Memory expansion device and server

Abstract

The utility model discloses a memory expansion device and a server, the memory expansion device comprises a substrate, a memory expansion module and a multi-channel input / output interface group, and the memory expansion module is arranged on the substrate; the multi-channel input / output interface group is arranged on the substrate, the multi-channel input / output interface group is connected with the memory expansion module, and the multi-channel input / output interface group is used for being connected with a mainboard of a server. The memory expansion device is provided with the multi-channel input / output interface group, and the multi-channel input / output interface group of the memory expansion device can be directly connected with the mainboard of the server through the MCIO cable without an adapter plate, so that the adaptability of the memory expansion device and the server is improved; and the server mainboard is prevented from being connected through an adapter plate, so that the insertion loss can be effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a memory expansion device and a server. Background Art

[0002] With the development of information technology, the rapid increase in the number of CPU (Central Processing Unit) cores in servers and the increase in information processing volume, the demand for memory is also increasing. In cloud services and some computing-intensive scenarios, insufficient memory will become a bottleneck limiting server performance. How to efficiently expand memory has always been a problem studied by industry insiders.

[0003] The memory expansion device can increase the total amount of memory available to the server and improve the server's memory performance. When the server's built-in memory slots are insufficient to meet demand or are already full, the memory expansion device can provide additional memory resources to expand the system's total memory capacity, thereby supporting larger-scale data processing. In addition, the memory expansion device can also reduce the pressure on data transmission between the main memory and the CPU, and to a certain extent improve the system's response speed and overall performance.

[0004] However, the interface of the existing memory expansion device does not match the interface of the existing server, and an additional adapter board is required to connect to the server. The memory expansion device has poor compatibility with the server and is prone to insertion loss. Utility Model Content

[0005] The main technical problem solved by the present application is to provide a memory expansion device and a server to improve the adaptability of the memory expansion device to the server and facilitate the installation of the memory expansion device on the server.

[0006] To solve the above technical problems, the first technical solution adopted in the present application is to provide a memory expansion device, which includes a substrate, a memory expansion module and a multi-channel input / output interface group, the memory expansion module is arranged on the substrate; a multi-channel input / output interface group, the multi-channel input / output interface group is arranged on the substrate, the multi-channel input / output interface group is connected to the memory expansion module, and the multi-channel input / output interface group is used to connect to the mainboard of the server.

[0007] In a possible implementation, the memory expansion module includes: at least a first memory master controller and a second memory master controller, the first memory master controller is arranged on the substrate, and the first memory master controller is connected to the multi-channel input / output interface group; the second memory master controller is arranged on the substrate, and the second memory master controller is connected to the multi-channel input / output interface group; a first slot group, the first slot group is arranged on the substrate, and the first slot group is connected to the first memory master controller; a second slot group, the second slot group is arranged on the substrate, and the second slot group is connected to the second memory master controller; wherein, the first slot group and the second slot group are used to insert the same or different memory modules.

[0008] In a possible implementation, the multi-channel input / output interface group includes at least a first multi-channel input / output interface and a second multi-channel input / output interface; the first multi-channel input / output interface is connected to the first memory master, and the second multi-channel input / output interface is connected to the second memory master.

[0009] In a possible implementation, the first multi-channel input / output interface and / or the second multi-channel input / output interface is a multi-channel input / output connector; the multi-channel input / output connector is a standard package connector or a small size package connector.

[0010] In a possible implementation manner, both the first memory master and the second memory master are CXL memory masters.

[0011] In a possible implementation, the first slot group includes a plurality of first dual in-line memory module slots; the first dual in-line memory module slots are arranged on the substrate; each of the first dual in-line memory module slots is connected to the first memory master through one or more data transmission channels; the second slot group includes a plurality of second dual in-line memory module slots; the second dual in-line memory module slots are arranged on the substrate, and each of the second dual in-line memory module slots is connected to the second memory master through one or more data transmission channels.

[0012] In a possible implementation, the first memory master includes one or more first memory controllers, each of which is connected to one or more of the first dual in-line memory module slots; the second memory master includes one or more second memory controllers, each of which is connected to one or more of the second dual in-line memory module slots.

