Heat exchange device and electrical equipment

Abstract

The utility model relates to the technical field of electrical engineering, and discloses a heat exchange device and electrical equipment, and the heat exchange device comprises a refrigeration part which comprises a cold end, a hot end and a side wall, and the side wall is arranged between the cold end and the hot end; the first heat dissipation piece is arranged on the side close to the cold end, the first heat dissipation piece comprises a first substrate, and a first tooth piece is arranged on the side, away from the cold end, of the first substrate; the second heat dissipation piece is arranged on the side close to the hot end, the second heat dissipation piece comprises a second substrate, and a second tooth piece is arranged on the side, away from the hot end, of the second substrate; the other side of the first substrate and / or the other side of the second substrate are / is provided with a containing space, and the containing space at least contains part of the side wall of the refrigeration part. The refrigeration part is adopted for heat exchange, and the cold end of the refrigeration part can quickly absorb heat; by at least accommodating part of the side wall of the refrigeration part in the accommodating space, the contact area between the refrigeration part and the first heat dissipation part and the contact area between the refrigeration part and the second heat dissipation part can be further increased, so that the heat transfer efficiency is improved, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical engineering, in particular to a heat exchange device and electrical equipment. Background Art

[0002] When installing a traditional heat exchanger, such as a heat dissipation structure, in existing electrical equipment, it is necessary to first open an opening on the housing of the electrical equipment, and then place the heat exchanger in the opening so that the opposite sides of the heat exchanger are respectively arranged inside and outside the housing. Among them, the heat exchanger is usually formed by extrusion of aluminum alloy, and teeth are arranged on opposite sides of the heat exchanger. When in use, a fan is used inside the housing to blow the heat to the teeth inside the housing, and the heat is transferred to the teeth outside the housing through the thermal conductivity of the material of the heat exchanger itself, and then the heat on the teeth is taken away by the fan outside the housing. This method can effectively reduce the ambient temperature inside the housing, thereby increasing the service life of the electrical components inside the housing. However, when the temperature inside the housing is too high, since the temperature can only be reduced by the heat transfer of the material of the heat exchanger itself, the temperature cannot be transferred out quickly, which may damage the electrical components or reduce the service life of the electrical components.

[0003] The prior art discloses a semiconductor refrigerator with a hydrophilic coating, such as Figure 1 As shown, the semiconductor refrigerator is composed of a cooling block 01, a semiconductor cooling sheet 02 and a heat sink 03, wherein the cooling block 01 is arranged at the cold end of the semiconductor cooling sheet 02, and the heat sink 03 is arranged at the hot end of the semiconductor cooling sheet 02. The cooling block 01 is arranged inside the box 04, and the heat sink 03 is arranged outside the box 04. The cold end of the semiconductor cooling sheet 02 can generate cold air, which is transmitted through the cooling block 01, thereby reducing the temperature inside the box 04. The hot end of the semiconductor cooling sheet 02 generates hot air at the same time, and the hot air is discharged through the heat sink 03. However, since the two sides of the semiconductor cooling sheet 02 are only in contact with the surfaces of the cooling block 01 and the heat sink 03, the contact area is small, resulting in poor heat dissipation effect. Utility Model Content

[0004] In view of this, the utility model provides a heat exchange device and an electrical device to solve the problem of poor heat dissipation effect of the heat exchange device.

[0005] In a first aspect, the utility model provides a heat exchange device, comprising:

[0006] A refrigeration element, comprising a cold end, a hot end and a side wall, wherein the side wall is arranged between the cold end and the hot end;

[0007] A first heat sink is provided at a side close to the cold end, the first heat sink comprises a first substrate, and a first tooth plate is provided at a side of the first substrate away from the cold end;

[0008] A second heat sink is disposed on a side close to the hot end, the second heat sink comprises a second substrate, and a second tooth piece is disposed on a side of the second substrate away from the hot end;

[0009] An accommodation space is provided on the other side of the first substrate and / or the other side of the second substrate, and the accommodation space at least accommodates a portion of the side wall of the refrigeration component.

