Stepped screen plate stacking powder filling structure and vapor chamber applicable to stepped screen plate stacking powder filling structure

Abstract

The utility model provides a stepped screen plate stacking powder filling structure and an applicable uniform temperature plate thereof. The stepped screen plate stacking powder filling structure comprises a cover plate, a first screen plate, a second screen plate and a capillary structure. The first net plate is stacked on the inner surface of the cover plate in the first direction and comprises a first through opening communicated to the inner surface. The second screen plate is stacked on the first screen plate in the first direction and comprises a second through opening which is communicated to the inner surface through the first through opening, and the second screen plate is spatially opposite to the first through opening and the heat source. The second through opening is larger than the first through opening in the view of the first direction, and the top face of the first screen plate corresponding to the second through opening forms a first lap joint face which is not covered by the second screen plate. The capillary structures are arranged in the first through opening and the second through opening, the first lap joint face is communicated to the first screen plate, the stepped containing space formed by stacking the screen plates is filled with copper powder and then sintered into the porous capillary structures, and the problem of working fluid backwater circuit break caused by different sintering shrinkage ratios of the screen plates and the copper powder is effectively solved.

Description

Technical Field

[0001] The utility model relates to a temperature equalizing plate structure, in particular to a stepped mesh plate stacking powder filling structure and a temperature equalizing plate applicable thereto. Background Art

[0002] In traditional heat spreader products, the heat source surface of the heat spreader is mostly combined with mesh stacking and capillary structure. However, due to the different shrinkage ratios of the mesh and copper powder during sintering, it is easy to form a short circuit at the vertical interface between the mesh and copper powder after sintering, which will cause the working fluid in this area to be unable to reflux smoothly, seriously affecting the performance of the heat spreader.

[0003] Furthermore, under the increasingly stringent product performance requirements, the traditional capillary structure design of the stencil combined with copper powder filling has become increasingly insufficient for use. Therefore, how to further improve the working fluid reflux capacity on the existing connection interface has become the research and development focus of each company.

[0004] In view of this, it is necessary to provide a stepped mesh plate stacking powder filling structure and a suitable temperature equalizing plate, by filling the stepped accommodating space formed by stacking the mesh plates with copper powder and then sintering it into a porous capillary structure, thereby effectively improving the working fluid return water circuit breaker problem caused by the different sintering shrinkage ratios of the mesh plates and copper powder, thereby greatly improving the product's heat dissipation capacity and solving the deficiencies of the prior art. Utility Model Content

[0005] The purpose of this case is to provide a stepped mesh plate stacking powder filling structure and a suitable temperature equalizing plate, by filling the stepped accommodating space formed by stacking the mesh plates with metal powder and then sintering it into a porous capillary structure, effectively improving the working fluid return water circuit breaker problem caused by the different sintering shrinkage ratios of the mesh plates and metal powder, thereby greatly improving the product's heat dissipation capacity.

[0006] Another purpose of the present case is to provide a stepped mesh plate stacking powder filling structure and a temperature equalizing plate applicable thereto. The temperature equalizing plate is assembled by pairing an upper cover structure and a lower cover structure with each other. The stepped mesh plate stacking powder filling structure corresponds to a heat source and can be constructed on the upper cover structure or / and the lower cover structure. When a plurality of mesh plates are stacked on the cover plate through a hot pressing process, the opening area of ​​each mesh plate increases vertically from the bottom to the top from the inner surface of the cover plate to form a stepped accommodation space. After metal powder such as copper powder is filled in the stepped accommodation space, it can be sintered into a porous capillary structure with a porosity less than that of the mesh plate, and the porous capillary structure forms a good connection with the mesh plate through a horizontal first overlap surface. As a result, the mesh plate in the temperature equalizing plate can smoothly guide the working fluid to flow back to the capillary structure in the horizontal direction.

[0007] Another purpose of the present case is to provide a stepped mesh plate stacking and powder filling structure and a suitable heat spreader. In order to form a stepped accommodation space to fill metal powder for sintering, corresponding to the heat source position, multiple mesh plates are stacked from the inner surface of the cover plate from bottom to top and the opening area is increased. The shape of the opening is, for example, but not limited to, rectangular, circular or diamond-shaped. The number of first overlapping surfaces can be adjusted according to actual application requirements, and can be adjacent to part or all of the periphery of the corresponding opening. Thus, multiple mesh plates can be stacked in multiple ways to form a stepped accommodation space with sufficient first overlapping surfaces in different areas of the cover plate for powder filling, stacking and sintering, effectively improving the problem of water return circuit interruption of the working fluid caused by the different sintering shrinkage ratios of the mesh plates and metal powder, thereby greatly improving the efficiency of the working fluid reflux inside the heat spreader, and improving the overall performance surface of the heat spreader.

