Integrated circuit package

Abstract

The utility model relates to an integrated circuit package. An integrated circuit package includes a support substrate and a heat spreader. And the side wall of the radiator is fastened on the mounting surface of the supporting substrate through fastening equipment. A fastening device is housed in the compartment of the sidewall and passes through the support substrate through the first aperture. The fastening device and the first aperture are configured to enable fastening of the sidewall to the mounting surface and to allow relative movement of the fastening device with respect to the first aperture.

Description

[0001] Priority Claim

[0002] This application claims the benefit of priority of French Patent Application No. 2303527 filed on April 7, 2023, the contents of which are incorporated herein by reference in their entirety to the maximum extent permitted by law. Technical Field

[0003] Embodiments and implementations relate to the field of electronic devices, and in particular to the field of integrated circuit packaging, and more particularly to fastening a heat sink to a supporting substrate of an integrated circuit package. Background Art

[0004] One type of integrated circuit package, such as a ceramic grid array (CLGA) type package, includes a heat sink to allow heat generated by the chip of the integrated circuit during its operation to be dissipated to the exterior of the package.

[0005] The heat sink is typically secured to the supporting substrate of the package by means of a glue that forms a chemical bond between the heat sink and the supporting substrate at high temperatures (eg, during thermal annealing of the package).

[0006] However, the material of the support substrate sometimes has a relatively low coefficient of thermal expansion (known as the coefficient of thermal expansion (CTE)) compared to the material of the heat sink, so that the latter exerts mechanical stresses on the support substrate. These stresses occur in particular at temperatures at which the heat sink expands, for example during thermal annealing of the package, and are generally proportional to the difference between the respective coefficients of thermal expansion of the heat sink and the support substrate. In particular, these stresses can be a source of deformation of the support substrate, which may then have a curvature at its ends after the temperature has been lowered and does not recover its initial flat shape.

[0007] In particular, in the case of a metal heat sink made of copper and a supporting substrate made of ceramic, the difference between the thermal expansion coefficients is relatively high. -6 K -1 The CLGA package is made of ceramic such as alumina (Al2O3) and is fastened to a substrate with a thermal expansion coefficient of 17×10 -6 K -1 After the heat sink was made of copper, deformation of the supporting substrate was noticed.

[0008] Therefore, the deformed support substrate is not suitable for mounting the package on a printed circuit board because an empty space appears between the bent end of the package and the printed circuit board once the package is mounted on the board.

[0009] It is therefore necessary to find a solution that allows preventing deformation of the support substrate during fastening of the heat sink thereon. Summary of the invention

[0010] According to one aspect, an integrated circuit package is provided, comprising a support substrate and a heat sink, the heat sink comprising a side wall fastened to a mounting surface of the support substrate by a fastening device.

[0011] The fastening device is housed in the compartment of the side wall and passes through the support base plate through the first aperture. The fastening device and the first aperture are configured to enable fastening of the side wall to a mounting surface and to enable relative movement of the fastening device relative to the first aperture.

[0012] In other words, the heat sink remains fastened to the supporting substrate by means of the fastening device whose movement is not completely restricted by the first aperture.

[0013] In particular, the fastening device is free to move in the expansion direction of the heat sink to prevent the heat sink from exerting mechanical stress on the support substrate during its expansion. And, when the heat sink recovers its original shape (i.e., when it is retracted), the fastening device can restore its original position to avoid exerting other mechanical stress on the support substrate when the heat sink is retracted.

[0014] Thus, the package according to this aspect comprises a heat sink fastened to a support substrate, the support substrate not deforming during expansion of the heat sink even if there is a significant difference between the coefficients of thermal expansion of the support substrate and the heat sink. Thus, such a package according to this aspect has no curvature at its ends.

[0015] In particular, for example, for a given ceramic type, the support substrate may have a plurality of -6 K -1 With 12×10 -6 K -1 The thermal expansion coefficient of the heat sink may be between 15×10 -6 K -1 With 17×10 -6 K -1 The thermal expansion coefficient between.

