Detection device for wafer scratches

Abstract

The utility model relates to the field of wafer scratch detection, in particular to a wafer scratch detection device which comprises a U-shaped block, a detection assembly is fixed on the top surface of the U-shaped block, a pop-up assembly is arranged on the inner side surface of the U-shaped block, the detection assembly comprises a detection frame fixed on the surface of the U-shaped block, a first sleeve is fixed on the surface of the detection frame, and a second sleeve is fixed on the surface of the first sleeve. A limiting block is fixed to the side surface of the detection frame, a placement plate is arranged on the inner side of the detection frame, multiple sets of placement grooves are formed in the top surface of the placement plate, a first sliding groove is formed in the surface of the first sleeve, a first spring is arranged in the first sleeve, and a first protruding column is arranged in the first sleeve. According to the utility model, the detection frame and the placement plate are arranged in the detection assembly, the surface of the placement plate is provided with the multiple groups of placement grooves, the scratch detector is matched, multiple groups of wafers can be detected at the same time, the detection efficiency is improved, and the concave columns and the clamping columns are arranged on the surface of the placement plate, so that the multiple groups of placement plates can be stacked, and the space is saved.

Description

Technical Field

[0001] The utility model relates to the field of wafer scratch detection, in particular to a detection device for wafer scratches. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. If you need to detect surface defects, you usually need to use high-precision tools such as microscopes for observation and analysis.

[0003] With respect to the above-mentioned related technologies, the inventors believe that the following defects exist: if surface defects need to be detected, it is usually necessary to use high-precision tools such as microscopes for observation and analysis, but only one defect can be detected at a time, resulting in low detection efficiency. Utility Model Content

[0004] In order to improve the problem that if surface defects need to be detected, high-precision tools such as microscopes are usually required for observation and analysis, but only one detection can be performed at a time, resulting in low detection efficiency, the present application provides a detection device for wafer scratches.

[0005] The present application provides a detection device for wafer scratches adopts the following technical scheme: a detection device for wafer scratches, comprising a U-shaped block, a detection component is fixed on the top surface of the U-shaped block, and a pop-up component is provided on the inner surface of the U-shaped block, the detection component comprises a detection frame fixed to the surface of the U-shaped block, and a sleeve is fixed on the surface of the detection frame, a limiting block is fixed on the side surface of the detection frame, and a placement plate is provided on the inner side of the detection frame, a plurality of groups of placement grooves are provided on the top surface of the placement plate, a sliding groove is provided on the surface of the sleeve, and a spring is provided inside the sleeve, a convex column is provided inside the sleeve, and a sliding column is fixed on the surface of the convex column.

[0006] It is further provided that a concave column is fixed on the top surface of the placement plate, and a clamping column is fixed on the bottom surface of the placement plate.

[0007] It is further configured that the protruding column 1 sequentially penetrates the detection frame and the placement plate and extends into the interior thereof, and the surface of the sliding column 1 contacts the inner wall of the sliding groove 1.

[0008] It is further provided that the U-shaped blocks are provided in two groups, and the U-shaped blocks are symmetrically arranged with each other, and a damping block is provided on the inner side of the U-shaped block.

[0009] It is further configured that the pop-up assembly includes a limiting column arranged on the inner side of the damping block, and a box body is fixed on the surface of the limiting column, a spring 2 is sleeved on the surface of the limiting column, a box door is installed on the surface of the box body through a hinge, and an acrylic plate is fixed on the side surface of the box body.

[0010] It is further configured that a servo electric cylinder is fixed to the top surface of the box door, and a plurality of groups of scratch detectors are fixed to the bottom surface of the servo electric cylinder, a sleeve 2 is fixed to the bottom surface of the box door, and a support column is fixed to the bottom surface of the box door.

[0011] It is further arranged that a slide groove 2 is opened on the surface of the sleeve 2, and a spring 3 is arranged inside the sleeve 2, a convex column 2 is movably connected inside the sleeve 2, and a slide column 2 is fixed on the surface of the convex column 2.

[0012] Compared with the related art, the device for detecting wafer scratches provided by the utility model has the following beneficial effects:

[0013] The utility model provides a detection device for wafer scratches, wherein a detection component is arranged on the surface of a U-shaped block, and a detection frame and a placement plate are arranged inside the detection component, and a plurality of placement grooves are opened on the surface of the placement plate. In conjunction with a scratch detector, a plurality of groups of wafers can be detected at the same time, thereby improving detection efficiency. Since concave columns and clamping columns are arranged on the surface of the placement plate, a plurality of groups of placement plates can be stacked, thereby saving space and improving actual use effect.