[0008] In order to achieve the aforementioned purpose, the present case provides a stepped mesh plate stacking powder filling structure, including a cover plate, a first mesh plate, a second mesh plate and a capillary structure. The cover plate includes an outer surface and an inner surface arranged opposite to each other. The first mesh plate is stacked on the inner surface along a first direction and includes a first opening. The first opening is connected to the inner surface. The second mesh plate is stacked on the first mesh plate along a first direction and includes a second opening, wherein the second opening is connected to the inner surface through the first opening, spatially relative to the first opening, wherein the second opening is larger than the first opening in the viewing direction of the first direction, and the top surface of the first mesh plate corresponds to the second opening to form a first overlapping surface, and the first overlapping surface is not covered by the second mesh plate. The capillary structure is arranged in the first opening and the second opening, and is connected to the first mesh plate at least through the first overlapping surface.

[0009] In one embodiment, the first mesh plate and the capillary structure at least partially overlap in the first direction. In one embodiment, the outer surface of the cover plate is attached to the heat source, and the area of ​​the first opening in the first direction is not less than the area of ​​the heat source.

[0010] In one embodiment, the first screen plate and the second screen plate are stacked on the cover plate through a heat pressing process.

[0011] In one embodiment, the bottom surface of the first mesh plate is attached to the inner surface of the cover plate, and the bottom surface of the second mesh plate is attached to the top surface of the first mesh plate, wherein the first mesh plate and the second mesh plate are assembled to guide a working fluid to flow back to the capillary structure along a second direction, and the second direction is perpendicular to the first direction.

[0012] In one embodiment, the first overlapping surface is connected between the periphery of the second opening and the periphery of the first opening, and the extending direction of the first overlapping surface is perpendicular to the first direction.

[0013] In one embodiment, the first opening and the second opening are respectively rectangular when viewed from the first direction, and the first overlapping surface is adjacent to a single side, two connected sides, two opposite sides or three connected sides of the first opening.

[0014] In one embodiment, the first opening and the second opening are respectively circular in shape when viewed from the first direction, and the first overlapping surface is adjacent to the outer periphery of the first opening.

[0015] In one embodiment, the first opening and the second opening are respectively in a rhombus shape when viewed from the first direction, and the first overlapping surface is disposed around the outer periphery of the first opening.

[0016] In one embodiment, the first through opening and the second through opening form a stepped accommodating space, and the capillary structure is accommodated in the stepped accommodating space.

[0017] In one embodiment, the capillary structure is a porous capillary structure formed by filling a metal powder in the stepped accommodation space and then sintering the metal powder.

[0018] In one embodiment, the first mesh plate and the second mesh plate are respectively a copper mesh, the metal powder is a copper powder, and the porosity of the capillary structure is smaller than the porosity of the first mesh plate and the second mesh plate.

[0019] In one embodiment, the first mesh plate is formed by stacking a double-layer mesh plate structure.

[0020] In one embodiment, the stepped mesh plate stacking powder filling structure also includes a third mesh plate, which is stacked on the second mesh plate along the first direction and includes a third opening, wherein the third opening is connected to the inner surface through the second opening and the first opening, and is spatially relative to the second opening and the first opening, wherein the third opening is larger than the second opening when viewed from the first direction, and the top surface of the second mesh plate corresponds to the third opening to form a second overlapping surface, and the second overlapping surface is not covered by the third mesh plate, wherein the capillary structure is arranged in the first opening, the second opening and the third opening, and is connected to the first mesh plate at least through the first overlapping surface, and is connected to the second mesh plate at least through the second overlapping surface.

