Circuit board structure capable of reducing power supply noise
By designing a multi-layered stacked structure on the circuit board and using the first and second ground copper strips to wrap the high-voltage power supply area, the problems of power supply noise impact and increased production costs are solved, and the complete isolation between the high-voltage power supply and the low-voltage power supply is achieved. Effective noise reduction.
Patent Information
- Application Number
- CN202420804139.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-04-17
AI Technical Summary
In existing circuit board designs, the high-voltage power plane cannot be completely isolated from the low-voltage power plane, resulting in the power supply noise impact still exists, and reducing the noise impact by increasing the interlayer thickness will increase production costs.
Design a circuit board with a multi-layer stack structure, and a first grounding copper strip is arranged around the high-voltage power area, and a second grounding copper strip is arranged on the adjacent target layer, so that the high-voltage power area is horizontal. Both are wrapped in grounded copper, thus achieving complete isolation from the low voltage power area.
It effectively reduces the power supply noise generated by high-voltage power supply, protects the low-voltage power area from interference, reduces production costs, improves production efficiency, and realizes effective isolation between high-voltage power supply and low-voltage power supply.
Smart Images
Figure CN222464900U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board design, in particular to a circuit board structure for reducing power supply noise. Background Art
[0002] Printed Circuit Board (PCB), also known as printed circuit board, is an important part of the physical support and signal transmission of electronic products. With the continuous development of electronic technology, power supply plays a vital role in circuit boards. The voltage difference between power supplies (the voltage difference between high voltage and low voltage) is becoming more and more important. If the high voltage and low voltage are close to each other, there will be voltage deviation (voltage deviation is the deviation of the actual voltage from the rated value). High or low voltage will affect the normal use of the power supply. If the power supply cannot be used normally, the entire board will be damaged and cannot be used normally.
[0003] In circuit board design, voltage power supplies of 12V and above are usually considered high voltage power supplies, and power supplies below 3.3V are considered low voltage power supplies. If the high voltage power supply and the low voltage power supply are too close, the power supply noise generated in the high voltage power supply will propagate to the low voltage power supply plane, which will cause noise coupling to the low voltage power supply and affect the stability of the low voltage, and easily cause the problem of voltage difference. In order to solve this problem, the prior art usually adopts the method of pulling the physical distance between the high voltage power supply plane and the low voltage power supply plane. Although this method can reduce the influence between high and low voltages to a certain extent, since the high voltage power supply plane and the low voltage power supply plane cannot be completely isolated, the influence of power supply noise still exists. In addition, when the high voltage power supply and the low voltage power supply are in adjacent upper and lower layers, it is also necessary to increase the thickness between the layers to pull the distance apart to reduce the influence of power supply noise. However, this approach will undoubtedly increase production costs and reduce production efficiency.
[0004] The above defects need to be solved urgently. Utility Model Content
[0005] In order to solve the problem that the high-voltage power plane and the low-voltage power plane on the existing circuit board cannot be completely isolated, the influence of power supply noise still exists, and when the high-voltage power supply and the low-voltage power supply are in adjacent upper and lower layers, increasing the thickness between layers to increase the spacing will increase the production cost, the utility model provides a circuit board structure that reduces power supply noise.
[0006] The technical solution of the utility model is as follows:
[0007] A circuit board structure for reducing power supply noise includes a circuit board body with a multi-layer stacking structure, the circuit board body includes a target power supply layer and an adjacent target stacking layer, a high-voltage power supply area and a low-voltage power supply area are arranged on the target power supply layer, and a circle of first grounding copper foil is arranged around the high-voltage power supply area;
[0008] The adjacent target stack is adjacent to the target power layer up and down, and a second grounding copper sheet corresponding to the high-voltage power area is provided on the adjacent target stack, and the orthographic projection area of the second grounding copper sheet is equal to the orthographic projection area of the high-voltage power area.
[0009] According to the utility model of the above solution, a plurality of first ground vias are arranged at intervals on the first grounding copper sheet.
[0010] According to the above solution of the utility model, the distance between two adjacent first via holes is 15 mm to 25 mm.
[0011] According to the above solution of the utility model, the distance between two adjacent first ground vias is 20 mm.
[0012] According to the above-mentioned solution of the utility model, the second grounding copper sheet is provided with second ground via holes which correspond one to one with the first ground via holes.
[0013] According to the above solution of the utility model, the width of the first grounding copper sheet is greater than 0.5 mm.
