Power supply assembly, power supply device and charging and discharging equipment

Abstract

The utility model relates to the technical field of battery processing equipment, and discloses a power supply assembly, a power supply device and charging and discharging equipment, the power supply assembly comprises a power supply module and a liquid cooling assembly, the power supply module comprises a circuit board and a component arranged on the circuit board, the liquid cooling assembly comprises a shell part, the shell part is provided with an accommodating cavity, and the accommodating cavity is provided with an opening. The shell part is provided with a containing cavity, the containing cavity is used for introducing and discharging cooling liquid, the shell part is connected to the circuit board, part of the surface of the shell part is sunken towards the interior of the containing cavity to form an avoiding groove, and the avoiding groove is arranged corresponding to the component to avoid the component. According to the power supply assembly, the power supply device and the charging and discharging equipment, heat dissipation is carried out in a liquid cooling mode, the heat conductivity coefficient of liquid is high, the heat conduction speed is high, the heat dissipation efficiency of the power supply assembly is high, and the situation that the power supply assembly cannot operate normally or even is damaged due to the high temperature can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of battery processing equipment, in particular to a power supply component, a power supply device and a charging and discharging device. Background Art

[0002] During the production process of batteries, the batteries need to be formed and divided into different capacities to activate the batteries and determine their capacity. The above operations are usually carried out with the help of charging and discharging equipment, and the batteries are charged and discharged using the power supply device of the charging and discharging equipment. However, the power supply device will generate heat during charging and discharging. If the heat cannot be dissipated quickly, the temperature of the power supply device will be high and it will not be able to operate normally, which will directly affect the operation of the charging and discharging equipment.

[0003] Existing power supply devices use forced air cooling to enhance ventilation and cooling effect with the help of fans, thereby reducing the temperature of the power supply device.

[0004] However, when forced air cooling is used, the heat dissipation efficiency of the power supply unit is low due to the low thermal conductivity of air and the limited heat conduction speed. The power supply unit is at risk of not being able to operate normally or even being damaged due to high temperature. Utility Model Content

[0005] The embodiments of the utility model disclose a power supply component, a power supply device and a charging and discharging device. The heat is dissipated by liquid cooling. The thermal conductivity of the liquid is high, the heat conduction speed is fast, and the heat dissipation efficiency of the power supply component is high, which can prevent the power supply component from being unable to operate normally or even being damaged due to high temperature.

[0006] In the first aspect, an embodiment of the utility model discloses a power supply component, including a power supply module and a liquid cooling component, wherein the power supply module includes a circuit board and components arranged on the circuit board, and the liquid cooling component includes a shell portion, wherein the shell portion has a accommodating cavity, and the accommodating cavity is used to pass and discharge cooling liquid, the shell portion is connected to the circuit board, and a portion of the surface of the shell portion is recessed into the accommodating cavity to form an avoidance groove, and the avoidance groove is arranged corresponding to the components to avoid the components.

[0007] As an optional implementation, in an embodiment of the utility model, a portion of the surface of the shell portion facing the circuit board is recessed into the accommodating cavity to form the avoidance groove.

[0008] As an optional implementation, in an embodiment of the utility model, the accommodating cavity includes a plurality of chambers connected in sequence, and the cooling liquid introduced into the accommodating cavity flows through the plurality of chambers in sequence and is discharged.

[0009] As an optional implementation, in an embodiment of the utility model, the shell portion is provided with a partition structure, the partition structure is located in the accommodating cavity, and the partition structure is used to divide the accommodating cavity into a plurality of chambers.

[0010] As an optional implementation, in an embodiment of the utility model, the partition structure includes a partition part and / or a first partition plate, the portion of the shell part formed with the avoidance groove corresponds to the partition part located in the accommodating cavity, the partition part protrudes into the accommodating cavity, and the first partition plate is arranged in the accommodating cavity.

