Circuit board pressing machine

Abstract

The utility model relates to a circuit board pressing machine. The circuit board pressing machine comprises a rack, and a circuit board conveying module, an upper pressing module and a lower pressing module which are arranged on the rack, the upper pressing module comprises an upper module translation mechanism and an upper pressing assembly which are arranged on the rack; the upper press-fit assembly comprises a plurality of independent upper press-fit modules connected with the upper module translation mechanism, and the plurality of upper press-fit modules are all located above the circuit board conveying module; the lower pressing module comprises a lower module translation mechanism and a lower pressing assembly which are arranged on the rack; and the lower pressing assembly comprises a lower pressing driving structure connected with the lower module translation mechanism and a lower pressing platform connected with the lower pressing driving structure, and the lower pressing platform corresponds to the multiple upper pressing modules up and down. According to the utility model, the problem that the quantity of required equipment and fixtures is increased due to the fact that a large quantity of pressing modules are required for pressing different products because the pressing machine cannot be compatible with the products with different typesets when the glue is pressed can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a circuit board pressing machine. Background Art

[0002] In the production and processing of flexible circuit boards, it is often necessary to assemble electronic components onto flexible circuit boards. In the assembly process of electronic components, it is necessary to press colloids (such as pressure-sensitive adhesives or heat-sensitive adhesives) on electronic components or circuit boards. Therefore, in traditional technology, a press machine is used to press the colloid, which can ensure reliable adhesion of the colloid and improve the pressing efficiency. However, the press machine in traditional technology is not compatible with circuit board products with different layouts when pressing the colloid, resulting in a large number of pressing modules required for pressing different circuit board products, thereby increasing the number of equipment and fixtures required for the press machine. Utility Model Content

[0003] The utility model provides a circuit board pressing machine, which can solve the technical problem that the pressing machine in the traditional technology is not compatible with circuit board products with different layouts when pressing colloids, resulting in a large number of pressing modules required for pressing different circuit board products, thereby increasing the number of equipment and clamps required for the pressing machine.

[0004] In order to solve the above technical problems, the utility model provides a circuit board pressing machine, comprising:

[0005] frame;

[0006] A circuit board conveying module is arranged on the frame;

[0007] An upper pressing die set includes an upper die set translation mechanism disposed on the frame, and an upper pressing assembly connected to the upper die set translation mechanism; the upper pressing assembly includes a plurality of independent upper pressing modules connected to the upper die set translation mechanism, and the plurality of upper pressing modules are all located above the circuit board conveying module; and,

[0008] The lower pressing die group includes a lower die group translation mechanism arranged on the frame, and a lower pressing component connected to the lower die group translation mechanism; the lower pressing component includes a lower pressing drive structure connected to the lower die group translation mechanism, and a lower pressing platform connected to the lower pressing drive structure, and the lower pressing platform corresponds to the multiple upper pressing modules up and down.

[0009] Optionally, the lower pressing platform includes a heat insulation plate connected to the lower pressing drive structure, a heating structure arranged on the heat insulation plate, a lower pressing plate arranged on the heating structure, and a plurality of lower pressing heads arranged on the top surface of the lower pressing plate, and the plurality of lower pressing heads correspond one by one to the plurality of upper pressing modules.

[0010] Optionally, the heating structure includes a heating plate arranged between the lower pressing plate and the heat insulation plate, and a heating tube arranged in the heating plate, wherein the heating tube is used to connect a heating power supply module.

[0011] Optionally, the lower pressing drive structure includes a main lower pressing frame and a main lower pressing drive member arranged on the frame, and a secondary lower pressing frame and a secondary lower pressing drive member vertically slidably arranged on the main lower pressing frame, the secondary lower pressing frame is connected to the driving end of the main lower pressing drive member, and the secondary lower pressing drive member is connected to the lower pressing platform.

[0012] Optionally, the upper pressing assembly includes a module mounting seat connected to the upper mold group translation mechanism, a plurality of the upper pressing modules are detachably mounted on the module mounting seat, and a spacing strip is provided between two adjacent upper pressing modules.

[0013] Optionally, each of the upper pressing modules includes a module body arranged on the module mounting seat, an upper pressing driving member arranged on the module body or the module mounting seat, an upper pressing block connected to the driving end of the upper pressing driving member, and an upper pressing head arranged on the upper pressing block, and the upper pressing head is arranged correspondingly to the lower pressing platform above and below.

