Surface-mounted diode test equipment convenient to disassemble and assemble

By designing a combined structure of split current test board and test components, the complex disassembly and assembly of existing test equipment when replacing test pieces at different spacings is solved, and the rapid disassembly and replacement of test components is realized, and the maintenance and maintenance of equipment is simplified. process.

CN222462828UActive Publication Date: 2025-02-11FOSHAN JIALIMEI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202420546624.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-20
Publication Date
2025-02-11
Estimated Expiration
2034-03-20

AI Technical Summary

Technical Problem

When replacing test pieces of different spacings, the entire test support base and re-weld the power cord, the existing plastic sealing diode rear-channel packaging test equipment needs to be removed and the power cord is re-welded, resulting in complex disassembly and assembly.

Method used

A patch diode testing equipment that is easy to disassemble and assemble is designed, using a combined structure of a split current test board and a test assembly. The test assembly can be disassembled and replaced separately without disassembling the current test board and re-welding the power cord.

Benefits of technology

The rapid disassembly and replacement of test components is achieved, complex welding operations are avoided, and the equipment maintenance and repair process is simplified.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a patch diode test device convenient to disassemble and assemble, the top end face of a test base is fixedly provided with a current test board, the position of the top end face of the test base close to the front end of the test base is provided with a positioning groove, and a first test assembly and a second test assembly are arranged in the positioning groove of the test base. The first test assembly and the second test assembly are respectively connected with pins at two sides of the diode and are used for electrically testing the diode, the mounting grooves are convenient for positioning and mounting the test assemblies, the current test board is assembled with the first test assembly and the second test assembly in a split manner, and when the distances between the pins of the diodes in different batches are different and the test assemblies in different specifications need to be disassembled and replaced, the test assemblies can be disassembled and replaced. The current test board and the power connector do not need to be dismounted, and dismounting is more convenient.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging testing, in particular to a chip diode testing device which is easy to assemble and disassemble. Background Art

[0002] At present, with the continuous development of semiconductor technology, the market demand for plastic-encapsulated chip diodes is gradually increasing. The last process of plastic-encapsulated chip diode production is the back-end packaging test. The back-end packaging test of existing plastic-encapsulated chip diodes requires packaging after testing.

[0003] In the patent application document with application number 201010555597.8, a back-end packaging test device for plastic-sealed SMD diodes is disclosed, wherein the test device includes a test support seat, an insulating seat, a guide cover for guiding the workpiece, and four test pieces for testing the electrical properties of the workpiece, wherein the test support seat is fixed on the main base, the insulating seat is fixed on the upper end of the test support seat, the guide cover and the four test pieces are all fixed on the insulating seat, and the four test pieces are all arranged at both ends of the guide cover;

[0004] When the workpiece enters the testing device, the workpiece first enters the guide cover as the lifting plate descends, and is guided by the guide cover and contacts the four test pieces. The electrical performance of the workpiece is tested through the four test pieces. The structure of the testing device in the application document is relatively complex. The power cord is directly connected to the test piece and fixed on the test piece by soldering. When replacing the test piece with different spacing, the test piece support seat needs to be completely removed and replaced, and the power cord needs to be re-soldered and connected, which makes the disassembly and assembly relatively complicated. Utility Model Content

[0005] In view of the technical defects existing in the background technology, the utility model proposes a patch diode testing device that is easy to disassemble and assemble, which solves the above technical problems and meets the actual needs. The specific technical solution is as follows:

[0006] A patch diode testing device that is easy to disassemble and assemble comprises a device base, a test base is provided at the top of the device base, a current test board is fixedly provided at the top end face of the test base, a positioning groove is provided at the top end face of the test base near the front end of the test base, a test assembly is provided in the positioning groove, including a first test assembly and a second test assembly, a positioning opening is provided at the front end of the current test board corresponding to the position of the positioning groove, a power supply assembly is provided at the rear end of the current test board, the power supply assembly is electrically connected to the test assembly via the current test board, and both the current test board and the test assembly are provided with positioning holes that penetrate along the thickness direction thereof.

