Backboard assembly and connector

Abstract

The utility model provides a backboard assembly and a connector. The back plate assembly comprises a back plate, and an embedding groove is formed in the middle area of the back plate. The back plate assembly further comprises an insert, and one end of the insert is connected into the inlaying groove in an inlaid mode. And the surface of the other end of the insert is higher than the surface of the back plate. The embedding groove is formed in the middle area of the back plate, one end of the insert is embedded in the embedding groove, and the surface of the other end of the insert is higher than the upper surface of the back plate, so that when the back plate assembly is applied to connector assembly, the insert can provide supporting force for the middle area of the circuit board and the socket board; therefore, the deformation of the middle area between the circuit board and the socket board is reduced, the contact uniformity and stability of the socket board and the chip are effectively improved, and the signal conduction stability of the connector is effectively improved.

Description

Technical Field

[0001] The present disclosure relates to the field of connectors, and in particular to a backplane assembly and a connector. Background Art

[0002] The connector is formed by sequentially stacking and assembling a backplane, a circuit board (PCB), a socket, a chip (CPU) and a pressure plate.

[0003] For example, Chinese patent document CN114512834A discloses a chip connector for electrically connecting a chip module with a circuit board. The chip connector includes a body carrying conductive terminals, a frame surrounding the body, and a transfer plate. The body and the frame are mounted on the circuit board. The transfer plate has a first end and a second end opposite to each other. The first end is pivotally mounted on the corresponding first end of the frame and can make the transfer plate have a tendency to rotate outward. The second end is provided with a first buckling portion, and the corresponding second end of the frame is provided with a second buckling portion. The first buckling portion is buckled on the second buckling portion by pressing. The chip connector transfer plate is initially fixed by pressing the first and second buckling portions, which greatly simplifies the assembly process.

[0004] Although the technical solution of the above patent can greatly simplify the assembly process, it also has the following problems: during the assembly process of the chip connector, the circuit board is also fixed to the backplane by bolts, and the socket is fixedly connected to one side of the circuit board. When the bolts are fixed, a pulling force is generated and acts on the middle area between the Socket and the PCB, causing a large deformation of the middle area between the Socket and the PCB, thereby causing unstable contact between the Socket terminal and the chip, and further causing the connection signal of the connector to be non-conductive.

[0005] Therefore, how to improve the uniformity and stability of the contact between the socket and the chip is a problem that needs to be solved urgently. Utility Model Content

[0006] The purpose of the present disclosure is to overcome the deficiencies in the prior art and to provide a backplane assembly and a connector that can improve the uniformity and stability of the contact between the socket and the chip.

[0007] The purpose of this disclosure is achieved through the following technical solutions:

[0008] A back plate assembly comprises a back plate, wherein a mosaic groove is formed in the middle area of ​​the surface of the back plate, and the mosaic groove penetrates the back plate;

[0009] The back plate assembly also includes an inlay, one end of which is inlaid in the inlay groove;

[0010] The surface of the other end of the insert is higher than the surface of the back plate so as to abut against the circuit board.

[0011] The backplane assembly according to the embodiment of the present disclosure has at least the following advantages:

[0012] By forming an embedding groove in the middle area of ​​the back plate, one end of the embedding component is embedded in the embedding groove, and the surface of the other end of the embedding component is higher than the upper surface of the back plate, so that when the back plate assembly is used for connector assembly, the embedding component can provide a supporting force to the middle area of ​​the circuit board and the socket board, reduce the deformation of the middle area of ​​the circuit board and the socket board, thereby effectively improving the uniformity and stability of the contact between the socket board and the chip, and further effectively improving the stability of the signal conduction of the connector.

[0013] In one of the embodiments, the height difference between the surface of the insert and the surface of the back plate is 0.1 mm to 2 mm.

[0014] In one embodiment, the insert includes an edging ring block and a supporting ring block, one end of the edging ring block is connected to one end of the supporting ring block, the surrounding side surface of the edging ring block is inlaid with the inner wall of the inlay groove, one end of the supporting ring block is inlaid on the surface of the back plate, and the other end of the supporting ring block is used to abut against the circuit board.

