Semiconductor wafer waxing equipment

Abstract

The utility model discloses semiconductor wafer waxing equipment, which relates to the technical field of semiconductor wafers and comprises a machine body. A conveying device is arranged on one side of the machine body; an electric push rod is fixedly connected to the inner side wall of the top end of the machine body; the bottom end of the electric push rod is fixedly connected with a motor; the output end of the motor is fixedly connected with a positioning frame; a heater is fixedly connected to the interior of the positioning frame; the positioning chassis is moved to the position below the positioning frame through the conveying device, the heater is internally provided with the heating wire, the wax disc is heated through heat of the heating wire, then the bottom end of the wax disc is attached to the surface of the semiconductor wafer body through the electric push rod, then the positioning frame is rotated through the motor, and therefore the wax disc waxes the semiconductor wafer body. The semiconductor wafer body can be conveyed to the position below the positioning frame through the conveying device, then the semiconductor wafer body is fully automatically waxed, and the waxing work efficiency of the semiconductor wafer body is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer waxing device. Background Art

[0002] Semiconductor wafer refers to the basic material used to manufacture integrated circuits and other semiconductor devices. It is usually made of high-purity silicon crystals with a flat surface and a specific lattice structure; the surface of the semiconductor wafer is coated with a thin layer of wax to protect the wafer surface from damage or contamination.

[0003] A Chinese patent with authorization announcement number CN219203112U discloses a semiconductor wax machine wafer carrier, including a wafer carrier body, one side of the wafer carrier body is recessed inward to form a plurality of circular grooves, an edge padding open ring is provided in the circular groove, the edge padding open ring is arranged along the inner wall of the circular groove, the side of the wafer carrier body is recessed inward to form a channel groove for tweezers to clamp a wafer, the channel groove extends to the inner cavity of the circular groove through the opening of the first edge open ring and the opening of the second edge open ring in sequence; by arranging the edge padding open ring in the circular groove on the wafer carrier body, a step formed by the height difference between the first edge open ring and the second edge open ring provides a support for the wafer and protects the wafer at the same time, the edge padding open ring raises the wafer to avoid the chip on the wafer from contacting the wafer carrier body, so that the chip on the wafer will not be damaged during the automatic material taking operation of the waxing machine, which is easy to mass produce and improves the yield.

[0004] The shortcomings of the above-mentioned prior art solutions are: the above-mentioned solution provides a support for the wafer by setting an edge pad open ring in the circular groove on the wafer carrier body, and the step formed by the height difference between the first edge open ring and the second edge open ring avoids the chip on the wafer from contacting the wafer carrier body, so that the chip on the wafer will not be damaged during the automatic material retrieval operation of the waxing machine; the above-mentioned solution is a simple storage of semiconductor wafers, which is convenient for subsequent material retrieval and waxing processing, but the waxing process cannot be performed automatically, resulting in cumbersome processing steps and low waxing efficiency of semiconductor wafers. Here we provide a semiconductor wafer waxing device. Utility Model Content

[0005] The utility model aims to provide a semiconductor wafer waxing device to solve the technical problems in the prior art that the waxing process cannot be automated, resulting in complicated processing steps and low semiconductor wafer waxing efficiency.

[0006] The technical problem to be solved by the utility model can be achieved through the following technical solutions:

[0007] A semiconductor wafer waxing device comprises a body; a conveying device is provided on one side of the body; an electric push rod is fixedly connected to the inner side wall of the top end of the body; a motor is fixedly connected to the bottom end of the electric push rod; a positioning frame is fixedly connected to the output end of the motor; a heater is fixedly connected to the interior of the positioning frame, and a heating wire is installed inside the heater; a wax tray is installed inside the positioning frame; a positioning chassis is provided at the top of the conveying device; a semiconductor wafer body is installed on the top of the positioning chassis; a limit rod is provided inside the positioning chassis, and a semiconductor wafer body is provided on one side of the limit rod.

[0008] As a further solution of the utility model: a fan is fixedly connected to one side of the electric push rod on the top inner side wall of the body; the bottom end of the fan is fixedly connected to an air collecting hood, and a semiconductor wafer body is provided at the bottom end of the air collecting hood.

[0009] As a further solution of the utility model: a plurality of groups of limit adjustment grooves are arranged inside the positioning chassis, and limit rods are inserted inside the limit adjustment grooves.