[0014] According to the above-mentioned solution of the utility model, there is a gap between the high-voltage power supply area and the first grounding copper sheet.
[0015] According to the above-mentioned solution of the utility model, the width of the gap is 0.5 mm to 1.0 mm.
[0016] According to the above solution of the utility model, the width of the gap is 0.5 mm.
[0017] According to the above-mentioned solution of the utility model, the area of the high-voltage power supply region is smaller than or equal to the area of the low-voltage power supply region.
[0018] The utility model according to the above scheme has the following beneficial effects:
[0019] In the circuit board structure for reducing power supply noise, a circle of first grounding copper foil is arranged around the high-voltage power supply area. The first grounding copper foil can play a good shielding role and can effectively reduce the power supply noise generated by the high-voltage power supply to spread around, thereby protecting the low-voltage power supply area from interference. In addition, a second grounding copper foil corresponding to the high-voltage power supply area is arranged on the adjacent target stack, so that the high-voltage power supply area is also effectively shielded in the vertical direction, and the positive projection area of the second grounding copper foil is equal to the positive projection area of the high-voltage power supply area, so that the second grounding copper foil can completely cover the high-voltage power supply area, that is, whether in the horizontal direction or the vertical direction, the high-voltage power supply area is wrapped by the grounding copper foil, thereby achieving complete isolation of the high-voltage power supply area from the low-voltage power supply area, reducing the noise problem of the high-voltage power supply, and reducing the pressure difference problem caused by the close distance between the high-voltage power supply area and the low-voltage power supply area, so that the power plane can operate effectively and safely, and when the high-voltage power supply area and the low-voltage power supply area are in adjacent upper and lower layers, there is no need to increase the thickness between the layers, so that the high-voltage power supply and the low-voltage power supply can be effectively isolated, thereby reducing production costs and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the structure of the target power layer;
[0021] Figure 2 It is a schematic diagram of the structure of the stacked layer near the target;
[0022] Figure 3 It is one of the partial cross-sectional views of the utility model;
[0023] Figure 4 This is the second partial cross-sectional view of the present utility model.
[0024] In the figure, 1, target power layer; 11, high voltage power area; 12, low voltage power area; 2, adjacent target stack; 3, first ground copper sheet; 4, second ground copper sheet; 5, first ground via; 6, second ground via. DETAILED DESCRIPTION
[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0026] like Figure 1As shown, the utility model provides a circuit board structure for reducing power supply noise, including a circuit board body with a multi-layer stacked structure, the circuit board body including a target power supply layer 1 and an adjacent target stack 2, a high-voltage power supply area 11 and a low-voltage power supply area 12 are arranged on the target power supply layer 1, and a circle of first grounding copper foil 3 is arranged around the high-voltage power supply area 11, and the first grounding copper foil 3 can play a good shielding role, that is, the first grounding copper foil 3 can play an isolation role, and can isolate power supply impurities such as noise sources brought by the high-voltage power supply area 11, and can effectively reduce the power supply noise generated by the high-voltage power supply from spreading to the surroundings, thereby protecting the low-voltage power supply area 12 from interference.
[0027] like Figure 1 , Figure 4 As shown, in this example, the adjacent target stack 2 is adjacent to the target power layer 1, and the circuit board body can be designed as a six-layer stack structure. The target power layer 1 is located at the fourth layer of the circuit board body, and the adjacent target stack 2 is the third layer of the circuit board body and the fifth layer of the circuit board body. In actual design, the stack positions of the adjacent target stack 2 and the target power layer 1 can be designed according to actual needs.
[0028] like Figure 2 As shown, in this embodiment, a second grounding copper sheet 4 corresponding to the high-voltage power supply area 11 is provided on the adjacent target stack 2, and the orthographic projection area of the second grounding copper sheet 4 is equal to the orthographic projection area of the high-voltage power supply area 11, so that the second grounding copper sheet 4 can completely cover the high-voltage power supply area 11, thereby forming a complete shielding layer. This fully covered design effectively reduces the outward diffusion of the power supply noise generated by the high-voltage power supply area 11, and also avoids the interference of other electrical signals to the high-voltage power supply area 11. Since the adjacent target stack 2 is located in the upper and lower stacks of the target power supply layer 1, this layout enables the second grounding copper sheet 4 to shield the high-voltage power supply area 11 from the top and bottom respectively. In this way, the high-voltage power supply area 11 is tightly wrapped by two layers of grounding copper sheets, forming a relatively closed environment. In this case, the high-voltage power supply area 11 can only be coupled backflow with the second grounding copper sheet 4, thereby avoiding problems such as power supply noise caused by high voltage.