[0014] Optionally, the upper mold group translation mechanism and the lower mold group translation mechanism are integrated.

[0015] Optionally, the frame includes a main frame body, and a connecting frame movably arranged on the main frame body;

[0016] The upper mold group translation mechanism and the circuit board conveying module are both arranged on the main frame, the upper mold group translation mechanism is connected to the connecting frame, and the upper pressing assembly and the lower pressing assembly are respectively arranged on the upper and lower sides of the connecting frame.

[0017] Optionally, the upper mold group translation mechanism includes a mold group transverse movement structure provided on the main frame, and a mold group longitudinal movement structure connected to the mold group transverse movement structure, and the connecting frame is connected to the mold group longitudinal movement structure; or,

[0018] The upper mold group translation mechanism includes a mold group transverse movement structure arranged on the main frame, and a mold group longitudinal movement structure connected to the mold group transverse movement structure, the connecting frame is connected to the mold group transverse movement structure, the mold group longitudinal movement structure is connected to the upper pressing assembly, and the upper pressing assembly is slidably arranged on the connecting frame.

[0019] Optionally, the circuit board conveying module includes two conveying racks arranged in parallel on the frame, a conveyor belt structure arranged on each of the conveying racks, and a limiting plate structure arranged on each of the conveying racks, a limited gap is formed between the limiting plate structure and the conveyor belt structure, and the upper pressing assembly and the lower pressing assembly are respectively located on the upper and lower sides of the conveyor belt structure.

[0020] The beneficial effects brought by the technical solution provided by the utility model include:

[0021] The circuit board to be pressed can be received and conveyed by the circuit board conveying module arranged on the frame; then, the circuit board conveying module can convey the circuit board to be pressed between the upper pressing module and the lower pressing module to press the colloid on the circuit board from the upper and lower sides.

[0022] Specifically, before crimping the colloid on the circuit board, the upper pressing assembly can be translated by the upper mold group translation mechanism on the frame, and the lower pressing assembly can be translated by the lower mold group translation mechanism on the frame, so that the upper pressing assembly and the lower pressing assembly correspond to the arrangement of the colloid on the circuit board to be pressed; when crimping the colloid on the circuit board, the lower pressing platform can be driven to rise by the lower pressing driving structure of the lower pressing assembly, and multiple colloids arranged on the circuit board to be pressed can be simultaneously supported from the bottom of the circuit board to be pressed, and the multiple colloids arranged on the circuit board can be crimped separately from the top of the circuit board to be pressed by the multiple upper pressing modules of the upper pressing assembly, which is flexible and reliable.

[0023] By setting the lower pressing platform as an integral structure, the consistency of processing and production can be ensured, the number of parts can be reduced, and the assembly precision requirements can be relatively lowered; in addition, by making the upper pressing assembly include multiple independent upper pressing modules, each upper pressing module can independently press a colloid, and has strong adaptability and compatibility. When pressing circuit boards with different layouts, the colloid on the circuit board can be pressed by using different upper pressing modules. The pressing modules can be flexibly switched according to the layout on the circuit board, and the pressing of the entire circuit board can be achieved with one device, which can reduce costs and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 The three-dimensional structure diagram of the circuit board pressing machine according to the embodiment of the utility model is shown in FIG. Figure 1 ;

[0026] Figure 2 The three-dimensional structure diagram of the circuit board pressing machine according to the embodiment of the utility model is shown in FIG. Figure 2 ;

[0027] Figure 3 It is a side structural schematic diagram of the circuit board pressing machine according to an embodiment of the utility model;

[0028] Figure 4 The three-dimensional structure diagram of the upper pressing die set and the lower pressing die set of the circuit board pressing machine according to the embodiment of the utility model Figure 1 ;

[0029] Figure 5 The three-dimensional structure diagram of the upper pressing die set and the lower pressing die set of the circuit board pressing machine according to the embodiment of the utility model Figure 2 ;

[0030] Figure 6 It is a side view structural schematic diagram of the upper pressing die set and the lower pressing die set of the circuit board pressing machine according to the embodiment of the utility model;

[0031] Figure 7 The three-dimensional structure diagram of the upper pressing module of the circuit board pressing machine according to the embodiment of the utility model Figure 1 ;

[0032] Figure 8 The three-dimensional structure diagram of the upper pressing module of the circuit board pressing machine according to the embodiment of the utility model Figure 2 ;

[0033] Fig. 9 It is a schematic diagram of the three-dimensional structure of the circuit board conveying module of the circuit board pressing machine described in an embodiment of the utility model.

