Wafer bearing disc and wafer bearing device

Abstract

The utility model discloses a wafer bearing disc and a wafer bearing device, which are applied to the field of wafer bearing, and the wafer bearing disc comprises a wafer bearing disc main body; a plurality of wafer bearing grooves are formed in the wafer bearing disc main body; the plurality of wafer bearing grooves are sequentially arranged along a preset direction, and the sizes among the plurality of wafer bearing grooves are reduced along the preset direction; the bottom surfaces of the plurality of wafer bearing grooves form a step-shaped structure, and the surface of the wafer bearing disc main body exposes all bottom surfaces of the wafer bearing grooves of all sizes; the bottom surface of each wafer bearing groove is used as a bottom surface for bearing a wafer with a corresponding size; the preset direction is the surface, provided with the plurality of wafer bearing grooves, of the wafer bearing disc main body and points to the direction of the interior of the wafer bearing disc main body, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer bearing grooves. According to the utility model, the wafer bearing grooves with multiple sizes are arranged in the wafer bearing disc main body, so that one wafer bearing disc can be adapted to wafers with multiple sizes.

Description

Technical Field

[0001] The utility model relates to the field of wafer bearing, in particular to a wafer bearing plate and a wafer bearing device. Background Art

[0002] In the field of semiconductor preparation, wafers need to be processed in a variety of ways to complete chip preparation. When processing and transferring wafers, the wafers need to be placed on wafer carriers for transfer. However, existing single-piece wafer carriers are only suitable for wafers of a single size. Under conditions where wafer sizes vary, multiple wafer carriers need to be used for carrying operations, which increases processing costs. Utility Model Content

[0003] In view of this, the purpose of the present invention is to provide a wafer carrier and a wafer carrier device, which solves the problem in the prior art that when the wafer sizes vary, a variety of wafer carriers need to be used for carrying.

[0004] In order to solve the above technical problems, the utility model provides a wafer carrier plate, comprising a wafer carrier plate main body;

[0005] The wafer carrying plate body is provided with a plurality of wafer carrying grooves;

[0006] The plurality of wafer carrying grooves are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrying grooves decrease along the preset direction;

[0007] The bottom surfaces of the plurality of wafer carrying grooves form a stepped structure, and the surface of the wafer carrying plate body exposes the entire bottom surfaces of the wafer carrying grooves of all sizes; the bottom surface of each wafer carrying groove serves as the bottom surface for carrying wafers of corresponding sizes;

[0008] The preset direction is a direction pointing from a surface of the wafer carrier plate body on which the plurality of wafer carrier grooves are opened to the inside of the wafer carrier plate body, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrier grooves.

[0009] Optionally, the centers of the multiple wafer carrying grooves coincide along the preset direction.

[0010] Optionally, the dimensions between the plurality of wafer carrying grooves decrease arbitrarily along the preset direction.

[0011] Optionally, the sizes of the plurality of wafer carrying grooves decrease in equal steps from 12 inches to 2 inches along the preset direction.

[0012] Optionally, the side wall of each wafer carrying groove is perpendicular to the bottom surface of the wafer carrying groove.

[0013] Optionally, the height of the side wall of each wafer carrying groove is greater than or equal to half the thickness of the wafer to be carried.

[0014] Optionally, at least one notch is formed on the edge of each wafer carrying groove.

[0015] Optionally, the notch is an arc-shaped notch.

[0016] Optionally, a chamfer structure is provided at a top corner of the side wall of each wafer carrying groove.

[0017] Optionally, the chamfered structure is an arc-shaped chamfered structure.

[0018] The utility model also provides a wafer carrying device, comprising:

[0019] A wafer carrier substrate, and a plurality of wafer carrier plates as described above;

[0020] A plurality of wafer carrying plates are distributed on the surface of the wafer carrying device base.

[0021] It can be seen that the wafer carrier provided by the utility model includes a wafer carrier plate body, a plurality of wafer bearing grooves are provided in the wafer carrier plate body, the plurality of wafer bearing grooves are arranged in sequence along a preset direction, and the size between the plurality of wafer bearing grooves decreases along the preset direction, the bottom surfaces of the plurality of wafer bearing grooves form a stepped structure, and the surface of the wafer carrier plate body exposes the entire bottom surfaces of the wafer bearing grooves of all sizes, the bottom surface of each wafer bearing groove is used as the bottom surface for carrying wafers of corresponding sizes, the preset direction is the surface of the wafer carrier plate body in which the plurality of wafer bearing grooves are provided, pointing to the direction inside the wafer carrier plate body, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer bearing grooves. By arranging wafer bearing grooves of multiple sizes in the wafer carrier plate body, the utility model can use one wafer carrier plate to adapt to wafers of multiple sizes when transferring and performing corresponding operations on the wafer, thereby expanding the application scenarios of a wafer carrier plate and reducing the cost of carrying a single wafer.

