Injection molding machine with semiconductor cooling function

Abstract

The utility model relates to an injection molding machine with a semiconductor cooling function, which comprises an injection molding machine and an oil tank arranged in the injection molding machine, the oil tank is provided with an oil temperature detection sensor, a semiconductor is arranged on one side of the oil tank and is positioned in the injection molding machine, and a heat conduction device is arranged between the semiconductor and the oil tank. The heat conduction device communicates with the semiconductor and the oil tank, and the semiconductor transmits the adjusted temperature into the oil tank through the heat conduction device, so that the temperature of the hydraulic oil in the oil tank is adjusted, and the problem that in the prior art, when the oil temperature of the hydraulic oil is too high, the temperature is too high is effectively solved; the technical problems that the oil temperature of hydraulic oil is mostly cooled through cooling water generated by cooperation of an external cooling tower and a water pump, however, the cooling mode is prone to polluting the environment, water resources are prone to being wasted, then the environment is polluted, water scales are generated by the cooling water and need to be manually cleaned, and time and labor are wasted are solved.

Description

Technical Field

[0001] The present application relates to the technical field of oil temperature control equipment, and more specifically, to an injection molding machine with a semiconductor cooling function. Background Art

[0002] The hydraulic transmission system in the injection molding machine can provide power for various actions of the injection molding process through hydraulic oil, and meet the pressure, speed, temperature and other requirements of various parts of the injection molding machine. Therefore, hydraulic oil is crucial in the entire operation system of the injection molding machine, and the oil temperature of the hydraulic oil should not be too high or too low during operation. If the hydraulic oil temperature is too high, the seal will be damaged by high temperature, resulting in reduced sealing performance. If the hydraulic oil temperature is too low, the deformation of the seal is insufficient, which will aggravate the wear of the seal during operation and reduce the life of the seal.

[0003] In the prior art, when the temperature of the hydraulic oil is too high, most of the time, an external cooling tower is used in conjunction with a water pump to produce circulating cooling water, and the cooling water is used to cool the hydraulic oil of the injection molding machine. However, this cooling method not only requires a large amount of water resources, but also easily causes a waste of water resources, thereby polluting the environment. In addition, the cooling water will also produce scale, which requires manual cleaning frequently, which is time-consuming and labor-intensive. Utility Model Content

[0004] In view of the deficiencies of the above-mentioned prior art, the purpose of the present application is to provide an injection molding machine with a semiconductor cooling function, including an injection molding machine and an oil tank installed inside the injection molding machine, the oil tank is provided with an oil temperature detection sensor, and a semiconductor is provided on one side of the oil tank, and the semiconductor is located inside the injection molding machine, a heat conduction device is provided between the semiconductor and the oil tank, and the heat conduction device is connected to the semiconductor and the oil tank respectively, and the semiconductor transmits the regulated temperature to the inside of the oil tank through the heat conduction device, thereby regulating the temperature of the hydraulic oil in the oil tank.

[0005] Preferably, a microcomputer controller is provided on one side of the outside of the injection molding machine, and the microcomputer controller is electrically connected to a first cable, and the first cable is electrically connected to a temperature detection sensor, so that the microcomputer controller is electrically connected to the temperature detection sensor through the first cable.

[0006] Preferably, a single-chip microcomputer controller is provided on one side of the microcomputer controller, and the single-chip microcomputer controller is signal-connected to the microcomputer controller, a second cable is electrically connected to the single-chip microcomputer controller, and the second cable is electrically connected to the semiconductor, and a signal is transmitted to the single-chip microcomputer controller through the microcomputer controller, so that the single-chip microcomputer controller can send a temperature signal to the semiconductor through the second cable.

[0007] Preferably, a heat dissipation device is further provided inside the injection molding machine, and the heat dissipation device is electrically connected to a third cable, and the third cable is electrically connected to the single-chip microcomputer controller.