[0015] In one of the embodiments, the edging ring block and the supporting ring block together form a position-avoiding installation hole.

[0016] In one embodiment, the insert is in the shape of a rectangular ring, a triangle, an ellipse, or a circle.

[0017] A connector comprises a backplane assembly, a circuit board, a socket board, a chip and a pressure plate as described in any of the above embodiments, wherein the backplane assembly, the circuit board, the socket board, the chip and the pressure plate are stacked in sequence, and the insert abuts against the circuit board.

[0018] The connector according to the embodiment of the present disclosure has at least the following advantages:

[0019] By using the backplane assembly disclosed in the present invention, the concave deformation in the middle area of ​​the circuit board and the socket board of the connector is reduced after assembly, thereby making the contact between the chip and the terminals of the socket board more uniform and stable, thereby effectively improving the signal conduction stability of the connector.

[0020] In one embodiment, the back plate is provided with a plurality of first through holes and a plurality of second through holes, and the back plate assembly further comprises a plurality of first bolt members and a plurality of second bolt members;

[0021] The circuit board is provided with a plurality of third through holes and a plurality of fourth through holes, one end of each of the first bolt members is arranged in the corresponding first through hole, and the other end of each of the first bolt members is arranged in the corresponding first through hole and the corresponding third through hole, one end of each of the second bolt members is arranged in the corresponding second through hole, and the other end of each of the second bolt members is arranged in the corresponding second through hole and the corresponding fourth through hole, so that the circuit board is respectively in contact with the back plate and the insert.

[0022] In one embodiment, the socket board is fixedly connected to a side of the circuit board away from the back plate, and the socket board is provided with a chip abutment groove, and one end of the chip is movably abutted in the chip abutment groove, so that the chip is communicatively connected with the circuit board through the socket board;

[0023] The projection area of ​​the socket board on the circuit board covers the projection area of ​​the insert on the circuit board.

[0024] In one embodiment, the pressing plate is provided with a plurality of fifth through holes;

[0025] The pressing plate is provided with a plurality of first spring bolts, each of which is passed through the corresponding fifth passing hole, one end of each of which is provided with a central connecting hole, and the other end of each of which is screwed to the corresponding central connecting hole;

[0026] The connector further includes a first pad;

[0027] The first pad is arranged around the periphery of the socket plate, and the first pad is provided with a plurality of sixth through holes, a plurality of first mounting grooves and a plurality of second mounting grooves, and the other end of each of the first bolt members is passed through the corresponding first through hole, the corresponding third through hole and the corresponding sixth through hole and is screwed to the corresponding central connecting hole;

[0028] The first pad is provided with a plurality of first nut members and a plurality of second nut members, one end of each of the first nut members is arranged in the corresponding first installation groove, one end of each of the second nut members is arranged in the corresponding second installation groove, and the other end of each of the second bolt members is passed through the corresponding second penetration hole and the corresponding fourth penetration hole and is threadedly connected with the corresponding first nut member;

[0029] The pressing plate is provided with a plurality of seventh penetration holes, and a plurality of second spring bolt members are provided on the pressing plate. One end of each of the second spring bolt members is penetrated through the corresponding seventh penetration hole and is threadedly connected with the corresponding second nut member.

[0030] In one embodiment, the connector further comprises a second pad, the second pad is movably connected to the pressure plate, and the second pad is arranged around the periphery of the chip;

[0031] The second pad is provided with a plurality of avoidance grooves and a plurality of eighth penetration holes, one end of each of the first spring bolt members is arranged in the corresponding avoidance groove, one end of each of the second spring bolt members is penetrated through the corresponding seventh penetration hole and the corresponding eighth penetration hole and is screwed to the corresponding second nut member so that the pressure plate abuts against the chip.

