Transportation and storage device for semiconductor polishing solution

Abstract

The utility model provides a transportation and storage device for a semiconductor polishing solution, which relates to the technical field of semiconductors, and comprises a barrel body with an opening at the top, and the polishing solution is stored in the barrel body; the barrel cover is connected to the opening; the supply pipe comprises a plurality of pipe sections, and the adjacent pipe sections are flexibly connected; wherein one end of the supply pipe is arranged on the barrel cover in a penetrating manner, and the other end of the supply pipe extends into the barrel body. The supply pipe can be adaptive to the height of the barrel body, so that the stability, the efficiency and the availability of sucking the polishing solution are improved, and the residual waste of the polishing solution is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor flattening, in particular to a transport and storage device for semiconductor polishing liquid. Background Art

[0002] Chemical Mechanical Polishing (CMP) technology is a technology that achieves global flatness of the wafer surface in integrated circuit (IC) manufacturing. It can achieve ultra-high flatness at the atomic level, and its effect directly affects the final quality and yield of the chip.

[0003] In the prior art, when replacing a CMP polishing liquid storage barrel, the barrel top of the storage barrel is often sunken, resulting in the storage barrel height being less than the length of the supply pipe, and the barrel cover cannot be installed. In addition, there is also the problem that the supply pipe cannot be fully extended to the barrel bottom, resulting in some polishing liquid in the storage barrel being unusable. Therefore, there is room for improvement. Utility Model Content

[0004] The utility model provides a transport storage device for semiconductor polishing liquid, so as to solve the problem in the prior art that a supply pipe cannot be adapted due to the depression of the barrel top of the storage barrel.

[0005] The utility model provides a wafer test circuit structure, comprising:

[0006] A barrel body, the top of which is provided with an opening, and the polishing liquid is stored in the barrel body;

[0007] A barrel cover connected to the opening; and

[0008] A supply pipe, comprising a plurality of pipe sections, adjacent pipe sections being flexibly connected;

[0009] Among them, one end of the supply pipe is penetrated on the barrel cover, and the other end of the supply pipe extends into the barrel body.

[0010] In one embodiment of the present invention, the supply pipe comprises:

[0011] A first pipe section is provided on the barrel cover;

[0012] A second pipe section is located in the barrel; and

[0013] The flexible section is connected between the first pipe section and the second pipe section.

[0014] In an embodiment of the present invention, when the second tube section contacts the bottom of the barrel, the flexible section is shortened or bent.

[0015] In an embodiment of the present invention, the second pipe section is provided with a notch, and the notch is located at one end of the second pipe section close to the bottom of the barrel body.

[0016] In an embodiment of the present invention, the cross section of the notch is rectangular.

[0017] In an embodiment of the present invention, the cross section of the notch is triangular.

[0018] In one embodiment of the utility model, the transport and storage device for the semiconductor polishing liquid further comprises a guardrail, the shape of the guardrail is adapted to the barrel body, and the barrel body is located inside the guardrail.

[0019] In one embodiment of the utility model, the transport and storage device for semiconductor polishing liquid also includes a plurality of connectors, one end of each connector is connected to the top of the barrel body, and the other end of each connector is connected to the guardrail near the top of the barrel body.

[0020] In one embodiment of the utility model, the connecting member includes a cross bar and a vertical bar, wherein the cross bar is clamped on the guardrail, the top end of the vertical bar is connected to the middle position of the cross bar, and the bottom end of the vertical bar is connected to the barrel body.

[0021] In an embodiment of the present invention, the number of the connecting members is two, and the two connecting members are symmetrically distributed with respect to the opening.

[0022] The beneficial effects of the utility model are as follows: the supply pipe of the utility model can adaptively adapt to the height of the barrel, and the utility model improves the stability, efficiency and availability of absorbing the polishing liquid, and reduces the residual waste of the polishing liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram showing a concave top of a polishing liquid storage bucket in the prior art is shown.

[0024] Figure 2 Shown is a cross-sectional view of a semiconductor polishing liquid transportation and storage device provided by the utility model.

[0025] Figure 3 Shown is a schematic structural diagram of a supply pipe provided in one embodiment of the utility model.

[0026] Figure 4 Shown is a schematic structural diagram of a notch provided in an embodiment of the utility model.

[0027] Figure 5 Another structural schematic diagram showing a notch provided in an embodiment of the utility model.

[0028] Figure 6Shown is a schematic structural diagram of a guardrail and a connecting piece provided in one embodiment of the utility model.

[0029] Figure Number:

[0030] 100, barrel body; 110, opening;

[0031] 200. Barrel cover;

[0032] 300, supply pipe; 310, first pipe section; 320, second pipe section; 321, notch; 330, flexible section;

[0033] 400, guardrail;

[0034] 500. Connectors. DETAILED DESCRIPTION

[0035] The following describes the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and the features in the embodiments can be combined with each other without conflict. It should also be understood that the terms used in the embodiments of the present invention are intended to describe specific implementation schemes, rather than to limit the scope of protection of the present invention. The test methods for which specific conditions are not specified in the following examples are usually carried out under conventional conditions or under the conditions recommended by the manufacturers.