[0022] In addition, the utility model also provides a wafer carrying device, which also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0024] Figure 1 A schematic structural diagram of a wafer carrier provided in an embodiment of the utility model;

[0025] Figure 2 A schematic diagram of a top view of a wafer carrier provided in an embodiment of the utility model;

[0026] Figure 3 A schematic cross-sectional structure diagram of a wafer carrier provided in an embodiment of the utility model;

[0027] Figure 4 A schematic diagram of a top view of another wafer carrier provided in an embodiment of the utility model;

[0028] Figure 5 A schematic cross-sectional structure diagram of another wafer carrier provided in an embodiment of the utility model;

[0029] Figures 1 to 5 In the figure, the reference numerals are described as follows:

[0030] 10-wafer carrying plate body, 11-wafer carrying groove, 12-arc-shaped notch, 13-arc-shaped chamfer structure. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Example 1

[0033] Please refer to Figure 1 , Figure 1 A schematic diagram of the structure of a wafer carrier provided by an embodiment of the utility model. The wafer carrier may include a wafer carrier body 10;

[0034] A plurality of wafer carrying grooves 11 are provided in the wafer carrying plate body 10;

[0035] The plurality of wafer carrying grooves 11 are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrying grooves 11 decrease along the preset direction;

[0036] The bottom surfaces of the plurality of wafer carrying grooves 11 form a stepped structure, and the surface of the wafer carrying plate body 10 exposes the entire bottom surfaces of the wafer carrying grooves 11 of all sizes; the bottom surface of each wafer carrying groove 11 serves as the bottom surface for carrying wafers of corresponding sizes;

[0037] The preset direction is a direction from a surface of the wafer carrier plate body 10 where the plurality of wafer carrier grooves 11 are formed, pointing to the interior of the wafer carrier plate body 10 , and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrier grooves 11 .

[0038] In this embodiment, among the multiple wafer-carrying grooves 11 opened in the wafer-carrying plate main body 10, the wafer-carrying groove 11 with a small size is arranged at the lower side of the wafer-carrying groove 11 with a large size, and among the two wafer-carrying grooves 11 at adjacent positions, the wafer-carrying groove 11 located at the lower side is opened at the bottom surface of the wafer-carrying groove 11 located at the upper side, that is, the wafer-carrying groove 11 with a smaller size is opened at a part of the bottom surface of the wafer-carrying groove 11 located at the upper side, and the unopened area at the bottom surface of the wafer-carrying groove 11 located at the upper side is used as the bottom surface for carrying the wafer, and the bottom surface and side walls of the multiple wafer-carrying grooves 11 form a stepped structure in the wafer-carrying plate main body 10. In this embodiment, by further opening a wafer-carrying groove 11 with a smaller size at the bottom surface of the wafer-carrying groove 11 with a larger size, and performing the above operation cyclically, and the entire bottom surface of each wafer-carrying groove 11 is completely exposed to the surface of the wafer-carrying plate main body 10, it is ensured that wafers of different sizes can be placed in the corresponding wafer-carrying groove 11, and the wafer can be limited.

[0039] The present embodiment does not limit the specific number of wafer carrying grooves 11 opened in the wafer carrying plate main body 10, and the number of wafer carrying grooves 11 opened can be greater than two. The present embodiment does not limit the specific positions of the multiple wafer carrying grooves 11, as long as the wafer carrying groove 11 located on the upper side can completely cover the wafer carrying groove 11 located on the lower side. Correspondingly, the present embodiment does not limit the specific shape of the side wall of the wafer carrying groove 11. For example, the side wall of the wafer carrying groove 11 can be a slope shape, or the side wall of the wafer carrying groove 11 can also be a straight surface shape perpendicular to the bottom surface, or the side wall of the wafer carrying groove 11 can also be other shapes. The present embodiment also does not limit the deviation value of the size between the multiple wafer carrying grooves 11, and can be set according to the size of the wafer to be carried.