[0013] In a possible implementation, the substrate includes a first surface and a second surface that are opposite to each other; the memory expansion module is disposed on the first surface of the substrate, and the multi-channel input / output interface group is disposed on the second surface of the substrate.

[0014] In a possible implementation manner, the memory expansion device further includes: mounting holes, a plurality of the mounting holes being arranged on the substrate.

[0015] To solve the above technical problems, the second technical solution adopted by the present application is to provide a server, which includes a mainboard and a memory expansion device. The memory expansion device is the above-mentioned memory expansion device, and the multi-channel input / output interface group of the memory expansion device is connected to the mainboard.

[0016] The beneficial effect of the present application is: Different from the prior art, the present application provides a memory expansion device and a server. The memory expansion device includes a substrate, a memory expansion module and a multi-channel input / output interface group, the memory expansion module is arranged on the substrate; the multi-channel input / output interface group is arranged on the substrate, the multi-channel input / output interface group is connected to the memory expansion module, and the multi-channel input / output interface group is used to connect to the mainboard of the server. As mentioned above, the memory expansion device is provided with a multi-channel input / output interface group, namely, an MCIO interface group. The multi-channel input / output interface group of the memory expansion device can be directly connected to the mainboard of the server through an MCIO cable, which improves the compatibility of the memory expansion device and the server. On the other hand, the memory expansion device avoids transferring the server mainboard through an adapter board, which can effectively reduce insertion loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the front structure of the memory expansion device of the present application;

[0019] Figure 2 yes Figure 1 Schematic diagram of the back structure of the memory expansion device;

[0020] Figure 3 It is a schematic diagram of the structure of the standard package multi-channel input / output connector of this application;

[0021] Figure 4 It is a structural schematic diagram of a small-size package multi-channel input / output connector of the present application.

[0022] Among them, 100, memory expansion device; 10, baseboard; 20, multi-channel input / output interface group; 21, first multi-channel input / output interface; 22, second multi-channel input / output interface; 31, first memory master; 32, second memory master; 41, first slot group; 411, first dual in-line memory module slot; 42, second slot group; 421, second dual in-line memory module slot; 50, mounting hole; 60, PCIe CEM Edge (Peripheral Component Interconnect Express Common Electrical Model Edge, peripheral component interconnect standard universal) interface; 70, power interface. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0024] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said", and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless otherwise clearly indicated above, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0025] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0026] It should be understood that the terms "include", "comprises" or any other variations used herein are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "includes..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0027] Existing memory expansion devices have poor compatibility with servers and require an adapter board to connect to the server, and the connection method is prone to insertion loss.

[0028] Based on the above problems, the present application proposes a memory expansion device and a server, which can effectively solve the above problems by setting a multi-channel input and output interface on the memory expansion device.

[0029] A memory expansion device and a server provided by the present application are described in detail below in conjunction with the accompanying drawings and embodiments.

[0030] This application provides a memory expansion device. Figure 1 and Figure 2 , Figure 1 It is a schematic diagram of the front structure of the memory expansion device of the present application. Figure 2 yes Figure 1 Schematic diagram of the back structure of the memory expansion device. In a specific embodiment, the memory expansion device of the present application includes a base plate, a memory expansion module and a multi-channel input and output interface group.

[0031] The memory expansion module is arranged on the substrate 10. The multi-channel input / output interface group 20 is arranged on the substrate 10, the multi-channel input / output interface group 20 is connected to the memory expansion module, and the multi-channel input / output interface group 20 is used to connect to the mainboard of the server. Specifically, a functional circuit (not shown) is arranged on the substrate 10, and the memory expansion module is connected to the multi-channel input / output interface group 20 through the functional circuit. The functional circuit can include a power management module, a clock generator, a control circuit element, and devices such as capacitors and inductors. Among them, the multi-channel input / output interface group 20 includes 2, 4 or other reasonable numbers of multi-channel input / output interfaces. The multi-channel input / output interface is the MCIO (Multi-Chip I / O) interface. In this embodiment, the memory expansion device 100 is a memory expansion based on the CXL (Computing Expression Link) technology. The CXL technology is based on PCIe (Peripheral Component Interconnect Express, a high-speed serial computer expansion bus), and is backward compatible with the PCIe standard so that the multi-channel input / output interface design complies with the PCIe standard. The multi-channel input / output interface of the memory expansion device 100 can be directly connected to the PCIe interface of the server motherboard through the MCIO cable. There is no need to use an adapter board to achieve the connection, which improves the compatibility of the memory expansion device 100 with the server motherboard. On the other hand, it avoids the generation of large insertion loss when connected through the adapter board. In some other embodiments, the multi-channel input / output interface design can also comply with the CXL standard, so that the memory expansion device 100 can be directly connected to the CXL interface of the server motherboard through the multi-channel input / output interface, without specific limitation.