[0016] According to one embodiment, the support base comprises a lower side opposite the mounting surface and the fastening means comprises rivets, each rivet comprising a first end received in a corresponding compartment and a second end located below the lower side of the support base.

[0017] The distance between the first end and the second end is equal to the thickness of the support base plate plus a gap that enables both the sidewalls to remain fastened to the mounting surface of the support base plate and the movement of each rivet in the first aperture.

[0018] The rivet enables quick and reliable fastening of the heat sink to the supporting substrate and is long enough to provide clearance and facilitate movement of the rivet in the first aperture.

[0019] According to one embodiment, the support base comprises an underside opposite the mounting surface and the compartment has a threaded sidewall and the fastening device comprises a screw configured to be screwed into the threaded compartment while leaving a gap between the screw head and the underside of the support base.

[0020] Advantageously, screws are used instead of rivets to fasten the heat sink to the support substrate, and the screws can be tightened or loosened and possibly completely removed, for example replaced by new screws.

[0021] According to one embodiment, the value of the gap is comprised between 10 μm and 20 μm.

[0022] This clearance range allows the fastening device to move freely while avoiding excessive space between the side wall of the heat sink and the mounting surface of the support substrate.

[0023] According to one embodiment, the first orifice has an oblong shape.

[0024] According to one embodiment, the side wall of the heat sink has an annular shape with a square or rectangular cross section, and the support base includes four first apertures respectively located at positions opposite to four corner regions of the side wall.

[0025] This number of first apertures and thus of fastening devices is sufficient to reliably fasten a side wall having such a shape on the mounting face of the support substrate without any risk of generating mechanical stresses on the support substrate during expansion of the heat sink.

[0026] According to one embodiment, the axis of each first orifice in the plane of the mounting surface forms an angle of 45° with respect to the direction of the two edges of the side wall adjacent to this first orifice.

[0027] The elongated shape combined with the 45° angle allows orienting the movement of the fastening devices so that they move in the direction of expansion or contraction of the heat sink and gives the heat sink greater freedom of movement, reducing stress on the supporting substrate.

[0028] Thus, the fastening device can be moved along the axis of the first aperture.

[0029] According to one embodiment, the fastening device is thermally conductive.

[0030] The fastening device thus allows forming a passage through the supporting substrate to dissipate the heat generated by the electronic chip in the package in operation.

[0031] According to another aspect, a method for manufacturing an integrated circuit package is provided, comprising: providing a support substrate including a mounting surface; providing a heat sink including a side wall; forming a compartment in the side wall of the heat sink; forming a first opening in the support substrate; and fastening the side wall to the mounting surface of the support substrate by a fastening device, the fastening device being accommodated in the compartment of the side wall of the heat sink and passing through the support substrate through the first opening so that the fastening device can move relative to the first opening.

[0032] According to one embodiment, the support substrate includes a lower side opposite to the mounting surface, and fastening the side wall to the mounting surface includes riveting by rivets, each rivet including a first end accommodated in a corresponding compartment and a second end located below the lower side of the support substrate, and the distance between the first end and the second end is equal to the thickness of the support substrate plus a gap, which enables both the side wall to remain fastened to the mounting surface of the support substrate and each rivet to move in the first opening.

[0033] According to one embodiment, the support substrate includes a lower side opposite to the mounting surface, forming a compartment in the side wall of the heat sink includes threading the compartment, and fastening the side wall to the mounting surface includes screwing a screw into the threaded compartment while leaving a gap between the screw head and the lower side of the support substrate.

[0034] According to one embodiment, the gap has a value comprised between 10 μm and 20 μm.

[0035] According to one embodiment, the first orifices are made such that they have an elongated shape.

[0036] According to one embodiment, a heat sink whose side wall has a ring shape with a square or rectangular cross section is provided, and four first apertures respectively located opposite to four corner regions of the side wall are formed in the support substrate.

[0037] According to one embodiment, the axis of each first orifice in the plane of the mounting surface forms an angle of 45° with respect to the directions of the two edges of the side wall adjacent to this first orifice.