[0032] In one embodiment, the pressing plate is provided with a plurality of first positioning and mounting holes, the second pad is provided with a plurality of second positioning and mounting holes, the first pad is provided with a plurality of positioning and mounting posts, each of the positioning and mounting posts is passed through the corresponding first positioning and mounting holes and the corresponding second positioning and mounting holes, so that each of the positioning and mounting posts is movably connected to the pressing plate and the second pad;

[0033] A plurality of buckling blocks are provided at the periphery of the second pad, a plurality of buckling grooves are provided at the periphery of the pressure plate, and each of the buckling blocks is buckled with a corresponding buckling groove so that the pressure plate is buckled with the second pad.

[0034] In one embodiment, the backplane assembly further includes an insulating gasket, which is disposed between the backplane assembly and the circuit board, one side of the insulating gasket abuts against the insert and the backplane respectively, and the other side of the insulating gasket abuts against the circuit board.

[0035] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 is a schematic structural diagram of a backplane assembly in one embodiment;

[0038] Figure 2 for Figure 1 A schematic structural diagram of the back panel assembly from another perspective;

[0039] Figure 3 for Figure 2An enlarged schematic diagram of point A is shown;

[0040] Figure 4 for Figure 1 A schematic diagram of a partial explosion structure of the back plate assembly shown;

[0041] Figure 5 This is a schematic diagram of the structure of a connector in one embodiment;

[0042] Figure 6 for Figure 5 A schematic structural diagram of the connector from another perspective;

[0043] Figure 7 for Figure 5 A cross-sectional view of the structure of the connector when it is not locked;

[0044] Figure 7a for Figure 7 a partial enlarged view of the connector shown;

[0045] Figure 7b for Figure 5 A partial enlarged view of the connector when it is locked;

[0046] Figure 8 for Figure 5 Another structural cross-sectional view of the connector shown;

[0047] Fig. 9 for Figure 5 A schematic diagram of a partial structure of the connector shown;

[0048] Fig.10 for Figure 5 Schematic diagram of the partial structure of the connector shown. DETAILED DESCRIPTION

[0049] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0050] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0052] See also Figures 1 to 10 In order to better understand the connector 20 of the present disclosure, the connector 20 is further explained below:

[0053] The connector 20 of one embodiment includes a backplane assembly 10, a circuit board 500, a socket board 600, a chip 700 and a pressure plate 800. The backplane assembly 10, the circuit board 500, the socket board 600, the chip 700 and the pressure plate 800 are stacked in sequence, and the insert 200 abuts against the circuit board 500.

[0054] In this embodiment, by using the backplane assembly 10 disclosed in the present invention, the concave deformation of the middle area of ​​the circuit board 500 and the socket board 600 of the connector 20 after assembly is reduced, thereby making the contact between the chip 700 and the terminals of the socket board 600 more uniform and stable, thereby effectively improving the signal conduction stability of the connector 20.

[0055] See also Figures 1 to 4 In order to better understand the backplane assembly 10 of the present disclosure, the backplane assembly 10 is further explained below:

[0056] The backplane assembly 10 of one embodiment includes a backplane 100, and a mounting groove 101 is formed in the middle area of ​​the backplane 100. The backplane assembly 10 also includes an insert 200, and one end of the insert 200 is inserted into the mounting groove 101. The surface of the other end of the insert 200 is higher than the surface of the backplane 100, so as to abut against the circuit board.

[0057] In this embodiment, an embedding groove 101 is formed in the middle area of ​​the back plate 100, one end of the embedding component 200 is embedded in the embedding groove 101, and the surface of the other end of the embedding component 200 is higher than the upper surface of the back plate 100, so that when the back plate assembly 10 is used for connector assembly, the embedding component 200 can provide a supporting force for the middle area of ​​the circuit board and the socket board, reduce the deformation of the middle area of ​​the circuit board and the socket board, thereby effectively improving the uniformity and stability of the contact between the socket board and the chip, and further effectively improving the stability of the signal conduction of the connector.

[0058] It should also be noted that the end of the insert 200 facing away from the back plate 100 is higher than the upper surface of the back plate 100 , so that the insert 200 can well support the middle area of ​​the circuit board.

[0059] like Figure 2 and Figure 3 As shown, in one embodiment, the height difference between the surface of the insert 200 and the surface of the back plate 100 is 0.1 mm to 2 mm. It can be understood that the surface of the insert 200 is higher than the upper surface of the back plate 100, and the height difference between 0.1 mm and 2 mm can well support the middle area of ​​the circuit board and reduce the concave deformation of the middle area of ​​the circuit board.