[0032] Different from the prior art, the present application provides a memory expansion device 100, which is provided with a multi-channel input / output interface group 20, namely, an MCIO interface group. The multi-channel input / output interface group of the memory expansion device 100 can be directly connected to the mainboard of the server through an MCIO cable, thereby improving the compatibility of the memory expansion device 100 with the server. On the other hand, the memory expansion device 100 avoids connecting to the server mainboard through an adapter board, thereby effectively reducing insertion loss.

[0033] In this embodiment, the memory expansion module includes a first memory master 31, a first slot group 41, a second memory master 32 and a second slot group 42. The first memory master 31 is arranged on the substrate 10, and the first memory master 31 is connected to the multi-channel input / output interface group 20. The first slot group 41, the first slot group 41 is arranged on the substrate 10, and the first slot group 41 is connected to the first memory master 31. The second memory master 32, the second memory master 32 is arranged on the substrate 10, and the second memory master 32 is connected to the multi-channel input and output interface group. The second slot group 42, the second slot group 42 is arranged on the substrate 10, and the second slot group 42 is connected to the second memory master 32. Among them, the first slot group 41 and the second slot group 42 are used to insert the same or different memory modules. Specifically, the memory expansion module includes at least two memory masters. In this embodiment, the memory expansion module includes two memory masters. In some other embodiments, the memory expansion device 100 can also include three, four or other reasonable numbers of memory masters, without specific limitation. Among them, the memory master is used to manage and control the memory resources on the memory expansion device 100, and control the transmission of data between the memory module and the server. Among them, the first memory master 31 and the second memory master 32 support the connection of different types of memory modules. For example, the first memory master 31 supports the connection of DDR4 (Double Data Rate Fourth Generation SDRAM, the fourth generation double data rate synchronous dynamic random access memory), the second memory master 32 supports the connection of DDR5, or the first memory master 31 supports the connection of DDR5, and the second memory master 32 supports the connection of DDR4. This setting enables the memory expansion device 100 to expand a variety of different types of memory modules to the server. In some other embodiments, the first memory master 31 and the second memory master 32 can also support the connection of the same type of memory modules, for example, the first memory master 31 and the second memory master 32 both support the connection of DDR4, or the first memory master 31 and the second memory master 32 both support the connection of DDR5, etc. The memory expansion module includes at least a first memory master 31 and a second memory master 32. In some other embodiments, the memory expansion module may further include more memory masters so that the memory expansion device 100 can support more types of memory modules.

[0034] In this embodiment, the multi-channel input / output interface group 20 includes a first multi-channel input / output interface 21 and a second multi-channel input / output interface 22. The first multi-channel input / output interface 21 is connected to the first memory master 31, and the second multi-channel input / output interface 22 is connected to the second memory master 32. Specifically, the first memory master 31 is connected to the mainboard of the server through the first multi-channel input / output interface 21, so that the memory module inserted in the first slot group 41 is connected to the mainboard. The second memory master 32 is connected to the mainboard of the server through the second multi-channel input / output interface 22, so that the memory module inserted in the second slot group 42 is connected to the mainboard. In this embodiment, the memory expansion device 100 includes two memory masters, and the multi-channel input / output interface group 20 includes two multi-channel input / output interfaces corresponding to the two memory masters. In some other embodiments, the number of memory masters can also be different from two, and the multi-channel input / output interface group 20 includes the same number of multi-channel input / output interfaces as the memory masters and corresponding to each other.