[0008] In summary, the present application has the following beneficial effects:

[0009] The oil temperature inside the oil tank is monitored by an oil temperature detection sensor arranged on the oil tank. When the oil temperature inside the oil tank is too high, cooling is performed through a semiconductor. After semiconductor cooling, the cooled temperature is transmitted to the inside of the oil tank through a heat conduction device, thereby cooling the hydraulic oil in the oil tank. The cooperation among the oil temperature sensor, the semiconductor and the heat conduction device effectively solves the problem in the prior art that when the temperature of the hydraulic oil is too high, most of the cooling water is produced by an external cooling tower in cooperation with a water pump for recycling, and the oil temperature of the hydraulic oil of the injection molding machine is cooled by the cooling water. However, such a cooling method not only requires a large amount of water resources, but also easily causes a waste of water resources, thereby polluting the environment. In addition, the cooling water will also produce scale, which requires frequent manual cleaning of the scale, which is a time-consuming and labor-intensive technical problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the overall structure of an injection molding machine with semiconductor cooling function;

[0011] Figure 2 The invention is a module control diagram of an injection molding machine with semiconductor cooling function.

[0012] Figure numerals: 1, injection molding machine; 1001, oil tank; 2, oil temperature detection sensor; 3, semiconductor; 4, heat conduction device; 5, microcomputer controller; 5001, sending module; 5002, receiving module; 6, first cable; 7, single-chip microcomputer controller; 8, second cable; 9, heat dissipation device; 10, third cable. DETAILED DESCRIPTION

[0013] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0014] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it can be directly or indirectly connected to the other component.

[0015] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0016] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0017] An injection molding machine with semiconductor cooling function, see Figure 1 to Figure 2 , including an injection molding machine 1 and an oil tank 1001 installed inside the injection molding machine 1, the oil tank 1001 is provided with an oil temperature detection sensor 2, and a semiconductor 3 is provided on one side of the oil tank 1001, and the semiconductor 3 is located inside the injection molding machine 1, a heat conduction device 4 is provided between the semiconductor 3 and the oil tank 1001, and the heat conduction device 4 is respectively connected to the semiconductor 3 and the oil tank 1001, and the semiconductor 3 transmits the adjusted temperature to the inside of the oil tank 1001 through the heat conduction device 4, thereby adjusting the temperature of the hydraulic oil in the oil tank 1001.

[0018] A microcomputer controller 5 is provided on one side of the outside of the injection molding machine 1, and the microcomputer controller 5 is electrically connected to a first cable 6, and the first cable 6 is electrically connected to a temperature detection sensor, so that the microcomputer controller 5 is electrically connected to the temperature detection sensor through the first cable 6. In this embodiment, the staff can set the standard value of the oil temperature inside the oil tank 1001 of the injection molding machine 1 during operation in advance in the microcomputer controller 5, and the standard value can be changed according to the actual situation on site, which is not specifically limited in this embodiment.

[0019] A single-chip controller 7 is provided on one side of the microcomputer controller 5, and the single-chip controller 7 is signal-connected to the microcomputer controller 5. A second cable 8 is electrically connected to the single-chip controller 7, and the second cable 8 is electrically connected to the semiconductor 3. The signal is transmitted to the single-chip controller 7 through the microcomputer controller 5, so that the single-chip controller 7 can send a temperature signal to the semiconductor 3 through the second cable 8. In this embodiment, a sending module 5001 is provided inside the microcomputer controller 5, and the sending module 5001 is signal-connected to the single-chip controller 7, and the microcomputer controller 5 sends instructions to the single-chip controller 7 through the sending module 5001. A receiving module 5002 is also provided inside the microcomputer controller 5, and the receiving module 5002 is signal-connected to the oil temperature detection sensor 2, and the microcomputer controller 5 receives the signal fed back by the oil temperature detection sensor 2 through the receiving module 5002.

[0020] A heat dissipation device 9 is also provided inside the injection molding machine 1, and the heat dissipation device 9 is electrically connected to a third cable 10, and the third cable 10 is electrically connected to the single-chip controller 7. In this embodiment, the single-chip controller 7 drives the heat dissipation device 9 to continuously work inside the injection molding machine 1 through the third cable 10, thereby performing conventional heat dissipation on all components inside the injection molding machine 1, thereby extending the service life of all components inside the injection molding machine 1.