[0034] In the figure: 10, circuit board press machine; 100, frame; 110, main frame; 112, frame body; 114, side bracket; 120, connecting frame; 200, circuit board conveying module; 210, conveying frame; 220, conveyor belt structure; 230, limit plate structure; 240, frame adjustment structure; 300, upper pressing module; 302, upper module translation mechanism; 304, upper pressing assembly; 310, upper pressing module; 312, module body; 314, upper pressing drive; 316, upper pressing block; 318, upper pressing head; 320, module mounting seat; 330, module horizontal Shift structure; 332, transverse shift drive screw structure; 334, transverse shift guide rail; 340, module longitudinal shift structure; 342, longitudinal shift drive screw structure; 344, longitudinal shift guide rail; 350, visual inspection structure; 400, lower pressing module; 404, lower pressing assembly; 410, lower pressing drive structure; 412, main lower pressing frame; 414, main lower pressing drive member; 416, secondary lower pressing frame; 420, lower pressing platform; 422, heat insulation board; 424, heating structure; 4242, heating plate; 426, lower pressing plate; 428, lower pressing head; 429, snap connection structure. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] like Figure 1 and Figure 3 As shown, the utility model provides a circuit board pressing machine 10, comprising a frame 100, a circuit board conveying module 200 arranged on the frame 100, and an upper pressing module 300 and a lower pressing module 400 arranged on the frame 100 and respectively located above and below the circuit board conveying module 200. The circuit board to be pressed can be received and conveyed by the circuit board conveying module 200 arranged on the frame 100; then, the circuit board conveying module 200 can convey the circuit board to be pressed between the upper pressing module 300 and the lower pressing module 400, and press the colloid on the circuit board from the upper and lower sides.

[0037] Specifically, the upper pressing module 300 may include an upper module translation mechanism 302 disposed on the frame 100, and an upper pressing assembly 304 connected to the upper module translation mechanism 302. Moreover, the upper pressing assembly 304 may include a plurality of independent upper pressing modules 310 connected to the upper module translation mechanism 302, and the plurality of upper pressing modules 310 are all located above the circuit board conveying module 200. In addition, the lower pressing module 400 may include a lower module translation mechanism disposed on the frame 100, and a lower pressing assembly 404 connected to the lower module translation mechanism. Moreover, the upper pressing assembly 304 may include a lower pressing driving structure 410 connected to the upper module translation mechanism 302, and a lower pressing platform 420 connected to the lower pressing driving structure 410, and the lower pressing platform 420 of the lower pressing assembly 404 corresponds to the plurality of upper pressing modules 310 of the upper pressing assembly 304 from top to bottom.

[0038] Before crimping the colloid on the circuit board, the upper pressing assembly 304 can be translated by the upper mold group translation mechanism 302 on the frame 100, and the lower pressing assembly 404 can be translated by the lower mold group translation mechanism on the frame 100, so that the upper pressing assembly 304 and the lower pressing assembly 404 correspond to the arrangement of the colloid on the circuit board to be pressed; when crimping the colloid on the circuit board, the lower pressing driving structure 410 of the lower pressing assembly 404 can be used to drive the lower pressing platform 420 to rise, and the multiple colloids arranged on the circuit board to be pressed can be supported at the same time from the bottom of the circuit board to be pressed, and the multiple upper pressing modules 310 of the upper pressing assembly 304 can be used to crimp the multiple colloids arranged on the circuit board from the top of the circuit board to be pressed, which is flexible and reliable.

[0039] By setting the lower pressing platform 420 as an integral structure, the consistency of processing and production can be ensured, the number of parts can be reduced, and the assembly precision requirement can be relatively lowered; in addition, by making the upper pressing component 304 include multiple independent upper pressing modules 310, each upper pressing module 310 can independently press a colloid, and has strong adaptability and compatibility. When pressing circuit boards with different layouts, the colloid on the circuit board can be pressed by using different upper pressing modules 310. The pressing modules can be flexibly switched according to the layout of the circuit board, and the pressing of the entire circuit board can be achieved with one device, which can reduce costs and improve production efficiency.

