Chip feeding device and die bonder

Abstract

The utility model discloses a chip feeding device and a die bonder, the chip feeding device comprises a base, a material belt feeding disc and a winding belt driving mechanism, the material belt feeding disc is rotatably installed on the base, a material roll is wound on the material belt feeding disc, and the material roll comprises a winding belt and a chip embedded in a winding belt groove; the base is provided with a coiled tape recycling cavity, the coiled tape driving mechanism is installed on the base, the coiled tape driving mechanism is configured to drive coiled tapes released from the material tape feeding disc to be conveyed to the chip feeding position, and chips on the coiled tapes located at the chip feeding position are taken out by the chip mounting device; the tape winding driving mechanism is further configured to output tape winding waste of which the chips are taken away through the tape winding recycling cavity, so that interference between the tape winding waste and a movement mechanism below the base is avoided when the tape winding waste is output. According to the chip feeding device, interference between the coiled tape waste and the movement mechanism below the base can be avoided when the coiled tape waste is output, and the compatibility of the chip feeding device is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor packaging equipment, and in particular, relates to a chip feeding device and a die bonding machine. Background Art

[0002] Die bonding refers to the use of conductive materials to fix the chip to the carrier. Since die bonding is directly related to the performance and stability of the circuit, it is a core link in the semiconductor packaging process.

[0003] At present, in the semiconductor chip bonding process, two chip supply methods are usually adopted: feeder feeding or wafer tray feeding. The existing feeder feeding mechanism generally supplies chips in such a way that after the chips are taken out, the waste tape is directly output from the bottom of the feeder feeding mechanism. In this way, if there are other mechanical mechanisms (such as motion modules, conveyor tracks, etc.) under the feeder feeding mechanism, the output of the waste tape will interfere with the mechanical mechanism under the feeder feeding mechanism, affecting the normal operation of the mechanical mechanism under the feeder feeding mechanism. Utility Model Content

[0004] The purpose of the present application is to provide a chip feeding device to solve the problem in the prior art that the tape of the chip feeding device is directly output from the bottom of the feeder feeding mechanism, which may interfere with other mechanical mechanisms. In addition, the present application also provides a die bonding machine including the chip feeding device.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a chip feeding device, which includes a base, a tape feeding tray and a tape drive mechanism, wherein:

[0007] The tape supply tray is rotatably mounted on the base, and the tape supply tray is wound with a material roll, which includes a tape roll and a chip embedded in a tape roll groove;

[0008] A tape recovery cavity is provided on the base, and a tape drive mechanism is installed on the base. The tape drive mechanism is configured to drive the tape released from the tape supply tray to be transported to the chip loading position, and the chip on the tape at the chip loading position is taken out by the chip placement device;

[0009] The tape drive mechanism is also configured to output the tape waste from which the chip is taken away through the tape recovery chamber to avoid interference between the tape waste and the motion mechanism under the base during output.

[0010] By setting a tape recovery chamber on the base, the tape driving mechanism will take away the tape waste of the chip and output it through the tape recovery chamber, which can avoid interference between the tape waste and the moving mechanism under the base during output. The overall structure is simple and the design is ingenious, which is conducive to improving the compatibility of the chip feeding device.

[0011] Optionally, the material roll includes a film sheet attached to the tape, which encapsulates the chip in the groove of the tape; the chip feeding device also includes a film tape recovery mechanism, which is configured to automatically peel off and recover the film sheet on the tape before the tape is conveyed to the chip loading station.

[0012] By setting up a film tape recovery mechanism, the film on the material roll can be automatically peeled off and recovered while realizing automatic chip feeding.

[0013] Optionally, the film tape recovery mechanism includes a film tape recovery drive assembly, a film tape recovery disk and a tension control assembly. The film tape recovery disk is rotatably mounted on a base. The film strip peeled off from the roll is wound onto the film tape recovery disk after passing through the tension control assembly. The tension control assembly is configured to adjust the tension of the peeled film strip between the roll and the film tape recovery disk in real time. The film tape recovery drive assembly is configured to drive the film tape recovery disk to rotate so as to automatically peel off the film strip on the roll for recovery.