[0010] As a further solution of the utility model: a plurality of groups of positioning rods are fixedly connected to the bottom end of the heater; and a wax tray is installed at the bottom end of the positioning rods.

[0011] As a further solution of the utility model: a disassembly groove is provided on one side of the positioning rod, and a disassembly groove is opened inside the positioning frame; a disassembly knife is slidably connected to the inner side wall of the disassembly groove, and a wax tray is provided on one side of the disassembly knife.

[0012] As a further solution of the utility model: a No. 2 magnet sheet is fixedly connected inside the positioning chassis; a No. 1 magnet sheet is fixedly connected inside the conveying device, and the No. 1 magnet sheet corresponds to the No. 2 magnet sheet.

[0013] The beneficial effects of the utility model are as follows: the positioning chassis is moved to the bottom of the positioning frame by the conveying device, the motor is moved downward by the electric push rod, and the movement of the motor will cause the positioning frame to move together. Before work, the wax tray is installed at the bottom end of the positioning frame, and a heating wire is provided inside the heater. The wax tray is heated by the heat of the heating wire, and then the bottom end of the wax tray is fitted with the surface of the semiconductor wafer by the electric push rod, and then the positioning frame is rotated by the motor, so that the wax tray is waxed on the semiconductor wafer. The semiconductor wafer can be conveyed to the bottom of the positioning frame by the conveying device, and then the semiconductor wafer is automatically waxed, thereby improving the waxing efficiency of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described below in conjunction with the accompanying drawings.

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the positioning chassis structure in the utility model;

[0017] Figure 3 It is a schematic diagram of the positioning frame structure in the utility model.

[0018] In the figure: 1. machine body; 2. conveying device; 3. electric push rod; 4. motor; 5. positioning frame; 6. semiconductor wafer body; 7. positioning chassis; 8. heater; 9. wax tray; 10. positioning rod; 11. disassembly slot; 12. disassembly knife; 13. limit rod; 14. limit adjustment slot; 15. No. 1 magnet sheet; 16. No. 2 magnet sheet; 17. fan; 18. air collecting hood. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] like Figure 1-Figure 3 As shown, a semiconductor wafer waxing device comprises a body 1; a conveying device 2 is provided on one side of the body 1; an electric push rod 3 is fixedly connected to the inner side wall of the top end of the body 1; a motor 4 is fixedly connected to the bottom end of the electric push rod 3; a positioning frame 5 is fixedly connected to the output end of the motor 4; a heater 8 is fixedly connected to the interior of the positioning frame 5, and a heating wire is installed inside the heater 8; a wax tray 9 is installed inside the positioning frame 5; a positioning chassis 7 is provided at the top of the conveying device 2; a semiconductor wafer body 6 is installed on the top of the positioning chassis 7; a limiting rod 13 is provided inside the positioning chassis 7, and a semiconductor wafer body 6 is provided on one side of the limiting rod 13.

[0021] The positioning chassis 7 is moved to the bottom of the positioning frame 5 by the conveying device 2, and the motor 4 is moved downward by the electric push rod 3. The movement of the motor 4 will cause the positioning frame 5 to move together. Before work, the wax tray 9 is installed at the bottom end of the positioning frame 5. A heating wire is provided inside the heater 8. The wax tray 9 is heated by the heat of the heating wire, and then the bottom end of the wax tray 9 is fitted with the surface of the semiconductor wafer body 6 by the electric push rod 3. Then, the positioning frame 5 is rotated by the motor 4, so that the wax tray 9 is waxed on the semiconductor wafer body 6. The semiconductor wafer body 6 can be conveyed to the bottom of the positioning frame 5 by the conveying device 2, and then the semiconductor wafer body 6 is waxed automatically, thereby improving the waxing work efficiency of the semiconductor wafer body 6.

[0022] A fan 17 is fixedly connected to one side of the electric push rod 3 on the inner wall of the top of the body 1; a wind collecting cover 18 is fixedly connected to the bottom end of the fan 17, and a semiconductor wafer body 6 is provided at the bottom end of the wind collecting cover 18.

[0023] After being waxed, the semiconductor wafer body 6 needs to be quickly air-dried. The positioning chassis 7 is moved to the bottom of the fan 17 through the conveying device 2. The movement of the positioning chassis 7 causes the semiconductor wafer body 6 to move together. The wind generated by the fan 17 is transported to the surface of the semiconductor wafer body 6, which can quickly dry the wax on the semiconductor wafer body 6. The wind collecting hood 18 can concentrate the wind force to prevent the wind from flowing in other directions.