[0040] In addition, the frame 100 may include a main frame body 110. Furthermore, the main frame body 110 may include a frame body 112, and a side bracket 114 disposed on the side of the frame body 112. The circuit board conveying module 200 may be disposed on the frame body 112, the upper module translation mechanism 302 of the upper pressing module 300 may be disposed on the side bracket 114 or / and the frame body 112, and the lower module translation mechanism may also be disposed on the side bracket 114 or / and the frame body 112. Furthermore, the lower pressing assembly 404 may be located inside the frame body 112, and the upper pressing assembly 304 may be located above the frame body 112, so that the upper pressing assembly 304 and the lower pressing assembly 404 are respectively located on both sides of the circuit board conveying module 200.

[0041] In addition, in some embodiments, the upper die set translation mechanism 302 and the lower die set translation mechanism can be independently arranged, that is, the upper pressing assembly 304 of the upper pressing die set 300 is driven independently by the upper die set translation mechanism 302, and the lower pressing assembly 404 of the lower pressing die set 400 is driven independently by the lower die set translation mechanism, so that the upper pressing assembly 304 and the lower pressing assembly 404 move in the horizontal plane respectively, and correspond to the colloid on the circuit board to be pressed on the circuit board conveying module 200 from the upper and lower sides respectively.

[0042] In addition, if Figure 1 and Figure 2 As shown, in other embodiments, the upper mold translation mechanism 302 and the lower mold translation mechanism are integrated. That is, the upper pressing assembly 304 of the upper pressing module 300 and the lower pressing assembly 404 of the lower pressing module 400 are driven by the same mold translation mechanism, so that the upper pressing assembly 304 and the lower pressing assembly 404 move in the horizontal plane at the same time, which is convenient for the upper and lower correspondence with the colloid on the circuit board to be pressed on the circuit board conveying module 200. By setting the upper mold translation mechanism 302 and the lower mold translation mechanism as the same mold translation mechanism, not only the cost is saved, but also the displacement of the upper pressing assembly 304 and the lower pressing assembly 404 can be accurate and reliable, which is convenient for the alignment with the colloid on the circuit board.

[0043] Furthermore, if Figures 4 to 6 As shown, the frame 100 may further include a connecting frame 120 movably arranged on the main frame body 110, the upper die group translation mechanism 302 is connected to the connecting frame 120, and the upper pressing assembly 304 and the lower pressing assembly 404 are respectively arranged on the upper and lower sides of the connecting frame 120. By arranging both the upper pressing assembly 304 and the lower pressing assembly 404 on the connecting frame 120, the upper pressing assembly 304 and the lower pressing assembly 404 form a whole, which is convenient for simultaneous driving by the upper die group translation mechanism 302. Moreover, the circuit board conveying module 200 can be arranged through the connecting frame 120, so that the upper pressing assembly 304 and the lower pressing assembly 404 are located on the upper and lower sides of the circuit board conveying module 200.

[0044] In addition, the connecting frame 120 can be suspended on the frame body 112 through the upper die group translation mechanism 302 connected to the side bracket 114 of the main frame 110 and / or the frame body 112; in addition, the top of the connecting frame 120 can also be connected through the upper die group translation mechanism 302, and the bottom of the connecting frame 120 can be slidably disposed on the frame body 112. The connecting frame 120 and the upper pressing assembly 304 and the lower pressing assembly 404 thereon can be driven by the upper die group translation mechanism 302 to translate in a plane, so that the upper pressing assembly 304 and the lower pressing assembly 404 correspond to the top and bottom of the colloid on the circuit board to be pressed on the circuit board conveying module 200, respectively.

[0045] Moreover, in some embodiments, the upper module translation mechanism 302 may include a module transverse movement structure 330 disposed on the side bracket 114 of the main frame 110, and a module longitudinal movement structure 340 connected to the module transverse movement structure 330, and the connecting frame 120 is connected to the module longitudinal movement structure 340. The module transverse movement structure 330 can drive the connecting frame 120 to move horizontally and horizontally, which can be consistent with the conveying direction of the circuit board conveying module 200; the module longitudinal movement structure 340 can drive the connecting frame 120 to move horizontally and longitudinally, thereby driving the upper pressing assembly 304 and the lower pressing assembly 404 on the connecting frame 120 to translate in the horizontal and vertical directions.