[0011] As an optional implementation, in an embodiment of the utility model, the partition structure includes the partition part and the first partition plate, the extension direction of the partition part is different from the extension direction of the first partition plate, and the partition part and the first partition plate are cross-arranged to jointly divide the accommodating cavity into four chambers.

[0012] As an optional implementation, in an embodiment of the utility model, when the partition structure includes at least the partition part, the protruding height of the partition part is smaller than the depth of the accommodating cavity, so that the chambers separated by the partition part are connected.

[0013] As an optional implementation, in an embodiment of the utility model, when the partition structure includes at least the first partition, one end of the first partition abuts against the inner wall of the accommodating cavity, and the other end of the first partition forms a gap with the inner wall of the accommodating cavity, so that the chambers located on both sides of the first partition are connected;

[0014] Alternatively, two ends of the first partition plate abut against the inner wall of the accommodating cavity, and the first partition plate is provided with a first through hole, and the first through hole is used to connect the chambers located on both sides of the first partition plate.

[0015] As an optional implementation, in an embodiment of the utility model, each chamber is provided with a plurality of second partitions, and the plurality of second partitions are spaced apart to divide each chamber into a plurality of sub-chambers, and the plurality of sub-chambers are interconnected.

[0016] As an optional implementation, in an embodiment of the utility model, thermal conductive glue is filled between the component and the avoidance groove.

[0017] As an optional implementation, in an embodiment of the utility model, the shell portion is provided with a liquid inlet and a liquid outlet, the liquid inlet is connected to the accommodating cavity, the liquid inlet is used to introduce cooling liquid into the accommodating cavity, the liquid outlet is connected to the accommodating cavity, and the liquid outlet is used to discharge the cooling liquid in the accommodating cavity.

[0018] As an optional implementation, in an embodiment of the utility model, the liquid cooling assembly further includes a cover body portion, and the cover body portion is connected to the shell portion to cover the accommodating cavity.

[0019] In a second aspect, an embodiment of the utility model discloses a power supply device, comprising a cabinet and a plurality of power supply components disclosed in the first aspect, wherein the plurality of power supply components are sequentially stacked in the cabinet.

[0020] In a third aspect, an embodiment of the utility model discloses a charging and discharging device, including the power supply device disclosed in the second aspect.

[0021] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0022] In the embodiment of the utility model, the shell part of the liquid cooling component is connected to the circuit board of the power module, and the housing cavity of the shell part is used to pass and discharge the cooling liquid. When the power module is in operation, the heat generated by the circuit board can be transferred to the shell part and the heat can be taken away by the cooling liquid passed in and discharged from the housing cavity. In addition, part of the surface of the shell part is recessed into the housing cavity to form an avoidance groove. While the avoidance groove is used to avoid the components, the surface of the shell part corresponding to the avoidance groove can transfer the heat generated by the components to the shell part when the power module is in operation, and the heat can be taken away by the cooling liquid passed in and discharged from the housing cavity. Thus, the heat dissipation is achieved by liquid cooling through the liquid cooling component. The thermal conductivity of the liquid is high, the heat conduction speed is fast, and the heat dissipation efficiency of the power module is high, which can prevent the power module from being unable to operate normally or even being damaged due to high temperature.

[0023] In addition, compared to the existing method of using fans to dissipate heat, liquid cooling components operate more quietly when dissipating heat and can avoid the noise generated by the use of fans. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this technical field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a structural schematic diagram of a power supply component disclosed in Embodiment 1 of the present utility model;

[0026] Figure 2 yes Figure 1 A schematic diagram of the structure of the disclosed power supply assembly from a left perspective;

[0027] Figure 3This is a schematic diagram of the structure of a liquid cooling assembly disclosed in Embodiment 1 of the present utility model;

[0028] Figure 4 yes Figure 3 A schematic diagram of the structure of the disclosed liquid cooling assembly from a left perspective;

[0029] Figure 5 This is a schematic diagram of the structure of the partition structure separating the accommodating cavity disclosed in the first embodiment of the utility model;

[0030] Figure 6 It is a schematic structural diagram of the power supply device disclosed in the second embodiment of the present utility model;

[0031] Figure 7 It is a simplified structural diagram of the charging and discharging device disclosed in the third embodiment of the present utility model.