[0038] According to one embodiment, the fastening devices are made such that they are thermally conductive.

[0039] According to one embodiment, the support substrate has a 10×10 -6 K -1 With 12×10 -6 K -1 The thermal expansion coefficient between the heat sink and the heat sink has a thermal expansion coefficient of 15×10 -6 K -1 With 17×10 -6 K -1 The thermal expansion coefficient between.

[0040] According to one aspect of the present disclosure, an integrated circuit package is provided, comprising: a supporting substrate; and a heat sink, comprising a side wall fastened to a mounting surface of the supporting substrate by a fastening device; wherein the fastening device is accommodated in a compartment of the side wall and passes through the supporting substrate through a first aperture; and wherein the fastening device and the first aperture are configured to enable the side wall to be fastened to the mounting surface and to enable the fastening device to be relatively moved relative to the first aperture.

[0041] In a preferred embodiment, wherein the support base includes a lower side opposite the mounting surface and wherein the fastening device includes rivets, each rivet includes a first end received in a corresponding compartment and a second end located below the lower side of the support base, wherein the distance between the first end and the second end is equal to the thickness of the support base plus a gap that enables both maintaining fastening to the side wall of the mounting surface of the support base and enabling each rivet to move in the first aperture.

[0042] In a preferred embodiment, the value of the gap is comprised between 10 μm and 20 μm.

[0043] In a preferred embodiment, wherein the support base comprises an underside opposite the mounting surface and wherein the compartment is threaded and the fastening device comprises a screw configured to be screwed into the threaded compartment while leaving a gap between the screw head and the underside of the support base.

[0044] In a preferred embodiment, the value of the gap is comprised between 10 μm and 20 μm.

[0045] In a preferred embodiment, the first aperture has an elongated shape.

[0046] In a preferred embodiment, in which the axis of each first opening has an elongated shape in the plane of the mounting surface, forms an angle of 45° with respect to the direction of the two edges of the side wall adjacent to this first opening.

[0047] In a preferred embodiment, wherein the side wall of the heat sink has an annular shape with a square or rectangular cross section, and the support base plate includes four first openings respectively located at positions opposite to four corner regions of the side wall.

[0048] In a preferred embodiment, the fastening device is thermally conductive.

[0049] In a preferred embodiment, the support substrate has a 10×10 -6 K -1 With 12×10 -6 K -1 The thermal expansion coefficient between the heat sink and the heat sink has a thermal expansion coefficient of 15×10 -6 K-1 With 17×10 -6 K -1 The thermal expansion coefficient between.

[0050] According to another aspect of the present disclosure, a method for manufacturing an integrated circuit package is provided, comprising: providing a support substrate including a mounting surface; providing a heat sink including a side wall; forming a compartment in the side wall of the heat sink; forming a first opening in the support substrate; and fastening the side wall to the mounting surface of the support substrate by a fastening device, the fastening device being accommodated in the compartment of the side wall of the heat sink and passing through the support substrate through the first opening so that the fastening device can move relative to the first opening.

[0051] In a preferred embodiment, wherein the support base includes a lower side opposite the mounting surface, wherein fastening the side wall to the mounting surface includes riveting by rivets, wherein each rivet includes a first end received in a corresponding compartment and a second end located below the lower side of the support base, wherein the distance between the first end and the second end is equal to the thickness of the support base plus a gap, which gap enables both the side wall to remain fastened to the mounting surface of the support base and the movement of each rivet in the first aperture.

[0052] In a preferred embodiment, the value of the gap is comprised between 10 μm and 20 μm.

[0053] In a preferred embodiment, the support substrate includes a lower side opposite the mounting surface, wherein forming a compartment in the side wall of the heat sink includes threading the compartment, and wherein fastening the side wall to the mounting surface includes screwing a screw into the threaded compartment while leaving a gap between the screw head and the lower side of the support substrate.

[0054] In a preferred embodiment, the value of the gap is comprised between 10 μm and 20 μm.