[0021] To achieve the above-mentioned purpose, the present case further provides a temperature equalizing plate, including an upper cover structure and a lower cover structure. The upper cover structure and the lower cover structure are assembled to form a temperature equalizing plate, wherein the upper cover structure or / and the lower cover structure are a stepped mesh plate stacking powder filling structure, and the stepped mesh plate stacking powder filling structure includes a cover plate, a first mesh plate, a second mesh plate and a capillary structure. The cover plate includes an outer surface and an inner surface arranged opposite to each other. The first mesh plate is stacked on the inner surface along a first direction and includes a first opening. The first opening is connected to the inner surface. The second mesh plate is stacked on the first mesh plate along a first direction and includes a second opening, wherein the second opening is connected to the inner surface through the first opening, relative to the first opening in space, wherein the second opening is larger than the first opening in the visual direction of the first direction, and the top surface of the first mesh plate forms a first overlap surface with respect to the second opening, and the first overlap surface is not covered by the second mesh plate. The capillary structure is arranged in the first opening and the second opening, and is connected to the first mesh plate at least through the first overlap surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to more fully understand the above contents, and are not intended to limit the present invention.

[0023] Figure 1 A three-dimensional diagram showing the structure of a temperature equalizing plate according to an embodiment of the present invention;

[0024] Figure 2 A cross-sectional structural diagram of a temperature homogenizing plate according to an embodiment of the present invention is disclosed;

[0025] Figure 3 reveal Figure 2 Enlarged view of the middle area P;

[0026] Figure 4 A cross-sectional schematic diagram of a stepped screen stacking powder filling structure according to a first embodiment of the present invention is disclosed;

[0027] Figure 5 A top view of a stepped screen stacking powder filling structure according to a first embodiment of the present invention is disclosed;

[0028] FIG. 6A to FIG. 6D The present invention discloses different exemplary embodiments of the stepped stencil stacking powder filling structure including a single-side first overlap surface;

[0029] 7A to 7F Disclose the different demonstration examples of the stepped stencil stacking powder filling structure including the first double-sided overlap surface;

[0030] FIG. 8A to FIG. 8D Disclose the different demonstration examples of the stepped stencil stacking powder filling structure including the first overlap surface of three sides;

[0031] Fig. 9A and Fig. 9B The invention discloses respectively exemplary embodiments of the stepped screen stacking powder filling structure including first overlapping surfaces of different shapes;

[0032] Fig.10 A cross-sectional schematic diagram of a stepped screen stacking powder filling structure according to a second embodiment of the present invention is disclosed;

[0033] Fig.11 A cross-sectional schematic diagram of a stepped screen stacking powder filling structure according to a third embodiment of the present invention is disclosed.

[0034] Description of Figure Numbers:

[0035] 1: Temperature balancing board

[0036] 10, 10a, 10b: Stepped stencil stacking powder filling structure

[0037] 10': Lower cover structure

[0038] 11: Cover

[0039] 111: Outer surface

[0040] 112: Inner surface

[0041] 12: First screen

[0042] 120: First port

[0043] 121: Bottom

[0044] 122: Top

[0045] 12': Heightened mesh panel

[0046] 120': Heightened opening

[0047] 121': bottom surface

[0048] 122': Top

[0049] 13: Second screen

[0050] 130: Second port

[0051] 131: Bottom

[0052] 132: Top

[0053] 14: Capillary structure

[0054] 15: The third screen

[0055] 150: The third port

[0056] 151: Bottom

[0057] 152: Top

[0058] 20: Upper cover structure

[0059] 21: Cover

[0060] 22: Capillary structure

[0061] 23: Support column

[0062] 24: Accommodation cavity

[0063] 9: Heat source

[0064] P: Area

[0065] S1: First lap joint

[0066] S2: Second lap joint

[0067] X, Y, Z: Axis DETAILED DESCRIPTION

[0068] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments, all of which do not depart from the scope of the present invention, and the description and drawings therein are essentially used for illustrative purposes rather than for limiting the present invention. For example, if the following content of the present invention describes that a first feature is set on or above a second feature, it means that it includes an embodiment in which the first feature and the second feature are directly in contact, and also includes an embodiment in which an additional feature can be set between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, different embodiments of the present invention may use repeated reference symbols and / or marks. These repetitions are for the purpose of simplification and clarity, and are not used to limit the relationship between the various embodiments and / or the appearance structure. Furthermore, in order to facilitate the description of the relationship between a component or feature component and another (multiple) component or (multiple) feature component in the drawings, space-related terms such as "inside", "outside", "top surface", "bottom surface" and similar terms may be used. In addition to the orientation shown in the drawings, spatially related terms are used to cover different orientations of the device in use or operation. The device may also be positioned in another manner (e.g., rotated 90 degrees or located in other orientations), and the description of the spatially related terms used may be interpreted accordingly. In addition, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to another component, or there may be an intervening component. In addition, it is understood that although the terms "first", "second", etc. may be used in the application claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are for different components. For example: the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component without departing from the scope of the embodiment. The term "and / or" used in this way includes any or all combinations of one or more related listed items.

