High-efficiency chip-spacing-equal COB (Chip On Board) die bonding structure

Abstract

The utility model relates to the technical field of COB light sources, and particularly discloses a high-efficiency equal-chip-spacing COB die bonding structure comprising a COB substrate which is provided with a power supply positive electrode bonding pad, a power supply negative electrode bonding pad and a die bonding ring. A plurality of warm light chips and cold light chips which are electrically connected with the power supply positive electrode bonding pad and the power supply negative electrode bonding pad respectively are arranged in the die bonding ring, the warm light chips are sequentially distributed at the vertexes of a square, and the cold light chips are sequentially distributed in a cross shape; and the end parts of the warm light chip and the cold light chip face the center of the die bonding ring. According to the utility model, through the unique circuit layout, the chip can be rotated at any angle for die bonding, and a more uniform light emitting effect can be realized; and the time for replacing the chip film during production can be reduced, so that the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light sources, in particular to a COB solid crystal structure with high efficiency and equal chip spacing. Background Art

[0002] COB (Chip on Board), chip on board packaging, COB light source usually includes a substrate, on which are set a light-emitting area, cold light positive electrode pad, cold light negative electrode pad, warm light positive electrode pad, warm light negative electrode pad and conductive circuit; COB light source is widely used due to its long life, no pollution, high light efficiency and other characteristics. Figure 1 As shown, the existing COB light source can only be set with a chip that rotates 180 degrees or 90 degrees when bonding the crystal, which causes the COB light source to emit light unevenly, and increases the time for changing the chip film during production, reducing production efficiency, and resulting in low production efficiency. Utility Model Content

[0003] The technical problem to be solved by the utility model is that, in view of the above-mentioned defects of the prior art, a COB solid crystal structure with high efficiency and equal chip spacing is provided to solve the technical problems of the existing COB light source such as the uneven light output. Through the unique circuit layout, the chip can be rotated at any angle for solid crystal output, which can achieve a more uniform light output effect; and the time for changing the chip film during production can be reduced, thereby improving production efficiency.

[0004] In order to solve the above technical problems, the technical solution of the utility model is:

[0005] A high-efficiency COB die-bonding structure with equal chip spacing comprises a COB substrate, on which a positive power pad, a negative power pad and a die-bonding ring are arranged, and in the die-bonding ring are arranged a plurality of warm light chips and cold light chips electrically connected to the positive power pad and the negative power pad, respectively. The warm light chips are arranged in sequence at the vertices of a square, and the cold light chips are arranged in sequence in a "cross" shape, and the ends of the warm light chip and the cold light chip are both oriented toward the center of the die-bonding ring.

[0006] Preferably, the warm light chip includes a first warm light chip, a second warm light chip, a third warm light chip and a fourth warm light chip, and the first warm light chip, the second warm light chip, the third warm light chip and the fourth warm light chip are sequentially distributed along the vertices of a square.

[0007] Preferably, the cold light chip includes a first cold light chip, a second cold light chip, a third cold light chip, a fourth cold light chip, a fifth cold light chip and a sixth cold light chip, and the first cold light chip and the second cold light chip are both arranged in a transverse distribution.

[0008] Preferably, the third cold light chip, the fourth cold light chip, the fifth cold light chip and the sixth cold light chip are all arranged in a vertical distribution.

[0009] Preferably, the first warm light chip, the third cold light chip, the second warm light chip, the second cold light chip, the third warm light chip, the sixth cold light chip, the fourth warm light chip and the first cold light chip are sequentially distributed along the edge of the circle.

[0010] Preferably, the fourth cold light chip and the fifth cold light chip are both located on a vertical diameter line of the circle.

[0011] By adopting the above technical scheme, the utility model provides a COB solid crystal structure with high efficiency and equal chip spacing, which has the following beneficial effects: a plurality of warm light chips and cold light chips electrically connected to the positive power pad and the negative power pad, respectively, are arranged in the solid crystal ring of the COB solid crystal structure with high efficiency and equal chip spacing, and the warm light chips are arranged in sequence in the vertices of a square, and the cold light chips are arranged in sequence in the shape of a "cross", and the ends of the warm light chip and the cold light chip are both facing the center of the solid crystal ring. Through the unique circuit layout, the chip can be rotated at any angle for solid crystal, and a more uniform light output effect can be achieved; and the time for changing the chip film during production can be reduced, thereby improving production efficiency, and the production efficiency is relatively high. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of an existing COB light source;

[0013] Figure 2 It is a schematic diagram of the structure of the utility model;

[0014] In the figure, 1-COB substrate, 2-positive power pad, 3-negative power pad, 4-solid die ring, 5-first warm light chip, 6-second warm light chip, 7-third warm light chip, 8-fourth warm light chip, 9-first cold light chip, 10-second cold light chip, 11-third cold light chip, 12-fourth cold light chip, 13-fifth cold light chip, 14-sixth cold light chip. DETAILED DESCRIPTION