[0055] In a preferred embodiment, wherein forming the first apertures comprises forming each first aperture to have an elongated shape.

[0056] In a preferred embodiment, the axis of each first opening of the elongated shape forms an angle of 45° in the plane of the mounting surface with respect to the direction of the two edges of the side wall adjacent to this first opening.

[0057] In a preferred embodiment, the heat sink has a side wall in an annular shape with a square or rectangular cross section, and forming the first aperture includes forming four first apertures in the support substrate at positions respectively opposite to four corner regions of the side wall.

[0058] In a preferred embodiment, the fastening device is thermally conductive.

[0059] In a preferred embodiment, the support substrate has a 10×10 -6 K -1 With 12×10 -6 K -1 The thermal expansion coefficient between the heat sink and the heat sink has a thermal expansion coefficient of 15×10 -6 K -1 With 17×10 -6 K -1 The coefficient of thermal expansion between. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Other advantages and features of the present invention will become apparent after studying the detailed description of non-limiting examples and embodiments and in light of the accompanying drawings, in which:

[0061] Figure 1 schematically illustrates a cross-sectional view of an integrated circuit package;

[0062] Figure 2 schematically illustrates a cross-sectional view of an integrated circuit package;

[0063] Figure 3 The above reference is schematically illustrated Figure 1 a cross-sectional view of the described package;

[0064] Figure 4 The diagram shows the previous reference Figure 1 A top view of the described package; and

[0065] Figure 5 A mode of embodiment of a method for manufacturing an integrated circuit package is illustrated. DETAILED DESCRIPTION

[0066] Figure 1 A cross-sectional view of an integrated circuit package 1 according to an embodiment is schematically illustrated.

[0067] The package 1 includes a support substrate 2 including a mounting surface 21 and a lower surface 20 opposite to the mounting surface.

[0068] The support substrate 2 has a conventional structure known per se and can have different compositions depending on the package type. The support substrate 2 comprises conductive traces, typically made of copper, integrated into one or more layers of dielectric material. In the case of a "CLGA" type package, the dielectric material is typically a ceramic, such as aluminum oxide (Al2O3) or aluminum nitride (AlN).

[0069] In particular, the support substrate 2 may include a ceramic fired at a low temperature, called a low temperature co-fired ceramic (LTCC) of the GL773 type commercialized by Kyocera Corporation of Japan, whose thermal expansion coefficient is included in the range of 10×10 -6 K-1 With 12×10 -6 K -1 Between, for example 12×10 -6 K -1 .

[0070] The support substrate 2 comprises a first aperture 50 extending through a thickness Esub of the support substrate 2 between the mounting face 21 and the lower face 20 of the support substrate 2. For example, the thickness Esub of the support substrate 2 is comprised between 3 mm and 4 mm.

[0071] The integrated circuit package 1 further comprises at least one electronic integrated circuit chip 3 and a heat sink 4 .

[0072] The electronic chip(s) 3 may be mounted and connected to the mounting face 21 of the support substrate 2 in a conventional manner known per se, for example by means of solder connection beads.

[0073] The heat sink 4 comprises a side wall 41 and an upper wall 40. The side wall 41 is fastened to the mounting face 21 of the support substrate 2 by means of a fastening device 60, and the upper wall 40 is fastened to the electronic chip 3 via an interface material 7, which is preferably thermally conductive, in this context. The side wall 41 comprises a compartment 51, such as an aperture (or blind opening) extending partially into the side wall 41 and aligned with the first aperture 50 of the support substrate 2.

[0074] In addition, the heat sink 4 is made of metal, for example, copper (Cu), and then the thermal expansion coefficient is equal to 17×10 - 6 K -1 Therefore, at high temperatures, in particular during thermal annealing of the package, the expansion of the heat sink 4 is more significant than that of the supporting substrate and will exert mechanical stresses on the supporting substrate if the side walls have been fastened to the mounting surface, for example with glue as in the prior art.