[0007] As an improvement of the above scheme, a first terminal is provided on the side of the current testing board corresponding to the position of the first test component, and a second terminal is provided on the side corresponding to the position of the second test component. The first test component and the second test component are symmetrically arranged along the central axis of the positioning groove and are respectively connected to the first terminal and the second terminal.

[0008] As an improvement of the above solution, the first test assembly includes a first insulating block and a plurality of first pins extending along the thickness direction of the first insulating block, and the rear ends of the first pins are in contact with the end surface of the current test board.

[0009] As an improvement of the above solution, the second test assembly includes a second insulating block and a plurality of second pins extending along the thickness direction of the second insulating block, and the rear ends of the second pins are in contact with the end surface of the current test board.

[0010] As an improvement of the above scheme, a first positioning hole is provided along the thickness direction of the current testing plate, and a plurality of first screw holes are provided along the thickness direction of the testing base at positions corresponding to the first positioning holes. A first screw is provided in the first screw hole, and the first screw passes through the first positioning hole and is fixed to the second screw hole.

[0011] As an improvement of the above scheme, a second positioning hole is provided along the thickness direction of the first insulating block, a second screw hole is provided at the bottom of the positioning groove corresponding to the lower part of the first insulating block, a second screw is provided in the second screw hole, and the second screw passes through the second positioning hole and is fixed to the second screw hole.

[0012] As an improvement of the above scheme, a third positioning hole is provided along the thickness direction of the second insulating block, a third screw hole is provided at the bottom of the positioning groove corresponding to the lower part of the second insulating block, a third screw is provided in the third screw hole, and the third screw passes through the third positioning hole and is fixed to the third screw hole.

[0013] The utility model has the beneficial effects that: the rear end of the current test board is connected to the power supply and is fixed to the test base by a first screw; the first test component and the second test component are arranged in a positioning groove in the test base and are respectively connected to the pins on both sides of the diode to perform an electrical test on the diode; the installation groove facilitates the positioning and installation of the test components; the current test board is assembled separately from the first test component and the second test component; when the spacing between the pins of different batches of diodes is different and test components of different specifications need to be disassembled and replaced, there is no need to disassemble the current test board and re-solder the power supply connector, and disassembly and assembly are more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0015] Figure 2 It is an exploded schematic diagram of the test base, current test board and test assembly structure of the utility model.

[0016] Figure 3 This is a schematic diagram of the test base and test assembly structure of the utility model.

[0017] Figure 4 This is a schematic diagram of the structure of the current test board and the test assembly of the utility model.

[0018] Among them: device base 1, test base 2, first screw hole 201, first screw 202, current test board 3, positioning opening 301, first terminal 302, second terminal 303, first positioning hole 304, positioning groove 4, second screw hole 401, third screw hole 402, second screw 403, third screw 404, first test component 5, first insulating block 501, first pin 502, second positioning hole 503, second test component 6, second insulating block 601, second pin 602, third positioning hole 603, power supply component 7. DETAILED DESCRIPTION

[0019] The implementation methods of the present invention are described below in conjunction with the accompanying drawings and relevant embodiments. The implementation methods of the present invention are not limited to the following embodiments, and the present invention involves relevant necessary components in this technical field, which should be regarded as common knowledge in this technical field and can be known and mastered by technical personnel in this technical field.

[0020] like Figures 1 to 4 As shown, a patch diode testing device that is easy to disassemble and assemble includes a device base 1, a test base 2 is provided on the top of the device base 1, a current test board 3 is fixedly provided on the top end face of the test base 2, a positioning groove 4 is provided on the top end face of the test base 2 near the front end of the test base 2, a test component is provided in the positioning groove 4, including a first test component 5 and a second test component 6, a positioning opening 301 is provided at the front end of the current test board 3 corresponding to the position of the positioning groove 4, a power supply component 7 is provided at the rear end of the current test board 3, the power supply component 7 is electrically connected to the test component through the current test board 3, and the current test board 3 and the test component are both provided with positioning holes passing through along the thickness direction thereof.