[0014] Through the cooperation of the film tape recovery drive component and the film tape recovery disk, automatic stripping and recovery of the film is achieved, providing a film tape recovery mechanism with a simple structure and easy implementation; through the tension control component, real-time adjustment of the tension of the stripped film between the winding tape and the film tape recovery disk is achieved to ensure that the tension of the stripped film between the winding tape and the film tape recovery disk is constant.

[0015] Optionally, the film tape recovery drive assembly includes a first motor and a first gear set, and the first motor drives the film tape recovery disk to rotate through the first gear set. A film tape recovery drive assembly with compact structure, high transmission efficiency, high precision, high stability and reliability, and long service life is provided.

[0016] Optionally, the tension control assembly includes a swinging member and a tensioning wheel, the first end of the swinging member is hinged on the base as a connecting end, a guide wheel is installed at the first end of the swinging member, and the tensioning wheel is installed in the middle of the swinging member. The diaphragm passes around the guide wheel and the tensioning wheel in sequence and is connected to the film tape recovery disk, so that the tensioning wheel can tension the diaphragm through its own gravity.

[0017] Through the cooperation of the swinging member, the tensioning wheel and the guide wheel, the diaphragm is tensioned by the tensioning wheel's own gravity, providing a tension control component with a simple structure, low cost and no power required.

[0018] Optionally, positioning holes are formed on the sides of the tape, and the tape driving mechanism includes a second motor, a second gear set and a driving disk. The driving disk is rotatably mounted on the base, and the second motor drives the driving disk to rotate via the second gear set. There are multiple driving teeth on the edge of the driving disk, and the driving teeth engage with the positioning holes on the tape. The second motor conveys the tape engaged with the driving teeth via the second gear set and the driving disk.

[0019] The cooperation between the second motor and the second gear set realizes driving the driving disk to rotate, and the cooperation between the driving disk and the tape is used to realize the conveying of the tape. The overall structure is compact and the conveying accuracy is high.

[0020] Optionally, a cutting mechanism is installed at the output port of the tape recovery chamber, and the cutting mechanism is configured to cut the waste tape into several sections.

[0021] By setting up the cutting mechanism, the waste tape can be cut into a plurality of small sections, so as to facilitate the recycling of the waste tape.

[0022] Optionally, the tape recovery chamber extends along the length direction of the base, the input port of the tape recovery chamber is located below the chip material collection station, and the conveying direction of the waste material in the tape recovery chamber is opposite to the conveying direction of the tape driven by the tape driving mechanism.

[0023] By arranging the tape recovery chamber to extend along the length direction of the base and conveying the waste tape in the opposite direction to the conveying direction of the tape, the recovery of the waste tape is facilitated and the output port of the waste tape is kept away from the moving mechanism under the base as much as possible.

[0024] Optionally, the tape recovery chamber is opened at the bottom of the base, the input port of the tape recovery chamber is arranged upward, and the output port of the tape recovery chamber is arranged downward.

[0025] By arranging the tape recovery chamber at the bottom of the base, with the input port of the tape recovery chamber facing upwards and the output port facing downwards, the recovery of waste tape is further facilitated.

[0026] On the second aspect, the present application also proposes a die bonding machine, which includes a material conveying device, a glue dispensing device, the above-mentioned chip feeding device and a patch device, wherein the material conveying device is configured to transport the lead frame from the glue dispensing station to the patch station, the glue dispensing device is configured to perform glue dispensing on the lead frame at the glue dispensing station, the chip feeding device is configured to provide chips to the patch device, and the patch device is configured to pick up the chips provided by the chip feeding device and place the picked up chips on the lead frame at the patch station.