[0021] Working principle: During the operation of the injection molding machine 1, the oil temperature detection sensor 2 will continuously monitor the temperature of the hydraulic oil in the oil tank 1001 of the injection molding machine 1. When the oil temperature inside the oil tank 1001 is abnormal, the oil temperature detection sensor 2 will feed back the monitored data to the receiving module 5002 inside the microcomputer controller 5 through the first cable 6, and the microcomputer controller 5 will analyze the data fed back by the oil temperature detection sensor 2. When the microcomputer controller 5 determines that the oil temperature inside the oil tank 1001 is lower than the set standard value, the microcomputer controller 5 will transmit the heating signal to the single-chip controller 7 through the sending module 5001, and the single-chip controller 7 will transmit the heating signal to the semiconductor 3 through the second cable 8, and use the semiconductor 3 to heat, and finally transmit the heated temperature to the inside of the oil tank 1001 through the heat conduction device 4, so as to heat the hydraulic oil inside the oil tank 1001;

[0022] When the microcomputer controller 5 determines that the oil temperature inside the oil tank 1001 is higher than the set standard value, the microcomputer controller 5 will transmit a cooling signal to the single-chip controller 7 through the sending module 5001, and the single-chip controller 7 will transmit the cooling signal to the semiconductor 3 through the second cable 8, and use the semiconductor 3 for cooling. Finally, the refrigerated temperature is transmitted to the inside of the oil tank 1001 through the heat conduction device 4, so as to cool the hydraulic oil inside the oil tank 1001. Through the cooperation between the oil temperature detection sensor 2, the semiconductor 3, the microcomputer controller 5, the single-chip controller 7, the first cable 6 and the second cable 8, the problem that in the prior art, when the oil temperature of the hydraulic oil is too high, most of them use an external cooling tower and a water pump to produce circulating cooling water, and use the cooling water to cool the oil temperature of the hydraulic oil of the injection molding machine 1, but such a cooling method not only requires a large amount of water resources, but also easily causes a waste of water resources, thereby polluting the environment, and the cooling water will also produce scale, which requires manual frequent cleaning of the scale, which is time-consuming and labor-intensive technical problems.

[0023] The above embodiments are merely explanations of the present application and are not limitations of the present application. After reading this specification, those skilled in the art may make modifications to the embodiments without any creative contribution as needed. However, as long as they are within the scope of the claims of the present application, they are protected by the patent law.

Claims

1. An injection molding machine with semiconductor cooling function, characterized in that: It includes an injection molding machine and an oil tank installed inside the injection molding machine, the oil tank is provided with an oil temperature detection sensor, and a semiconductor is provided on one side of the oil tank, and the semiconductor is located inside the injection molding machine, a heat conduction device is provided between the semiconductor and the oil tank, and the heat conduction device is connected to the semiconductor and the oil tank respectively, and the semiconductor transmits the adjusted temperature to the inside of the oil tank through the heat conduction device, thereby adjusting the temperature of the hydraulic oil in the oil tank.

2. The injection molding machine with semiconductor cooling function according to claim 1, characterized in that: A microcomputer controller is arranged on one side of the outside of the injection molding machine, and the microcomputer controller is electrically connected to a first cable, and the first cable is electrically connected to a temperature detection sensor, so that the microcomputer controller is electrically connected to the temperature detection sensor through the first cable.

3. The injection molding machine with semiconductor cooling function according to claim 2, characterized in that: A single-chip microcomputer controller is provided on one side of the microcomputer controller, and the single-chip microcomputer controller is signal-connected to the microcomputer controller. A second cable is electrically connected to the single-chip microcomputer controller, and the second cable is electrically connected to the semiconductor. The signal is transmitted to the single-chip microcomputer controller through the microcomputer controller, so that the single-chip microcomputer controller can send a temperature signal to the semiconductor through the second cable.

4. The injection molding machine with semiconductor cooling function according to claim 3, characterized in that: A heat dissipation device is also provided inside the injection molding machine, and the heat dissipation device is electrically connected to a third cable, and the third cable is electrically connected to the single-chip microcomputer controller.

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