[0010] Beneficial effects: By using a refrigeration element for heat exchange, the cold end of the refrigeration element can quickly absorb the heat on one side of the first heat sink, thereby reducing the ambient temperature on one side of the first heat sink, while the hot end of the refrigeration element can quickly release the heat absorbed by the cold end, and the heat exchange efficiency is high; by providing the first tooth plate and the second tooth plate, the contact area between the first heat sink and the second heat sink and the air can be increased, thereby achieving rapid heat exchange; by accommodating at least part of the side wall of the refrigeration element in the accommodating space, the contact area between the refrigeration element and the first heat sink and the second heat sink can be further increased, thereby improving the heat transfer efficiency and improving the heat dissipation effect.

[0011] In an optional embodiment, a first accommodating space is provided on the other side of the first substrate, and the cold end is provided in the first accommodating space;

[0012] A second accommodating space is disposed on the other side of the second substrate, the hot end is disposed in the second accommodating space, and the second accommodating space and the first accommodating space are disposed opposite to each other and together enclose the accommodating space.

[0013] Beneficial effects: The first accommodating space and the second accommodating space can be used to locate and place the refrigeration component.

[0014] In an optional embodiment, the accommodating space accommodates all side walls of the refrigeration component.

[0015] Beneficial effect: By arranging all the side walls of the refrigeration element in the accommodating space, heat can be transferred through the first heat dissipation element and the second heat dissipation element to the maximum extent, thereby improving the heat exchange effect.

[0016] In an optional embodiment, the heat exchange device comprises:

[0017] A partition is arranged between the first heat dissipation member and the second heat dissipation member.

[0018] Beneficial effect: By setting a partition, the first heat sink and the second heat sink can be isolated, preventing heat transfer through contact between the first heat sink and the second heat sink, and ensuring that all heat transfer is achieved through the refrigeration element, thereby improving the heat exchange effect.

[0019] In an optional embodiment, the partition is a thermal insulation member.

[0020] In an optional embodiment, a third accommodating space is provided on the partition, and the refrigeration element is arranged in the third accommodating space;

[0021] And / or, at least two of the first heat sink, the partition and the second heat sink are detachably connected.

[0022] In an optional embodiment, a heat conducting element is provided between the first heat dissipating element and the refrigerating element, and / or between the second heat dissipating element and the refrigerating element;

[0023] And / or, the refrigeration element is suitable for being connected to a power source via a connecting line;

[0024] The first substrate and / or the second substrate is provided with an escape space communicating with the outside, and the escape space is suitable for passing the connecting wire.

[0025] Beneficial effect: By setting up the heat conductive element, the heat transfer between the first heat dissipation element and the refrigeration element and between the second heat dissipation element and the refrigeration element can be further accelerated, and the heat conduction efficiency is higher; the refrigeration element is connected to the power supply through a connecting line, which can control the start and shut down of the refrigeration element, save energy, and is safer when used.

[0026] In a second aspect, the utility model further provides an electrical device, comprising:

[0027] A box body having an opening;

[0028] The above-mentioned heat exchange device is fixed at the opening.

[0029] Beneficial effect: Because the electrical equipment includes a heat exchange device, it has the same effect as the heat exchange device and will not be described in detail here.

[0030] In an optional embodiment, the first heat sink is disposed inside the box, and the second heat sink is disposed outside the box;

[0031] And / or, the first heat dissipation element or the second heat dissipation element is fixed at the opening;

[0032] And / or, a fan is disposed outside the box, and the fan is disposed close to the second gear piece.

[0033] Beneficial effect: By arranging the first heat sink inside the box, the refrigeration element can quickly cool the first heat sink, thereby quickly reducing the ambient temperature inside the box to increase the service life of the electrical components inside the box; by arranging a fan, the heat dissipation can be further accelerated.

[0034] In an optional embodiment, the cross-sectional size of the first substrate is the same as the size of the opening;

[0035] and / or, the cross-sectional dimensions of the partition are the same as the dimensions of the opening;

[0036] And / or, a cross-sectional dimension of the second substrate is larger than a dimension of the opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 It is a schematic diagram of the structure of a semiconductor refrigerator with a hydrophilic coating in the prior art when in use;

[0039] Figure 2 This is a schematic structural diagram of a heat exchange device according to an embodiment of the utility model;

[0040] Figure 3 for Figure 2 An exploded view of the heat exchange device shown;

[0041] Figure 4 for Figure 2 A cross-sectional view of the heat exchange device shown;

[0042] Figure 5 for Figure 3 A schematic diagram of the structure of a refrigeration component of a heat exchange device shown;

[0043] Figure 6 for Figure 3 A schematic structural diagram of a first heat sink of a heat exchange device shown;

[0044] Figure 7 for Figure 3 A schematic structural diagram of a second heat sink of the heat exchange device shown;

[0045] Figure 8 for Figure 3 A schematic structural diagram of a partition of a heat exchange device is shown.