[0040] The wafer carrier provided by the utility model comprises a wafer carrier plate body 10, a plurality of wafer bearing grooves 11 are provided in the wafer carrier plate body 10, the plurality of wafer bearing grooves 11 are arranged in sequence along a preset direction, and the size between the plurality of wafer bearing grooves 11 decreases along the preset direction, the bottom surfaces of the plurality of wafer bearing grooves 11 form a stepped structure, and the surface of the wafer carrier plate body 10 exposes the entire bottom surfaces of the wafer bearing grooves 11 of all sizes, the bottom surface of each wafer bearing groove 11 is respectively used as the bottom surface for carrying wafers of corresponding sizes, the preset direction is the surface of the plurality of wafer bearing grooves 11 provided in the wafer carrier plate body 10, pointing to the direction inside the wafer carrier plate body 10, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer bearing grooves 11. The utility model can use a wafer carrier plate to adapt to wafers of various sizes when transferring and performing corresponding operations on the wafers by providing the wafer bearing grooves 11 of multiple sizes in the wafer carrier plate body 10, thereby expanding the application scenario of a wafer carrier plate and reducing the cost of carrying a single wafer.

[0041] Example 2

[0042] Please refer to Figure 2 , Figure 2 A schematic diagram of a top view structure of a wafer carrier provided by an embodiment of the utility model. The wafer carrier may include a wafer carrier body 10;

[0043] A plurality of wafer carrying grooves 11 are provided in the wafer carrying plate body 10;

[0044] The plurality of wafer carrying grooves 11 are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrying grooves 11 decrease along the preset direction;

[0045] The bottom surfaces of the plurality of wafer carrying grooves 11 form a stepped structure, and the surface of the wafer carrying plate body 10 exposes the entire bottom surfaces of the wafer carrying grooves 11 of all sizes; the bottom surface of each wafer carrying groove 11 serves as the bottom surface for carrying wafers of corresponding sizes;

[0046] The preset direction is a direction from the surface of the wafer carrier plate body 10 where the plurality of wafer carrier grooves 11 are formed, pointing to the interior of the wafer carrier plate body 10 , and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrier grooves 11 ;

[0047] The centers of the multiple wafer carrying grooves 11 coincide with each other along a preset direction.

[0048] In the present embodiment, the center points of the multiple wafer carrying grooves 11 are set to coincide with each other along a preset direction, that is, the center points of the multiple wafer carrying grooves 11 coincide with each other along the arrangement direction of the wafer carrying grooves 11, which can ensure the neatness of the arrangement of the multiple wafer carrying grooves 11 and the neatness of the bottom surface of each wafer carrying groove 11, and ensure the stability of the wafer carrying grooves 11 in carrying the wafer.

[0049] Furthermore, in order to further improve the uniformity of the plurality of wafer carrying grooves 11 , the sizes of the plurality of wafer carrying grooves 11 may decrease arithmetically along a preset direction.

[0050] In this embodiment, the sizes of the plurality of wafer carrying grooves 11 are set to decrease arithmetically along a preset direction, which can further improve the uniformity of the plurality of wafer carrying grooves 11 .

[0051] Furthermore, in order to ensure the adaptability of the wafer carrying grooves 11 , the sizes of the above-mentioned multiple wafer carrying grooves 11 can be gradually reduced from 12 inches to 2 inches along a preset direction.

[0052] In the present embodiment, the plurality of wafer carrying grooves 11 are arranged to decrease in equal steps from 12 inches to 2 inches, so as to be adaptable to a variety of wafer sizes and ensure the applicability of the wafer carrying grooves 11 in the present embodiment.

[0053] Furthermore, in order to ensure the compactness of the structure and reduce the space occupied by the plurality of wafer carrying grooves 11, reference may be made to Figure 3 , Figure 3 The schematic diagram of the cross-sectional structure of a wafer carrier provided by an embodiment of the utility model is as follows: The side wall of each wafer carrier groove 11 may be perpendicular to the bottom surface of the wafer carrier groove 11 .

[0054] In the present embodiment, by setting the side wall of each wafer carrying groove 11 to be perpendicular to the bottom surface of the wafer carrying groove 11, the area occupied by setting a plurality of wafer carrying grooves 11 can be reduced, the space utilization of the structure can be improved, and the preparation cost can be reduced.

