Heating substrate for thermal printing head based on high-stability connector

Abstract

The utility model relates to the technical field of thermal printing head manufacturing, in particular to a heating substrate for a thermal printing head based on a high-stability connector, which is reasonable in structure, simple and convenient to assemble and capable of effectively improving the quality of a printing head product, and is characterized in that a convex boss is arranged at the lower part of the rear end of a plastic shell of the connector; the width of the boss is larger than the length of a single lower-row pin, the upper surface of the boss is provided with more than two pin grooves corresponding to the lower-row pins in a one-to-one correspondence manner, the lower-row pins are arranged above the boss, and the lower parts of the lower-row pins are embedded with the pin grooves. And the consistency and the stability of the product can be obviously improved.

Description

Technical field:

[0001] The utility model relates to the technical field of thermal print head manufacturing, in particular to a heating substrate for a thermal print head based on a high-stability connector, which has a reasonable structure and is easy to assemble and can effectively improve the product quality of the print head. Background technology:

[0002] As we all know, the key component of a thermal print head is a heating substrate for a thermal print head. A heating element and an electrode wire connected to the heating element are arranged on the heating substrate for a thermal print head. At the same time, a connector for connecting to an external signal sending component is also provided. The connector plays a role in transmitting data signals. Specifically, the signal sent from the printer main board is connected to the connector on the heating substrate for the thermal print head through a cable for signal transmission. Therefore, the stability of the connector directly determines the transmission quality of the signal.

[0003] At present, there are two main types of connector installation on the thermal substrate of thermal print heads, namely, direct plug-in connector and card board connector. The direct plug-in connector first installs the connector in the through-hole pad of the PCB, and then fixes it manually with solder wire. The card board connector directly clamps the connector on the pad (without reserved solder) and only relies on mechanical fixation, or clamps it on the pad (reserve solid solder paste) and fixes it by melting the solder paste, and then uses ultraviolet UV glue to fix the front and back of the connector for protection. The subsequent ultraviolet UV glue layer is complicated to operate when applied in a small space, and it is easy to cause the coating width and length to exceed the connector installation area. The width and length of the glue layer are too large, resulting in poor consistency in the subsequent heat sink assembly, affecting product quality.

[0004] In addition, with the advancement of automated production, automated equipment can be used to complete the assembly of connectors and heating substrates for thermal print heads. However, at the current stage, the automated assembly of connectors has low positioning accuracy, which is not conducive to improving automated work efficiency. Summary of the invention:

[0005] In view of the shortcomings and deficiencies in the prior art, the utility model proposes a heating substrate for a thermal print head based on a high-stability connector, which has a reasonable structure, is easy to assemble, can effectively improve product consistency, and is conducive to improving the efficiency of product automated assembly.

[0006] The utility model achieves this through the following measures:

[0007] A heating substrate for a thermal print head based on a high-stability connector is provided, comprising an insulating substrate, a base glaze layer on the surface of the insulating substrate, a heating resistor and an electrode wire on the base glaze layer, a soldering pad connected to the electrode wire on the surface of the insulating substrate, and a connector fixed to the insulating substrate by soldering the soldering pad. The connector comprises a plastic shell, and corresponding upper and lower rows of pins are arranged on the plastic shell. The connector is characterized in that a protruding boss is provided at the lower rear end of the plastic shell of the connector, the width of the boss is greater than the length of a single lower row pin, and at least two pin grooves corresponding to the lower row pins are provided on the upper surface of the boss corresponding to the lower row pins, and the lower row pins are arranged above the boss, and the lower portion of the lower row pins is engaged with the pin grooves.

[0008] The upper surface of the connector plastic shell of the utility model is provided with an alignment mark, and the alignment mark is convex or concave, and the upper surface of the insulating substrate is also provided with a corresponding alignment mark.

[0009] The thickness of the boss at the front end of the connector plastic shell of the utility model ranges from 0.05 to 0.1 mm, which is used to provide sufficient support strength for the lower row of pins and increase insulation reliability.

[0010] The alignment mark of the utility model is in the shape of a circle or a cross. Furthermore, the alignment mark is in the shape of a circular convex point or a circular concave part.

[0011] The junction between the connector and the insulating substrate of the utility model is covered with a UV ultraviolet light curing adhesive layer.

[0012] The utility model provides a connector with a front end boss structure on a heating substrate for a thermal print head, and effectively improves the support stability of the lower row of pins of the connector through the front end boss of the plastic shell, and the boss made of insulating material can ensure a reliable insulation effect. In addition, since a prefabricated plastic boss is provided, the operation of additionally coating UV glue on the back for wrapping in the prior art is avoided, and the problem of large glue width and glue length caused by coating ultraviolet UV glue is solved, thereby improving the compatibility of the heat sink installed by the terminal customer; the utility model also adds a recognition identification circle on the front of the connector and reserves a corresponding recognition circle on the insulating ceramic substrate, so that the automated assembly equipment can automatically identify the relative position of the recognition identification circle, thereby ensuring that the connector pins coincide with the center position of the ceramic substrate pad, thereby improving the assembly accuracy and being suitable for automated production.

[0013] Compared with the prior art, the utility model has the advantages of reasonable structure, simple assembly, and the ability to significantly improve product consistency and stability. Description of the drawings:

[0014] Attached Figure 1 It is a structural schematic diagram of the utility model.

[0015] Attached Figure 2 It is a structural schematic diagram of the connector in the utility model.

[0016] Attached Figure 3 It is an enlarged view of the connection between the connector and the heating substrate for the thermal print head in the utility model.