[0036] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect and purpose that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the utility model without substantial change of the technical content.

[0037] It should be noted that in the semiconductor manufacturing process, the CMP (Chemical Mechanical Polishing) process is an important global flattening precision ultra-precision processing technology, and the CMP polishing liquid is one of the three key elements of the process. Its performance and mutual matching determine the surface flatness level that CMP can achieve. In the CMP process, the polishing liquid can effectively remove the surface damage layer and the poor conductor film by matching the process parameters to achieve high-quality surface flatness. In addition, the polishing liquid also has the function of support and lubrication, which can ensure the stability and uniformity of the CMP process. Generally, the CMP polishing liquid is a mixture of abrasives, chemical reagents and additives with specific particle size and composition.

[0038] See also Figure 1 In the prior art, the polishing liquid storage barrel is squeezed by external force or affected by gravity during transportation and replacement, and its top is likely to be concave and deformed. The center position of the concave top of the storage barrel can differ by more than 10 cm from that before deformation, which greatly affects the installation of the supply pipe and the barrel cover and reduces production efficiency.

[0039] See also Figures 2 to 6 The utility model provides a semiconductor polishing liquid transportation and storage device, which can be used for the transportation, storage and supply of polishing liquid in the semiconductor chemical mechanical polishing manufacturing process. The semiconductor polishing liquid transportation and storage device of the utility model adopts a supply pipe with multiple pipe sections, and the pipe sections are flexibly connected to each other, which can adaptively adapt to the height of the barrel body, solving the problem that the length of the supply pipe cannot be adapted due to the concave top of the storage barrel. The following is a detailed description through specific embodiments.

[0040] See also Figure 2 In one embodiment of the utility model, a transport and storage device for semiconductor polishing liquid may include a barrel body 100, a barrel cover 200 and a supply pipe 300. Among them, the barrel body 100 may be a rectangular parallelepiped or a cylinder, and an opening 110 may be provided on the top. The polishing liquid may be stored in the barrel body 100. The barrel cover 200 may be connected to the opening 110. The connection method between the opening 110 and the barrel cover 200 may be a threaded connection or a pressure-fit connection. The supply pipe 300 may be used to transport the polishing liquid of the barrel body 100 to the CMP grinding equipment. The supply pipe 300 may include a plurality of pipe sections, and flexible connections are used between adjacent pipe sections. In this embodiment, one end of the supply pipe 300 may be passed through the barrel cover 200, and the other end of the supply pipe 300 may extend into the barrel body 100.

[0041] See also Figure 3In one embodiment of the utility model, the supply pipe 300 may include a first pipe section 310, a second pipe section 320 and a flexible section 330. The first pipe section 310 may be arranged on the barrel cover 200, and the second pipe section 320 may be located in the barrel body 100. The flexible section 330 may be connected between the first pipe section 310 and the second pipe section 320. The first pipe section 310, the second pipe section 320 and the flexible section 330 may form a communicating pipeline, and the polishing liquid may be delivered to the CMP grinding device. The flexible section 330 may be allowed to deform, such as bend or shorten, after being acted upon by an external force. It can be seen from this that the length of the supply pipe 300 may change with the action of an external force. When the second pipe section 320 located in the barrel body 100 contacts the bottom of the barrel body 100, the supply pipe 300 may adapt to the height change of the barrel body 100 through the bending or shortening of the flexible section 330, thereby solving the problem of height mismatch caused by the top concave deformation.

[0042] See also Figure 3 In one embodiment of the utility model, the first pipe section 310 and the second pipe section 320 can be made of straight pipes made of PFA (Perfluoroalkoxy, perfluoropropylene polymer). PFA material is a high-performance plastic material with excellent chemical corrosion resistance and high temperature resistance. PFA material is widely used in the manufacture of parts or equipment that need to resist chemical corrosion and high temperature. In this embodiment, the first pipe section 310 and the second pipe section 320 made of PFA material can ensure that the CMP abrasive is not affected by the pipeline material during the transportation process, thereby ensuring the stability and accuracy of the process. The flexible section 330 can be made of flexible rubber material.

[0043] See also Figure 4 , 5 In one embodiment of the present invention, a notch 321 is provided on the second pipe section 320. The notch 321 may be located at one end of the second pipe section 320 close to the bottom of the barrel body 100. In this embodiment, the cross-sectional shape of the notch 321 may be as follows: Figure 4 The rectangle shown, or Figure 5 The notch 321 is provided on the second pipe section 320 to improve the stability and efficiency of absorbing the polishing liquid. At the same time, the notch 321 can also prevent the bottom port of the second pipe section 320 from forming a closed connection with the bottom of the barrel body 100, thereby improving the utilization rate of the polishing liquid in the barrel body 100 and reducing the residual waste of the polishing liquid.