[0055] Furthermore, in order to ensure that the wafer supporting groove 11 can protect the wafer from bumps while supporting and limiting the wafer, the height of the side wall of each wafer supporting groove 11 can be greater than or equal to half the thickness of the wafer to be supported.

[0056] In the present embodiment, the side wall height of each wafer carrying groove 11 is set to be greater than or equal to half the thickness of the wafer to be carried, which can ensure that the wafer to be carried has a limiting effect while protecting the wafer to be carried.

[0057] Further, in order to facilitate the removal of the wafer in the wafer carrying groove 11, reference may be made to Figure 4, Figure 4 A schematic diagram of a top view of another wafer carrier provided by an embodiment of the utility model. The edge of each wafer carrier groove 11 may be provided with at least one notch.

[0058] In this embodiment, at least one notch is provided at the edge of each wafer carrying groove 11 , so that when the wafer in the wafer carrying groove 11 needs to be taken out, the wafer can be grabbed through the notch, thereby improving the convenience of use.

[0059] Furthermore, in order to avoid dust accumulation in the notch, the notch may be an arc-shaped notch 12 .

[0060] In this embodiment, the notch is configured as an arc-shaped notch 12 to avoid corners in the notch and reduce dust accumulation in the arc-shaped notch 12 .

[0061] The wafer carrier plate provided by the utility model comprises a wafer carrier plate main body 10, in which a plurality of wafer carrying grooves 11 are opened, the plurality of wafer carrying grooves 11 are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrying grooves 11 decrease along the preset direction, the bottom surfaces of the plurality of wafer carrying grooves 11 form a stepped structure, and the surface of the wafer carrier plate main body 10 exposes the entire bottom surfaces of the wafer carrying grooves 11 of all sizes, the bottom surface of each wafer carrying groove 11 serves as the bottom surface for carrying wafers of corresponding sizes, the preset direction is the surface of the wafer carrier plate main body 10 with the plurality of wafer carrying grooves 11 opened, pointing to the direction inside the wafer carrier plate main body 10, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrying grooves 11, and the centers of the plurality of wafer carrying grooves 11 coincide along the preset direction. The utility model arranges wafer carrying grooves 11 of multiple sizes in the wafer carrying plate main body 10, and can use one wafer carrying plate to adapt to wafers of multiple sizes when transferring and performing corresponding operations on the wafers, thereby expanding the application scenarios of a wafer carrying plate and reducing the carrying cost of a single wafer. The center points of the multiple wafer carrying grooves 11 are set to overlap along a preset direction, which can ensure the neatness of the arrangement of the multiple wafer carrying grooves 11 and ensure the stability of the wafers carried by the wafer carrying grooves 11. In addition, the embodiment of the utility model can further improve the uniformity of the multiple wafer carrying grooves 11 by setting the dimensions of the multiple wafer carrying grooves 11 to be equidistantly decreasing along a preset direction; the multiple wafer carrying grooves 11 are set to be equidistantly decreasing from 12 inches to 2 inches, which can adapt to a variety of wafer sizes and ensure the applicability of the wafer carrying grooves 11 in this embodiment; by setting the side wall of each wafer carrying groove 11 to be perpendicular to the bottom surface of the wafer carrying groove 11, the area occupied by setting multiple wafer carrying grooves 11 can be reduced, the space utilization rate of the structure can be improved, and the preparation cost can be reduced; the side wall height of each wafer carrying groove 11 is set to be greater than or equal to half the thickness of the wafer to be carried, which can ensure that the wafer to be carried has a limiting effect while protecting the wafer to be carried; at least one notch is opened at the edge of each wafer carrying groove 11, which can improve the convenience of use; setting the notch as an arc-shaped notch 12 can reduce the accumulation of dust in the arc-shaped notch 12.