[0069] Figure 1 A three-dimensional diagram of the structure of the temperature equalizing plate according to an embodiment of the present invention is disclosed. Figure 2 A cross-sectional structural diagram of a temperature homogenizing plate according to an embodiment of the present invention is disclosed. Figure 3 reveal Figure 2 Magnified view of region P in the middle. Figure 4 A cross-sectional schematic diagram of a stepped screen stacking powder filling structure according to a first embodiment of the present invention is disclosed. Figure 5The top view of the stepped mesh plate stacking powder filling structure of the first embodiment of the present case is disclosed. In this embodiment, the temperature equalizing plate 1 includes an upper cover structure 20 and a lower cover structure 10'. The upper cover structure 20 and the lower cover structure 10' are assembled with each other to form the temperature equalizing plate. In this embodiment, the upper cover structure 20 includes a cover plate 21, a capillary structure 22 and a support column 23. The capillary structure 22 is arranged on the inner surface of the cover plate 21, and the support column 23 is connected to the lower cover structure 10', and forms a receiving cavity 24 to accommodate the working fluid (not shown). It should be noted that in this embodiment, the lower cover structure 10' is a stepped mesh plate stacking powder filling structure 10. In other embodiments, the upper cover structure 20 may also have the same stepped mesh plate stacking powder filling structure 10, so as to correspond to the heat source 9 that needs to be dissipated. This case is not limited to this, and it is explained first. In this embodiment, the stepped mesh plate stacking powder filling structure 10 includes a cover plate 11, a first mesh plate 12, a second mesh plate 13 and a capillary structure 14. The cover plate 11 includes an outer surface 111 and an inner surface 112 arranged opposite to each other. The outer surface 111 is assembled and attached to the heat source 9. The first mesh plate 12 is stacked on the inner surface 112 of the cover plate 11 along the first direction (i.e., the Z-axis direction), the bottom surface 121 of the first mesh plate 12 is attached to the inner surface 112 of the cover plate 11, and the first mesh plate 12 includes a first through-hole 120. The first through-hole 120 is connected to the inner surface 112 of the cover plate 11, relative to the heat source 9 in space. The second mesh plate 13 is stacked on the first mesh plate 12 along the first direction (i.e., the Z-axis direction), the bottom surface 131 of the second mesh plate 13 is attached to the top surface 122 of the first mesh plate 12, the second mesh plate 13 is connected to the accommodating cavity 24 through the top surface 132, and the second mesh plate 13 includes a second opening 130. The second opening 130 is connected to the inner surface 112 of the cover plate 11 through the first opening 120, and is spatially relative to the first opening 120 and the heat source 9. The second opening 130 is larger than the first opening 120 when viewed from the first direction (i.e., the Z-axis direction), and the top surface 122 of the first mesh plate 12 forms a first overlap surface S1 corresponding to the second opening 130, and the first overlap surface S1 is not covered by the second mesh plate 13. The capillary structure 14 is disposed in the first opening 120 and the second opening 130 , connected to the first mesh plate 12 at least through the first overlapping surface S1 , and thermally coupled to the heat source 9 through the inner surface 112 and the outer surface 111 of the cover plate 11 .

