 7 is pulled to drive the traction rope 6 to move and pull the limiting device 4, thereby releasing the restriction on the semiconductor chip. The supporting device 8 is convenient for lifting the semiconductor chip, so as to facilitate the staff to take the semiconductor chip and improve work efficiency.

[0026] The limiting device 4 includes a fixed block 41, a reset spring 42, a clamping block 43, a pull rod 44 and a pull block 45. The fixed block 41 is fixedly connected to the top of the base 3. The side wall of the fixed block 41 is fixedly connected to the reset spring 42. The fixed block 41 is fixedly connected to the clamping block 43 through the reset spring 42. The side wall of the clamping block 43 is fixedly connected to the pull rod 44. The pull rod 44 is sleeved with the reset spring 42. The pull rod 44 is slidably connected to the fixed block 41. The end of the pull rod 44 away from the clamping block 43 is fixedly connected to the pull block 45. The pull block 45 is connected to the traction rope 6. The limiting device 4 is provided, and the fixed block 41 supports the clamping block 43 through the reset spring 42, so as to limit the semiconductor chip in the base 3.

[0027] The cross section of the pull rod 44 is rectangular, so that the pull rod 44 can only move horizontally and cannot deflect, thereby improving the support stability of the clamping block 43 on the semiconductor chip.

[0028] A rubber pad is provided at the bottom of the block 43 to improve the protection of the semiconductor chip.

[0029] The support device 8 includes a support plate 81, a push rod 82, a connecting plate 83 and a supporting spring 84. The support plate 81 is located in the groove of the base 3. The bottom of the support plate 81 is fixedly connected with a push rod 82, which is slidably connected to the base 3. The bottom of the push rod 82 is fixedly connected with a connecting plate 83, which is slidably connected to the column 2. The bottom of the connecting plate 83 is fixedly connected with a supporting spring 84, which is sleeved with the column 2. The support device 8 is set, and the base 3 supports the support plate 81 through the supporting spring 84, and then supports the semiconductor chip. When the limiting device 4 limits the semiconductor chip, the supporting spring 84 is in a compressed state. When the limiting device 4 is released from the limitation of the semiconductor chip, the elastic potential energy of the supporting spring 84 is converted into kinetic energy, and then the semiconductor chip is lifted up, which is convenient for the staff to take.

[0030] The inner wall of the groove of the base 3 is provided with a sponge pad 9. The sponge pad 9 is provided to improve the protection of the semiconductor chip.

[0031] The above is only a preferred specific implementation method of the utility model, but the protection scope of the utility model is not limited to it. Any technician familiar with the technical field within the technical scope disclosed by the utility model and any equivalent replacement or change based on the technical solution and improved concept of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor chip packaging test fixture, comprising a base plate (1), characterized in that: The top of the bottom plate (1) is fixedly connected to a column (2), the top of the column (2) is fixedly connected to a base (3), a groove is provided on the surface of the base (3), limiting devices (4) are provided on both sides of the top of the base (3), guide wheels (5) are provided on both sides of the base (3) and the bottom plate (1), the guide wheels (5) are slidably connected to a traction rope (6), the traction rope (6) is connected to the limiting device (4), a limiting frame is provided in the middle of the bottom plate (1), the traction rope (6) is slidably connected to the bottom plate (1), one end of the traction rope (6) located in the limiting frame of the bottom plate (1) is fixedly connected to a pull ring (7), and a supporting device (8) is provided inside the base (3).

2. A semiconductor chip packaging test fixture according to claim 1, characterized in that: The limiting device (4) comprises a fixed block (41), a return spring (42), a clamping block (43), a pull rod (44) and a pull block (45); the fixed block (41) is fixedly connected to the top of the base (3); the side wall of the fixed block (41) is fixedly connected to the return spring (42); the fixed block (41) is fixedly connected to the clamping block (43) via the return spring (42); the side wall of the clamping block (43) is fixedly connected to the pull rod (44); the pull rod (44) is sleeved with the return spring (42); the pull rod (44) is slidably connected to the fixed block (41); the end of the pull rod (44) away from the clamping block (43) is fixedly connected to the pull block (45); the pull block (45) is connected to the traction rope (6).

3. A semiconductor chip packaging test fixture according to claim 2, characterized in that: The cross section of the pull rod (44) is rectangular.

4. A semiconductor chip packaging test fixture according to claim 2, characterized in that: A rubber pad is provided at the bottom of the clamping block (43).

5. The semiconductor chip packaging test fixture according to claim 1, characterized in that: The support device (8) comprises a support plate (81), a push rod (82), a connecting plate (83) and a supporting spring (84); the support plate (81) is located in a groove of the base (3); the bottom of the support plate (81) is fixedly connected to the push rod (82); the push rod (82) is slidably connected to the base (3); the bottom of the push rod (82) is fixedly connected to the connecting plate (83); the connecting plate (83) is slidably connected to the column (2); the bottom of the connecting plate (83) is fixedly connected to the supporting spring (84); the supporting spring (84) is sleeved on the column (2).

6. The semiconductor chip packaging test fixture according to claim 1, characterized in that: A sponge pad (9) is provided on the inner wall of the groove of the base (3).

Images