[0046] Description of reference numerals:

[0047] 01. Refrigeration block; 02. Semiconductor refrigeration sheet; 03. Heat sink; 04. Box;

[0048] 1. Refrigeration element; 11. Cold end; 12. Hot end; 13. Connecting wire; 2. First heat sink; 21. First substrate; 211. Positioning element; 22. First tooth piece; 3. Second heat sink; 31. Second substrate; 311. Second storage space; 312. Mounting hole; 32. Second tooth piece; 33. Second connecting hole; 4. Partitioning element; 41. Third storage space. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0050] Combine the following Figures 2 to 8 , describing an embodiment of the utility model.

[0051] According to an embodiment of the utility model, on the one hand, a heat exchange device is provided, including: a refrigeration element 1, including a cold end 11, a hot end 12 and a side wall, and the side wall is arranged between the cold end 11 and the hot end 12; a first heat dissipation element 2, arranged on a side close to the cold end 11, the first heat dissipation element 2 includes a first substrate 21, and a first tooth plate 22 is provided on a side of the first substrate 21 away from the cold end 11; a second heat dissipation element 3, arranged on a side close to the hot end 12, the second heat dissipation element 3 includes a second substrate 31, and a second tooth plate 32 is provided on a side of the second substrate 31 away from the hot end 12; an accommodating space is provided on the other side of the first substrate 21 and / or the other side of the second substrate 31, and the accommodating space at least accommodates part of the side wall of the refrigeration element 1.

[0052] By adopting the refrigeration component 1 for heat exchange, the cold end 11 of the refrigeration component 1 can quickly absorb the heat on one side of the first heat sink 2, thereby reducing the ambient temperature on one side of the first heat sink 2, while the hot end 12 of the refrigeration component 1 can quickly release the heat absorbed by the cold end 11, and the heat exchange efficiency is high; by providing the first tooth plate 22 and the second tooth plate 32, the contact area between the first heat sink 2 and the second heat sink 3 and the air can be increased, thereby achieving rapid heat exchange; by accommodating at least part of the side wall of the refrigeration component 1 in the accommodating space, the contact area between the refrigeration component 1 and the first heat sink 2 and the second heat sink 3 can be further increased, thereby improving the heat transfer efficiency and the heat dissipation effect.

[0053] The cooling element 1 in this embodiment is a semiconductor refrigerator (TEC). After the TEC is powered on, the temperature of the cold end 11 decreases, cooling the ambient air, and the temperature of the hot end 12 increases, dissipating heat to the outside. As a convertible implementation, the cooling element 1 can also be other heat exchange structures capable of cooling, and no excessive restrictions are made here.

[0054] Specifically, a first accommodating space is provided on the other side of the first substrate 21, and the cold end 11 is provided in the first accommodating space; a second accommodating space 311 is provided on the other side of the second substrate 31, and the hot end 12 is provided in the second accommodating space 311. The second accommodating space 311 is arranged opposite to the first accommodating space, and they are jointly enclosed to form an accommodating space. The first accommodating space and the second accommodating space 311 can be used to locate and place the TEC. As a convertible embodiment, it is also possible that only the first accommodating space is provided on the first substrate 21 as the accommodating space, or only the second accommodating space 311 is provided on the second substrate 31 as the accommodating space, and no excessive restrictions are made here.

[0055] In this embodiment, heat conducting members are provided between the first heat sink 2 and the TEC, and between the second heat sink 3 and the TEC. The heat conducting members are thermally conductive silicone grease. By providing the heat conducting members, the heat transfer between the first heat sink 2 and the TEC, and between the second heat sink 3 and the TEC can be further accelerated, and the heat conduction efficiency is higher. As a convertible implementation, a heat conducting member may be provided only between the first heat sink 2 and the TEC, or a heat conducting member may be provided only between the second heat sink 3 and the TEC, or no heat conducting member may be provided between the first heat sink 2 and the TEC, and between the second heat sink 3 and the TEC. As a convertible implementation, the heat conducting member may be made of a metal material with good thermal conductivity such as copper or aluminum, or the heat conducting member may be made of other materials with good thermal conductivity, and no excessive restrictions are made here.