[0014] The utility model provides a detection device for wafer scratches. A pop-up component is arranged inside a damping block. By sliding a second slide column, the second slide column can drive a second convex column to slide, so that the second convex column releases the limit on the U-shaped block. Under the action of a second spring, the detection frame can be slid out, and the detection frame is convenient to disassemble. The utility model has good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic structural diagram of a preferred embodiment of a wafer scratch detection device provided by the utility model;

[0016] Figure 2 This is the front view of the utility model;

[0017] Figure 3 This is a cross-sectional view of the interior of the box of the utility model;

[0018] Figure 4 This is a bottom view of the box of the utility model;

[0019] Figure 5 for Figure 4 Enlarged view of point A in .

[0020] Numbers in the figure: 1. U-shaped block; 2. Detection component; 201. Detection frame; 202. Sleeve 1; 203. Limit block; 204. Placement plate; 205. Placement slot; 206. Slide slot 1; 207. Spring 1; 208. Boss 1; 209. Slide post 1; 210. Concave column; 211. Card post; 3. Pop-up component; 301. Limit post; 302. Box body; 303. Spring 2; 304. Box door; 305. Acrylic plate; 306. Servo cylinder; 307. Scratch detector; 308. Sleeve 2; 309. Support column; 310. Slide slot 2; 311. Spring 3; 312. Boss 2; 313. Slide post 2; 4. Damping block. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings show typical embodiments of the present invention.

[0022] Embodiment 1:

[0023] like Figure 1-5 As shown, a detection device for wafer scratches of the utility model comprises a U-shaped block 1, a detection component 2 is fixed on the top surface of the U-shaped block 1, and a pop-up component 3 is provided on the inner surface of the U-shaped block 1, the detection component 2 comprises a detection frame 201 fixed to the surface of the U-shaped block 1, and a sleeve 202 is fixed on the surface of the detection frame 201, a limiting block 203 is fixed on the side surface of the detection frame 201, and a placement plate 204 is provided on the inner side of the detection frame 201, a plurality of groups of placement grooves 205 are provided on the top surface of the placement plate 204, a sliding groove 206 is provided on the surface of the sleeve 202, and a spring 207 is provided inside the sleeve 202, a boss 208 is provided inside the sleeve 202, and a sliding column 209 is fixed on the surface of the boss 208.

[0024] like Figure 1-5 As shown, a concave column 210 is fixed on the top surface of the placement plate 204 , and a clamping column 211 is fixed on the bottom surface of the placement plate 204 .

[0025] like Figure 1-5 As shown, the protruding column 208 passes through the detection frame 201 and the placement plate 204 in sequence and extends to the inside thereof, and the surface of the sliding column 209 contacts the inner wall of the sliding groove 206 .

[0026] like Figure 1-5 As shown, two groups of U-shaped blocks 1 are provided, and the U-shaped blocks 1 are arranged symmetrically with each other, and a damping block 4 is provided on the inner side of the U-shaped block 1 .

[0027] During implementation, by placing the wafer in the placement slot 205 and starting the servo electric cylinder 306 at the same time, the servo electric cylinder 306 pushes the scratch detector 307 to slide, so that multiple groups of wafers can be inspected, thereby improving the inspection efficiency. At the same time, since the concave column 210 and the clamping column 211 are provided on the surface of the placement plate 204, multiple groups of placement plates 204 can be stacked to save space. When the placement plate 204 needs to be separated from the inspection frame 201, the sliding column 209 can be used to slide the sliding column 209, and the sliding column 209 can drive the convex column 208 to slide, thereby separating the convex column 208 from the placement plate 204. The placement plate 204 can be slid to remove the placement plate 204. Due to the detachable design of the placement plate 204, the user can avoid direct contact with the wafer, thereby improving the inspection effect.

[0028] Embodiment 2:

[0029] like Figure 1-5 As shown, based on the first embodiment, the utility model provides a technical solution: the pop-up component 3 includes a limiting column 301 arranged on the inner side of the damping block 4, and a box body 302 is fixed on the surface of the limiting column 301, a spring 2 303 is sleeved on the surface of the limiting column 301, a box door 304 is installed on the surface of the box body 302 through a hinge, and an acrylic plate 305 is fixed to the side surface of the box body 302.

[0030] like Figure 1-5 As shown, a servo electric cylinder 306 is fixed to the top surface of the box door 304, and a plurality of scratch detectors 307 are fixed to the bottom surface of the servo electric cylinder 306, a sleeve 2 308 is fixed to the bottom surface of the box door 304, and a support column 309 is fixed to the bottom surface of the box door 304.

[0031] like Figure 1-5 As shown, a second slide groove 310 is provided on the surface of the second sleeve 308 , and a third spring 311 is provided inside the second sleeve 308 . A second protrusion 312 is movably connected inside the second sleeve 308 , and a second slide column 313 is fixed on the surface of the second protrusion 312 .

[0032] During implementation, when the detection frame 201 needs to be ejected, the sliding column 313 is slid, and the sliding column 313 drives the convex column 312 to slide, so that the convex column 312 is separated from the U-shaped block 1. At the same time, the spring 303 pushes the U-shaped block 1 to slide, and the detection frame 201 can be slid to a suitable position for easy removal.