[0075] According to an embodiment of the present invention, the fastening device and the first aperture 50 are configured to enable fastening of the side wall 41 to the mounting surface 21 and to enable relative movement of the fastening device relative to the first aperture 50 in the plane of the mounting surface 21. In particular, the fastening device passes through the support substrate 2 through the first aperture 50 and is accommodated in the compartment 51 of the side wall 41.

[0076] In other words, the heat sink 4 remains fastened to the supporting base plate 2 by means of the fastening device, the movement of which is not completely restricted by the first orifice 50 .

[0077] The fastening device, which is free to move in the expansion direction of the heat sink 4, prevents the heat sink 4 from exerting mechanical stress on the support substrate 2 during its expansion (e.g., at high temperatures). Also, when the heat sink 4 recovers its original shape (i.e., when it retracts, especially during temperature reduction), the fastening device can restore its original position to avoid exerting further mechanical stress on the support substrate 2.

[0078] Therefore, even in the case where there is the above-mentioned difference in thermal expansion coefficients between the support substrate 2 and the heat sink 4 , the support substrate 2 of the package 1 according to this aspect does not deform during expansion or contraction of the heat sink 4 .

[0079] Furthermore, the support substrate 2 of this package 1 has no curvature at its ends and remains flat, so that when the package 1 is fastened on a printed circuit board, the space between the lower face 20 of the support substrate and the printed circuit board is minimized.

[0080] like Figure 1 As shown in , the fastening device includes rivets 60, each rivet including a first end 601 and a second end 602 and a body 600 connecting the first end 601 and the second end 602. The first end 601 of each rivet 60 is accommodated in a corresponding compartment 51 of the side wall 41, and the second end 602 of each rivet 60 is located below the lower face 20 of the support base plate 2 (and offset relative to the lower face 20 by a gap J).

[0081] Advantageously, the distance Lfix between the first end 601 and the second end 602 is equal to the thickness Esub of the support substrate 2 plus a gap J. The gap J enables both the side wall 41 to remain fastened to the mounting face 21 of the support substrate 2 and the movement of each rivet 60 in the first orifice 50 .

[0082] Advantageously, the value of the gap J is comprised between 10 μm and 20 μm. This gap J range enables the rivet 60 to move freely while avoiding the creation of an excessively large space between the side wall 41 of the heat sink 4 and the mounting face 21 of the support substrate 2 .

[0083] A person skilled in the art will know how to adjust the dimensions of the rivet 60 and the first aperture 50 to obtain such a gap J value and enable relative movement of the rivet with respect to the first aperture 50 .

[0084] Furthermore, the first end 601 and the second end 602 of the rivet 60 are configured to remain fastened to the side wall 41 of the mounting surface 21 and to move only very slightly along the height of the support substrate 2 .

[0085] Advantageously, the rivet 60 is thermally conductive, thus allowing a passage to be formed through the supporting substrate 2 to dissipate the heat generated in the package 1 by the electronic chip 3 in operation.

[0086] Figure 2 A cross-sectional view of an integrated circuit package 1 according to a variant is schematically illustrated. Similar to what has been described before, the heat sink and the support substrate have the same reference numerals.

[0087] According to this variant, only the compartment 51 and the fastening means of the side wall 41 are modified so that the compartment 51 has a threaded side wall and the fastening means comprises a screw 61. The screw 61 is configured to be screwed into the threaded compartment 51 while leaving a gap J between the screw head 602 and the lower face 20 of the support substrate 2.

[0088] Previously for Figure 1 All that has been described with respect to package 1, in particular the advantages relating to the fastening of the side wall to the mounting surface and the relative movement of the fastening device with respect to the first opening, applies to Figure 2 Package 1.

[0089] More specifically, the screw 61 passes through the support base plate 2 through the first aperture 50 and has a threaded end 611 which is screwed into a corresponding threaded compartment 51 .

[0090] In addition, the gap J between the screw head 602 and the lower surface 20 may include the gap J between the screw head 602 and the lower surface 20. Figure 1 The gaps described are within the same value range, ie, between 10 μm and 20 μm.

