PLC automatic control cabinet with waterproof and dustproof heat dissipation device

By designing waterproof and dust-proof heat dissipation devices in the PLC control cabinet, and using semiconductor refrigeration plates and fans to achieve temperature control and waterproof and dust-proof effects, the problem of poor waterproof and dustproof effects in the existing PLC control cabinet is solved.

CN222485093UActive Publication Date: 2025-02-14HAINAN ZHUOANTE ELECTRICAL EQUIP CO LTD
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Patent Information

Application Number
CN202421150043.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-24
Publication Date
2025-02-14
Estimated Expiration
2034-05-24

AI Technical Summary

Technical Problem

Existing PLC control cabinets are not effective in waterproofing and dustproofing, especially when it is difficult to achieve true waterproofing and dustproofing through rain covers and air filters.

Method used

A PLC automatic control cabinet with waterproof, dust-proof and heat-dissipation device is designed. By setting up a waterproof, dust-proof and heat-dissipation device on the cabinet, the device includes a shell, a partition, a semiconductor refrigeration plate and a fan, and the semiconductor refrigeration plate is used to provide cooling capacity. It also takes away heat through the fan to avoid air circulation and improves waterproof and dustproof effect.

Benefits of technology

By setting up a waterproof and dust-proof heat dissipation device in the PLC control cabinet, the temperature inside the cabinet is effectively controlled, the waterproof and dust-proof effect of the cabinet is improved, and the entry of dust and water is avoided.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222485093U_ABST
Patent Text Reader

Abstract

The utility model discloses a PLC automatic control cabinet with a waterproof and dustproof heat dissipation device. The cabinet comprises a cabinet body, one side of the cabinet body is provided with a mounting port, a waterproof and dustproof heat dissipation device is embedded in the mounting port, the waterproof and dustproof heat dissipation device comprises a shell fixed on the cabinet body, a partition plate is arranged in the middle of the inner side of the shell, and the interior of the shell is divided into an internal space and an external space by the partition plate; an inner cover plate and an outer cover plate are detachably and fixedly connected to the inner end and the outer end of the shell respectively, a plurality of semiconductor chilling plates are embedded in the partition plate, a first air inlet and a first air outlet are formed in the shell on the outer side of the inner space, a first fan is arranged in the shell, and a second air inlet and a second air outlet are formed in the shell on the outer side of the outer space. And a second fan is arranged in the second fan. According to the utility model, the waterproof and dustproof heat dissipation device is arranged on the cabinet body, and the semiconductor chilling plate in the waterproof and dustproof heat dissipation device is used for providing cooling capacity for the interior of the cabinet body, so that the temperature in the cabinet body is kept within a set range, and the waterproof and dustproof effects of the cabinet body are improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of control cabinets, in particular to a PLC automatic control cabinet with a waterproof, dustproof and heat dissipation device. Background Art

[0002] PLC is a programmable logic controller, which is a digital operation electronic system designed specifically for industrial environments. The PLC control cabinet is a box that integrates PLC and related components. It is used to centrally manage and control each link on the production line. It is generally composed of a main control unit, I / O module, power module, communication module, human-machine interface, etc.

[0003] The PLC control cabinet has many sophisticated internal devices, which will generate a lot of heat during operation. Generally, air inlets and outlets are set on the cabinet body, and a heat dissipation fan is set inside the air outlet. Under the action of the heat dissipation fan, air enters the cabinet body from the air inlet and is discharged from the air outlet with the heat generated by the internal equipment. In order to achieve waterproof and dustproof, the cabinet door and the cabinet body are generally sealed with a sealing ring; for the lines entering and exiting the PLC control cabinet, sealing can be achieved through waterproof joints or fillers; and for the air inlet and outlet, rain shields and air filters are generally set on the cabinet body to achieve waterproof and dustproof. Since the air inside and outside the cabinet is circulating, it is difficult to achieve true waterproof and dustproof effects through rain shields and air filters. Therefore, it is necessary to make improvements. Utility Model Content

[0004] The utility model aims to provide a PLC automatic control cabinet with a waterproof, dustproof and heat dissipation device in view of the deficiencies in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model provides a PLC automatic control cabinet with a waterproof and dustproof heat dissipation device, including a cabinet body and a cabinet door arranged on the front side of the cabinet body, one side of the cabinet body is provided with an installation port, and the installation port is embedded with a waterproof and dustproof heat dissipation device, the waterproof and dustproof heat dissipation device includes a shell fixed on the cabinet body, a partition is provided in the middle of the inner side of the shell, the partition divides the interior of the shell into an internal space and an external space, the inner and outer ends of the shell are respectively detachably fixedly connected with an inner cover plate and an outer cover plate, a plurality of semiconductor refrigeration plates are embedded on the partition, a first air inlet and a first air outlet are provided on the shell outside the internal space, and a first fan is provided inside the shell, and a second air inlet and a second air outlet are provided on the shell outside the external space, and a second fan is provided inside the shell.