[0032] Description of main reference numerals

[0033] 100, power supply assembly; 10, power supply module; 11, circuit board; 12, components; 20, liquid cooling assembly; 21, shell; 21a, accommodating chamber; 21b, avoidance groove; 21c, partition; 211, chamber; 211a, sub-chamber; 212, liquid inlet; 213, liquid outlet; 22, first partition; 23, second partition; 200, power supply device; 201, cabinet; 300, charging and discharging equipment. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0036] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0037] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0038] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0039] The utility model discloses a power supply component, a power supply device and a charging and discharging device. Liquid cooling is used for heat dissipation. The liquid has a high thermal conductivity and a fast heat conduction speed. The heat dissipation efficiency of the power supply component is high, which can prevent the power supply component from being unable to operate normally or even being damaged due to high temperature.

[0040] Embodiment 1

[0041] See also Figure 1 and Figure 2 , is a structural schematic diagram of a power supply assembly 100 provided in Embodiment 1 of the present utility model, the power supply assembly 100 includes a power supply module 10 and a liquid cooling assembly 20, the power supply module 10 includes a circuit board 11 and components 12 arranged on the circuit board 11, the liquid cooling assembly 20 includes a shell portion 21, the shell portion 21 has a receiving cavity 21a, the receiving cavity 21a is used for passing and discharging cooling liquid, the shell portion 21 is connected to the circuit board 11, a part of the surface of the shell portion 21 is recessed into the receiving cavity 21a to form an avoidance groove 21b, and the avoidance groove 21b is arranged corresponding to the component 12 to avoid the component 12.

[0042] In this embodiment, the shell part 21 of the liquid cooling component 20 is connected to the circuit board 11 of the power module 10, and the cooling liquid is introduced and discharged through the accommodating cavity 21a of the shell part 21. When the power module 10 is in operation, the heat generated by the circuit board 11 can be transferred to the shell part 21 and the heat can be taken away by the cooling liquid introduced and discharged from the accommodating cavity 21a. In addition, part of the surface of the shell part 21 is recessed into the accommodating cavity 21a to form an avoidance groove 21b. While the avoidance groove 21b is used to avoid the components 12, the surface of the shell part 21 corresponding to the avoidance groove 21b can transfer the heat generated by the components 12 to the shell part 21 when the power module 10 is in operation, and the heat can be taken away by the cooling liquid introduced and discharged from the accommodating cavity 21a. Therefore, the liquid cooling component 20 is used to achieve heat dissipation by liquid cooling. The liquid has a high thermal conductivity and a fast heat conduction speed. The heat dissipation efficiency of the power component 100 is high, which can prevent the power component 100 from being unable to operate normally or even damaged due to high temperature.

[0043] In addition, compared with the existing method of using a fan to dissipate heat, the liquid cooling component 20 runs more quietly when achieving heat dissipation and can avoid the noise generated by the use of a fan.

[0044] Optionally, there may be a plurality of avoidance grooves 21 b , and the plurality of avoidance grooves 21 b are respectively provided corresponding to a plurality of components 12 to avoid the corresponding components 12 .

[0045] The coolant may be water, mineral oil or fluorinated liquid, etc., which is not specifically limited in this embodiment.

[0046] Exemplarily, part of the surface of the housing portion 21 facing the circuit board 11 is recessed into the accommodating cavity 21a to form the avoidance groove 21b. In this way, the avoidance groove 21b is located on the side of the housing portion 21 facing the circuit board 11, and the part of the surface of the housing portion 21 facing the circuit board 11 and not forming the avoidance groove 21b can be connected to the circuit board 11. The housing portion 21 is entirely covered on the circuit board 11 and the components 12. The heat generated by the circuit board 11 and the components 12 can be promoted to dissipate upward and be conducted to the housing portion 21 by utilizing the upward movement of air due to thermal expansion, thereby improving the heat dissipation efficiency.