[0027] Through the cooperation of the material transmission device, the dispensing device, the chip feeding device and the patch device, the automatic die bonding processing of the semiconductor chip is realized, with a high degree of automation and high working efficiency; at the same time, the chip feeding device can avoid interference with the moving mechanism under the base during the output of the waste tape, which can expand the application scenarios of the chip feeding device and is conducive to improving the compatibility of the die bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of an existing material strip;

[0029] Figure 2is a schematic diagram of the three-dimensional structure of a chip feeding device provided in an embodiment of the present application;

[0030] Figure 3 is a front view schematic diagram of a chip feeding device provided in an embodiment of the present application;

[0031] Figure 4 is a rear view schematic diagram of a chip feeding device provided in an embodiment of the present application;

[0032] Figure 5 It is a structural schematic diagram of the film tape recovery mechanism and the tape drive mechanism of the chip feeding device provided in an embodiment of the present application.

[0033] Figures 1 to 5 The following reference numerals are included:

[0034] Base 10, tape recovery chamber 11;

[0035] Material belt supply tray 20;

[0036] The tape drive mechanism 30, the second motor 300, the second gear set 301, the drive disc 302, and the drive gear 303;

[0037] Tape 40, groove 41, tape waste 42, positioning hole 43;

[0038] The film tape recovery mechanism 50 , the film tape recovery disk 51 , the tension control assembly 52 , the swinging member 520 , the tensioning wheel 521 , the guide wheel 522 , the induction member 523 , the first motor 53 , and the first gear set 54 . DETAILED DESCRIPTION

[0039] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0040] At present, in the semiconductor chip bonding process, two chip supply methods are usually adopted: feeder feeding or wafer tray feeding. The existing feeder feeding mechanism generally supplies chips in such a way that after the chips are taken out, the waste tape is directly output from the bottom of the feeder feeding mechanism. If there are other mechanical mechanisms (such as motion modules, conveyor tracks, etc.) under the feeder feeding mechanism, the specific situation may be: feeder feeding is a feeding method, and another feeding method is to feed through a wafer tray. If it is to be compatible, the equipment will install both feeding methods. According to the actual production process, if the configuration is set as optional, the output of the waste tape of the feeder feeding mechanism will interfere with the wafer tray feeding mechanism below. Affect the normal operation of the mechanical mechanism below the feeder feeding mechanism.

[0041] Therefore, this application proposes a chip feeding device, please refer to Figures 1 to 4As shown, the chip feeding device provided in the embodiment of the present application includes a base 10, a material tape supply tray 20 and a reel driving mechanism 30. The material tape supply tray 20 is rotatably mounted on the base 10. The material tape supply tray 20 is wound with a material roll, and the material roll includes a reel 40 and a chip embedded in a reel groove 41. A reel recovery chamber 11 is opened on the base 10. The reel driving mechanism 30 is installed on the base 10. The reel driving mechanism 30 is configured to drive the reel 40 released from the material tape supply tray 20 to be transported to the chip upper material position, and the chip on the reel 40 located at the chip upper material position is taken out by the patch device. The reel driving mechanism 30 is also configured to output the waste tape 42 of the chip through the reel recovery chamber 11 to avoid interference between the waste tape 42 and the moving mechanism below the base 10 during output.

[0042] It can be seen that by setting the tape recovery chamber 11 on the base 10, the tape driving mechanism 30 will output the tape waste 42 that has taken away the chip through the tape recovery chamber 11, which can avoid interference between the tape waste 42 and the moving mechanism under the base 10 during output. The overall structure is simple and the design is ingenious, which is conducive to improving the compatibility of the chip feeding device.

[0043] As an embodiment, the material roll includes a film (not shown in the figure) applied to the tape 40, and the film encapsulates the chip in the groove 41 of the tape 40; the chip feeding device also includes a film tape recovery mechanism 50, and the film tape recovery mechanism 50 is configured to automatically peel off and recover the film on the tape 40 before the tape 40 is conveyed to the chip loading station.

[0044] It can be seen that by setting up the film tape recovery mechanism 50, while realizing automatic chip feeding, the film on the material roll can be automatically peeled off and recovered, providing a chip feeding device that combines chip loading, film tape recovery and roll tape waste 42 recovery.