[0062] Example 3

[0063] Please refer to Figure 5 , Figure 5 A schematic cross-sectional structure diagram of another wafer carrier provided by an embodiment of the utility model. The wafer carrier may include a wafer carrier body 10;

[0064] A plurality of wafer carrying grooves 11 are provided in the wafer carrying plate body 10;

[0065] The plurality of wafer carrying grooves 11 are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrying grooves 11 decrease along the preset direction;

[0066] The bottom surfaces of the plurality of wafer carrying grooves 11 form a stepped structure, and the surface of the wafer carrying plate body 10 exposes the entire bottom surfaces of the wafer carrying grooves 11 of all sizes; the bottom surface of each wafer carrying groove 11 serves as the bottom surface for carrying wafers of corresponding sizes;

[0067] The preset direction is a direction from the surface of the wafer carrier plate body 10 where the plurality of wafer carrier grooves 11 are formed, pointing to the interior of the wafer carrier plate body 10 , and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrier grooves 11 ;

[0068] A chamfer structure is provided at the top corner of the side wall of each wafer carrying groove 11 .

[0069] In this embodiment, by setting the top corner of the side wall of each wafer-carrying groove 11 as a chamfered structure, it is easy to place the wafer in the wafer-carrying groove 11, and it can play a guiding role when the wafer is placed. In this embodiment, the top corner of the side wall of each wafer-carrying groove 11, that is, the corner formed by the contact position between the side wall of the wafer-carrying groove 11 located on the lower side and the bottom surface of the wafer-carrying groove 11 located on the upper side.

[0070] Furthermore, in order to prevent the formed chamfered structure from bumping against the wafer and causing damage to the wafer, the chamfered structure may be an arc-shaped chamfered structure 13 .

[0071] In this embodiment, the chamfer structure is configured as an arc-shaped chamfer structure 13, and the formed arc-shaped surface can avoid collision with the edge of the wafer.

[0072] The wafer carrier plate provided by the utility model includes a wafer carrier plate main body 10, in which a plurality of wafer carrying grooves 11 are opened, the plurality of wafer carrying grooves 11 are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrying grooves 11 decrease along the preset direction, the bottom surfaces of the plurality of wafer carrying grooves 11 form a stepped structure, and the surface of the wafer carrier plate main body 10 exposes the entire bottom surfaces of the wafer carrying grooves 11 of all sizes, the bottom surface of each wafer carrying groove 11 serves as the bottom surface for carrying wafers of corresponding sizes, the preset direction is the surface of the wafer carrier plate main body 10 with the plurality of wafer carrying grooves 11 opened, pointing to the direction inside the wafer carrier plate main body 10, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrying grooves 11, and a chamfer structure is provided at the top corner of the side wall of each wafer carrying groove 11. The utility model provides wafer carrying grooves 11 of multiple sizes in the wafer carrying plate body 10, so that when transferring and performing corresponding operations on the wafer, one wafer carrying plate can be used to adapt to wafers of multiple sizes, thereby expanding the application scenarios of a wafer carrying plate and reducing the cost of carrying a single wafer. By setting the top corner of the side wall of each wafer carrying groove 11 as a chamfered structure, it is easy to place the wafer in the wafer carrying groove 11, and it can play a guiding role when the wafer is placed. In addition, by setting the chamfered structure as an arc-shaped chamfered structure 13, the arc-shaped surface formed in the embodiment of the utility model can avoid collision with the edge of the wafer.

[0073] To make the present invention easier to understand, the wafer carrier may specifically include:

[0074] A wafer carrier plate body; a plurality of wafer carrying grooves are provided in the wafer carrier plate body;

[0075] A plurality of wafer carrying grooves are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrying grooves decrease along the preset direction;

[0076] The bottom surfaces of the plurality of wafer carrying grooves form a stepped structure, and the surface of the wafer carrying plate body exposes the entire bottom surfaces of the wafer carrying grooves of all sizes; the bottom surface of each wafer carrying groove serves as the bottom surface for carrying wafers of corresponding sizes;

[0077] The preset direction is a surface of the wafer carrier plate body on which the plurality of wafer carrier grooves are provided, pointing to the direction inside the wafer carrier plate body, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrier grooves;

[0078] The centers of the multiple wafer-carrying grooves coincide along a preset direction; the sizes of the multiple wafer-carrying grooves decrease arithmetic steps from 12 inches to 2 inches along the preset direction; the side wall of each wafer-carrying groove is perpendicular to the bottom surface of the wafer-carrying groove; and the height of the side wall of each wafer-carrying groove is greater than or equal to one-half of the thickness of the wafer to be carried;

[0079] At least one arc-shaped notch is provided at the edge of each wafer-carrying groove; and an arc-shaped chamfered structure is provided at the top corner of the side wall of each wafer-carrying groove.