[0046] Furthermore, the module transverse movement structure 330 may include a transverse movement drive screw rod structure 332 disposed on the side bracket 114 of the main frame 110, and a transverse movement guide rail 334 disposed on the side bracket 114. Moreover, the module longitudinal movement structure 340 includes a longitudinal movement base slidably disposed on the transverse movement guide rail 334 and connected to the transverse movement drive screw rod structure 332, a longitudinal movement drive screw rod structure 342 disposed on the longitudinal movement base, and a longitudinal movement guide rail 344 disposed on the longitudinal movement base, the connecting frame 120 may be slidably disposed on the longitudinal movement guide rail 344, and the longitudinal movement drive screw rod structure 342 is connected to the connecting frame 120. Moreover, both the transverse movement guide rail 334 and the longitudinal movement guide rail 344 may be provided in plurality.

[0047] In addition, in some other embodiments, the upper module translation mechanism 302 may include a module transverse movement structure 330 disposed on the side bracket 114 of the main frame 110, and a module longitudinal movement structure 340 connected to the module transverse movement structure 330, the connecting frame 120 is connected to the module transverse movement structure 330, and the module longitudinal movement structure 340 is connected to the upper pressing assembly 304, and the upper pressing assembly 304 is slidably disposed on the connecting frame 120. The module transverse movement structure 330 can drive the connecting frame 120 to move horizontally and horizontally, and can drive the upper pressing assembly 304 and the lower pressing assembly 404 on the connecting frame 120 to translate horizontally and horizontally, which is consistent with the conveying direction of the circuit board conveying module 200; and the module longitudinal movement structure 340 can drive the upper pressing assembly 304 to move horizontally and longitudinally along the connecting frame 120, thereby driving the upper pressing assembly 304 to translate horizontally and longitudinally, and at this time, the lower pressing assembly 404 will not move horizontally and longitudinally at the same time as the upper pressing assembly 304.

[0048] Similarly, the module transverse movement structure 330 may include a transverse movement drive screw rod structure 332 disposed on the side bracket 114 of the main frame 110, and a transverse movement guide rail 334 disposed on the side bracket 114. Moreover, the module longitudinal movement structure 340 includes a connecting frame 120 slidably disposed on the transverse movement guide rail 334 and connected to the transverse movement drive screw rod structure 332, a longitudinal movement drive screw rod structure 342 disposed on the connecting frame 120, and a longitudinal movement guide rail 344 disposed on the connecting frame 120, and the upper pressing assembly 304 may be slidably disposed on the longitudinal movement guide rail 344, and the longitudinal movement drive screw rod structure 342 is connected to the upper pressing assembly 304.

[0049] In addition, both the lateral drive screw rod structure 332 and the longitudinal drive screw rod structure 342 can be set as screw rod linear drive structures, so that the movement accuracy of the two is high, thereby making the translation of the upper pressing assembly 304 and the lower pressing assembly 404 more accurate. Moreover, both the lateral drive screw rod structure 332 and the longitudinal drive screw rod structure 342 can include a drive motor, a drive screw rod connected to the output end of the drive motor, and a transmission nut or a transmission seat connected to the drive screw rod, and a transmission ball matched with the drive screw rod is provided in the transmission seat.

[0050] In addition, the upper pressing assembly 304 of the upper pressing module 300 may include a module mounting seat 320 connected to the upper module translation mechanism 302, and a plurality of upper pressing modules 310 may be detachably mounted on the module mounting seat 320, and a spacing bar is provided between two adjacent upper pressing modules 310. The module mounting seat 320 of the upper pressing assembly 304 may be fixedly mounted on the connecting frame 120, and the connecting frame 120 may be slidably mounted on the longitudinal guide rail of the module longitudinal movement structure 340 of the upper module translation mechanism 302, and the longitudinal drive screw rod structure is connected to the connecting frame 120; in addition, the module mounting seat 320 of the upper pressing assembly 304 may also be slidably mounted on the longitudinal guide rail of the module longitudinal movement structure 340 of the upper module translation mechanism 302, and connected to the longitudinal drive screw rod structure of the module longitudinal movement structure 340. Furthermore, the plurality of upper pressing modules 310 disposed on the module mounting seat 320 of the upper pressing assembly 304 are independent of each other, and each upper pressing module 310 can press the colloid independently.