[0047] In some embodiments, the accommodating chamber 21a includes a plurality of chambers 211 connected in sequence, and the coolant introduced into the accommodating chamber 21a flows through the plurality of chambers 211 in sequence and is discharged. In this way, by dividing the accommodating chamber 21a into a plurality of chambers 211 connected in sequence, when the coolant is introduced into the accommodating chamber 21a, the coolant can flow through and fill the plurality of chambers 211 in a predetermined order, and finally be discharged. In the process of the coolant entering and being discharged from the plurality of chambers 211, the heat generated by the circuit board 11 and the components 12 can be taken away in an orderly manner, and the orderly flow of the coolant can increase the flow rate of the coolant, avoid the generation of turbulence, turbulence and the like that affect the introduction and discharge of the coolant, and the heat dissipation efficiency is high, and the coolant can fully flow between the plurality of chambers 211 to achieve uniform heat dissipation, and the heat dissipation effect is better.

[0048] Exemplarily, the housing portion 21 is provided with a partition structure (not shown), which is located in the accommodating cavity 21a, and is used to divide the accommodating cavity 21a into a plurality of chambers 211. In this way, the accommodating cavity 21a is divided into a plurality of chambers 211 by providing a partition structure, and the styles are varied. The partition structure can be designed according to different usage conditions, so as to divide the accommodating cavity 21a into chambers 211 of different numbers and shapes, and the applicability is high.

[0049] Alternatively, if Figure 3 and Figure 4 As shown, the partition structure includes a partition 21c and / or a first partition 22. The portion of the shell 21 formed with the avoidance groove 21b corresponds to the partition 21c located in the accommodating cavity 21a. The partition 21c is protruded into the accommodating cavity 21a, and the first partition 22 is arranged in the accommodating cavity 21a. In this way, the partition 21c can be formed while the avoidance groove 21b is formed. The partition 21c is used to realize the partitioning function of the partition structure, thereby realizing structural reuse, and the overall structure of the shell 21 is relatively simple. The partitioning function of the partition structure is realized by using the first partition 22 arranged in the accommodating cavity 21a, and the structure is relatively simple and the difficulty of setting is relatively low.

[0050] In this embodiment, if Figure 3 and Figure 5 As shown, the partition structure includes a partition 21c and a first partition 22, the extension direction of the partition 21c is different from the extension direction of the first partition 22, and the partition 21c and the first partition 22 are cross-arranged to jointly divide the accommodating cavity 21a into four chambers 211. In this way, the accommodating cavity 21a is divided into four chambers 211 by the partition 21c and the first partition 22, and the coolant entering the accommodating cavity 21a can flow and be discharged along the four chambers 211 in sequence, and the coolant can fully exchange heat with the shell 21, thereby taking away the heat generated by the circuit board 11 and the components 12.

[0051] in, Figure 5 It is a structural schematic diagram of the partition 21 c and the first partition plate 22 jointly dividing the accommodating cavity 21 a into four chambers 211 .

[0052] Exemplarily, when the partition structure includes at least the partition 21c, the protruding height of the partition 21c is less than the depth of the accommodating cavity 21a, so that the chambers 211 separated by the partition 21c are connected. In this way, by designing that the protruding height of the partition 21c is less than the depth of the accommodating cavity 21a, the chambers 211 separated by the partition 21c can be connected at the top position of the partition 21c, so that the coolant can flow between the chambers 211 separated by the partition 21c.