[0035] In this embodiment, the first multi-channel input / output interface 21 and / or the second multi-channel input / output interface 22 are multi-channel input / output connectors. The multi-channel input / output connectors are connectors with standard packages or connectors with small size packages. Specifically, the multi-channel input / output connectors can be multi-channel input / output connectors with standard packages, and the multi-channel input / output connectors can be used in conjunction with the multi-channel input / output connectors of FIG. Figure 3 , Figure 3 The multi-channel input / output connector of the present application can also be a multi-channel input / output connector of small size package such as OC (OmniEdge CRE, high-speed high-density interconnection) and ULP (Ultra-Low Power Packaging, ultra-low power consumption). The specific type of the multi-channel input / output connector is not limited. Figure 4 , Figure 4 1 is a schematic diagram of the structure of the small-size package multi-channel input / output connector of the present application. The pin arrangement of the multi-channel input / output connector meets the SFF-9402 (a Reference Guide for Multi-Protocol Internal Cable Pinouts for SAS and / or PCIe, a reference guide for SAS and / or PCIe multi-protocol internal cable pinouts) standard to ensure the compatibility of the memory expansion device 100 with the server motherboard.

[0036] In this embodiment, the first memory master 31 and the second memory master 32 are both CXL memory masters. Specifically, the memory expansion device 100 is a memory expansion based on CXL technology, and this type of memory expansion device 100 complies with the PCIe standard, so that the multi-channel input / output interface of the memory expansion device 100 can be directly connected to the MCIO interface of the server motherboard through an MCIO cable.

[0037] In this embodiment, the first memory master 31 and the second memory master 32 both support 16 independent data transmission channels. The transmission rate of each transmission channel is 32 gigabits per second. The first slot group 41 includes four first dual in-line memory module slots 411. The first dual in-line memory module slots 411 are arranged on the substrate 10. The second slot group 42 includes four second dual in-line memory module slots 421. The second dual in-line memory module slots 421 are arranged on the substrate 10. In some other embodiments, the first slot group 41 includes a plurality of first dual in-line memory module slots 411, the second slot group 42 includes a plurality of second dual in-line memory module slots 421, each first dual in-line memory module slot 411 is connected to the first memory master 31 through one or more data transmission channels, and each second dual in-line memory module slot 421 is connected to the second memory master 32 through one or more data transmission channels. Specifically, the first slot group 41 and the second slot group 42 can support the insertion of the same or different types of memory modules. In this embodiment, the first slot group 41 includes four first dual in-line memory module slots 411, and each first dual in-line memory module slot 411 is connected to the first memory master 31 through four independent data transmission channels. The second slot group 42 includes four second dual in-line memory module slots 421, and each second dual in-line memory module slot 421 is connected to the second memory master 32 through four independent data transmission channels. Among them, in some other embodiments, the first memory master 31 and the second memory master 32 can also support other numbers of output transmission channels. For example, the first memory master 31 and the second memory master 32 can also support 8 independent data transmission channels. The first memory master 31 is connected to two first dual in-line memory module slots 411, and each first dual in-line memory module slot 411 is connected to the first memory master 31 through four data transmission channels. The second memory master 32 is connected to two second dual in-line memory module slots 421, and each second dual in-line memory module slot 421 is connected to the second memory master 32 through four data transmission channels. In addition, the data transmission channels supported by the first memory master 31 and the second memory master 32 are the same or different. In the present embodiment, the first memory master 31 and the second memory master 32 both support 16 data transmission channels. In some other implementations, both can also support different numbers of data transmission channels. For example, the first memory master 31 supports 16 data transmission channels, and the number of the first dual in-line memory module slots 411 is 4, which can be used to insert 4 DDR4 memory modules. The second memory master 32 supports 8 data transmission channels, and the number of the second dual in-line memory module slots 421 is 2, which can be used to insert 2 DDR5 memory modules.Among them, the dual in-line memory module slot is DIMM (Dual In-line Memory Module Socket), and the design of the dual in-line memory module slot supports double-sided pin contact, has higher data transmission efficiency and larger memory capacity. A suitable memory master can be selected to make the dual in-line memory module slot support DDR4, DDR5 or other different types of memory modules. In some other embodiments, the slot can also be specifically a SIMM slot (Single In-line Memory Module Socket) or other slots, without specific limitation. In this embodiment, each first dual in-line memory module slot 411 and the second dual in-line memory module slot 421 is a four-channel configuration, that is, each first dual in-line memory module slot 411 and the second dual in-line memory module slot 421 is connected to the memory master through four independent data transmission channels. In some other embodiments, the first dual in-line memory module slot 411 and the second dual in-line memory module slot 421 can also be a dual-channel configuration or other channel configurations, which are not specifically limited.