[0070] In the present embodiment, the first mesh plate 12 and the capillary structure 14 at least partially overlap in the visual direction of the first direction (i.e., the Z-axis direction). The area of ​​the first opening 120 in the visual direction of the first direction (i.e., the Z-axis direction) is not less than the area of ​​the heat source 9 attached to the outer surface 111 of the cover plate 11. In the present embodiment, the first mesh plate 12 and the second mesh plate 13 are placed on the inner surface 112 of the cover plate 11 along the first direction, for example, and then stacked on the cover plate 11 through a hot pressing process. After the hot pressing process, the first mesh plate 12 and the second mesh plate 13 stacked on the cover plate 11 form a stepped accommodation space through the first opening 120 and the second opening 130, and the capillary structure 14 is accommodated in the stepped accommodation space. It should be noted that in the present embodiment, the capillary structure 14 is a porous capillary structure formed by sintering after filling the stepped accommodation space with a metal powder. In the present embodiment, the first mesh plate 12 and the second mesh plate 13 are respectively a copper mesh, the metal powder is a copper powder, and the porosity of the capillary structure 14 is smaller than the porosity of the first mesh plate 12 and the second mesh plate 13. It is worth noting that when the first mesh plate 12 and the second mesh plate 13 are stacked on the cover plate 11 through a hot pressing process, the first opening 120 of the first mesh plate 12 and the second opening 130 of the second mesh plate 13 increase the opening area vertically from the bottom to the top from the inner surface 112 of the cover plate 11 to form a stepped accommodation space. After the metal powder such as copper powder is filled in the stepped accommodation space, it can be sintered into a porous capillary structure 14 with a porosity smaller than the porosity of the mesh plate, and the porous capillary structure 14 is well connected with the first mesh plate 12 through the horizontal first overlap surface S1. Thus, the first mesh plate 12 and the second mesh plate 13 in the temperature homogenizing plate 1 can smoothly guide the working fluid to flow back to the capillary structure 14 along the horizontal direction (ie, the X-axis direction or the Y-axis direction).

[0071] In this embodiment, the first opening 120 of the first mesh plate 12 and the second opening 130 of the second mesh plate 13 are respectively rectangular or square in the first direction (i.e., the Z-axis direction). The first overlap surface S1 is connected between the periphery of the second opening 130 and the periphery of the first opening 120, and the extension direction (i.e., the XY plane) is perpendicular to the first direction. In this embodiment, the bottom surface 121 of the first mesh plate 12 is attached to the inner surface 112 of the cover plate 11, and the bottom surface 131 of the second mesh plate 13 is attached to the top surface 122 of the first mesh plate 12. The first mesh plate 12 and the second mesh plate 13 are assembled to guide the working fluid to flow back to the capillary structure 14 along a second direction (e.g., the X-axis direction or the Y-axis direction), and the second direction is perpendicular to the first direction.