[0080] The wafer carrying device provided in the embodiment of the utility model is introduced below. The wafer carrying device described below and the wafer carrying plate described above can be referred to each other.

[0081] The wafer carrying device provided by the embodiment of the utility model may include:

[0082] A wafer carrier substrate, and a plurality of wafer carrier plates as described above;

[0083] A plurality of wafer carrying plates are distributed on the surface of the wafer carrying device base.

[0084] In this embodiment, a plurality of wafer carrying plates are arranged in the wafer carrying device base, so as to further improve the efficiency of carrying wafers.

[0085] The wafer carrier device provided by the embodiment of the utility model comprises a wafer carrier device base, and a plurality of wafer carrier plates as described above, wherein the plurality of wafer carrier plates are distributed on the surface of the wafer carrier device base. The wafer carrier plate comprises a wafer carrier plate body, a plurality of wafer carrier grooves are provided in the wafer carrier plate body, the plurality of wafer carrier grooves are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrier grooves decrease along the preset direction, the bottom surfaces of the plurality of wafer carrier grooves form a stepped structure, and the surface of the wafer carrier plate body exposes the entire bottom surfaces of the wafer carrier grooves of all sizes, the bottom surface of each wafer carrier groove serves as the bottom surface for carrying wafers of corresponding sizes, the preset direction is the surface of the wafer carrier plate body with the plurality of wafer carrier grooves, pointing to the direction inside the wafer carrier plate body, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrier grooves. The utility model provides wafer carrying grooves of multiple sizes in the wafer carrying plate body, so that when transferring and performing corresponding operations on the wafers, one wafer carrying plate can be used to adapt to wafers of multiple sizes, thereby expanding the application scenarios of a wafer carrying plate and reducing the carrying cost of a single wafer.

[0086] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0087] Finally, it should be noted that, in this article, relationships such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variants are intended to cover non-exclusive inclusions.

[0088] The above is a detailed introduction to a wafer carrier plate and a wafer carrier device provided by the present invention. This article uses specific examples to illustrate the principle and implementation method of the present invention. The description of the above embodiments is only used to help understand the structure of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A wafer carrier, characterized in that: It includes a wafer carrier plate body; The wafer carrying plate body is provided with a plurality of wafer carrying grooves; The plurality of wafer carrying grooves are arranged in sequence along a preset direction, and the sizes between the plurality of wafer carrying grooves decrease along the preset direction; The bottom surfaces of the plurality of wafer carrying grooves form a stepped structure, and the surface of the wafer carrying plate body exposes the entire bottom surfaces of the wafer carrying grooves of all sizes; the bottom surface of each wafer carrying groove serves as the bottom surface for carrying wafers of corresponding sizes; The preset direction is a direction from the surface of the wafer carrier plate body on which the plurality of wafer carrying grooves are formed, pointing to the interior of the wafer carrier plate body, and the preset direction is perpendicular to the bottom surfaces of the plurality of wafer carrying grooves; At least one notch is formed at the edge of each wafer carrying groove.

2. The wafer carrier according to claim 1, characterized in that: The centers of the plurality of wafer carrying grooves coincide with each other along the preset direction.

3. The wafer carrier according to claim 1, characterized in that: The dimensions of the plurality of wafer carrying grooves decrease equidistantly along the preset direction.

4. The wafer carrier according to claim 3, characterized in that: The sizes of the plurality of wafer carrying grooves decrease in equal steps from 12 inches to 2 inches along the preset direction.

5. The wafer carrier according to claim 1, characterized in that: The side wall of each wafer carrying groove is perpendicular to the bottom surface of the wafer carrying groove.

6. The wafer carrier according to claim 1, characterized in that: The height of the side wall of each wafer carrying groove is greater than or equal to half the thickness of the wafer to be carried.

7. The wafer carrier according to claim 1, characterized in that: The notch is an arc-shaped notch.

8. The wafer carrier according to any one of claims 1 to 7, characterized in that: A chamfer structure is provided at the top corner of the side wall of each wafer carrying groove.

9. The wafer carrier according to claim 8, characterized in that: The chamfered structure is an arc-shaped chamfered structure.

10. A wafer carrying device, characterized in that: include: A wafer carrier substrate, and a plurality of wafer carriers as claimed in any one of claims 1 to 9; A plurality of wafer carrying plates are distributed on the surface of the wafer carrying device base.

Images