[0053] For example, Figure 3 As shown, when the partition structure includes at least the first partition 22, one end of the first partition 22 abuts against the inner wall of the accommodating chamber 21a, and the other end of the first partition 22 forms a gap with the inner wall of the accommodating chamber 21a, so that the chambers on both sides of the first partition 22 are connected. In this way, the first partition 22 and the partition 21c together divide the accommodating chamber 21a into a plurality of chambers 211, and the other end of the first partition 22 forms a gap with the inner wall of the accommodating chamber 21a, so that the chambers 211 on both sides of the first partition 22 can be connected, and the coolant entering the accommodating chamber 21a flows in a predetermined order and fills the plurality of chambers 211.

[0054] In some other embodiments, both ends of the first partition 22 abut against the inner wall of the accommodating chamber 21a, and the first partition 22 is provided with a first through hole (not shown), and the first through hole is used to connect the chambers 211 located on both sides of the first partition 22. In this way, the chambers 211 located on both sides of the first partition 22 are connected by the first through hole provided on the first partition 22, and the coolant introduced into the accommodating chamber 21a flows in a predetermined order and fills the multiple chambers 211.

[0055] In some embodiments, each chamber 211 is provided with a plurality of second partitions 23, and the plurality of second partitions 23 are arranged at intervals to divide each chamber 211 into a plurality of sub-chambers 211a, and the plurality of sub-chambers 211a are arranged in communication with each other. In this way, each chamber 211 is divided into a plurality of sub-chambers 211a by the second partition 23. On the one hand, the plurality of sub-chambers 211a are relatively independent and can independently achieve heat dissipation, and the amplitude of the shaking that may be generated when the coolant flows in the chamber 211 is reduced, thereby reducing the generation of vibration. On the other hand, the second partition 23 can further increase the heat dissipation area and improve the heat dissipation efficiency.

[0056] As an optional implementation, Figure 3As shown, one end of the second partition 23 abuts against the inner wall of the chamber 211, and the other end of the second partition 23 forms a gap with the inner wall of the chamber 211, so that the sub-chambers 211a located on both sides of the second partition 23 are connected. In this way, the second partition 23 divides the accommodating chamber 21a into a plurality of sub-chambers 211a, and the other end of the second partition 23 forms a gap with the inner wall of the chamber 211, so that the sub-chambers 211a located on both sides of the second partition 23 can be connected, and the coolant entering the chamber 211 flows in a predetermined order and fills the plurality of sub-chambers 211a.

[0057] As another optional embodiment, both ends of the second partition plate 23 abut against the inner wall of the chamber 211, and the second partition plate 23 is provided with a second through hole (not shown), and the second through hole is used to connect the sub-chambers 211a located on both sides of the second partition plate 23. In this way, the sub-chambers 211a located on both sides of the second partition plate 23 are connected by the second through hole provided on the second partition plate 23, and the coolant entering the chamber 211 flows in a predetermined order and fills the multiple sub-chambers 211a.

[0058] Optionally, thermally conductive adhesive is filled between the component 12 and the avoidance groove 21b. In this way, on the one hand, the thermally conductive adhesive between the avoidance groove 21b and the component 12 can serve as a heat-conducting medium, so that the heat generated by the component 12 can be more efficiently transferred to the surface of the shell part 21 corresponding to the avoidance groove 21b, thereby improving the heat dissipation efficiency. On the other hand, the thermally conductive adhesive can make the component 12 and the surface of the shell part 21 corresponding to the avoidance groove 21b relatively fixed, thereby preventing the surface of the shell part 21 corresponding to the avoidance groove 21b from shaking and hitting the component 12 under the action of external force, thereby causing damage to the component 12, and can buffer the tiny vibrations of the shell part 21 generated when the coolant is introduced into and discharged from the accommodating cavity 21a, thereby allowing the component 12 to operate stably.