[0060] like Figure 2 and Figure 3 As shown, in one embodiment, the insert 200 includes a trim ring block 210 and a support ring block 220, one end of the trim ring block 210 is connected to one end of the support ring block 220, the surrounding side of the trim ring block 210 is inlaid with the inner wall of the inlay groove 101, one end of the support ring block 220 is inlaid on the surface of the back plate 100, and the other end of the support ring block 220 is used to abut against the circuit board. Further, the trim ring block 210 and the support ring block 220 together form a position-avoiding mounting hole 201. It can be understood that the trim ring block 210 and the support ring block 220 are an integrally formed structure, which can improve the structural stability of the insert, and provide a supporting force to the middle area of ​​the circuit board through the support ring block 220, thereby reducing the concave deformation of the middle area of ​​the circuit board. The position-avoiding mounting hole 201 is to facilitate the electrical connection of the circuit board with other components, so as to ensure the signal conduction of the connector.

[0061] like Figure 4 As shown, in one embodiment, the shape of the insert 200 is a rectangular ring, a triangle, an ellipse or a circle. It is understandable that in this embodiment, the shape of the insert 200 is a rectangular ring, and the rectangular ring structure of the insert 200 can provide support for the circuit board while leaving a clearance installation hole to facilitate the electrical connection between the circuit board and other components, ensuring the signal conduction of the connector.

[0062] like Figure 1 and Figure 7As shown, in one embodiment, the back plate 100 is provided with a plurality of first through holes 102 and a plurality of second through holes 103, and the back plate assembly 10 further includes a plurality of first bolt members 300 and a plurality of second bolt members 400. The circuit board 500 is provided with a plurality of third through holes 501 and a plurality of fourth through holes 502, one end of each first bolt member 300 is arranged in the corresponding first through hole 102, the other end of each first bolt member 300 is arranged in the corresponding first through hole 102 and the corresponding third through hole 501, one end of each second bolt member 400 is arranged in the corresponding second through hole 103, the other end of each second bolt member 400 is arranged in the corresponding second through hole 103 and the corresponding fourth through hole 502, so that the circuit board 500 is respectively in contact with the back plate 100 and the insert 200. It can be understood that the first bolt member 300 and the second bolt member 400 are used to fix the circuit board 500 and the back plate 100, and the first through hole 102 and the third through hole 501 are used to better introduce the first bolt member 300 into the back plate 100, and the second through hole 103 and the fourth through hole 502 are used to better introduce the second bolt member 400 into the back plate 100, so as to lock and fix the back plate 100 and the circuit board 500. The first bolt member 300 and the second bolt member 400 both have a relatively stable fixing effect, which can improve the connection stability between the back plate 100 and the circuit board 500.

[0063] like Figure 7 , Fig. 9 and Fig.10As shown, in one embodiment, the socket board 600 is fixedly connected to the side of the circuit board 500 away from the back plate 100, and the socket board 600 is provided with a chip abutment groove 601. One end of the chip 700 is movably abutted in the chip abutment groove 601, so that the chip 700 is connected to the circuit board 500 through the socket board 600. The projection area of ​​the socket board 600 on the circuit board 500 covers the projection area of ​​the insert 200 on the circuit board 600. It can be understood that the socket board 600 is fixedly connected to the circuit board 500, that is, the socket board 600 and the circuit board 500 are fixed by welding, so that when the back plate 100 and the circuit board 500 are locked, the middle area of ​​the circuit board 500 will be concave, and the socket board 600 will also be concave. By adding an insert 200 to the back plate 100, the concave deformation in the middle area of ​​the circuit board 500 is reduced, that is, the concave deformation in the middle area of ​​the socket board 600 is also reduced, and a chip abutment groove 601 is opened through the socket groove, so that one end of the chip 700 can be movably abutted in the chip abutment groove 601, thereby ensuring that the contact uniformity between the chip 700 and the socket board 600 is better, thereby ensuring that the communication signal between the chip 700 and the circuit board 500 is more stable. Furthermore, the center point of the projection surface of the socket board 600 on the circuit board 500 coincides with the center point of the projection surface of the insert 200 on the circuit board 600, so that the projection area of ​​the socket board 600 on the circuit board 500 covers the projection area of ​​the insert 200 on the circuit board 600, thereby ensuring that the area supported by the insert 200 is the concave area of ​​the socket board, thereby ensuring that the insert 200 can be effectively supported, thereby further ensuring that the chip 700 and the socket board 600 have good contact uniformity, and further improving the signal conduction stability of the connector 20.