[0024] The interior of the positioning chassis 7 is provided with a plurality of limit adjustment grooves 14 , and the limit rods 13 are inserted into the limit adjustment grooves 14 .

[0025] During operation, the positioning chassis 7 is placed on the conveying device 2, and then the semiconductor wafer body 6 is placed on the positioning chassis 7. The limit rod 13 can be inserted according to the size of the semiconductor wafer body 6. A plurality of limit adjustment grooves 14 are arranged inside the positioning chassis 7. The limit rod 13 is inserted into the limit adjustment groove 14 to limit the position of the semiconductor wafer body 6, thereby preventing the semiconductor wafer body 6 from rotating during the waxing process. The limit rod 13 can be inserted according to the size of the semiconductor wafer body 6.

[0026] A plurality of positioning rods 10 are fixedly connected to the bottom end of the heater 8 ; a wax tray 9 is installed at the bottom end of the positioning rods 10 .

[0027] Before work, the wax tray 9 needs to be installed at the bottom end of the positioning frame 5. The wax tray 9 can be inserted into the positioning rod 10. The positioning rod 10 is used to limit the position of the wax tray 9 to prevent the wax tray 9 from falling during work. The positioning rod 10 can also transfer the heat of the heater 8 to the wax tray 9.

[0028] A disassembly groove 11 is provided on one side of the positioning rod 10 , and a disassembly groove 11 is provided inside the positioning frame 5 ; a disassembly knife 12 is slidably connected to the inner side wall of the disassembly groove 11 , and a wax tray 9 is provided on one side of the disassembly knife 12 .

[0029] The wax tray 9 needs to be replaced after being worn out. The disassembly knife 12 inside the sliding disassembly groove 11 is inserted into the wax tray 9, and then the disassembly knife 12 is rotated to lift the wax tray 9, which is convenient for disassembly and replacement of the wax tray 9. The disassembly knife 12 is magnetically connected to the disassembly groove 11, which is convenient for limiting the disassembly knife 12 and also convenient for using the disassembly knife 12 to operate the wax tray 9.

[0030] A second magnet sheet 16 is fixedly connected to the interior of the positioning chassis 7 ; a first magnet sheet 15 is fixedly connected to the interior of the conveying device 2 , and the first magnet sheet 15 corresponds to the second magnet sheet 16 .

[0031] A No. 2 magnet sheet 16 is fixedly connected to the bottom end of the positioning chassis 7, and a No. 1 magnet sheet 15 is fixedly connected to the top end of the conveying device 2. The No. 2 magnet sheet 16 and the No. 1 magnet sheet 15 are adsorbed by magnetic attraction. When the positioning chassis 7 is placed on the conveying device 2, the positioning chassis 7 is adsorbed and fixed by the cooperation of the No. 2 magnet sheet 16 and the No. 1 magnet sheet 15 to avoid arbitrary changes in the position of the positioning chassis 7 during operation.