[0029] like Figures 1 to 3As shown, in this embodiment, whether from the horizontal direction or the vertical direction, the high-voltage power supply area 11 is wrapped by the grounding copper sheet, so as to achieve complete isolation of the high-voltage power supply area 11 from the low-voltage power supply area 12, reduce the noise problem of the high-voltage power supply, and reduce the voltage difference problem caused by the close distance between the high-voltage power supply area 11 and the low-voltage power supply area 12, so that the power plane can operate effectively and safely. Specifically, in the horizontal direction, the high-voltage power supply area 11 is tightly surrounded by a circle of the first grounding copper sheet 3, forming a solid barrier, thereby isolating the high-voltage power supply area 11 from the surrounding environment, so that the noise and power impurities generated by the high-voltage power supply are effectively confined to a specific area and cannot spread around, thereby protecting the low-voltage power supply area 12 from interference. In the vertical direction, the second grounding copper sheet 4 on the adjacent target stack 2 corresponds to the high-voltage power supply area 11 one by one, and its positive projection area is exactly equal to the positive projection area of the high-voltage power supply area 11, which means that the second grounding copper sheet 4 can completely cover the high-voltage power supply area 11, so whether from the top or the bottom, the high-voltage power supply area 11 is tightly wrapped by the grounding copper sheet and completely isolated from the low-voltage power supply area 12. In addition, when the high-voltage power supply area 11 and the low-voltage power supply area 12 are in adjacent upper and lower layers, unlike the traditional design that requires increasing the interlayer thickness to increase the distance between the high-voltage power supply and the low-voltage power supply, the utility model does not need to increase the additional interlayer thickness to achieve effective isolation between the high-voltage power supply and the low-voltage power supply, thereby reducing production costs and improving production efficiency.
[0030] In this embodiment, the voltage of the high-voltage power supply area 11 can be set to be greater than or equal to 12V, and the voltage of the low-voltage power supply area 12 can be set to be less than or equal to 3.3V. Such a voltage setting range not only meets the common power supply design standards, but also meets the diverse needs of different electronic devices for power supply voltage. At the same time, in actual design, the voltages of the high-voltage power supply area 11 and the low-voltage power supply area 12 can be accurately adjusted according to specific application scenarios and equipment requirements to achieve optimal performance and stability. In addition, the area of the high-voltage power supply area 11 is smaller than the area of the low-voltage power supply area 12. Of course, the area of the high-voltage power supply area 11 can also be designed to be equal to the area of the low-voltage power supply area 12. In actual design, the relationship between the area of the high-voltage power supply area 11 and the area of the low-voltage power supply area 12 can be designed according to actual needs.
[0031] like Figure 1 As shown, in this embodiment, a plurality of first ground vias 5 are arranged at intervals on the first ground copper sheet 3 for mutual return flow between the high voltage power supply area 11 and the low voltage power supply area 12. In addition, the spacing between two adjacent first ground vias 5 is 15 mm to 25 mm, and the spacing between two adjacent first ground vias 5 can be designed to be 20 mm. In actual design, the spacing between two adjacent first ground vias 5 can be designed according to actual needs.
[0032] In an optional embodiment, a plurality of first ground vias 5 are arranged at intervals on the first ground copper sheet 3 for mutual backflow between the high voltage power supply area 11 and the low voltage power supply area 12. In addition, the spacing between two adjacent first ground vias 5 is 15 mm to 25 mm, and the spacing between two adjacent first ground vias 5 can be designed to be 15 mm. In actual design, the spacing between two adjacent first ground vias 5 can be designed according to actual needs.
[0033] In another optional embodiment, a plurality of first ground vias 5 are arranged at intervals on the first ground copper sheet 3 for mutual backflow between the high voltage power supply area 11 and the low voltage power supply area 12. In addition, the spacing between two adjacent first ground vias 5 is 15 mm to 25 mm, and the spacing between two adjacent first ground vias 5 can be designed to be 25 mm. In actual design, the spacing between two adjacent first ground vias 5 can be designed according to actual needs.