[0033] The advantages of this technical solution in practical applications include but are not limited to the following:

[0034] 1. The detection assembly 2 is provided with a detection frame 201 and a placement plate 204. At the same time, a plurality of placement grooves 205 are provided on the surface of the placement plate 204. With the scratch detector 307, multiple groups of wafers can be detected at the same time to improve the detection efficiency. Since a concave column 210 and a clamping column 211 are provided on the surface of the placement plate 204, multiple groups of placement plates 204 can be stacked, which saves space and improves the actual use effect.

[0035] 2. By sliding the second slide post 313, the second slide post 313 can drive the second protrusion 312 to slide, so that the second protrusion 312 releases the limit on the U-shaped block 1. Under the action of the second spring 303, the detection frame 201 can be slid out, which is convenient for disassembling the detection frame 201 and has good practicality.

[0036] In the technical solution, by placing the wafer in the placement slot 205 and starting the servo electric cylinder 306 at the same time, the servo electric cylinder 306 pushes the scratch detector 307 to slide, so that multiple groups of wafers can be inspected, thereby improving the inspection efficiency. At the same time, since the surface of the placement plate 204 is provided with a concave column 210 and a clamping column 211, multiple groups of placement plates 204 can be stacked to save space. When the placement plate 204 and the inspection frame 201 need to be separated, the sliding column 209 is used, and the sliding column 209 can drive the convex column 208 to slide, thereby The placement plate 204 can be disassembled by separating the boss 1 208 from the placement plate 204 and sliding the placement plate 204. Due to the detachable design of the placement plate 204, the user is prevented from directly contacting the wafer, thereby improving the detection effect. When the detection frame 201 needs to be popped out, the sliding column 2 313 is sliding, and the sliding column 2 313 drives the boss 2 312 to slide, thereby separating the boss 2 312 from the U-shaped block 1. At the same time, the spring 2 303 pushes the U-shaped block 1 to slide, and the detection frame 201 can be slid to a suitable position for easy removal.

[0037] The above are only exemplary embodiments of the present disclosure, and the scope of the present disclosure cannot be limited thereto. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and the truth of practice, it will be easy for those skilled in the art to think of other embodiments of the present disclosure. This application is intended to cover any variation, use or adaptive change of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the technical field not recorded in the present disclosure.

Claims

1. A device for detecting wafer scratches, comprising a U-shaped block (1), characterized in that: A detection component (2) is fixed on the top surface of the U-shaped block (1), and a pop-up component (3) is provided on the inner surface of the U-shaped block (1); The detection assembly (2) comprises a detection frame (201) fixed to the surface of the U-shaped block (1), and a sleeve (202) is fixed on the surface of the detection frame (201), a limit block (203) is fixed on the side surface of the detection frame (201), and a placement plate (204) is provided on the inner side of the detection frame (201), and a plurality of placement grooves (205) are provided on the top surface of the placement plate (204), a sliding groove (206) is provided on the surface of the sleeve (202), and a spring (207) is provided inside the sleeve (202), a convex column (208) is provided inside the sleeve (202), and a sliding column (209) is fixed on the surface of the convex column (208).

2. The device for detecting wafer scratches according to claim 1, characterized in that: A concave column (210) is fixed on the top surface of the placement plate (204), and a clamping column (211) is fixed on the bottom surface of the placement plate (204).

3. The device for detecting wafer scratches according to claim 1, characterized in that: The protruding column 1 (208) sequentially penetrates the detection frame (201) and the placement plate (204) and extends into the interior thereof, and the surface of the sliding column 1 (209) contacts the inner wall of the sliding groove 1 (206).

4. The device for detecting wafer scratches according to claim 1, characterized in that: The U-shaped blocks (1) are provided in two groups, and the U-shaped blocks (1) are arranged symmetrically with each other. A damping block (4) is provided on the inner side of the U-shaped block (1).

5. The device for detecting wafer scratches according to claim 1, characterized in that: The pop-up assembly (3) comprises a limiting column (301) arranged on the inner side of the damping block (4), and a box body (302) is fixed on the surface of the limiting column (301), a spring 2 (303) is sleeved on the surface of the limiting column (301), a box door (304) is installed on the surface of the box body (302) via a hinge, and an acrylic plate (305) is fixed on the side surface of the box body (302).

6. The device for detecting wafer scratches according to claim 5, characterized in that: A servo electric cylinder (306) is fixed on the top surface of the box door (304), and a plurality of groups of scratch detectors (307) are fixed on the bottom surface of the servo electric cylinder (306). A sleeve 2 (308) is fixed on the bottom surface of the box door (304), and a support column (309) is fixed on the bottom surface of the box door (304).

7. The device for detecting wafer scratches according to claim 6, characterized in that: The surface of the second sleeve (308) is provided with a second slide groove (310), and the interior of the second sleeve (308) is provided with a third spring (311). The interior of the second sleeve (308) is movably connected with a second protrusion (312), and the surface of the second protrusion (312) is fixed with a second slide column (313).

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