[0064] like Figure 7 , Figure 7a and Figure 7bAs shown, in one embodiment, the pressure plate 800 is provided with a plurality of fifth through holes 801. The pressure plate 800 is provided with a plurality of first spring bolt members 810, each of which is provided in the corresponding fifth through hole 801, one end of each first spring bolt member 810 is provided with a central connection hole 8101, and the other end of each first bolt member 300 is screwed with the corresponding central connection hole 8101. The connector 20 further includes a first pad 900, which is arranged around the periphery of the socket plate 600, and the first pad 900 is provided with a plurality of sixth through holes 901, a plurality of first mounting grooves 902 and a plurality of second mounting grooves 903, and the other end of each first bolt member 300 is provided in the corresponding third through hole 501 and the corresponding sixth through hole 901 and is screwed with the corresponding central connection hole 8101. The first pad 900 is provided with a plurality of first nut members 910 and a plurality of second nut members 920, one end of each first nut member 910 is arranged in the corresponding first installation groove 902, one end of each second nut member 920 is arranged in the corresponding second installation groove 903, and the other end of each second bolt member 400 is passed through the corresponding second penetration hole 103 and the corresponding fourth penetration hole 502 and is screwed to the corresponding first nut member 910. The pressing plate 800 is provided with a plurality of seventh penetration holes 802, and the pressing plate 800 is provided with a plurality of second spring bolt members 820, one end of each second spring bolt member 820 is passed through the corresponding seventh penetration hole 802 and is screwed to the corresponding second nut member 920. It is understandable that the fifth through hole 801 can better allow the first spring bolt 810 to be introduced, and the central connection hole 8101 at one end of the first spring bolt 810 is screwed with the corresponding first bolt 300, so that the pressure plate 800 and the back plate 100 are locked by the first spring bolt 810 and the first bolt 300, so that the connector 20 can have a good structural stability. Then, the corresponding second bolt 400 is locked by the first nut 910 of the first pad 900, and the back plate 100, the circuit board 500 and the first pad 900 are locked and fixed, ensuring that the back plate 100, the circuit board 500 and the first pad 900 have a good structural stability, further improving the structural stability of the connector 20.

[0065] like Figures 5 to 8As shown, in one embodiment, the connector 20 further includes a second pad 1000, which is buckled with the pressure plate 800 and is arranged around the periphery of the chip 700. The second pad 1000 is provided with a plurality of avoidance grooves 1001 and a plurality of eighth penetration holes 1002, one end of each first spring bolt member 810 is arranged in the corresponding avoidance groove 1001, and one end of each second spring bolt member 820 is penetrated in the corresponding seventh penetration hole 802 and the corresponding eighth penetration hole 1002 and is screwed with the corresponding second nut member 920, so that the pressure plate 800 abuts against the chip 700. It can be understood that the second pad 1000 is buckled on the pressure plate 800, and then the second nut member 920 of the corresponding first pad 900 is locked by the second spring bolt member 820 of the pressure plate 800, so as to ensure that the pressure plate 800, the second pad 1000 and the first pad 900 have good connection stability. The avoidance groove 1001 serves as a avoidance guide, so that the first spring bolt member 810 can be directly locked with the first bolt member 300 better, ensuring a better locking and pressing effect between the pressure plate 800 and the back plate 100, thereby improving the structural stability of the connector 20.