[0059] Exemplarily, the housing portion 21 is provided with a liquid inlet 212 and a liquid outlet 213, wherein the liquid inlet 212 is connected to the accommodating chamber 21a, and the liquid inlet 212 is used to introduce cooling liquid into the accommodating chamber 21a, and the liquid outlet 213 is connected to the accommodating chamber 21a, and the liquid outlet 213 is used to discharge the cooling liquid in the accommodating chamber 21a. In this way, the accommodating chamber 21a is connected through the liquid inlet 212, and the cooling liquid can be introduced into the accommodating chamber 21a from the liquid inlet 212, and the liquid outlet 213 is connected to the accommodating chamber 21a, and the cooling liquid in the accommodating chamber 21a can be discharged from the accommodating chamber 21a from the liquid outlet 213, thereby realizing the flow of cooling liquid, and thus taking away the heat generated by the circuit board 11 and the components 12.

[0060] In some embodiments, the liquid cooling assembly 20 further includes a cover body (not shown), which is connected to the housing 21 to cover the accommodating cavity 21a. Thus, by connecting the cover body to the housing 21, the cover body can cover the accommodating cavity 21a to prevent the coolant from overflowing from the opening of the accommodating cavity 21a and causing a short circuit in the power module 10.

[0061] The first embodiment of the utility model provides a power supply assembly 100, which is connected to the circuit board 11 of the power module 10 through the shell part 21 of the liquid cooling assembly 20, and the cooling liquid is introduced and discharged through the accommodating cavity 21a of the shell part 21. When the power module 10 is in operation, the heat generated by the circuit board 11 can be transferred to the shell part 21 and the heat can be taken away by the cooling liquid introduced and discharged through the accommodating cavity 21a. In addition, part of the surface of the shell part 21 is recessed into the accommodating cavity 21a to form an avoidance groove 21b. While the avoidance groove 21b is used to avoid the components 12, the surface of the shell part 21 corresponding to the avoidance groove 21b can transfer the heat generated by the components 12 to the shell part 21 when the power module 10 is in operation, and the heat can be taken away by the cooling liquid introduced and discharged through the accommodating cavity 21a. Therefore, heat dissipation is achieved by liquid cooling through the liquid cooling component 20. The thermal conductivity of the liquid is high and the heat conduction speed is fast. The heat dissipation efficiency of the power supply component 100 is high, which can prevent the power supply component 100 from being unable to operate normally or even being damaged due to high temperature.

[0062] In addition, compared with the existing method of using a fan to dissipate heat, the liquid cooling component 20 runs more quietly when achieving heat dissipation and can avoid the noise generated by the use of a fan.

[0063] Embodiment 2

[0064] See also Figure 6 , is a schematic diagram of the structure of a power supply device 200 provided in Embodiment 2 of the present utility model. The power supply device 200 includes a cabinet 201 and a plurality of power supply components 100 of Embodiment 1. The plurality of power supply components 100 are sequentially stacked in the cabinet 201.

[0065] The second embodiment of the present invention provides a power supply device 200. The power supply component 100 has a high heat dissipation efficiency, which can prevent the power supply component 100 from being unable to operate normally or even being damaged due to high temperature, thereby ensuring the normal operation of the power supply device 200.

[0066] Embodiment 3

[0067] See also Figure 7 , is a schematic structural diagram of a charging and discharging device 300 provided in Embodiment 3 of the present utility model, and the charging and discharging device 300 includes the power supply device 200 of Embodiment 2.

[0068] The third embodiment of the present invention provides a charging and discharging device 300. The power supply device 200 has a high heat dissipation efficiency, which can prevent the power supply device 200 from being unable to operate normally or even damaged due to high temperature, thereby ensuring the normal operation of the charging and discharging device 300.

[0069] The above is a detailed introduction to a power supply component, a power supply device and a charging and discharging device disclosed in the embodiments of the present invention. This article uses individual examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the power supply component, the power supply device and the charging and discharging device of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A power supply assembly, characterized in that: include: A power module, the power module comprising a circuit board and components arranged on the circuit board; as well as A liquid cooling component, the liquid cooling component includes a shell portion, the shell portion has a accommodating cavity, the accommodating cavity is used to pass and discharge cooling liquid, the shell portion is connected to the circuit board, part of the surface of the shell portion is recessed into the accommodating cavity to form an avoidance groove, and the avoidance groove is arranged corresponding to the components to avoid the components.