[0045] As an embodiment, the film tape recovery mechanism 50 includes a film tape recovery drive assembly, a film tape recovery disk 51 and a tension control assembly 52. ​​The film tape recovery disk 51 is rotatably mounted on the base 10. The film strip peeled off from the roll 40 is wound onto the film tape recovery disk 51 after passing through the tension control assembly. The tension control assembly 52 is configured to adjust the tension of the stripped film strip between the roll 40 and the film tape recovery disk 51 in real time. The film tape recovery drive assembly is configured to drive the film tape recovery disk 51 to rotate around the rotating axis at its own center so as to automatically peel off the film strip on the roll 40 for recovery.

[0046] It can be seen that through the cooperation of the film tape recovery drive component and the film tape recovery disk 51, the automatic stripping and recovery of the film is realized, providing a film tape recovery mechanism 50 with a simple structure and easy implementation; through the tension control component 52, real-time adjustment of the tension of the stripped film between the take-up tape and the film tape recovery disk 51 is achieved to ensure that the tension of the stripped film between the take-up tape and the film tape recovery disk is constant, ensuring that the film is in a tensioned state during the recovery process.

[0047] See also Figure 1 , Figure 4 and Figure 5 As shown, as an embodiment, the film tape recovery drive assembly includes a first motor 53 and a first gear set 54, and the first motor 53 drives the film tape recovery disk 51 to rotate through the first gear set 54. Optionally, the driving end of the first motor 53 is meshed with the first gear set 54, and a transmission wheel meshed with the first gear set 54 is also installed on the back of the film tape recovery disk 51. The first motor 53 drives the film tape recovery disk 51 to rotate through the first gear set 54. It can be seen that the present application provides a film tape recovery drive assembly with a compact structure, high transmission efficiency, high precision, high stability and reliability, and long service life.

[0048] As an embodiment, the tension control assembly 52 includes a swinging member 520 and a tensioning wheel 521. The first end of the swinging member 520 is hinged on the base 10 as a connecting end. The first end of the swinging member 520 is installed with a guide wheel 522. The tensioning wheel 521 is installed in the middle of the swinging member 520. The diaphragm passes around the guide wheel 522 and the tensioning wheel 521 in sequence and is then connected to the film tape recovery disk 51, so that the tensioning wheel 521 tensions the diaphragm by its own gravity.

[0049] Specifically, the tension control assembly 52 further includes a sensor 523, which is mounted on the base 10 and disposed near the second end of the swing member 520. The sensor 523 is configured to control the first motor 53 to work or stop according to the detection result. Optionally, the sensor 523 may be a through-beam photoelectric sensor. If the second end of the swing member 520 blocks the through-beam photoelectric sensor, it indicates that the tension is balanced at this time; if the second end of the swing member 520 leaves the sensing area of ​​the through-beam photoelectric sensor, the first motor 53 works to ensure that the second end of the swing member 520 returns to the sensing area of ​​the through-beam photoelectric sensor.

[0050] It can be seen that through the cooperation of the swing member 520, the tensioning wheel 521 and the guide wheel 522, the diaphragm is tensioned by the self-gravity of the tensioning wheel 521, providing a tension control component 52 with a simple structure, low cost and no power required.

[0051] As an embodiment, a positioning hole 43 is formed on the side of the tape 40, and the tape driving mechanism 30 includes a second motor 300, a second gear set 301 and a driving disk 302. The driving disk 302 is rotatably mounted on the base 10. The second motor 300 drives the driving disk 302 to rotate through the second gear set 301. The driving disk 302 has a plurality of driving teeth 303 on the edge. The driving teeth 303 engage with the positioning holes 43 on the tape 40. The second motor 300 conveys the tape 40 engaged with the driving teeth 303 via the second gear set 301 and the driving disk 302.

[0052] It can be seen that the cooperation between the second motor 300 and the second gear set 301 realizes the driving disk 302 to rotate, and the cooperation between the driving disk 302 and the take-up tape 40 realizes the conveying of the take-up tape 40. The overall structure is compact and the conveying accuracy is high.