[0051] By installing a plurality of upper pressing modules 310 on the module mounting seat 320, the plurality of upper pressing modules 310 can be used to press the plurality of colloids one by one from the top of the plurality of colloids on the circuit board to be pressed. Moreover, according to the arrangement of the colloids on the circuit board to be pressed, the corresponding upper pressing module 310 can be controlled to press, and the adaptability is strong. Moreover, according to the spacing of the colloids, different spacing strips can be set to space two adjacent upper pressing modules 310, so that the upper pressing module 310 corresponds to the colloids.

[0052] Furthermore, if Figures 7 and 8 As shown, each upper pressing module 310 may include a module body 312 disposed on a module mounting seat 320, an upper pressing driving member 314 disposed on the module body 312 or the module mounting seat 320, an upper pressing block 316 connected to the driving end of the upper pressing driving member 314, and an upper pressing head 318 disposed on the upper pressing block 316, and the upper pressing head 318 is disposed correspondingly to the lower pressing platform 420 of the lower pressing assembly 404. The upper pressing module 310 can drive the upper pressing block 316 and the upper pressing head 318 thereon to descend through the upper pressing driving member 314, and can press the top of the colloid on the circuit board to be pressed from above; at the same time, the lower pressing platform 420 of the lower pressing assembly 404 rises under the drive of the lower pressing driving structure 410, and can press the bottom of the colloid on the circuit board to be pressed from below.

[0053] Moreover, the upper pressing drive member 314 can also be set as a screw linear drive structure, which has high movement accuracy, more precise control of the upper pressing head 318, and better crimping effect on the colloid. In addition, the upper pressing block 316 can be set as a detachable structure, which is convenient for replacement according to different needs to meet different colloid crimping requirements.

[0054] In addition, the upper pressing module 300 may also include a visual inspection structure 350 disposed on the module mounting seat 320 of the upper pressing assembly 304, which can visually inspect and locate the circuit board to be pressed that is conveyed by the circuit board conveying module 200, so as to facilitate the determination of the position of the colloid on the circuit board to be pressed, thereby facilitating the pressing of the colloid by the lower pressing platform 420 and the upper pressing module 310. Moreover, in the present embodiment, the visual inspection structure 350 may include a CCD (charge coupled device) industrial camera assembly disposed on the module mounting seat 320, which is located above the circuit board conveying module 200.

[0055] In addition, if Figures 4 to 6 As shown, the lower pressing platform 420 of the lower pressing module 400 may include a heat insulation plate 422 connected to the lower pressing driving structure 410, a heating structure 424 arranged on the heat insulation plate 422, a lower pressing plate 426 arranged on the heating structure 424, and a plurality of lower pressing heads 428 arranged on the top surface of the lower pressing plate 426, and the plurality of lower pressing heads 428 correspond one by one to the plurality of upper pressing modules 310. The lower pressing driving structure 410 can be arranged at the bottom of the connecting frame 120, and the heat insulation plate 422 of the lower pressing platform 420 can be arranged at the top of the lower pressing driving structure 410, the heating structure 424 is arranged at the top of the heat insulation plate 422, the lower pressing plate 426 is arranged at the top of the heating structure 424, and multiple lower pressing heads 428 can be arranged at the top of the lower pressing plate 426 according to preset rules, so that the multiple lower pressing heads 428 on the lower pressing plate 426 can correspond to circuit boards with different layouts, that is, circuit boards with colloids with different arrangements.

[0056] The lower pressing driving structure 410 can be used to drive the lower pressing platform 420 to rise, so that the multiple lower pressing heads 428 on the lower pressing plate 426 of the lower pressing platform 420 can apply pressure to the bottom of the multiple colloids on the circuit board to be pressed one by one. Moreover, when applying pressure to the bottom of the colloid, the lower pressing plate 426 and the multiple lower pressing heads 428 can be heated by the heating structure 424, so that the colloid pressed with the multiple lower pressing heads 428 can be heated, so that the pressing effect of the colloid is better. In addition, the heat insulation board 422 can isolate the lower pressing driving structure 410 and the heating structure 424 to prevent the heating structure 424 from damaging the lower pressing driving structure 410.