[0015] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0016] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0017] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0018] like Figure 1 As shown, in the structural schematic diagram of the utility model, the high-efficiency COB solid crystal structure with equal chip spacing includes a COB substrate 1, on which a positive power pad 2, a negative power pad 3 and a solid crystal ring 4 are arranged, and a plurality of warm light chips and cold light chips electrically connected to the positive power pad 2 and the negative power pad 3 are arranged in the solid crystal ring 4, respectively. The warm light chips are arranged in a square shape with the vertices distributed in sequence, and the cold light chips are arranged in a "cross" shape in sequence, and the ends of the warm light chips and the cold light chips are all facing the center of the solid crystal ring. It can be understood that the COB substrate 1 is arranged in a square shape, and the cross-section of the COB substrate 1 is a square, or a rectangle, etc. The positive power pad 2, the warm light chip, the cold light chip and the negative power pad 3 are all welded on the aluminum substrate 1, which can be used to connect to an external power supply. The COB substrate 1 can be a general PCB circuit board, etc., or an aluminum light source substrate, etc.

[0019] Specifically, the warm light chip includes a first warm light chip 5, a second warm light chip 6, a third warm light chip 7 and a fourth warm light chip 8, and the first warm light chip 5, the second warm light chip 6, the third warm light chip 7 and the fourth warm light chip 8 are sequentially arranged along the vertices of the square; the cold light chip includes a first cold light chip 9, a second cold light chip 10, a third cold light chip 11, a fourth cold light chip 12, a fifth cold light chip 13 and a sixth cold light chip 14, and the first cold light chip 9 and the second cold light chip 10 are horizontal The third cold light chip 11, the fourth cold light chip 12, the fifth cold light chip 13 and the sixth cold light chip 14 are all arranged in a vertical distribution; the first warm light chip 5, the third cold light chip 11, the second warm light chip 6, the second cold light chip 10, the third warm light chip 7, the sixth cold light chip 14, the fourth warm light chip 8 and the first cold light chip 9 are all arranged in sequence along the edge of the circle and are evenly spaced; the fourth cold light chip 12 and the fifth cold light chip 13 are both located on the vertical diameter line of the circle. It can be understood that the above-mentioned warm light chip can be a warm white light LED chip or an LED light-emitting lamp bead, etc., and the above-mentioned cold light chip can be a cold white light LED chip or an LED light-emitting lamp bead, etc. .

[0020] It can be understood that the above-mentioned chip is surrounded by a white oil layer on the outside, that is, a white oil layer is provided on the bottom and outer edge of each chip. The white oil layer can be white oil, etc., and the white oil is filled in the bottom of the chip to lift the chip. The edge of the chip uses white oil to form a wall, so that the chip is lifted and relatively independent, thereby preventing the chipset from being interfered with and shielded by the fluorescent powder of other color chipsets in the chip array. During production, the bottom layer is used as the circuit and the surface layer plays a cushioning role. When the spraying process is used to make the warm light part, there is no need to make a double-process high and low steel mesh. A safe distance is maintained between the steel mesh, and there is no risk of collapse and desoldering of the gold wire.

[0021] It can be understood that the utility model has a reasonable design and a unique structure. Through the unique circuit layout, the chip can be rotated at any angle for solid crystal, which can achieve a more uniform light output effect; and it can reduce the time for changing chip films during production, thereby improving production efficiency, and the production efficiency is relatively high.

[0022] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. A COB bonding structure with high efficiency and equal chip spacing, comprising a COB substrate, on which a positive power pad, a negative power pad and a bonding ring are arranged, characterized in that: A plurality of warm light chips and cold light chips electrically connected to the positive power pad and the negative power pad are arranged in the die-bonding ring. The warm light chips are arranged in sequence at the vertices of a square, and the cold light chips are arranged in sequence in a "cross" shape. The ends of the warm light chip and the cold light chip are both facing the center of the die-bonding ring.

2. The high-efficiency COB die bonding structure with equal chip spacing according to claim 1 is characterized in that: The warm light chip includes a first warm light chip, a second warm light chip, a third warm light chip and a fourth warm light chip, and the first warm light chip, the second warm light chip, the third warm light chip and the fourth warm light chip are sequentially distributed along the vertices of the square.

3. The high-efficiency COB die bonding structure with equal chip spacing according to claim 2 is characterized in that: The cold light chips include a first cold light chip, a second cold light chip, a third cold light chip, a fourth cold light chip, a fifth cold light chip and a sixth cold light chip, and the first cold light chip and the second cold light chip are both arranged in a transverse distribution.

4. The high-efficiency COB die bonding structure with equal chip spacing according to claim 3 is characterized in that: The third cold light chip, the fourth cold light chip, the fifth cold light chip and the sixth cold light chip are all arranged in a vertical distribution.

5. The high-efficiency COB die bonding structure with equal chip spacing according to claim 3 is characterized in that: The first warm light chip, the third cold light chip, the second warm light chip, the second cold light chip, the third warm light chip, the sixth cold light chip, the fourth warm light chip and the first cold light chip are sequentially distributed along the edge of the circle.

6. The high-efficiency COB die-bonding structure with equal chip spacing according to claim 5, characterized in that: The fourth cold light chip and the fifth cold light chip are both located on the vertical diameter line of the circle.

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