[0006] Furthermore, a fixing plate is provided on the outer side of the middle part of the shell, the fixing plate is fixedly connected to the cabinet body by bolts, and a sealing gasket is provided between the fixing plate and the cabinet body.

[0007] Furthermore, the first air inlet is arranged on four sides of the internal space, the first air outlet is arranged in the middle of the inner cover plate, and the first fan is arranged on the inner side of the first air outlet.

[0008] Furthermore, the cross-section of the shell outside the external space is hexagonal, the second air inlet and the second air outlet are arranged on the lower sides of both ends of the shell on the front and rear sides of the external space, the shell outside the second air inlet is connected with an air inlet channel extending forward and downward, the shell outside the second air outlet is connected with an air outlet channel extending rearward and downward, and the second fan is arranged on the inner side of the second air outlet.

[0009] Furthermore, grilles are provided at the outer ends of the air inlet channel and the air outlet channel.

[0010] Furthermore, an air filter is provided in the air inlet passage.

[0011] Furthermore, a heat dissipation fin is fixed to both inner and outer ends of the semiconductor refrigeration plate.

[0012] Beneficial effects: The utility model provides a waterproof and dustproof heat dissipation device on the cabinet body, and utilizes the semiconductor refrigeration plate in the waterproof and dustproof heat dissipation device to provide cooling for the cabinet body, thereby keeping the temperature inside the cabinet body within a set range; since there is no need to introduce air from the outside, and there is no need to discharge the air in the cabinet body, the waterproof and dustproof effect of the cabinet body is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of a PLC automatic control cabinet with a waterproof and dustproof heat dissipation device according to an embodiment of the utility model;

[0014] Figure 2 It is a schematic diagram of the partial structure of the inner end of the waterproof and dustproof heat dissipation device of an embodiment of the utility model;

[0015] Figure 3 It is a schematic diagram of the partial structure of the outer end of the waterproof and dustproof heat dissipation device of an embodiment of the utility model. DETAILED DESCRIPTION

[0016] The present invention is further explained below in conjunction with the accompanying drawings and specific embodiments. The embodiments are implemented based on the technical solution of the present invention. It should be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0017] like Figures 1 to 3As shown, the embodiment of the utility model provides a PLC automatic control cabinet with a waterproof, dustproof and heat dissipation device, including a cabinet body 1 and a cabinet door 2 arranged on the front side of the cabinet body 1, one side of the cabinet door 2 is hinged on the cabinet body 1, and the other side is detachably fixedly connected, and a sealing ring is arranged between the cabinet body 1 and the cabinet door 2, and after the cabinet door 2 is closed, dust and water will not enter the cabinet body 1 from between the two. A rain shield 4 is arranged on the top of the cabinet body 1, and a mounting opening 3 is arranged on one side of the cabinet body 1, and a waterproof, dustproof and heat dissipation device 5 is embedded in the mounting opening 3, and the waterproof, dustproof and heat dissipation device 5 includes a shell 51, and the interior of the shell 51 is hollow. The outer side of the shell 51 is fixed on the cabinet body 1, and a partition 52 is arranged in the middle of the inner side of the shell 51, and the partition 52 separates the interior of the shell 51 into an internal space and an external space, and the internal space is isolated from the external space. An opening is provided at both ends of the shell 51, and an inner cover plate 53 and an outer cover plate 54 are detachably fixedly connected to the outer side of the opening. The inner cover plate 53 and the outer cover plate 54 can be fixed to the shell 51 by bolts or snap connections, and a sealing ring can be provided between the outer cover plate 54 and the shell 51. A plurality of semiconductor cooling plates 55 are embedded on the partition 52, and preferably a heat dissipation fin 514 is fixed at both ends of the semiconductor cooling plate 55 to improve the heat exchange efficiency. A first air inlet 56 and a first air outlet 57 are provided on the shell 51 outside the internal space, a first fan 58 is provided inside the internal space, a second air inlet and a second air outlet are provided on the shell 51 outside the external space, and a second fan 59 is provided inside the external space.

[0018] In order to facilitate fixing the shell 51 on the cabinet 1, a fixing plate 510 is provided on the outer side of the middle part of the shell 51. The fixing plate 510 can be welded to the outer side of the shell 51. The fixing plate 510 is preferably fixed to the cabinet 1 by multiple bolts. In order to ensure the sealing between the fixing plate 510 and the cabinet 1, a sealing gasket is provided between the fixing plate 510 and the cabinet 1.

[0019] The first air inlet 56 of the embodiment of the utility model is preferably arranged on the four sides of the internal space, the first air outlet 57 is preferably arranged in the middle of the inner cover plate 53, and the first fan 58 is arranged on the inner side of the first air outlet 56, which is fixed to the inner cover plate 53 by four bolts.