[0072] It is worth noting that the first opening 120 of the first mesh plate 12 and the second opening 130 of the second mesh plate 13 are rectangular or square in the first direction (i.e., the Z-axis direction). After the first mesh plate 12 and the second mesh plate 13 are stacked, the first overlap surface S1 formed surrounds the four edges of the first opening 120 (e.g., Figure 5 In other embodiments, the position of the first opening 120 corresponding to the second opening 130 can be adjusted according to actual application requirements, so that the first mesh plate 12 and the second mesh plate 13 can maintain sufficient support strength to complete the stacking through the hot pressing process. In one embodiment, the first overlap surface S1 of the stepped mesh plate stacking powder filling structure 10 is only adjacent to a single side of the square first opening 120, such as FIG. 6A to FIG. 6D In one embodiment, the first overlapping surface S1 of the stepped mesh plate stacking powder filling structure 10 is adjacent to two opposite sides of the square first opening 120 (such as Fig. 7A and Figure 7B ), or two connected edges (as shown FIG. 7C to FIG. 7F In another embodiment, the first overlapping surface S1 of the stepped mesh plate stacking powder filling structure 10 can be adjacent to the three connected edges of the square first opening 120, such as FIG. 8A to FIG. 8D In another embodiment, the first opening 120 of the first mesh plate 12 and the second opening 130 of the second mesh plate 13 are respectively in a rhombus shape when viewed in the first direction (i.e., the Z-axis direction), and the first overlap surface S1 is in a rhombus ring, which is arranged around the outer periphery of the first opening 120, as shown in FIG. Fig. 9A In another embodiment, the first opening 120 of the first mesh plate 12 and the second opening 130 of the second mesh plate 13 are respectively circular in the first direction (i.e., the Z-axis direction), and the first overlapping surface S1 is a circular ring, and the outer periphery of the first opening 120 is adjacent to the first opening 120. Fig. 9B As shown. As can be seen from the above, in order to form a stepped accommodation space filled with metal powder and sintered, corresponding to the position of the heat source 9, the first mesh plate 12 and the second mesh plate 13 are stacked from the inner surface 112 of the cover plate 11 from bottom to top and the opening area is increased. The shape of the first opening 120 and the second opening 130 is, for example but not limited to, rectangular, circular or diamond-shaped. The number of first overlapping surfaces S1 can be adjusted according to actual application requirements, and can be adjacent to part or all of the periphery of the corresponding first opening 120. Therefore, the first mesh plate 12 and the second mesh plate 13 can be stacked in multiple variations to form a stepped accommodation space with sufficient first overlapping surfaces S1 in different areas of the cover plate 11 for powder filling stacking and sintering, effectively improving the problem of water return circuit interruption of the working fluid caused by the different shrinkage ratios of the mesh plate and the metal powder sintering, thereby greatly improving the efficiency of the working fluid reflux inside the temperature equalizing plate 1, and improving the overall performance surface of the temperature equalizing plate 1. Of course, the present case is not limited to this. Fig.10 The cross-sectional view of the stepped screen stacking powder filling structure of the second embodiment of the present invention is disclosed. In this embodiment, the stepped screen stacking powder filling structure 10a and Figures 3 to 5The stepped mesh plate stacking powder filling structure 10 shown is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In the present embodiment, the stepped mesh plate stacking powder filling structure 10a further includes an increased mesh plate 12', which is arranged between the first mesh plate 12 and the second mesh plate 13. The size and shape of the increased mesh plate 12' are, for example, the same as those of the first mesh plate 12. The bottom surface 121' of the increased mesh plate 12' is attached to the top surface 122 of the first mesh plate 12, and the bottom surface 131 of the second mesh plate 13 is attached to the top surface 122' of the increased mesh plate 12'. The second opening 130 is connected to the inner surface 112 of the cover plate 11 through the increased opening 120' and the first opening 120. The second opening 130 is larger than the heightened opening 120' and the first opening 120 when viewed from the first direction (i.e., the Z-axis direction), and the top surface 122' of the heightened mesh plate 12' forms a first overlap surface S1 corresponding to the second opening 130, and the first overlap surface S1 is not covered by the second mesh plate 13. The capillary structure 14 is disposed in the first opening 120, the heightened opening 120', and the second opening 130, and is connected to the heightened mesh plate 12' at least through the first overlap surface S1. Thus, the stepped accommodation space is filled with metal powder and then forms the capillary structure 14, which can also effectively improve the problem of water return circuit breakage of the working fluid caused by the different sintering shrinkage ratios of the mesh plate and the metal powder, and enhance the heat dissipation capacity of the product. In other words, the stacking height of the first mesh plate 12 and the second mesh plate 13 can be adjusted according to application requirements. For example, the first mesh plate 12 is formed by stacking a double-layer mesh plate structure. The stepped accommodation space formed by the first mesh plate 12 and the second mesh plate 13 can solve the problem of water return circuit breakage of the working fluid caused by the different sintering shrinkage ratios of the mesh plate and the metal powder. Of course, the present case is not limited to this.

[0073] Fig.11 The cross-sectional view of the stepped screen stacking powder filling structure of the third embodiment of the present invention is disclosed. In this embodiment, the stepped screen stacking powder filling structure 10b and Figures 3 to 5 The stepped mesh plate stacking powder filling structure 10 is similar to the structure 10 shown, and the same element numbers represent the same elements, structures and functions, which will not be repeated here. In this embodiment, the stepped mesh plate stacking powder filling structure 10b further includes a third mesh plate 15, which is stacked on the top surface 132 of the second mesh plate 13 along the first direction (i.e., the Z-axis direction), and the bottom surface 151 of the third mesh plate 15 is attached to the top surface 132 of the second mesh plate 13, and the third mesh plate 15 is connected to the accommodating cavity 24 through the top surface 152 (see Figure 3). The third mesh plate 15 includes a third opening 150. The third opening 150 is connected to the inner surface 112 of the cover plate 11 through the second opening 130 and the first opening 120, and is spatially relative to the second opening 130, the first opening 120 and the heat source 9. The third opening 150 is larger than the second opening 130 in the first direction (i.e., the Z-axis direction), and the second opening 130 is larger than the first opening 120. As a result, the top surface 122 of the first mesh plate 12 forms a first overlapping surface S1 corresponding to the second opening 130, and the first overlapping surface S1 is not covered by the second mesh plate 13, and the top surface 132 of the second mesh plate 13 forms a second overlapping surface S2 corresponding to the third opening 150, and the second overlapping surface S2 is not covered by the third mesh plate 15. In the present embodiment, the capillary structure 14 is disposed in the first opening 120, the second opening 130 and the third opening 150, and is connected to the first mesh plate 12 at least through the first overlap surface S1, and is connected to the second mesh plate 13 at least through the second overlap surface S2, and is thermally coupled to the heat source 9 through the inner surface 112 and the outer surface 111 of the cover plate 11. In other embodiments, the number of the first mesh plate 12, the second mesh plate 13 and the third mesh plate 15 can be adjusted according to the actual application requirements to form a stepped mesh plate stacking powder filling structure 10b with different step numbers, so as to solve the problem of water return circuit of the working fluid caused by the different sintering shrinkage ratios of the mesh plate and the metal powder, thereby improving the efficiency of the working fluid flowing back from the first mesh plate 12, the second mesh plate 13 and the third mesh plate 15 to the capillary structure 14.