[0091] A person skilled in the art will know how to adjust the dimensions of the screw 61 relative to the dimensions of the first aperture 50 to obtain such a gap J value and enable relative movement of the screw 61 relative to the first aperture 50 .

[0092] The screw 61 can be tightened or loosened, for example to adjust the value of the gap J, or can even be completely removed to be replaced with a new screw.

[0093] Advantageously, the screws 61 are also thermally conductive and therefore allow passages to be made through the support substrate 2 to dissipate the heat generated by the electronic chip 3 in operation in the package 1 .

[0094] Figure 3 The above reference is schematically illustrated Figure 1 A cross-section of the package 1 along the axis III-III is depicted.

[0095] The side wall 41 of the heat sink 4 has an annular shape with a square or rectangular cross section, and includes four compartments 51 located in four corner areas of the side wall 41 .

[0096] Each compartment 51 allows to prevent the movement of the fastening device relative to the side wall 41. For example, the compartment has an opening in the side wall 41, which opens up to the cavity in which the second end 602 of the rivet 60 is housed and is narrow enough to retain the second end 602 in the cavity.

[0097] exist Figure 2 In the alternative shown in , the threaded side wall of the compartment 51 allows retaining the threaded end 611 of the screw 61 and thus preventing movement of the screw 61 relative to the side wall 41 .

[0098] Figure 4 The diagram shows the previous reference Figure 1 A top view of package 1 is depicted.

[0099] The support base plate 2 includes four first apertures 50 respectively located at positions opposite to four corner regions of the side wall 41 .

[0100] Preferably, the first hole 50 has an elongated shape, and its length Lft is greater than the diameter of the body 600 of the rivet 60 (or the body of the screw), so that the rivet 60 (or the screw) can move freely in the plane of the mounting surface 21 during expansion or contraction of the heat sink 4.

[0101] The axis of each first hole 50 in the plane of the mounting surface 21 forms an angle of 45° with respect to the directions of the two edges of the side wall 41 adjacent to this first hole 50. Therefore, the rivet 60 (or screw) can move along the axis of the first hole 50.

[0102] The elongated shape of the first orifice 50 combined with the 45° angle allows the movement of the rivet 60 (or screw) to be oriented in the direction of expansion or contraction of the heat sink 4 and gives the heat sink 4 more freedom of movement.

[0103] The number of compartments 51 and first apertures 50 as well as their respective shapes and positioning in the side wall 41 and the support substrate 2 may vary and depend, for example, on the shape of the side wall 41 of the heat sink to be fastened to the mounting face 21 of the support substrate 2 .

[0104] Figure 5 The diagram shows a mode of implementation of a method for manufacturing an integrated circuit package 1. For example, this manufacturing method is used to manufacture Figure 1 or Figure 2 The package shown in 1.

[0105] The method comprises providing 100 a support substrate 2 comprising a mounting face 21 and a lower face 20 opposite the mounting face 21. The support substrate 2 has a thickness Esub and comprises conductive traces, typically made of copper, integrated in one or more dielectric material layers, which may consist of a ceramic such as aluminum oxide (Al2O3) or aluminum nitride (AlN). The thermal expansion coefficient of such a support substrate 2 of such a package is approximately 12×10 -6 K -1 .

[0106] The method further comprises providing 101 a heat sink 4, the heat sink 4 comprising a side wall 41, for example having a ring shape with a square or rectangular cross section. Furthermore, the heat sink 4 is made of metal, for example copper (Cu), and has a thickness equal to about 17×10 -6 K -1 The coefficient of thermal expansion.

[0107] The method further comprises forming 102 a compartment 51 in the side wall 41 of the heat sink 4 and forming 103 a first aperture 50 in the support substrate 2. More particularly, in manufacturing the reference Figure 2 In the case of the described package 1 , forming 102 the compartment 51 in the side wall 41 comprises threading the compartment 51 .