[0053] As a feasible implementation method, only one of the first motor 53 and the second motor 300 can be selected, and a third gear set can be configured to connect the first gear set 54 and the second gear set 301 through the third gear set, so as to achieve the effect of simultaneously driving the film tape recovery disk 51 and the driving disk 302 to move through one driving motor.

[0054] Please refer again Figure 2 As shown, as an embodiment, a cutting mechanism (not shown) is installed at the output port of the web recovery chamber 11, and the cutting mechanism is configured to cut the web waste 42 into several sections.

[0055] Specifically, the cutting mechanism may be connected to the output port of the tape recovery chamber 11 , or may be disposed below the output port of the tape recovery chamber 11 .

[0056] Specifically, the cutting mechanism may adopt scissor-like motion cutting, or may adopt a cylinder to drive the cutters to move toward each other for cutting.

[0057] It can be seen that by providing the cutting mechanism, the waste tape 42 can be cut into a plurality of small sections, so as to facilitate the recycling of the waste tape 42 .

[0058] Please refer again Figure 3 As shown, as an embodiment, the tape recovery chamber 11 extends along the length direction of the base 10, the input port of the tape recovery chamber 11 is located below the chip material removal station, and the conveying direction of the waste material 42 in the tape recovery chamber 11 is opposite to the tape conveying direction driven by the tape driving mechanism 30.

[0059] It can be seen that by setting the tape recovery chamber 11 to extend along the length direction of the base 10, and the conveying direction of the tape waste 42 is opposite to the conveying direction of the tape, the recovery of the tape waste 42 is facilitated, and the output port of the tape waste 42 is kept away from the moving mechanism under the base 10 as much as possible.

[0060] As an implementation manner, the tape recovery chamber 11 is opened at the bottom of the base 10, the input port of the tape recovery chamber 11 is arranged upward, and the output port of the tape recovery chamber 11 is arranged downward.

[0061] It can be seen that the tape recovery chamber 11 is arranged at the bottom of the base 10, with the input port of the tape recovery chamber 11 facing upward and the output port facing downward, which further facilitates the recovery of waste tape.

[0062] Compared with the prior art, the chip feeding device proposed in this embodiment has the following advantages:

[0063] 1) A tape recovery chamber is added to the base, and the waste tape is output through the tape recovery chamber, which can avoid interference between the waste tape and the motion mechanism under the base during output. The overall structure is simple and the design is ingenious, which is conducive to improving the compatibility of the chip feeding device;

[0064] 2) While realizing automatic chip feeding, it can also realize automatic stripping and recycling of the membrane;

[0065] 3) A tension control component is provided to ensure that the tension of the stripped film between the tape and the film tape recovery disk is constant;

[0066] 4) Both the material conveying and the film recovery adopt the gear transmission mode, which has compact structure, high transmission efficiency and high transmission precision;

[0067] 5) The cutting mechanism can cut the waste tape into multiple small sections to facilitate the recycling of the waste tape.

[0068] On the other hand, an embodiment of the present application also proposes a die bonding machine, which includes a material conveying device, a glue dispensing device, the above-mentioned chip feeding device and a patch device, wherein the material conveying device is configured to transport the lead frame from the glue dispensing station to the patch station, the glue dispensing device is configured to perform glue dispensing on the lead frame at the glue dispensing station, the chip feeding device is configured to provide chips to the patch device, and the patch device is configured to pick up the chips provided by the chip feeding device and place the picked up chips on the lead frame at the patch station.

[0069] Through the cooperation of the material transmission device, the dispensing device, the chip feeding device and the patch device, the automatic die bonding processing of the semiconductor chip is realized, with a high degree of automation and high working efficiency; at the same time, the chip feeding device can avoid interference with the moving mechanism under the base during the output of the waste tape, which can expand the application scenarios of the chip feeding device and is conducive to improving the compatibility of the die bonding machine.

