Alumina heating plate for semiconductor

Abstract

The utility model relates to the technical field of semiconductor heating, and discloses an aluminum oxide heating plate for a semiconductor, which comprises a box body, the front end of the box body is rotatably connected with a box door, the middle part of the box door is provided with an observation window, the left side of the inner wall of the box body is fixedly connected with a heater, and the bottom end of the inner wall of the box body is fixedly connected with an overturning assembly. A top box is fixedly connected to the top end of the overturning assembly, a second motor is fixedly connected to the bottom end of the inner wall of the top box, a second rotating shaft is fixedly connected to the driving end of the second motor, a top disc is fixedly connected to the exterior of the second rotating shaft, supporting columns are fixedly connected to the four sides of the bottom end of the top disc, and supporting rods are rotationally connected to the two sides of the top end of the top disc. According to the semiconductor clamping device, the second motor drives the top disc to rotate so as to drive the supporting rods and the clamping plates to clamp towards the center, so that clamping operation on a semiconductor is achieved, semiconductors of different sizes can be clamped more conveniently, and the applicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor heating, in particular to an aluminum oxide heating plate for semiconductors. Background Art

[0002] Semiconductor heating technology is a new heating method that uses the electrothermal properties of semiconductor materials to generate heat when current passes through them. This technology has the advantages of high efficiency, energy saving, and environmental protection, and is widely used in home appliances, industry, and other fields, such as semiconductor water heaters, semiconductor drying equipment, etc.

[0003] After searching, Chinese patent announcement number: CN220383244U discloses a semiconductor heating plate, the heating plate is arranged inside the shell, the bottom plate is arranged at the bottom of the shell, a plurality of evenly distributed support rods are fixed on the upper side of the bottom plate, a ceramic plate is arranged at the bottom of the heating plate, and the upper side of the ceramic plate is in contact with the lower side of the heating plate, the lower side of the ceramic plate is provided with a mounting groove corresponding to the support rod, a limiting component is arranged in the mounting groove, the limiting component is used to limit the position of the support rod, and a semiconductor heater is arranged at the bottom of the ceramic plate. The limiting component limits the support rod in the mounting groove, so that the position of the ceramic plate is fixed and stable, and while facilitating the disassembly and installation of the ceramic plate, it can also make it possible to maintain the upper side of the ceramic plate and the lower side of the heating plate in a state of contact during the heating of the heating plate, so as to avoid the problem of reduced heating effect caused by the downward movement of the ceramic plate out of contact with the heating plate.

[0004] The beneficial effects in the above patent specification mention that "through the setting of the limiting component, the connection between the support rod and the ceramic plate can be limited, so that the position of the ceramic plate can be fixed on the lower side of the heating plate, thereby maintaining the ceramic plate in contact with the heating plate during the entire heating process, thereby realizing the heating function of the heating plate." Although the above patent can limit the connection between the support rod and the ceramic plate, so that the position of the ceramic plate can be fixed on the lower side of the heating plate, it is unable to clamp semiconductors of different sizes according to different needs during specific use, which reduces the applicability of this device. For this reason, an alumina heating plate for semiconductors is proposed to solve the above problem. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides an alumina heating plate for semiconductors, aiming to improve the problem in the prior art that semiconductors of different sizes cannot be clamped according to different requirements, thereby reducing the applicability of the device.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A semiconductor alumina heating plate comprises a box body, the front end of the box body is rotatably connected to a box door, the middle part of the box door is provided with an observation window, the left side of the inner wall of the box body is fixedly connected to a heater, the bottom end of the inner wall of the box body is fixedly connected to a flip assembly, the top end of the flip assembly is fixedly connected to a top box, the bottom end of the inner wall of the top box is fixedly connected to a second motor, the driving end of the second motor is fixedly connected to a second rotating shaft, the outside of the second rotating shaft is fixedly connected to a top plate, the four sides of the bottom end of the top plate are fixedly connected to pillars, the two sides of the top end of the top plate are rotatably connected to support rods, the other end of the support rods is rotatably connected to a limiting block, the top end of the limiting block is fixedly connected to a clamping plate, the inside of the clamping plate is provided with a groove, and the inner wall of the groove is slidably connected to a shock absorbing assembly;