[0017] Attached Figure 4 It is a schematic structural diagram of a heating substrate for a thermal print head in an embodiment of the utility model.

[0018] Attached Figure 5 It is a schematic diagram of the connection state of the connector in the embodiment of the utility model.

[0019] Figure numerals: insulating substrate 1, heating resistor 2, protective adhesive layer 3, solder paste 4, connector 5, UV ultraviolet light curing adhesive layer 6, plastic shell 7, upper row of pins 8, lower row of pins 9, boss 10, alignment mark 11. Specific implementation method:

[0020] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0021] As attached Figure 1 As shown, the utility model proposes a heating substrate for a thermal print head based on a high-stable connector, which is provided with an insulating substrate 1, a bottom glaze layer is provided on the surface of the insulating substrate 1, a heating resistor 2 and an electrode wire are arranged on the bottom glaze layer, and a soldering pad connected to the electrode wire is also provided on the surface of the insulating substrate 1. The connector 5 is fixed to the insulating substrate 1 by soldering the soldering pad. The connector 5 includes a plastic shell 7, and the plastic shell 7 is provided with corresponding upper row pins 8 and lower row pins 9. The lower rear end of the plastic shell of the connector 5 has an outwardly protruding boss 10, and the width of the boss 10 is greater than the length of a single lower row pin. The upper surface of the boss 10 corresponds to the lower row pins and is provided with more than two pin grooves corresponding to the lower row pins one by one. The lower row pins 9 are arranged above the boss 10, and the lower part of the lower row pins 9 is engaged with the pin grooves.

[0022] In the present invention, an alignment mark 11 is disposed on the upper surface of the plastic shell of the connector 5 . The alignment mark 11 is convex or concave. A corresponding alignment mark 11 is also disposed on the upper surface of the insulating substrate 1 .

[0023] The thickness of the boss 10 at the front end of the connector plastic shell of the present invention ranges from 0.05 to 0.1 mm, and is used to provide sufficient support strength for the lower row of pins and increase insulation reliability.

[0024] The alignment mark 11 of the present invention is circular or cross-shaped. Furthermore, the alignment mark 11 is a circular convex point or a circular concave part.

[0025] Example:

[0026] This example provides a heating substrate for a thermal print head based on a high-stability connector, as shown in the attached Figure 2 As shown, the plastic shell of the connector 5 corresponds to the lower side of the lower row of pins, and is extended to form a boss 10, thereby providing a plastic reinforcement part for the lower layer of pins. The height of the boss-shaped plastic reinforcement part cannot exceed the size of the card opening to ensure that it does not affect the use function of the card connector. At the same time, a recognition alignment circle is added to the top layer of the plastic shell, which can be convex or concave, to ensure that the visual device can recognize the edge;

[0027] like Figure 3 As shown, the solder paste is evenly coated on the pad where the connector needs to be installed, and the connector is installed on the heating substrate for the thermal print head coated with the solder paste through a special clamp. The alignment is ensured by visual recognition equipment and alignment marks to ensure that the center of the connector pin coincides with the center of the pad on the substrate, and the top surface of the connector 5 is tightly matched with the thickness side of the thermal print head ceramic substrate. The opening size of the connector 5 is less than the thickness of the ceramic substrate. After the connector 5 is installed, the solder on the pad is pushed to the surrounding of the pad by the pin, and the product with the connector installed is placed on the carrier, and then the carrier is placed on the reflow oven track for reflow curing; after the product is reflowed, after high temperature, a whole line of solder paste shrinks according to each pad to fix the connector on the pad surface, and the solder between adjacent pads shrinks without bridging.

[0028] like Figure 4 and Figure 5 As shown, after welding, a layer of flexible UV ultraviolet light-curing glue is covered on the top and back of the connector, and special equipment is used to cure it to protect the connector 5, reduce the risk of short circuit caused by external foreign matter, and also improve the stability of the connector 5.

[0029] Compared with the prior art, the utility model has the advantages of reasonable structure, simple assembly, and the ability to significantly improve product consistency and stability.

Claims

1. A heating substrate for a thermal print head based on a high-stability connector, comprising an insulating substrate, a base glaze layer on the surface of the insulating substrate, a heating resistor and an electrode wire on the base glaze layer, a solder pad connected to the electrode wire on the surface of the insulating substrate, the connector is fixed on the insulating substrate by soldering the solder pad, the connector comprises a plastic shell, and corresponding upper and lower rows of pins are arranged on the plastic shell, characterized in that: The rear end lower portion of the connector's plastic shell has an outwardly protruding boss, the width of the boss is greater than the length of a single lower row pin, and the upper surface of the boss is provided with two or more pin grooves corresponding to the lower row pins, the lower row pins are arranged above the boss, and the lower portion of the lower row pins is engaged with the pin grooves.

2. A heating substrate for a thermal print head based on a high-stability connector according to claim 1, characterized in that: An alignment mark is arranged on the upper surface of the connector plastic shell, and the alignment mark is convex or concave, and a corresponding alignment mark is also arranged on the upper surface of the insulating substrate.

3. The heating substrate for a thermal print head based on a high-stability connector according to claim 1, characterized in that: The thickness of the boss at the front end of the connector plastic shell ranges from 0.05 to 0.1 mm.

4. A heating substrate for a thermal print head based on a high-stability connector according to claim 2, characterized in that: The alignment mark is circular, and the alignment mark is a circular convex point or a circular concave part.

5. The heating substrate for a thermal print head based on a high-stability connector according to claim 1, characterized in that: The junction between the connector and the insulating substrate is covered with a UV ultraviolet light curing adhesive layer.

Images