[0074] Taking the traditional temperature equalizer without a stepped mesh plate stacking powder structure as an example, its heat dissipation performance can maintain the temperature of the heat source at about 85°C to 90°C. However, using the temperature equalizer 1 with a stepped mesh plate stacking powder filling structure 10 in this case, its heat dissipation performance can reduce the temperature of the heat source to 75°C. Obviously, the temperature equalizer 1 in this case can greatly reduce the temperature of the heat source by utilizing the stepped mesh plate stacking powder filling structure 10, thereby improving the performance of the temperature equalizer 1. Of course, the size and position of the first opening 120, the second opening 130, and the third opening 150 can be adjusted according to the actual heat dissipation requirements of the heat source 9, or a double-sided heat dissipation temperature equalizer can be formed. This case is not limited to this and will not be repeated.

[0075] In summary, the present invention provides a stepped mesh plate stacking powder filling structure and a temperature equalizing plate applicable thereto. The stepped accommodation space formed by stacking the mesh plates is filled with metal powder and then sintered into a porous capillary structure, which effectively improves the problem of water return circuit interruption of the working fluid caused by the different sintering shrinkage ratios of the mesh plates and the metal powder, thereby greatly improving the heat dissipation capacity of the product. The temperature equalizing plate is assembled by pairing an upper cover structure and a lower cover structure with each other. The stepped mesh plate stacking powder filling structure corresponds to a heat source and can be constructed on the upper cover structure or / and the lower cover structure. When a plurality of mesh plates are stacked on the cover plate through a hot pressing process, the opening of each mesh plate increases the opening area vertically from the bottom to the top from the inner surface of the cover plate to form a stepped accommodation space. After metal powder such as copper powder is filled in the stepped accommodation space, it can be sintered into a porous capillary structure with a porosity less than that of the mesh plate, and the porous capillary structure forms a good connection with the mesh plate through the horizontal first overlap surface. As a result, the mesh plate inside the temperature equalizer can smoothly guide the working fluid to flow back to the capillary structure in the horizontal direction. In order to form a stepped accommodation space to fill the metal powder for sintering, corresponding to the heat source position, multiple mesh plates are stacked from the inner surface of the cover plate from bottom to top and the opening area is increased. The shape of the opening is, for example, but not limited to, rectangular, circular or diamond-shaped. The number of first overlapping surfaces can be adjusted according to the actual application requirements, and can be adjacent to part or all of the periphery of the corresponding opening. As a result, multiple mesh plates can be stacked in a variety of ways to form a stepped accommodation space with sufficient first overlapping surfaces in different areas of the cover plate for powder filling, stacking and sintering, effectively improving the working fluid return water circuit breaker problem caused by the different sintering shrinkage ratios of the mesh plate and the metal powder, thereby greatly improving the efficiency of the working fluid reflux inside the temperature equalizer and improving the overall performance surface of the temperature equalizer.

[0076] The present invention can be modified in various ways by those skilled in the art, but all of them are within the scope of the protection sought by the attached claims.