[0044] See also Figure 6In one embodiment of the utility model, the transport and storage device for the semiconductor polishing liquid may further include a guardrail 400 and a connector 500. The shape of the guardrail 400 may be compatible with the shape of the barrel body 100, for example, it may be a rectangular frame or a cylindrical frame. The barrel body 100 may be placed in the guardrail 400 to reduce the influence of external forces. The number of connectors 500 may be multiple. One end of the connector 500 may be connected to the bottom of the barrel body 100, and the other end thereof may be connected to the guardrail 400 near the top of the barrel body 100. It can be seen that the probability of the top of the barrel body 100 being concave and deformed can be reduced through the coordinated support of the guardrail 400 and the connector 500.

[0045] See also Figure 6 In one embodiment of the utility model, the number of the connecting members 500 may be two, and the two connecting members 500 may be symmetrically distributed about the opening 110. The connecting member 500 may include a crossbar 501 and a vertical bar 502. Among them, the top end of the vertical bar 502 may be connected to the middle position of the crossbar 501, that is, the connecting member 500 may be T-shaped. In this embodiment, a plurality of parallel longitudinal beams are provided on one side of the guardrail 400 close to the top of the barrel body 100. The two ends of the crossbar 501 may be respectively clamped on a longitudinal beam, and the bottom end of the vertical bar 502 may be connected to the top of the barrel body 100. In some embodiments, the connecting member 500 may rotate around the vertical bar 502 to facilitate the release of its connection with the guardrail 400.

[0046] In summary, the utility model proposes a transport and storage device for semiconductor polishing liquid, which relates to the field of semiconductor technology. The utility model adopts a flexible supply pipe, which can adaptively adapt to the height of the barrel body, solving the problem that the length of the supply pipe cannot be adapted due to the depression and deformation of the barrel top. At the same time, the utility model also improves the stability, efficiency and availability of the polishing liquid, and reduces the residual waste of the polishing liquid. Therefore, the utility model effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0047] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

[0048] Therefore, many modifications may be made to adapt a particular environment or material to the essential scope and spirit of the present invention. The present invention is not intended to be limited to the specific terms used in the following claims and / or the specific embodiments disclosed as the best mode for carrying out the present invention, but the present invention will include any and all embodiments and equivalents falling within the scope of the appended claims. Therefore, the scope of the present invention will be determined only by the appended claims.

Claims

1. A transport and storage device for semiconductor polishing liquid, characterized in that: include: A barrel body, the top of which is provided with an opening, and the polishing liquid is stored in the barrel body; A barrel cover connected to the opening; as well as A supply pipe, comprising a plurality of pipe sections, adjacent pipe sections being flexibly connected; Among them, one end of the supply pipe is penetrated on the barrel cover, and the other end of the supply pipe extends into the barrel body.

2. The semiconductor polishing liquid transportation and storage device according to claim 1, characterized in that: The supply pipe comprises: A first pipe section is provided on the barrel cover; A second pipe section is located in the barrel; and The flexible section is connected between the first pipe section and the second pipe section.

3. The semiconductor polishing liquid transportation and storage device according to claim 2, characterized in that: When the second tube section contacts the bottom of the barrel, the flexible section shortens or bends.

4. The semiconductor polishing liquid transportation and storage device according to claim 3, characterized in that: The second pipe section is provided with a notch, and the notch is located at one end of the second pipe section close to the bottom of the barrel body.

5. The semiconductor polishing liquid transport and storage device according to claim 4, characterized in that: The cross section of the notch is rectangular.

6. The semiconductor polishing liquid transportation and storage device according to claim 4, characterized in that: The cross section of the notch is a triangle.

7. The semiconductor polishing liquid transport and storage device according to claim 1, characterized in that: The semiconductor polishing liquid transportation and storage device also includes a guardrail, the shape of which is adapted to the barrel body, and the barrel body is located inside the guardrail.

8. The semiconductor polishing liquid transport and storage device according to claim 7, characterized in that: The semiconductor polishing liquid transportation and storage device also includes a plurality of connectors, one end of each connector is connected to the top of the barrel body, and the other end of each connector is connected to the guardrail near the top of the barrel body.

9. The semiconductor polishing liquid transport and storage device according to claim 8, characterized in that: The connecting member comprises a cross bar and a vertical bar, wherein the cross bar is clamped on the guardrail, the top end of the vertical bar is connected to the middle position of the cross bar, and the bottom end of the vertical bar is connected to the barrel body.

10. The semiconductor polishing liquid transportation and storage device according to claim 8, characterized in that: The number of the connecting pieces is two, and the two connecting pieces are symmetrically distributed with respect to the opening.

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