[0066] like Figure 2 , Figure 3 , Figure 5 , Figure 7 and Figure 8As shown, in one embodiment, the pressing plate 800 is provided with a plurality of first positioning and mounting holes 803, and the second pad 1000 is provided with a plurality of second positioning and mounting holes 1002. The first pad 900 is provided with a plurality of positioning and mounting posts 930, and each positioning and mounting post 930 is inserted into the corresponding first positioning and mounting hole 803 and the corresponding second positioning and mounting hole 1002. The periphery of the second pad 1000 is provided with a plurality of buckle blocks 1010, and the periphery of the pressing plate 800 is provided with a plurality of buckle grooves 804, and each buckle block 1010 is buckled with the corresponding buckle groove 804, so that the pressing plate 800 and the second pad 1000 are buckled. In one embodiment, the back plate assembly 10 further includes an insulating gasket 1100, which is disposed between the back plate assembly 10 and the circuit board 500, one side of the insulating gasket 1100 is respectively in contact with the insert 200 and the back plate 100, and the other side of the insulating gasket 1100 is in contact with the circuit board 500. It can be understood that the positioning and mounting column 930 can quickly position and assemble the first pad 900, the second pad 1000 and the pressure plate 800, and the first positioning and mounting hole 803 and the second positioning and mounting hole 1002 can allow the positioning and mounting column 930 to be more accurately introduced into the pressure plate 800 and the second pad 1000, so as to connect the pressure plate 800, the second pad 1000 and the first pad 900 in series, so that the pressure plate 800, the second pad 1000 and the first pad 900 are accurately assembled, eliminating the assembly error of the connector 20. Further, the movable connection between the pressure plate 800 and the second pad 1000 is specifically fixed by buckling, that is, a plurality of buckling blocks 1010 are buckled in the corresponding buckling grooves 804 respectively, so that the pressure plate 800 and the second pad 1000 are locked and fixed. Furthermore, the insulating gasket 1100 is provided with a plurality of through holes, so that the insulating gasket 1100 can be provided through the plurality of first bolt members 300 and the plurality of second bolt members 400, that is, the circuit board 500, the insulating gasket 1100 and the back plate assembly 10 can be locked and fixed by the plurality of first bolt members 300 and the plurality of second bolt members 400. The provision of the insulating gasket 1100 can prevent the back plate 100 and the insert 200 from directly contacting the circuit board 500, respectively, and prevent the back plate 100 from being charged, thereby improving the safety of the connector 20. Furthermore, the insulating gasket 1100 is provided with a matching hollow area in the middle, so that the circuit board 500 can be connected to other components through the insulating hollow area.

[0067] It should be noted that the multiple mentioned in the present disclosure refers to more than two, including two.

[0068] Compared with the prior art, the present invention has at least the following advantages:

[0069] By forming an embedding groove in the middle area of ​​the back plate, one end of the embedding component is embedded in the embedding groove, and the surface of the other end of the embedding component is higher than the upper surface of the back plate, so that when the back plate assembly is used for connector assembly, the embedding component can provide a supporting force to the middle area of ​​the circuit board and the socket board, reduce the deformation of the middle area of ​​the circuit board and the socket board, thereby effectively improving the uniformity and stability of the contact between the socket board and the chip, and further effectively improving the stability of the signal conduction of the connector.

[0070] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

Claims

1. A backplane assembly, comprising a backplane, characterized in that: An inlay groove is formed in the middle area of ​​the surface of the back plate, and the inlay groove runs through the back plate; The back plate assembly also includes an inlay, one end of which is inlaid in the inlay groove; The surface of the other end of the insert is higher than the surface of the back plate so as to abut against the circuit board.

2. The back plate assembly according to claim 1, characterized in that: The height difference between the surface of the insert and the surface of the back plate is 0.1 mm to 2 mm.

3. The back plate assembly according to claim 2, characterized in that: The insert comprises an edge ring block and a support ring block, one end of the edge ring block is connected to one end of the support ring block, the surrounding side surface of the edge ring block is inlaid with the inner wall of the inlay groove, one end of the support ring block is inlaid on the surface of the back plate, and the other end of the support ring block is used to abut against the circuit board; and / or, The edging ring block and the supporting ring block together form a position-avoiding installation hole.