[0056] like Figure 5 As shown, the TEC in this embodiment is suitable for connecting to a power source through a connecting wire 13; a relief space connected to the outside is provided on the second substrate 31, and the relief space is suitable for passing the connecting wire 13. Specifically, the relief space is a connecting hole, such as Figure 7 As shown, the second substrate 31 is provided with a second connection hole 33, and the second connection hole 33 is suitable for passing the connection line 13. The TEC is connected to the power supply through the connection line 13, which can control the start and shut down of the TEC, save energy, and is safer when used. As a convertible embodiment, it can also be that the first substrate 21 is provided with an escape space connected to the outside, that is, a first connection hole, and the first connection hole is suitable for passing the connection line 13, or the first substrate 21 is provided with a first connection hole, and the second substrate 31 is provided with a second connection hole 33, and the first connection hole and the second connection hole 33 are jointly enclosed to form an escape space, which is suitable for allowing the connection line 13 to pass through. As a convertible embodiment, the escape space can also be an escape groove.

[0057] like Figure 4 As shown, the entire side wall of the TEC is contained in the containing space enclosed by the second containing space 311 and the first containing space. By containing the entire side wall of the TEC in the containing space, the heat can be transferred through the first heat sink 2 and the second heat sink 3 to the maximum extent, thereby improving the heat exchange effect. As a convertible implementation, it is also possible that only part of the side wall of the TEC is contained in the containing space.

[0058] In order to prevent the first heat sink 2 and the second heat sink 3 from contacting each other and causing heat exchange, as shown in FIG. Figure 2-Figure 3 As shown, the heat exchange device in this embodiment includes: a partition 4, which is arranged between the first heat sink 2 and the second heat sink 3. Among them, the partition 4 is a heat insulation member. By setting the partition 4, the first heat sink 2 and the second heat sink 3 can be isolated, and heat transfer between the first heat sink 2 and the second heat sink 3 through contact can be prevented, and the heat transfer can be ensured to be achieved entirely through TEC, thereby improving the heat exchange effect. As a convertible implementation, when only part of the side wall of TEC is accommodated in the accommodation space, the partition 4 may not be arranged.

[0059] like Figure 8 As shown, the partition 4 is provided with a third accommodating space 41, and the TEC is disposed in the third accommodating space 41. The size of the third accommodating space 41 is adapted to the size of the TEC, and specifically, the size of the third accommodating space 41 can be set to be the same as the size of the TEC to prevent heat exchange between the first heat sink 2 and the second heat sink 3.

[0060] In this embodiment, the first heat sink 2, the partition 4, and the second heat sink 3 are all detachably connected. As a convertible implementation, the first heat sink 2 and the partition 4, or the second heat sink 3 and the partition 4, or the first heat sink 2 and the second heat sink 3 can also be fixedly connected. The specific connection method is determined according to actual conditions and is not limited here.

[0061] Specifically, Figure 6-Figure 8As shown, two mounting positions are provided on the first substrate 21, the second substrate 31 and the separator 4, and the first substrate 21, the second substrate 31 and the separator 4 are connected and fixed by pins. Furthermore, a positioning member 211 is provided on the first substrate 21, and specifically, the positioning member 211 can be a positioning protrusion, and positioning holes are provided on the separator 4 and the second substrate 31. The positioning member 211 is inserted into the positioning holes of the separator 4 and the second substrate 31 for pre-positioning installation. As a convertible embodiment, the first substrate 21, the second substrate 31 and the separator 4 can also be connected and fixed by bolts. As a convertible embodiment, there can also be only one or three mounting positions, and the specific number of settings is determined according to actual conditions, and no excessive restrictions are made here.

[0062] According to an embodiment of the present utility model, on the other hand, an electrical device is provided, including: a box body, provided with an opening; and the above-mentioned heat exchange device, wherein the heat exchange device is fixed at the opening.

[0063] Specifically, the heat exchange device is used to cool down the capacitor, diode and inductor in the box. As a convertible implementation, the heat exchange device can also be used to cool down heating elements such as circuit boards and power supplies, without too much restriction here.