[0008] As a further description of the above technical solution:

[0009] The flip assembly comprises a bottom ring, the bottom end of which is fixedly connected to the bottom end of the inner wall of the box body, the bottom end of the inner wall of the box body is fixedly connected to a motor 1, and the driving end of the motor 1 is fixedly connected to a rotating shaft 1;

[0010] As a further description of the above technical solution:

[0011] The shock absorbing assembly comprises a rubber pad, the outer side wall of the rubber pad is fixedly connected to a limiting plate, and a plurality of springs are arranged inside the groove;

[0012] As a further description of the above technical solution:

[0013] The top end of the bottom ring is rotatably connected to the bottom end of the top box, and the outer top end of the second rotating shaft is rotatably connected to the inner wall of the top end of the top box;

[0014] As a further description of the above technical solution:

[0015] The bottom end of the support is slidably connected to the bottom end of the inner wall of the top box, and the top end of the support rod is slidably connected to the top end of the inner wall of the top box;

[0016] As a further description of the above technical solution:

[0017] The outer portion of the limit block is slidably connected to the inner wall of the top end of the top box, and the bottom end of the clamping plate is slidably connected to the top end of the top box;

[0018] As a further description of the above technical solution:

[0019] The outer portion of the limit plate is slidably connected to the inner wall of the groove, and a handle is fixedly connected to the right side of the front end of the door;

[0020] As a further description of the above technical solution:

[0021] One end of the spring is fixedly connected to one side of the inner wall of the groove, and the other end of the spring is fixedly connected to one side of the limiting plate.

[0022] The utility model has the following beneficial effects:

[0023] In the utility model, the rotation of the top plate is driven by motor 2, thereby driving the support rod and the clamping plate to clamp toward the center, thereby realizing the clamping operation of the semiconductor, making it easier to clamp semiconductors of different sizes, thereby improving the applicability of the device. At the same time, when the clamping plate clamps the semiconductor, the rubber pad here will be squeezed by force, so that the limit plate cooperates with the groove to squeeze the spring, causing it to contract, and at the same time providing a reaction force, so that it can clamp the semiconductor more tightly without damaging it, thereby increasing the stability of the device.

[0024] In the utility model, the top box is driven to rotate by starting the motor, and the bottom ring here serves as a support for the top box to prevent it from tilting during rotation. This structure achieves the effect of flipping the heated semiconductor, thereby comprehensively heating the semiconductor and improving the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a three-dimensional schematic diagram of an aluminum oxide heating plate for semiconductors proposed by the utility model;

[0026] Figure 2 This is a schematic diagram of the structure of a heater of an alumina heating plate for semiconductors proposed by the utility model;

[0027] Figure 3 This is a schematic structural diagram of a top plate of an alumina heating plate for semiconductors proposed by the utility model;

[0028] Figure 4 The utility model is a schematic structural diagram of a clamping plate of an alumina heating plate for semiconductors.

[0029] Legend:

[0030] 1. Box body; 2. Box door; 3. Observation window; 4. Heater; 5. Bottom ring; 6. Motor 1; 7. Shaft 1; 8. Top box; 9. Motor 2; 10. Shaft 2; 11. Top plate; 12. Pillar; 13. Support rod; 14. Limit block; 15. Clamp; 16. Groove; 17. Rubber pad; 18. Limit plate; 19. Spring. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Reference Figure 1-Figure 2 The utility model provides an embodiment: an alumina heating plate for semiconductors, comprising a box body 1, a box door 2 is rotatably connected to the front end of the box body 1, an observation window 3 is opened in the middle of the box door 2, and the observation window 3 here is used to observe the heating situation of the semiconductor inside the box body 1, a handle is fixedly connected to the right side of the front end of the box door 2, a heater 4 is fixedly connected to the left side of the inner wall of the box body 1, and the heater 4 here is used to heat the semiconductor, and a flip assembly is fixedly connected to the bottom end of the inner wall of the box body 1.