4. The back plate assembly according to claim 3, characterized in that: The shape of the insert is a rectangular ring, a triangle, an ellipse or a circle.

5. A connector, characterized in that: It comprises the backplane assembly, circuit board, socket board, chip and pressure plate according to any one of claims 1 to 4, wherein the backplane assembly, circuit board, socket board, chip and pressure plate are sequentially stacked, and the insert abuts against the circuit board.

6. The connector according to claim 5, characterized in that: The back plate is provided with a plurality of first through holes and a plurality of second through holes, and the back plate assembly further comprises a first bolt member and a second bolt member; The circuit board is provided with a plurality of third through holes and a plurality of fourth through holes, one end of each of the first bolt members is arranged in the corresponding first through hole, and the other end of each of the first bolt members is arranged in the corresponding first through hole and the corresponding third through hole, one end of each of the second bolt members is arranged in the corresponding second through hole, and the other end of each of the second bolt members is arranged in the corresponding second through hole and the corresponding fourth through hole, so that the circuit board is respectively in contact with the back plate and the insert.

7. The connector according to claim 6, characterized in that: The socket board is fixedly connected to a side of the circuit board away from the back board, and the socket board is provided with a chip abutment groove, and one end of the chip is movably abutted in the chip abutment groove, so that the chip is communicatively connected with the circuit board through the socket board; The projection area of ​​the socket board on the circuit board covers the projection area of ​​the insert on the circuit board.

8. The connector according to claim 7, characterized in that: The pressing plate is provided with a plurality of fifth penetration holes; The pressing plate is provided with a plurality of first spring bolts, each of which is passed through the corresponding fifth passing hole, one end of each of which is provided with a central connecting hole, and the other end of each of which is screwed to the corresponding central connecting hole; The connector further includes a first pad; The first pad is arranged around the periphery of the socket plate, and the first pad is provided with a plurality of sixth through holes, a plurality of first mounting grooves and a plurality of second mounting grooves, and the other end of each of the first bolt members is passed through the corresponding first through hole, the corresponding third through hole and the corresponding sixth through hole and is screwed to the corresponding central connecting hole; The first pad is provided with a plurality of first nut members and a plurality of second nut members, one end of each of the first nut members is arranged in the corresponding first installation groove, one end of each of the second nut members is arranged in the corresponding second installation groove, and the other end of each of the second bolt members is passed through the corresponding second penetration hole and the corresponding fourth penetration hole and is threadedly connected with the corresponding first nut member; The pressing plate is provided with a plurality of seventh penetration holes, and a plurality of second spring bolt members are provided on the pressing plate. One end of each of the second spring bolt members is penetrated through the corresponding seventh penetration hole and is threadedly connected with the corresponding second nut member.

9. The connector according to claim 8, characterized in that: The connector further comprises a second pad, the second pad is movably connected to the pressing plate, and the second pad is arranged around the periphery of the chip; The second pad is provided with a plurality of avoidance grooves and a plurality of eighth penetration holes, one end of each of the first spring bolt members is arranged in the corresponding avoidance groove, one end of each of the second spring bolt members is penetrated through the corresponding seventh penetration hole and the corresponding eighth penetration hole and is screwed to the corresponding second nut member so that the pressure plate abuts against the chip.

10. The connector according to claim 9, characterized in that: The pressure plate is provided with a plurality of first positioning and mounting holes, the second pad is provided with a plurality of second positioning and mounting holes, the first pad is provided with a plurality of positioning and mounting posts, and each of the positioning and mounting posts is passed through the corresponding first positioning and mounting holes and the corresponding second positioning and mounting holes; A plurality of buckle blocks are provided at the periphery of the second pad, a plurality of buckle grooves are provided at the periphery of the pressing plate, and each of the buckle blocks is buckled with a corresponding buckle groove, so that the pressing plate is buckled with the second pad; and / or, The backplane assembly further comprises an insulating gasket, which is arranged between the backplane assembly and the circuit board, one side of the insulating gasket abuts against the insert and the backplane respectively, and the other side of the insulating gasket abuts against the circuit board.

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