[0064] In this embodiment, the first heat sink 2 is disposed inside the box, and the second heat sink 3 is disposed outside the box. By disposing the first heat sink 2 inside the box, the TEC can quickly cool the first heat sink 2, thereby quickly reducing the ambient temperature inside the box, thereby increasing the service life of the electrical components inside the box.

[0065] In this embodiment, the second heat sink 3 is fixed at the opening. Figure 2 As shown, the cross-sectional dimensions of the first substrate 21 are the same as the dimensions of the opening; the cross-sectional dimensions of the partition 4 are the same as the dimensions of the opening; and the cross-sectional dimensions of the second substrate 31 are larger than the dimensions of the opening. Among them, a mounting hole 312 is provided near the end of the second substrate 31, and a mounting position is also provided at the opening of the box body. The second substrate 31 and the box body are fixed by bolts. As a convertible embodiment, the first heat sink 2 can also be fixed at the opening.

[0066] In this embodiment, a fan is provided outside the box, and the fan is provided near the second tooth plate 32. By providing the fan, heat dissipation can be further accelerated. As a convertible implementation, a fan can also be provided inside the box to accelerate cooling.

[0067] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A heat exchange device, characterized in that: include: A refrigeration element (1) comprises a cold end (11), a hot end (12) and a side wall, wherein the side wall is arranged between the cold end (11) and the hot end (12); A first heat sink (2) is arranged on a side close to the cold end (11), the first heat sink (2) comprising a first substrate (21), and a first tooth plate (22) is arranged on a side of the first substrate (21) away from the cold end (11); A second heat sink (3) is arranged on a side close to the hot end (12), the second heat sink (3) comprising a second substrate (31), and a second tooth plate (32) is arranged on a side of the second substrate (31) away from the hot end (12); The other side of the first substrate (21) and / or the other side of the second substrate (31) is provided with an accommodation space, and the accommodation space at least accommodates a portion of the side wall of the refrigeration component (1).

2. The heat exchange device according to claim 1, characterized in that: A first accommodating space is provided on the other side of the first substrate (21), and the cold end (11) is arranged in the first accommodating space; A second accommodating space (311) is provided on the other side of the second substrate (31), the hot end (12) is arranged in the second accommodating space (311), and the second accommodating space (311) and the first accommodating space are arranged opposite to each other and together enclose the accommodating space.

3. The heat exchange device according to claim 1, characterized in that: The accommodating space accommodates the entire side wall of the refrigeration component (1).

4. The heat exchange device according to claim 3, characterized in that: The heat exchange device comprises: A partition (4) is provided between the first heat dissipation element (2) and the second heat dissipation element (3).

5. The heat exchange device according to claim 4, characterized in that: The partition (4) is a heat insulating member.

6. The heat exchange device according to claim 4, characterized in that: The partition (4) is provided with a third accommodating space (41), and the refrigeration element (1) is arranged in the third accommodating space (41); And / or, at least two of the first heat dissipation element (2), the partition element (4) and the second heat dissipation element (3) are detachably connected.

7. The heat exchange device according to any one of claims 1 to 6, characterized in that: A heat conducting element is provided between the first heat dissipating element (2) and the refrigerating element (1), and / or between the second heat dissipating element (3) and the refrigerating element (1); And / or, the refrigeration element (1) is suitable for being connected to a power source via a connecting line (13); An escape space communicating with the outside is provided on the first substrate (21) and / or the second substrate (31), and the escape space is suitable for passing the connecting line (13).

8. An electrical device, characterized in that: include: A box body having an opening; The heat exchange device according to any one of claims 1 to 7, wherein the heat exchange device is fixed at the opening.

9. The electrical device according to claim 8, characterized in that The first heat sink (2) is arranged inside the box, and the second heat sink (3) is arranged outside the box; And / or, the first heat dissipation element (2) or the second heat dissipation element (3) is fixed at the opening; And / or, a fan is disposed outside the box, and the fan is disposed close to the second tooth blade (32).

10. The electrical device according to claim 9, characterized in that The cross-sectional dimensions of the first substrate (21) are the same as the dimensions of the opening; and / or, the cross-sectional dimensions of the partition (4) are the same as the dimensions of the opening; And / or, the cross-sectional size of the second substrate (31) is larger than the size of the opening.

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