[0108] Advantageously, four first orifices 50 are formed in the supporting base plate 2 and four compartments 51 are formed in the side wall 41 , so that the first orifices 50 are respectively located opposite four corner regions of the side wall 41 and are aligned with the corresponding compartments 51 during fastening of the side wall 41 .

[0109] Furthermore, the first orifice 50 has an elongated shape. Forming 103 the first orifice 50 may be performed in parallel with the steps of providing 101 the heat sink and forming 102 the compartment 51 , or may be performed before or after step 101 and / or step 102 .

[0110] Afterwards, the method comprises fastening 104 the side wall 41 to the mounting surface 21 of the support base 2 by means of fastening means, such as rivets 60 or screws 61, which may be thermally conductive. The fastening means is housed in a compartment 51 of the side wall 41 of the heat sink 4 and passes through the support base 2 through the first aperture 50, so that the fastening means can move relative to the first aperture 50.

[0111] Reference before manufacturing Figure 1In the case of the package 1 described, the fastening 104 comprises riveting with rivets 60, each rivet 60 comprising a first end 601 housed in the corresponding compartment 51 and a second end 602 located below the lower face 20 of the support substrate 2. The distance Lfix between the first end 601 and the second end 602 is equal to the thickness Esub of the support substrate plus a gap J that enables both the side wall 41 to remain fastened to the mounting face 21 of the support substrate 2 and the movement of each rivet 60 in the first orifice 50.

[0112] Reference before manufacturing Figure 2 In the case of the package 1 described, the fastening 104 consists in screwing the screw 61 into the threaded compartment 51 while leaving a gap J between the screw head 602 and the lower surface 20 of the support substrate 2. Preferably, the gap J has a value comprised between 10 μm and 20 μm.

[0113] The axis of each first orifice 50 in the plane of the mounting surface 21 forms an angle of 45° with respect to the directions of the two edges of the side wall 41 adjacent to this first orifice 50 .

Claims

1. An integrated circuit package, characterized in that: include: A supporting substrate; as well as A heat sink including a side wall fastened to a mounting surface of a support substrate by a fastening device; wherein the fastening device is received in a compartment of the side wall and passes through the support base plate through the first aperture; as well as The fastening device and the first aperture are configured such that the side wall can be fastened to the mounting surface and such that the fastening device can be relatively moved relative to the first aperture.

2. The package according to claim 1, characterized in that wherein the support base includes a lower side opposite the mounting surface and wherein the fastening device includes rivets, each rivet including a first end received in a corresponding compartment and a second end located below the lower side of the support base, wherein the distance between the first end and the second end is equal to the thickness of the support base plus a gap that enables both retention of fastening to the side wall of the mounting surface of the support base and movement of each rivet in the first aperture.

3. The package according to claim 2, characterized in that The value of the gap is comprised between 10 μm and 20 μm.

4. The package according to claim 1, characterized in that Wherein the support base plate comprises an underside opposite the mounting surface and wherein the compartment is threaded and the fastening device comprises a screw configured to be screwed into the threaded compartment while leaving a gap between the screw head and the underside of the support base plate.

5. The package according to claim 4, characterized in that The value of the gap is comprised between 10 μm and 20 μm.

6. The package according to claim 1, characterized in that The first opening has an elongated shape.

7. The package according to claim 6, characterized in that The axis of each first opening which has an elongated shape in the plane of the mounting surface forms an angle of 45° with respect to the direction of the two edges of the side wall adjacent to this first opening.

8. The package according to claim 1, characterized in that The side wall of the heat sink has an annular shape with a square or rectangular cross section, and the support base includes four first openings respectively located at positions opposite to four corner regions of the side wall.

9. The package according to claim 1, characterized in that The fastening device is heat conductive.

10. The package according to claim 1, characterized in that The supporting substrate has a 10×10 -6 K -1 With 12×10 -6 K -1 The thermal expansion coefficient between the heat sink and the heat sink has a thermal expansion coefficient of 15×10 -6 K -1 With 17×10 -6 K -1 The coefficient of thermal expansion between.

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