[0057] Further, the heating structure 424 may include a heating plate 4242 disposed between the lower pressing plate 426 and the heat insulating plate 422, and a heating pipe disposed in the heating plate 4242, the heating pipe being used to connect to a heating power module. The heating power module may heat the heating pipe, so that the heating pipe heats the heating plate 4242, thereby causing the heating plate 4242 to heat the lower pressing plate 426. Moreover, a plurality of heating pipes may be evenly disposed in the heating plate 4242, so that heating is faster and more even.

[0058] Moreover, the lower pressing plate 426 can be detachably connected to the heating plate 4242 or the heat insulating plate 422 of the heating structure 424, and a plurality of lower pressing heads 428 can be fixedly arranged on the lower pressing plate 426. In this way, different lower pressing plates 426 and lower pressing heads 428 can be replaced as needed to meet the pressing requirements of circuit boards with different layouts. That is, the lower pressing plate 426 and the heating plate 4242 (or the heat insulating plate 422) can be detachably connected through a snap connection structure 429. Specifically, the snap connection structure 429 may include a connecting snap provided on one of the lower pressing plate 426 and the heating plate 4242 (or the heat insulating plate 422), and a connecting snap convex provided on the other one, so that the two can be snap-connected for easy disassembly and installation.

[0059] In addition, the lower pressing driving structure 410 may include a main lower pressing frame 412 and a main lower pressing driving member 414 arranged on the connecting frame 120 of the frame 100, and a secondary lower pressing frame 416 and a secondary lower pressing driving member arranged vertically on the main lower pressing frame 412 for sliding movement, the secondary lower pressing frame 416 being connected to the driving end of the main lower pressing driving member 414, and the secondary lower pressing driving member being connected to the lower pressing platform 420. The secondary lower pressing frame 416 and the lower pressing platform 420 thereon can be preliminarily lifted by the main lower pressing driving member 414, and then the height of the lower pressing platform 420 can be finely adjusted by the secondary lower pressing driving member. Moreover, both the main lower pressing driving member 414 and the secondary lower pressing driving member can be set as a motor driving structure. Further, both the main lower pressing driving member 414 and the secondary lower pressing driving member can be set as a screw rod linear driving structure.

[0060] In addition, if Fig. 9As shown, the circuit board conveying module 200 may include two conveying racks 210 arranged in parallel on the frame 100, a conveyor belt structure 220 arranged on each conveying rack 210, and a limit plate structure 230 arranged on each conveying rack 210, a limited gap is formed between the limit plate structure 230 and the conveyor belt structure 220, and the upper pressing assembly 304 and the lower pressing assembly 404 are respectively located on the upper and lower sides of the conveyor belt structure 220. The circuit board to be pressed can be placed on the conveyor belt structure 220 on the two conveying racks 210, and the circuit board to be pressed can be conveyed to between the upper pressing assembly 304 and the lower pressing assembly 404 by the two conveyor belt structures 220, that is, the colloid on the circuit board to be pressed can be pressed from the upper and lower sides by the upper pressing assembly 304 and the lower pressing assembly 404. Moreover, by forming a limited gap between the limit plate structure 230 and the conveyor belt structure 220, the circuit board to be pressed can be limited to avoid the circuit board from being offset during the conveying and pressing process.

[0061] Furthermore, the conveyor belt structure 220 may include a conveyor belt motor disposed on the conveyor frame 210, a conveyor belt transmission structure connected to the conveyor belt motor, and a conveyor belt disposed on the conveyor belt transmission structure, wherein the conveyor belt transmission structure is disposed on the conveyor frame 210, the conveyor belt is extended along the length direction of the conveyor frame 210, and a limiting gap is formed between the conveyor belt and the limiting plate structure 230. Furthermore, the limiting plate structure 230 may include a plurality of pressing plates disposed side by side on the top of the conveyor frame 210, and a limiting gap is formed between the plurality of pressing plates and the conveyor belt.

[0062] In addition, the circuit board conveying module 200 may further include a frame adjustment structure 240 disposed on the frame base 112 of the main frame 110. The frame adjustment structure 240 may include adjustment rails disposed side by side on the frame base 112, and the two conveying frames 210 are both transversely slidably disposed on the two adjustment rails; the frame adjustment structure 240 also includes an adjustment drive structure connected between the two conveying frames 210, for adjusting the spacing between the two conveying frames 210.