2. The power supply assembly according to claim 1, characterized in that: A portion of the surface of the shell portion facing the circuit board is recessed into the accommodating cavity to form the avoidance groove.

3. The power supply assembly according to claim 1, characterized in that: The accommodating cavity comprises a plurality of chambers which are connected in sequence, and the cooling liquid introduced into the accommodating cavity flows through the plurality of chambers in sequence and is discharged.

4. The power supply assembly according to claim 3, characterized in that: The shell portion is provided with a partition structure, the partition structure is located in the accommodating cavity, and the partition structure is used to divide the accommodating cavity into a plurality of chambers.

5. The power supply assembly according to claim 4, characterized in that: The partition structure includes a partition part and / or a first partition plate. The portion of the shell part where the avoidance groove is formed corresponds to the partition part located in the accommodating cavity. The partition part protrudes into the accommodating cavity, and the first partition plate is arranged in the accommodating cavity.

6. The power supply assembly according to claim 5, characterized in that: The partition structure includes the partition part and the first partition plate. The extension direction of the partition part is different from the extension direction of the first partition plate. The partition part and the first partition plate are cross-arranged to jointly divide the accommodating cavity into the four chambers.

7. The power supply assembly according to claim 5 or 6, characterized in that: When the partition structure at least includes the partition part, the protruding height of the partition part is smaller than the depth of the accommodating cavity, so that the chambers separated by the partition part are connected.

8. The power supply assembly according to claim 5 or 6, characterized in that: When the partition structure includes at least the first partition, one end of the first partition abuts against the inner wall of the accommodating cavity, and the other end of the first partition forms a gap with the inner wall of the accommodating cavity, so that the chambers located on both sides of the first partition are connected; Alternatively, two ends of the first partition plate abut against the inner wall of the accommodating cavity, and the first partition plate is provided with a first through hole, and the first through hole is used to connect the chambers located on both sides of the first partition plate.

9. The power supply assembly according to any one of claims 3 to 6, characterized in that: Each of the chambers is provided with a plurality of second partitions, and the plurality of second partitions are arranged at intervals to divide each of the chambers into a plurality of sub-chambers, and the plurality of sub-chambers are arranged in communication with each other.

10. The power supply assembly according to claim 9, characterized in that: One end of the second partition plate abuts against the inner wall of the chamber, and the other end of the second partition plate forms a gap with the inner wall of the chamber, so that the sub-chambers located on both sides of the second partition plate are connected; Alternatively, two ends of the second partition plate abut against the inner wall of the chamber, and the second partition plate is provided with a second through hole, and the second through hole is used to connect the sub-chambers located on both sides of the second partition plate.

11. The power supply assembly according to any one of claims 1 to 6, characterized in that: The space between the components and the avoidance groove is filled with heat-conducting glue.

12. The power supply assembly according to any one of claims 1 to 6, characterized in that: The shell part is provided with a liquid inlet and a liquid outlet, the liquid inlet is connected to the accommodating cavity, the liquid inlet is used to introduce cooling liquid into the accommodating cavity, the liquid outlet is connected to the accommodating cavity, and the liquid outlet is used to discharge the cooling liquid in the accommodating cavity.

13. The power supply assembly according to any one of claims 1 to 6, characterized in that: The liquid cooling assembly further comprises a cover body portion, which is connected to the shell portion to cover the accommodating cavity.

14. A power supply device, characterized in that: It comprises a cabinet and a plurality of power supply components according to any one of claims 1 to 13, wherein the plurality of power supply components are sequentially stacked in the cabinet.

15. A charging and discharging device, characterized in that: Comprising the power supply device as claimed in claim 14.

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