[0070] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A chip feeding device, characterized in that: The chip feeding device comprises a base, a tape feeding tray and a tape winding driving mechanism, wherein: The material tape supply tray is rotatably mounted on the base, and a material roll is wound around the material tape supply tray, wherein the material roll includes a tape and a chip embedded in a groove of the tape; The base is provided with a tape recovery cavity, the tape drive mechanism is installed on the base, and the tape drive mechanism is configured to drive the tape released from the tape supply tray to be transported to the chip upper material position, and the chip on the tape located at the chip upper material position is taken out by the chip placement device; The tape drive mechanism is also configured to output the tape waste from which the chip is taken away through the tape recovery chamber to avoid interference between the tape waste and the motion mechanism under the base during output.

2. The chip feeding device according to claim 1, characterized in that: The material roll includes a film sheet attached to the tape, and the film sheet encapsulates the chip in the groove of the tape; the chip feeding device also includes a film tape recovery mechanism, and the film tape recovery mechanism is configured to automatically peel off and recover the film sheet on the tape before the tape is conveyed to the chip loading station.

3. The chip feeding device according to claim 2, characterized in that: The film tape recovery mechanism includes a film tape recovery drive assembly, a film tape recovery disk and a tension control assembly. The film tape recovery disk is rotatably mounted on the base. The film strip peeled off from the roll is wound onto the film tape recovery disk after passing through the tension control assembly. The tension control assembly is configured to adjust the tension of the stripped film strip between the roll and the film tape recovery disk in real time. The film tape recovery drive assembly is configured to drive the film tape recovery disk to rotate so as to automatically peel off the film strip on the roll for recovery.

4. The chip feeding device according to claim 3, characterized in that: The film tape recovery drive assembly includes a first motor and a first gear set, and the first motor drives the film tape recovery disk to rotate through the first gear set.

5. The chip feeding device according to claim 3, characterized in that: The tension control assembly includes a swinging member and a tensioning wheel. The first end of the swinging member is hinged on the base as a connecting end. A guide wheel is installed at the first end of the swinging member. The tensioning wheel is installed in the middle of the swinging member. The diaphragm is connected to the film tape recovery disk after passing through the guide wheel and the tensioning wheel in sequence, so that the tensioning wheel tensions the diaphragm through its own gravity.

6. The chip feeding device according to claim 1, characterized in that: A positioning hole is formed on the side of the tape, and the tape driving mechanism includes a second motor, a second gear set and a driving disk. The driving disk is rotatably mounted on the base, and the second motor drives the driving disk to rotate via the second gear set. A plurality of driving teeth are arranged on the edge of the driving disk, and the driving teeth engage with the positioning holes on the tape. The second motor conveys the tape engaged with the driving teeth via the second gear set and the driving disk.

7. The chip feeding device according to claim 1, characterized in that: A cutting mechanism is installed at the output port of the tape recovery chamber, and the cutting mechanism is configured to cut the tape waste into several sections.

8. The chip feeding device according to claim 1, characterized in that: The tape recovery chamber extends along the length direction of the base, the input port of the tape recovery chamber is located below the chip material retrieval station, and the conveying direction of the waste material in the tape recovery chamber is opposite to the conveying direction of the tape driven by the tape driving mechanism.

9. The chip feeding device according to claim 1, characterized in that: The tape recovery chamber is opened at the bottom of the base, the input port of the tape recovery chamber is arranged upward, and the output port of the tape recovery chamber is arranged downward.

10. A die bonding machine, characterized in that: The die bonding machine includes a material conveying device, a glue dispensing device, a chip feeding device and a patch device as described in any one of claims 1 to 9, wherein the material conveying device is configured to transport the lead frame from the glue dispensing station to the patch station, the glue dispensing device is configured to perform glue dispensing on the lead frame at the glue dispensing station, the chip feeding device is configured to provide chips to the patch device, and the patch device is configured to pick up the chips provided by the chip feeding device and place the picked up chips on the lead frame at the patch station.

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