[0033] Reference Figure 3 The flip assembly includes a bottom ring 5, the bottom end of the bottom ring 5 is fixedly connected to the bottom end of the inner wall of the box body 1, and the flip assembly here can realize the flipping effect of the vertically clamped semiconductor, so as to realize the comprehensive heating of the semiconductor, the bottom end of the inner wall of the box body 1 is fixedly connected with a motor 6, the driving end of the motor 6 is fixedly connected with a rotating shaft 7, and the top of the flip assembly is fixedly connected with a top box 8. After starting, the motor 6 here can drive the rotating shaft 7 to rotate, thereby driving the rotation of the top box 8, and the top box 8 here is made of aluminum oxide, which is usually called alumina. It is a hard, amphoteric oxide with many significant properties, including high melting point, excellent wear resistance and corrosion resistance. It is an excellent semiconductor heating support base;

[0034] The bottom end of the top box 8 is rotatably connected to the bottom end of the rotating shaft 1 7, the bottom end of the inner wall of the top box 8 is fixedly connected to the motor 2 9, the driving end of the motor 2 9 is fixedly connected to the rotating shaft 2 10, the motor 2 9 here can drive the rotating shaft 2 10 to rotate after starting, the outer top end of the rotating shaft 2 10 is rotatably connected to the inner wall of the top end of the top box 8, the outer part of the rotating shaft 2 10 is fixedly connected to the top plate 11, the rotating shaft 2 10 here can drive the rotation of the top plate 11 when rotating, and the top box 8 here provides a stable support for the rotating shaft 2 10, so that it remains stable when rotating;

[0035] The four sides of the bottom end of the top plate 11 are fixedly connected with pillars 12, and the bottom ends of the pillars 12 are slidably connected to the bottom ends of the inner walls of the top box 8. The multiple pillars 12 here provide stable rotation support for the top plate 11. The top sides of the top of the top plate 11 are rotatably connected with support rods 13, and the top ends of the support rods 13 are slidably connected to the top ends of the inner walls of the top box 8. The other ends of the support rods 13 are rotatably connected to the limit blocks 14. When the top plate 11 here rotates, it can drive the two support rods 13 to clamp toward the center, thereby driving the two limit blocks 14 to move toward the center.

[0036] Reference Figure 3-Figure 4 The outside of the limit block 14 is slidably connected to the inner wall of the top end of the top box 8, and the top of the limit block 14 is fixedly connected with a clamping plate 15. The function of the limit block 14 here is to maintain the stability of the clamping plate 15 when it moves at the top end of the top box 8, so that it can move in a straight line without deviation. The bottom end of the clamping plate 15 is slidably connected to the top end of the top box 8. A groove 16 is provided inside the clamping plate 15, and a shock-absorbing component is slidably connected to the inner wall of the groove 16. The shock-absorbing component includes a rubber pad 17. The shock-absorbing component here can effectively reduce the force applied to the clamped semiconductor, protect the surface of the semiconductor from damage, and prevent cracks from occurring during the heating process.

[0037] The outer wall of the rubber pad 17 is fixedly connected to the limit plate 18, and the outer part of the limit plate 18 is slidably connected to the inner wall of the groove 16. A plurality of springs 19 are arranged inside the groove 16. After the rubber pad 17 clamps the semiconductor, it transmits a squeezing force to the limit plate 18, and the limit plate 18 transmits this force to the spring 19, causing it to generate a reaction force, so that the rubber pad 17 can clamp the semiconductor tighter. One end of the spring 19 is fixedly connected to one side of the inner wall of the groove 16, and the other end of the spring 19 is fixedly connected to one side of the limit plate 18. The groove 16 and the limit plate 18 here provide stable support for the spring 19, so that it maintains its own stability during expansion and contraction to prevent breakage.