[0063] In the description of the present utility model, it should be noted that the terms "upper", "lower", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0064] It should be noted that, in the present utility model, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0065] The above description is only a specific embodiment of the utility model, so that those skilled in the art can understand or implement the utility model. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features of the utility model described herein.

Claims

1. A circuit board pressing machine, characterized in that: include: frame; A circuit board conveying module is arranged on the frame; An upper pressing die set comprises an upper die set translation mechanism disposed on the frame, and an upper pressing assembly connected to the upper die set translation mechanism; the upper pressing assembly comprises a plurality of independent upper pressing modules connected to the upper die set translation mechanism, and the plurality of upper pressing modules are all located above the circuit board conveying module; as well as, The lower pressing die group includes a lower die group translation mechanism arranged on the frame, and a lower pressing component connected to the lower die group translation mechanism; the lower pressing component includes a lower pressing drive structure connected to the lower die group translation mechanism, and a lower pressing platform connected to the lower pressing drive structure, and the lower pressing platform corresponds to the multiple upper pressing modules up and down.

2. The circuit board pressing machine according to claim 1, characterized in that: The lower pressing platform includes a heat insulation plate connected to the lower pressing driving structure, a heating structure arranged on the heat insulation plate, a lower pressing plate arranged on the heating structure, and a plurality of lower pressing heads arranged on the top surface of the lower pressing plate, and the plurality of lower pressing heads correspond one by one to the plurality of upper pressing modules.

3. The circuit board pressing machine according to claim 2, characterized in that: The heating structure comprises a heating plate arranged between the lower pressing plate and the heat insulating plate, and a heating tube arranged in the heating plate, wherein the heating tube is used to connect a heating power supply module.

4. The circuit board pressing machine according to claim 1, characterized in that: The lower pressing driving structure includes a main lower pressing frame and a main lower pressing driving member arranged on the frame, and a secondary lower pressing frame and a secondary lower pressing driving member vertically slidably arranged on the main lower pressing frame, the secondary lower pressing frame is connected to the driving end of the main lower pressing driving member, and the secondary lower pressing driving member is connected to the lower pressing platform.

5. The circuit board pressing machine according to any one of claims 1 to 4, characterized in that: The upper pressing assembly comprises a module mounting seat connected to the upper die set translation mechanism, a plurality of upper pressing modules are detachably mounted on the module mounting seat, and a spacing strip is provided between two adjacent upper pressing modules.

6. The circuit board pressing machine according to claim 5, characterized in that: Each of the upper pressing modules includes a module body arranged on the module mounting seat, an upper pressing driving member arranged on the module body or the module mounting seat, an upper pressing block connected to the driving end of the upper pressing driving member, and an upper pressing head arranged on the upper pressing block, and the upper pressing head is arranged correspondingly to the lower pressing platform above and below.

7. The circuit board pressing machine according to any one of claims 1 to 4, characterized in that: The upper die set translation mechanism and the lower die set translation mechanism are integrated.

8. The circuit board pressing machine according to claim 7, characterized in that: The frame includes a main frame body and a connecting frame movably arranged on the main frame body; The upper mold group translation mechanism and the circuit board conveying module are both arranged on the main frame, the upper mold group translation mechanism is connected to the connecting frame, and the upper pressing assembly and the lower pressing assembly are respectively arranged on the upper and lower sides of the connecting frame.

9. The circuit board pressing machine according to claim 8, characterized in that: The upper mold group translation mechanism includes a mold group transverse movement structure provided on the main frame, and a mold group longitudinal movement structure connected to the mold group transverse movement structure, and the connecting frame is connected to the mold group longitudinal movement structure; or, The upper mold group translation mechanism includes a mold group transverse movement structure arranged on the main frame, and a mold group longitudinal movement structure connected to the mold group transverse movement structure, the connecting frame is connected to the mold group transverse movement structure, the mold group longitudinal movement structure is connected to the upper pressing assembly, and the upper pressing assembly is slidably arranged on the connecting frame.

10. The circuit board pressing machine according to any one of claims 1 to 4, characterized in that: The circuit board conveying module includes two conveying frames arranged in parallel on the frame, a conveyor belt structure arranged on each of the conveying frames, and a limiting plate structure arranged on each of the conveying frames, a limited gap is formed between the limiting plate structure and the conveyor belt structure, and the upper pressing assembly and the lower pressing assembly are respectively located on the upper and lower sides of the conveyor belt structure.

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