[0021] like Figure 2As shown, in the structure of the utility model, the top end surface of the test base 2 is fitted with a current test board 3, the rear end of the current test board 3 is provided with a power supply component 7 connected to a power supply, and a positioning groove 4 is provided near the front end of the test base 2, and the positioning groove 4 is used to position and place the first test component 5 and the second test component 6, and the ends of the first test component 5 and the second test component 6 facing each other are connected to the pins of the diode, and the ends facing away from each other are connected to the current test board 3, and the diode to be tested is placed between the first test component 5 and the second test component 6 to measure whether it meets the production standards;

[0022] like Figure 2 and Figure 3 As shown, it should be noted that, the current test board 3 and the test base 2 are screwed and fixed by the first screw 202, the first test component 5 and the test base 2 are screwed and fixed by the second screw 403, and the second test component 6 and the test base 2 are screwed and fixed by the third screw 404. Compared with the traditional test component in which the power cord is directly welded on the test piece and connected to the pin of the diode for testing, the first test component 5 and the second test component 6 can be disassembled and replaced separately without disassembling the current test board 3 and re-welding the power cord, and it is more convenient to replace test components of different specifications.

[0023] like Figure 2 and Figure 4 As shown, further, in the above scheme, a first terminal 302 is provided on the side of the current testing board 3 corresponding to the position of the first test component 5, and a second terminal 303 is provided on the side corresponding to the position of the second test component 6. The first test component 5 and the second test component 6 are symmetrically arranged along the central axis of the positioning groove 4, and are respectively connected to the first terminal 302 and the second terminal 303. The connection state between the first test component 5 and the first terminal 302 can be changed to be separated or connected by screwing the first screw 202. Similarly, the connection state between the second test component 6 and the second terminal 303 can be changed to be separated or connected by screwing the second screw 403.

[0024] like Figure 2 , Figure 3 and Figure 4 As shown, further, in the above scheme, the first test component 5 includes a first insulating block 501 and a plurality of first pins 502 passing through the thickness direction of the first insulating block 501, and the rear end of the first pin 502 is in contact with the end surface of the current test board 3.

[0025] Furthermore, in the above solution, the second test assembly 6 includes a second insulating block 601 and a plurality of second pins 602 extending along the thickness direction of the second insulating block 601 , and the rear ends of the second pins 602 are in contact with the end surface of the current test board 3 .

[0026] like Figure 4 As shown, it should be noted that, in use, the first pin 502 in the first test component 5 matches and fits with the first terminal 302 on the current test board 3, and the second pin 602 in the second test component 6 matches and fits with the second terminal 303 on the current test board 3. When the pins at both ends of the diode to be tested are respectively fitted with the first pin 502 and the second pin 602, the quality of the diode can be quickly detected to determine whether it meets the production standards.

[0027] Furthermore, in the above scheme, a first positioning hole 304 is penetrated along the thickness direction of the current testing plate 3, and a plurality of first screw holes 201 are penetrated at positions corresponding to the first positioning hole 304 along the thickness direction of the testing base 2, and a first screw 202 is disposed in the first screw hole 201, and the first screw 202 passes through the first positioning hole 304 and is fixed to the second screw hole 401.

[0028] Furthermore, in the above scheme, a second positioning hole 503 is provided along the thickness direction of the first insulating block 501, and a second screw hole 401 is provided at the bottom of the positioning groove 4 corresponding to the lower part of the first insulating block 501, and a second screw 403 is provided in the second screw hole 401, and the second screw 403 passes through the second positioning hole 503 and is fixed to the second screw hole 401.

[0029] Furthermore, in the above scheme, a third positioning hole 603 is provided along the thickness direction of the second insulating block 601, and a third screw hole 402 is provided at the bottom of the positioning groove 4 corresponding to the lower part of the second insulating block 601, and a third screw 404 is provided in the third screw hole 402, and the third screw 404 passes through the third positioning hole 603 and is fixed to the third screw hole 402.