[0038] Working principle: When the staff uses this alumina heating plate, they can first open the box door 2. At this time, they can place the semiconductor to be heated on the top of the top box 8, and then start the motor 2 9. At this time, the motor 2 9 will drive the rotation of the shaft 2 10 and the top plate 11, thereby driving the support rod 13, the limit block 14 and the clamping plate 15 to clamp toward the center. The support 12 here plays a supporting role for the top plate 11, so that it remains stable during rotation. When the rubber pad 17 first contacts the semiconductor, with the squeezing force, the rubber pad 17 transfers the force to the limit plate 18, thereby cooperating with the groove 16 to cause the spring 19 to contract. At the same time, the spring 19 releases the reaction force, so that the rubber pad 17 clamps the semiconductor tighter. At the same time, the rubber pad 17 here is made of rubber, so even if the semiconductor is clamped, its surface will not be damaged, avoiding the risk of surface cracks when using the heater 4 to heat it.

[0039] Then the motor 6 can be started, and the motor 6 will drive the rotating shaft 7 to rotate, thereby driving the top box 8 to rotate, and the semiconductor can be driven to rotate 360 ​​degrees in all directions. At this time, the heater 4 can be turned on to heat it in all directions, thereby improving the quality of the product. During the heating process, the staff can observe the heating of the semiconductor from the observation window 3. After the heating is completed, the semiconductor can be taken out by pulling the handle.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An alumina heating plate for semiconductor, comprising a housing (1), characterized in that: The front end of the box body (1) is rotatably connected to a box door (2), the middle of the box door (2) is provided with an observation window (3), the left side of the inner wall of the box body (1) is fixedly connected to a heater (4), the bottom end of the inner wall of the box body (1) is fixedly connected to a flip assembly, the top of the flip assembly is fixedly connected to a top box (8), the bottom end of the inner wall of the top box (8) is fixedly connected to a second motor (9), the driving end of the second motor (9) is fixedly connected to a second rotating shaft (10), the outside of the second rotating shaft (10) is fixedly connected to a top plate (11), the bottom four sides of the top plate (11) are fixedly connected to pillars (12), the top two sides of the top of the top plate (11) are rotatably connected to support rods (13), the other end of the support rods (13) is rotatably connected to a limit block (14), the top of the limit block (14) is fixedly connected to a clamping plate (15), the inside of the clamping plate (15) is provided with a groove (16), and the inner wall of the groove (16) is slidably connected to a shock absorbing assembly.

2. The alumina heating plate for semiconductor according to claim 1, characterized in that: The flip assembly comprises a bottom ring (5), the bottom end of the bottom ring (5) being fixedly connected to the bottom end of the inner wall of the box body (1), the bottom end of the inner wall of the box body (1) being fixedly connected to a motor 1 (6), and the driving end of the motor 1 (6) being fixedly connected to a rotating shaft 1 (7).

3. The alumina heating plate for semiconductor according to claim 1, characterized in that: The shock absorbing assembly comprises a rubber pad (17), the outer side wall of the rubber pad (17) is fixedly connected to a limiting plate (18), and a plurality of springs (19) are arranged inside the groove (16).

4. The alumina heating plate for semiconductor according to claim 2, characterized in that: The top end of the bottom ring (5) is rotatably connected to the bottom end of the top box (8), and the outer top end of the second rotating shaft (10) is rotatably connected to the inner wall of the top end of the top box (8).

5. The alumina heating plate for semiconductor according to claim 1, characterized in that: The bottom end of the support (12) is slidably connected to the bottom end of the inner wall of the top box (8), and the top end of the support rod (13) is slidably connected to the top end of the inner wall of the top box (8).

6. The alumina heating plate for semiconductor according to claim 1, characterized in that: The outside of the limit block (14) is slidably connected to the inner wall of the top end of the top box (8), and the bottom end of the clamping plate (15) is slidably connected to the top end of the top box (8).

7. The alumina heating plate for semiconductor according to claim 3, characterized in that: The outside of the limiting plate (18) is slidably connected to the inner wall of the groove (16), and a handle is fixedly connected to the right side of the front end of the box door (2).

8. The alumina heating plate for semiconductor according to claim 3, characterized in that: One end of the spring (19) is fixedly connected to one side of the inner wall of the groove (16), and the other end of the spring (19) is fixedly connected to one side of the limiting plate (18).

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