[0020] The cross section of the shell 51 outside the external space of the embodiment of the utility model is hexagonal, and the second air inlet and the second air outlet are preferably arranged at the lower sides of the two ends of the shell 51 on the front and rear sides of the external space, and the shell 51 outside the second air inlet is connected to an air inlet channel 511 extending forward and downward, and the shell 51 outside the second air outlet is connected to an air outlet channel 512 extending backward and downward, and the second fan 59 is arranged on the inner side of the second air outlet. The structural arrangement of the second air inlet, the second air outlet, the air inlet channel 511 and the air outlet channel 512 can prevent the air discharged from the air outlet channel 512 from directly circulating into the external space, affecting the heat dissipation effect of the semiconductor cooling plate 55.

[0021] In order to prevent impurities from entering the external space, grilles 513 are provided at the outer ends of the air inlet channel 511 and the air outlet channel 512. It is also preferred to set an air filter in the air inlet channel 511, and the air filter can be a non-woven filter or a synthetic fiber filter.

[0022] During operation, after the semiconductor refrigeration sheet 55 is powered on, its inner end is cooling and its outer end is heating. The inner end of the semiconductor refrigeration sheet 55 can add coldness to the interior of the cabinet 1, offsetting the heat generated by the equipment inside the cabinet 1, thereby keeping the interior of the cabinet 1 within an appropriate temperature range. The heat generated by the outer end of the semiconductor refrigeration sheet 55 can be taken away by the air introduced by the second fan 511. Since the air does not flow between the inside and outside of the cabinet 1 when the cabinet 1 dissipates heat to the equipment, the waterproof and dustproof effect can be better achieved. It should also be noted that the temperature in the internal space can be detected by a temperature sensor, and the temperature in the internal space can be controlled to be kept above the air condensation temperature to avoid condensation of liquid water on the semiconductor refrigeration sheet 55 in the internal space; the bottom of the internal space can also be connected to the drainage pipe, and the drainage pipe can be led out of the cabinet 1, so that the generated condensed water can be discharged to the container outside the cabinet 1 or a designated location.

[0023] The above is only a preferred embodiment of the utility model. It should be pointed out that for ordinary technicians in this technical field, other parts not specifically described belong to the prior art or common knowledge. Under the premise of not departing from the principle of the utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the utility model.

Claims

1. A PLC automatic control cabinet with a waterproof and dustproof heat dissipation device, characterized in that: It includes a cabinet body and a cabinet door arranged on the front side of the cabinet body, a mounting opening is arranged on one side of the cabinet body, a waterproof and dustproof heat dissipation device is embedded in the mounting opening, the waterproof and dustproof heat dissipation device includes a shell fixed on the cabinet body, a partition is arranged in the middle of the inner side of the shell body, the partition divides the interior of the shell body into an internal space and an external space, the inner and outer ends of the shell body are respectively detachably and fixedly connected with an inner cover plate and an outer cover plate, a plurality of semiconductor refrigeration plates are embedded on the partition plate, a first air inlet and a first air outlet are arranged on the shell body outside the internal space, and a first fan is arranged inside the shell body, a second air inlet and a second air outlet are arranged on the shell body outside the external space, and a second fan is arranged inside the shell body.

2. A PLC automatic control cabinet with a waterproof and dustproof heat dissipation device according to claim 1, characterized in that: A fixing plate is arranged on the outer side of the middle part of the shell, the fixing plate is fixedly connected with the cabinet body by bolts, and a sealing gasket is arranged between the fixing plate and the cabinet body.

3. The PLC automatic control cabinet with a waterproof and dustproof heat dissipation device according to claim 1 is characterized in that: The first air inlet is arranged at four sides of the internal space, the first air outlet is arranged in the middle of the inner cover plate, and the first fan is arranged on the inner side of the first air outlet.

4. The PLC automatic control cabinet with a waterproof and dustproof heat dissipation device according to claim 1 is characterized in that: The cross-section of the shell outside the external space is hexagonal, and the second air inlet and the second air outlet are arranged on the lower sides of both ends of the shell on the front and rear sides of the external space. The shell outside the second air inlet is connected with an air inlet channel extending forward and downward, and the shell outside the second air outlet is connected with an air outlet channel extending backward and downward, and the second fan is arranged on the inner side of the second air outlet.

5. A PLC automatic control cabinet with a waterproof and dustproof heat dissipation device according to claim 4, characterized in that: The outer ends of the air inlet channel and the air outlet channel are both provided with grilles.

6. The PLC automatic control cabinet with a waterproof and dustproof heat dissipation device according to claim 4 is characterized in that: An air filter is arranged in the air inlet passage.

7. The PLC automatic control cabinet with a waterproof and dustproof heat dissipation device according to claim 1 is characterized in that: A heat dissipation fin is respectively fixed at the inner and outer ends of the semiconductor refrigeration plate.