[0030] like Figure 2 , Figure 3 and Figure 4 As shown, it should be noted that during installation, after the test base 2 is fixed to the device base 1, the positioning opening 301 on the current test board 3 is aligned with the positioning groove 4, the first through hole is aligned with the first screw hole 201, and the first screw 202 is screwed to fix the current test board 3 on the test base 2;

[0031] After the installation of the current test board 3 is completed, the first test component 5 and the second test component 6 are placed in the positioning groove 4, and the pin of the first test component 5 is aligned with the first terminal 302, and the second through hole is aligned with the second screw hole 401, and the second screw 403 is screwed to fix the first test component 5; the pin of the second test component 6 is aligned with the second terminal 303, and the third through hole is aligned with the third screw hole 402, and the second test component 6 is screwed to fix the third screw 404. The power cord and the test component are connected through the current test board 3, and there is no need to connect the power cord and the test component through soldering, which is convenient for quick disassembly and replacement of the test component.

[0032] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A chip diode testing device that is easy to disassemble and assemble, characterized in that: The invention comprises a device base (1), wherein a test base (2) is provided at the top of the device base (1), a current test board (3) is fixedly provided at the top end surface of the test base (2), a positioning groove (4) is provided at the top end surface of the test base (2) near the front end of the test base (2), a test assembly is provided in the positioning groove (4), including a first test assembly (5) and a second test assembly (6), a positioning opening (301) is provided at the front end of the current test board (3) corresponding to the position of the positioning groove (4), a power supply assembly (7) is provided at the rear end of the current test board (3), the power supply assembly (7) is electrically connected to the test assembly via the current test board (3), and both the current test board (3) and the test assembly are provided with positioning holes penetrating along the thickness direction thereof.

2. The chip diode testing device that is easy to disassemble and assemble according to claim 1 is characterized in that: A first wiring terminal (302) is provided on a side of the current test board (3) corresponding to the position of the first test component (5), and a second wiring terminal (303) is provided on a side corresponding to the position of the second test component (6); the first test component (5) and the second test component (6) are symmetrically arranged along the central axis of the positioning groove (4), and are respectively connected to the first wiring terminal (302) and the second wiring terminal (303).

3. The chip diode testing device that is easy to disassemble and assemble according to claim 1 is characterized in that: The first test assembly (5) comprises a first insulating block (501) and a plurality of first pins (502) extending along the thickness direction of the first insulating block (501), wherein the rear ends of the first pins (502) are in contact with the end surface of the current test board (3).

4. The chip diode testing device that is easy to assemble and disassemble according to claim 1 is characterized in that: The second test assembly (6) comprises a second insulating block (601) and a plurality of second pins (602) extending through the thickness direction of the second insulating block (601), wherein the rear ends of the second pins (602) are in contact with the end surface of the current test board (3).

5. The chip diode testing device that is easy to assemble and disassemble according to claim 1 is characterized in that: A first positioning hole (304) is provided along the thickness direction of the current test plate (3), and a plurality of first screw holes (201) are provided at positions corresponding to the first positioning holes (304) along the thickness direction of the test base (2). A first screw (202) is provided in the first screw hole (201), and the first screw (202) passes through the first positioning hole (304) and is fixed to the second screw hole (401).

6. The chip diode testing device that is easy to assemble and disassemble according to claim 3 is characterized in that: A second positioning hole (503) is provided along the thickness direction of the first insulating block (501); a second screw hole (401) is provided at the bottom of the positioning groove (4) corresponding to the lower part of the first insulating block (501); a second screw (403) is provided in the second screw hole (401); the second screw (403) passes through the second positioning hole (503) and is fixed to the second screw hole (401).

7. The chip diode testing device that is easy to assemble and disassemble according to claim 4 is characterized in that: A third positioning hole (603) is provided along the thickness direction of the second insulating block (601); a third screw hole (402) is provided at the bottom of the positioning groove (4) corresponding to the lower part of the second insulating block (601); a third screw (404) is provided in the third screw hole (402); the third screw (404) passes through the third positioning hole (603) and is fixed to the third screw hole (402).

Citation Information

Patent Citations

  • Post-packaging test equipment for plastic package surface mounted devices diode

    CN102060116B