Claims

1. A stepped screen stacking powder filling structure, characterized in that: include: A cover plate, comprising an outer surface and an inner surface disposed opposite to each other; A first mesh plate is stacked on the inner surface along a first direction and comprises a first through opening, wherein the first through opening is connected to the inner surface; A second mesh plate is stacked on the first mesh plate along the first direction and comprises a second opening, wherein the second opening is connected to the inner surface through the first opening and is spatially relative to the first opening, wherein the second opening is larger than the first opening when viewed from the first direction, and a top surface of the first mesh plate corresponds to the second opening to form a first overlapping surface, and the first overlapping surface is not covered by the second mesh plate; as well as The capillary structure is disposed in the first opening and the second opening, and is connected to the first mesh plate at least through the first overlapping surface.

2. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The first mesh plate and the capillary structure at least partially overlap in a viewing direction of the first direction.

3. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The outer surface of the cover plate is attached to the heat source, and the area of ​​the first opening when viewed from the first direction is not less than the area of ​​the heat source.

4. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The first mesh plate and the second mesh plate are stacked on the cover plate through a hot pressing process.

5. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The bottom surface of the first mesh plate is attached to the inner surface of the cover plate, and the bottom surface of the second mesh plate is attached to the top surface of the first mesh plate, wherein the first mesh plate and the second mesh plate are assembled to guide the working fluid to flow back to the capillary structure along a second direction, and the second direction is perpendicular to the first direction.

6. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The first overlapping surface is connected between the periphery of the second opening and the periphery of the first opening, and the extending direction of the first overlapping surface is perpendicular to the first direction.

7. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The first opening and the second opening are respectively rectangular in shape when viewed from the first direction, and the first overlapping surface is adjacent to a single side, two connected sides, two opposite sides or three connected sides of the first opening.

8. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The first opening and the second opening are respectively circular in shape when viewed from the first direction, and the first overlapping surface is adjacent to an outer periphery of the first opening.

9. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The first opening and the second opening are respectively in a rhombus shape when viewed from the first direction, and the first overlapping surface is arranged around the outer periphery of the first opening.

10. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The first through opening and the second through opening form a stepped accommodating space, and the capillary structure is accommodated in the stepped accommodating space.

11. The stepped screen stacking powder filling structure according to claim 10, characterized in that: The capillary structure is a porous capillary structure formed by filling the stepped accommodation space with metal powder and then sintering the metal powder.

12. The stepped screen stacking powder filling structure according to claim 11, characterized in that: The first mesh plate and the second mesh plate are copper meshes respectively, the metal powder is copper powder, and the porosity of the capillary structure is smaller than the porosity of the first mesh plate and the second mesh plate.

13. The stepped screen stacking powder filling structure according to claim 1, characterized in that: The first mesh plate is formed by stacking a double-layer mesh plate structure.

14. The stepped screen stacking powder filling structure according to claim 1, characterized in that: It also includes a third mesh plate, which is stacked on the second mesh plate along the first direction and includes a third opening, wherein the third opening is connected to the inner surface through the second opening and the first opening, and is spatially relative to the second opening and the first opening, wherein the third opening is larger than the second opening when viewed from the first direction, and the top surface of the second mesh plate corresponds to the third opening to form a second overlapping surface, and the second overlapping surface is not covered by the third mesh plate, wherein the capillary structure is arranged in the first opening, the second opening and the third opening, and is connected to the first mesh plate at least through the first overlapping surface, and is connected to the second mesh plate at least through the second overlapping surface.

15. A temperature equalizing plate, characterized in that: include: The upper cover structure and the lower cover structure are assembled together to form the temperature homogenizing plate, wherein the upper cover structure and / or the lower cover structure are a stepped mesh plate stacking powder filling structure, and the stepped mesh plate stacking powder filling structure comprises: A cover plate, comprising an outer surface and an inner surface disposed opposite to each other; A first mesh plate is stacked on the inner surface along a first direction and comprises a first through opening, wherein the first through opening is connected to the inner surface; A second mesh plate is stacked on the first mesh plate along the first direction and comprises a second opening, wherein the second opening is connected to the inner surface through the first opening, and is spatially relative to the first opening, wherein the second opening is larger than the first opening when viewed from the first direction, and a top surface of the first mesh plate corresponds to the second opening to form a first overlapping surface, and the first overlapping surface is not covered by the second mesh plate; and The capillary structure is disposed in the first opening and the second opening, and is connected to the first mesh plate at least through the first overlapping surface.

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