[0032] The working principle of the utility model is as follows: during operation, the positioning chassis 7 is placed on the conveying device 2, and then the semiconductor wafer body 6 is placed on the positioning chassis 7. The limiting rod 13 can be inserted according to the size of the semiconductor wafer body 6. The interior of the positioning chassis 7 is provided with a plurality of limiting adjustment grooves 14. The limiting rod 13 is inserted into the limiting adjustment grooves 14 to limit the position of the semiconductor wafer body 6, so as to prevent the semiconductor wafer body 6 from rotating during the waxing process. The limiting rod 13 can be inserted according to the size of the semiconductor wafer body 6. The bottom end of the positioning chassis 7 is fixedly connected with a No. 2 magnet sheet 16, and the top end of the conveying device 2 is fixedly connected with a No. 1 magnet sheet 15. The No. 2 magnet sheet 16 and the No. 1 magnet sheet 15 are fixedly connected. The sheet 15 is adsorbed by the magnetic attraction. When the positioning chassis 7 is placed on the conveying device 2, the positioning chassis 7 is adsorbed and fixed by the cooperation of the second magnet sheet 16 and the first magnet sheet 15 to prevent the position of the positioning chassis 7 from changing at will during the work process; the positioning chassis 7 is moved to the bottom of the positioning frame 5 by the conveying device 2, and the motor 4 is moved downward by the electric push rod 3. The movement of the motor 4 will move the positioning frame 5 together. Before work, the wax tray 9 is installed at the bottom end of the positioning frame 5. A heating wire is provided inside the heater 8. The wax tray 9 is heated by the heat of the heating wire, and then the bottom end of the wax tray 9 is attached to the surface of the semiconductor wafer 6 by the electric push rod 3, and then The motor 4 rotates the positioning frame 5, so that the wax disc 9 waxes the semiconductor wafer body 6. The semiconductor wafer body 6 can be transported to the bottom of the positioning frame 5 by the conveying device 2, and then the semiconductor wafer body 6 is waxed automatically, thereby improving the waxing efficiency of the semiconductor wafer body 6. Before work, the wax disc 9 needs to be installed at the bottom end of the positioning frame 5. The wax disc 9 can be inserted into the positioning rod 10. The position of the wax disc 9 is limited by the positioning rod 10 to prevent the wax disc 9 from falling during work. The positioning rod 10 can also transfer the heat of the heater 8 to the wax disc 9. After the wax disc 9 is worn out, it needs to be replaced. The disassembly knife 12 in the sliding disassembly groove 11 is used to make the disassembly knife 1 2 is inserted into the wax tray 9, and then the disassembly knife 12 is rotated to lift the wax tray 9, which is convenient for disassembling and replacing the wax tray 9. The disassembly knife 12 is magnetically connected to the disassembly slot 11, which is convenient for limiting the disassembly knife 12 and also convenient for using the disassembly knife 12 to operate the wax tray 9; the semiconductor wafer body 6 needs to be quickly air-dried after being waxed, and the positioning chassis 7 is moved to the bottom of the fan 17 by the conveying device 2. The movement of the positioning chassis 7 causes the semiconductor wafer body 6 to move together, and the wind generated by the fan 17 is conveyed to the surface of the semiconductor wafer body 6, so that the wax on the semiconductor wafer body 6 can be quickly air-dried, and the wind collecting hood 18 can concentrate the wind force to prevent the wind from flowing in other directions.

[0033] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A semiconductor wafer waxing device, characterized in that: The invention comprises a machine body (1); a conveying device (2) is provided on one side of the machine body (1); an electric push rod (3) is fixedly connected to the inner side wall of the top end of the machine body (1); a motor (4) is fixedly connected to the bottom end of the electric push rod (3); a positioning frame (5) is fixedly connected to the output end of the motor (4); a heater (8) is fixedly connected to the interior of the positioning frame (5), and a heating wire is installed inside the heater (8); a wax disc (9) is installed inside the positioning frame (5); a positioning chassis (7) is provided at the top end of the conveying device (2); a semiconductor wafer (6) is installed at the top end of the positioning chassis (7); a limiting rod (13) is provided inside the positioning chassis (7), and a semiconductor wafer (6) is provided on one side of the limiting rod (13).

2. A semiconductor wafer waxing device according to claim 1, characterized in that: A fan (17) is fixedly connected to one side of the electric push rod (3) on the inner wall of the top end of the machine body (1); a wind collecting hood (18) is fixedly connected to the bottom end of the fan (17); and a semiconductor wafer body (6) is provided at the bottom end of the wind collecting hood (18).

3. A semiconductor wafer waxing device according to claim 1, characterized in that: The interior of the positioning chassis (7) is provided with a plurality of groups of limit adjustment grooves (14), and the limit rods (13) are inserted into the interior of the limit adjustment grooves (14).

4. A semiconductor wafer waxing device according to claim 1, characterized in that: A plurality of groups of positioning rods (10) are fixedly connected to the bottom end of the heater (8); a wax tray (9) is installed at the bottom end of the positioning rods (10).

5. A semiconductor wafer waxing device according to claim 4, characterized in that: A disassembly groove (11) is provided on one side of the positioning rod (10), and a disassembly groove (11) is provided inside the positioning frame (5); a disassembly knife (12) is slidably connected to the inner side wall of the disassembly groove (11), and a wax tray (9) is provided on one side of the disassembly knife (12).

6. The semiconductor wafer waxing device according to claim 1, characterized in that: A second magnet sheet (16) is fixedly connected to the interior of the positioning chassis (7); a first magnet sheet (15) is fixedly connected to the interior of the conveying device (2), and the first magnet sheet (15) corresponds to the second magnet sheet (16).

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