[0034] like Figure 1 As shown, in this embodiment, there is a gap between the high-voltage power supply area 11 and the first grounding copper sheet 3. The existence of the gap helps to reduce the direct electrical contact between the high-voltage power supply area 11 and the first grounding copper sheet 3, thereby avoiding possible short circuits or electrical interference. When the high-voltage power supply is working, strong electric and magnetic fields may be generated around it. If it is in direct contact with the grounding copper sheet, it may cause abnormal current flow or signal interference, ensuring the stability and reliability of the power supply. In addition, the width of the gap is 0.5mm to 1.0mm, and the width of the gap can be designed to be 0.5mm. In actual design, the width of the gap can be designed according to actual needs.
[0035] In an optional embodiment, there is a gap between the high-voltage power supply area 11 and the first grounding copper sheet 3. The presence of the gap helps to reduce the direct electrical contact between the high-voltage power supply area 11 and the first grounding copper sheet 3, thereby avoiding possible short circuits or electrical interference. When the high-voltage power supply is working, strong electric and magnetic fields may be generated around it. If it is in direct contact with the grounding copper sheet, it may cause abnormal current flow or signal interference, thereby ensuring the stability and reliability of the power supply. In addition, the width of the gap is 0.5mm to 1.0mm, and the width of the gap can be designed to be 0.8mm. In actual design, the width of the gap can be designed according to actual needs.
[0036] In another optional embodiment, there is a gap between the high-voltage power supply area 11 and the first grounding copper sheet 3. The presence of the gap helps to reduce the direct electrical contact between the high-voltage power supply area 11 and the first grounding copper sheet 3, thereby avoiding possible short circuits or electrical interference. When the high-voltage power supply is working, strong electric and magnetic fields may be generated around it. If it is in direct contact with the grounding copper sheet, it may cause abnormal current flow or signal interference, thereby ensuring the stability and reliability of the power supply. In addition, the width of the gap is 0.5mm to 1.0mm, and the width of the gap can be designed to be 1.0mm. In actual design, the width of the gap can be designed according to actual needs.
[0037] In this embodiment, the width of the first grounding copper sheet 3 is greater than 0.5 mm. The width of the first grounding copper sheet 3 can be designed to be 0.6 mm, 0.8 mm, 1.0 mm, etc. In actual design, the width of the first grounding copper sheet 3 can be designed according to the design space in the circuit board.
[0038] like Figure 2 As shown, in this embodiment, second ground vias 6 corresponding to the first ground vias 5 are provided on the second ground copper foil 4, which are used for mutual backflow between the high-voltage power supply area 11 and the low-voltage power supply area 12, and the spacing between two adjacent second ground vias 6 is equal to the spacing between two adjacent first ground vias 5, further enhancing the electrical performance and stability of the circuit board structure.
[0039] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.
[0040] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.
Claims
1. A circuit board structure for reducing power supply noise, characterized in that: A circuit board body comprising a multi-layer stacked structure, wherein the circuit board body comprises a target power layer and an adjacent target stacked layer, wherein a high voltage power area and a low voltage power area are arranged on the target power layer, and a circle of first grounding copper foil is arranged around the high voltage power area; The adjacent target stack is adjacent to the target power layer up and down, and a second grounding copper sheet corresponding to the high-voltage power area is provided on the adjacent target stack, and the orthographic projection area of the second grounding copper sheet is equal to the orthographic projection area of the high-voltage power area.
2. The circuit board structure for reducing power supply noise according to claim 1, characterized in that: A plurality of first ground vias are arranged at intervals on the first ground copper sheet.
3. The circuit board structure for reducing power supply noise according to claim 2, characterized in that: The distance between two adjacent first ground via holes is 15 mm to 25 mm.
4. The circuit board structure for reducing power supply noise according to claim 3, characterized in that: The distance between two adjacent first ground via holes is 20 mm.
5. The circuit board structure for reducing power supply noise according to claim 2, characterized in that: The second ground copper sheet is provided with second ground via holes corresponding to the first ground via holes in a one-to-one manner.
6. The circuit board structure for reducing power supply noise according to claim 1, characterized in that: The width of the first grounding copper sheet is greater than 0.5 mm.
7. The circuit board structure for reducing power supply noise according to claim 1, characterized in that: There is a gap between the high voltage power supply area and the first grounding copper sheet.
8. The circuit board structure for reducing power supply noise according to claim 7, characterized in that: The width of the gap is 0.5 mm to 1.0 mm.
9. The circuit board structure for reducing power supply noise according to claim 8, characterized in that: The width of the gap is 0.5 mm.
10. The circuit board structure for reducing power supply noise according to claim 1, characterized in that: The area of the high voltage power supply region is smaller than or equal to the area of the low voltage power supply region.