[0038] In this embodiment, the first memory master 31 includes one or more first memory controllers, each of which is connected to one or more first dual in-line memory module slots 411. The second memory master 32 includes one or more second memory controllers, each of which is connected to one or more second dual in-line memory module slots 421. Specifically, in this embodiment, the first memory master 31 includes two first memory controllers, each of which is connected to two first dual in-line memory module slots 411, and the second memory master 32 includes two second memory controllers, each of which is connected to two second dual in-line memory module slots 421. In some other embodiments, the first memory master 31 can also include one, three, or other reasonable numbers of first memory controllers, and each first memory controller can be connected to one, three, or other reasonable numbers of second dual in-line memory module slots 421, without specific limitation.

[0039] In this embodiment, the substrate 10 includes a first surface and a second surface that are opposite to each other. The memory expansion module is disposed on the first surface of the substrate 10, and the multi-channel input / output interface group 20 is disposed on the second surface of the substrate 10. Specifically, the memory expansion module and the multi-channel input / output interface group 20 are disposed on different surfaces of the substrate 10, so as to avoid the accumulation of components causing the multi-channel input / output interface group 20 to limit the heat dissipation capacity of the memory expansion module.

[0040] In this embodiment, the memory expansion device 100 further includes mounting holes 50, and a plurality of mounting holes 50 are provided on the substrate 10. Specifically, in this embodiment, four mounting holes 50 are provided on the substrate 10, and the four mounting holes 50 are respectively located at four vertex areas of the substrate 10. The function of the mounting holes 50 is to fix the memory expansion device 100 at a specified position to ensure that it is firmly mounted on the mainboard of the server. On the other hand, the fixing holes can also ensure good contact between the memory expansion device 100 and the mainboard to prevent malfunctions caused by poor contact.

[0041] In this embodiment, the memory expansion device 100 is also provided with a PCIe CEM Edge (Peripheral Component Interconnect Express Common Electrical Model Edge) interface 60, which is arranged at the edge of the substrate 10 and is also used to connect to the mainboard of the server. The interface can be a 4-channel, 8-channel, 16-channel connection structure, etc., without specific limitation. The interface is used to provide a BMC (Baseboard Management Controller, microcontroller) I2C signal and serves as a fixed interface to ensure the structural compatibility with the server.

[0042] In this embodiment, the memory expansion device 100 is also provided with a power interface 70, and the power interface 70 is a PCIe Power Supply interface, wherein the specific type of the power interface 70 is not limited. The power interface 70 can be a 4-pin, 6-pin, 8-pin or other connection structure, without specific limitation. The current range of the power interface 70 is 5A to 8A, for example, it can be any reasonable value such as 5A, 7A, 8A, etc. The power interface 70 provides a power input of 12V and at least 150W. In some other embodiments, the power interface 70 can also provide power inputs of other reasonable values ​​such as 13V, 15V, 200W, 220W, etc., without specific limitation.

[0043] Further, in the present embodiment, the width of the substrate 10 ranges from 111.15 mm to 111.28 mm, for example, the width of the substrate 10 can be 111.15 mm, 111.20 mm, 111.25 mm, 111.28 mm, and other reasonable values, without specific limitation. The length of the substrate 10 can range from 248.92 mm to 254 mm, for example, the length of the substrate 10 can be 248.92 mm, 250 mm, 252 mm, 254 mm, and other reasonable values, wherein, in some other embodiments, the length of the substrate 10 can also range from 306.92 mm to 312.00 mm, for example, the length of the substrate 10 can be 306.92 mm, 308 mm, 310 mm, 312 mm, and other reasonable values.

[0044] Different from the prior art, the present application provides a memory expansion device 100, which is provided with a multi-channel input / output interface group 20, namely, an MCIO interface group. The multi-channel input / output interface group of the memory expansion device 100 can be directly connected to the mainboard of the server through an MCIO cable, thereby improving the compatibility of the memory expansion device 100 with the server. On the other hand, the memory expansion device 100 avoids connecting the server mainboard through an adapter board, thereby effectively reducing insertion loss. On the other hand, the memory expansion device 100 is provided with at least a first memory master 31 and a second memory master 32, as well as a first slot group 41 and a second slot group 42 corresponding to the two memory masters, so that the memory expansion device 100 can provide expansion of more types of memory modules, and the memory capacity that can be expanded is larger.

[0045] Correspondingly, the present application further provides a server, which includes a mainboard and a memory expansion device, wherein the memory expansion device is the memory expansion device described in the above embodiment, and the multi-channel input / output interface group of the memory expansion device is connected to the mainboard.

[0046] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent principle transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A memory expansion device, characterized in that: include: substrate; A memory expansion module, wherein the memory expansion module is arranged on the substrate; A multi-channel input / output interface group, the multi-channel input / output interface group is arranged on the substrate, the multi-channel input / output interface group is connected to the memory expansion module, and the multi-channel input / output interface group is used to connect to the mainboard of the server.

2. The memory expansion device according to claim 1, characterized in that: The memory expansion module comprises: At least a first memory master and a second memory master, wherein the first memory master is arranged on the substrate and connected to the multi-channel input / output interface group; the second memory master is arranged on the substrate and connected to the multi-channel input / output interface group; A first slot group, the first slot group is arranged on the substrate, and the first slot group is connected to the first memory master; A second slot group, the second slot group is arranged on the substrate, and the second slot group is connected to the second memory master; The first slot group and the second slot group are used to insert the same or different memory modules.

3. The memory expansion device according to claim 2, characterized in that: The multi-channel input / output interface group includes at least a first multi-channel input / output interface and a second multi-channel input / output interface; the first multi-channel input / output interface is connected to the first memory master, and the second multi-channel input / output interface is connected to the second memory master.

4. The memory expansion device according to claim 3, characterized in that: The first multi-channel input / output interface and / or the second multi-channel input / output interface is a multi-channel input / output connector.

5. The memory expansion device according to claim 3, characterized in that: The first memory master and the second memory master are both CXL memory masters.

6. The memory expansion device according to claim 5, characterized in that: The first slot group includes a plurality of first dual in-line memory module slots; the first dual in-line memory module slots are arranged on the substrate; each of the first dual in-line memory module slots is connected to the first memory master through one or more data transmission channels; The second slot group includes a plurality of second dual in-line memory module slots; the second dual in-line memory module slots are arranged on the substrate, and each of the second dual in-line memory module slots is connected to the second memory master through one or more data transmission channels.

7. The memory expansion device according to claim 6, characterized in that: The first memory master includes one or more first memory controllers, each of which is connected to one or more first dual in-line memory module slots; The second memory master includes one or more second memory controllers, and each of the second memory controllers is connected to one or more second dual in-line memory module slots.

8. The memory expansion device according to claim 1, characterized in that: The substrate comprises a first surface and a second surface opposite to each other; The memory expansion module is arranged on the first surface of the substrate, and the multi-channel input / output interface group is arranged on the second surface of the substrate.

9. The memory expansion device according to claim 1, characterized in that: The memory expansion device also includes: Mounting holes, a plurality of the mounting holes are arranged on the substrate.

10. A server, characterized in that: The server comprises: Motherboard; A memory expansion device, wherein the memory expansion device is the memory expansion device according to any one of claims 1 to 9, and the multi-channel input / output interface group of the memory expansion device is connected to the mainboard.

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