SBD device positioning and packaging structure

Abstract

The utility model discloses an SBD device positioning packaging structure, which comprises a positioning block, an SBD chip, an injection molding packaging substrate, a first pin and a second pin, the positioning block is arranged in the injection molding packaging substrate, an opening corresponding to the SBD chip is concavely arranged on the front surface of the positioning block, the SBD chip is arranged in the opening, and the first pin and the second pin are arranged in the injection molding packaging substrate. First positioning columns which upwards extend to the top surface of the injection molding packaging base body are arranged at the top of the positioning block at intervals, first positioning holes are formed in the first positioning columns, and second positioning columns which downwards extend to the bottom surface of the injection molding packaging base body are arranged at the bottom of the positioning block at intervals. According to the positioning and packaging structure of the SBD device, the SBD core can be clamped and positioned through the positioning block, and the first positioning hole and the second positioning hole are matched with a positioning pin in a packaging injection mold, so that the positioning block is fixed, and the stability in the injection packaging process is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of SBD packaging, in particular to a SBD device positioning packaging structure. Background Art

[0002] During the production process of SBD devices (Schottky diodes), they need to be packaged for protection. In order to reduce costs, insulating plastic materials can be used for injection molding of SBDs to ensure insulation effects and improve safety in use.

[0003] The injection molding package of SBD devices requires the use of an injection mold. The SBD chip is placed in the cavity of the injection mold, and the mold is closed for injection molding to expose the end of the pin. In order to achieve the positioning of the SBD chip in the mold cavity, a positioning groove corresponding to the pin can be designed in the injection mold, and the SBD chip can be indirectly positioned by positioning the pin. However, the pin is relatively slender and has a certain elasticity. The positioning stability is poor and it is easy to deform during the injection molding impact process, resulting in the problem of SBD chip offset, which reduces the qualified rate and needs to be improved. Utility Model Content

[0004] The utility model aims to provide a SBD device positioning packaging structure to position the SBD chip and improve the position accuracy and qualified rate of the packaging.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A SBD device positioning packaging structure comprises: a positioning block, an SBD chip, an injection molding packaging base, a first pin and a second pin, wherein the positioning block is arranged in the injection molding packaging base, the front side of the positioning block is concavely provided with an opening corresponding to the SBD chip, the SBD chip is arranged in the opening, the first pin is arranged at the upper part of the SBD chip and extends to the left to the outside of the injection molding packaging base, the second pin is arranged at the lower part of the SBD chip and extends to the right to the outside of the injection molding packaging base, the top of the positioning block is provided with a first positioning column extending upward to the top surface of the injection molding packaging base, the first positioning column is provided with a first positioning hole, the bottom of the positioning block is provided with a second positioning column extending downward to the bottom surface of the injection molding packaging base, the second positioning column is provided with a second positioning hole.

[0007] Wherein, the positioning block, the first positioning column and the second positioning column adopt an integrated structure.

[0008] Wherein, the positioning block is an insulating plastic block or a ceramic block.

[0009] Wherein, a first conductive adhesive layer for fixing the first pin is arranged on the top surface of the SBD chip.

[0010] Wherein, a second conductive adhesive layer for fixing the second pin is arranged on the bottom surface of the SBD chip.

[0011] Wherein, the number of the first positioning columns is at least 2.

[0012] Wherein, the number of the second positioning columns is at least 2.

[0013] The beneficial effects of the utility model are as follows: an SBD device positioning packaging structure can clamp and position the SBD core through a positioning block, and utilize the first positioning hole and the second positioning hole to cooperate with the positioning pins in the packaging injection mold to fix the positioning block, thereby improving the stability during the injection molding packaging process, improving the position accuracy of the SBD chip in the injection molding packaging substrate and the packaging production qualification rate, and the first positioning hole and the second positioning hole are also beneficial to the weight reduction and heat dissipation of the injection molding packaging substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model;

[0015] Figure 2 yes Figure 1 Left view of the center positioning block. DETAILED DESCRIPTION

[0016] Combine the following Figure 1~Figure 2 The technical solution of the utility model is further illustrated by specific embodiments.

[0017] like Figure 1 The SBD device positioning packaging structure shown includes: a positioning block 1, an SBD chip 2, an injection molding packaging base 3, a first pin 11 and a second pin 12. The positioning block 1 is arranged in the injection molding packaging base 3, and the injection molding packaging base 3 is injection molded by an injection mold to achieve coverage of the positioning block 1 and the SBD chip 2.

[0018] An opening 10 corresponding to the SBD chip 2 is provided in the front of the positioning block 1, and the SBD chip 2 is provided in the opening 10. Figure 2 As shown, the opening 10 runs through the left and right sides of the positioning block 1, which is conducive to the placement of the SBD chip 2. In this embodiment, the positioning block 1 is made of an insulating plastic block or a ceramic block, which has a good insulation effect and ensures the safety of the SBD chip 2.

[0019] The first pin 11 is arranged on the upper part of the SBD chip and extends to the left to the outside of the injection molding package base 3. In this embodiment, the top surface of the SBD chip 2 is provided with a first conductive adhesive layer 6 for fixing the first pin 11, so as to realize the connection and conductivity between the top surface of the SBD chip 2 and the first pin 11, thereby improving the stability of the packaging injection molding process.

[0020] The second pin 12 is arranged at the lower part of the SBD chip 2 and extends rightward to the outside of the injection-molded package base 3. In this embodiment, a second conductive adhesive layer 7 for fixing the second pin 12 is arranged on the bottom surface of the SBD chip 2 to achieve connection and conduction between the bottom surface of the SBD chip 2 and the second pin 12.

[0021] A first positioning column 4 extending upward to the top surface of the injection-molded packaging substrate 3 is arranged at intervals on the top of the positioning block 1, and a first positioning hole 5 is arranged in the first positioning column 4. In the present embodiment, the number of the first positioning columns 4 is at least 2, and the top of the positioning block 1 is positioned by cooperating with the positioning pins in the packaging injection mold through at least 2 first positioning holes 5.

[0022] like Figure 1 As shown, second positioning columns 8 extending downward to the bottom surface of the injection-molded packaging substrate 3 are arranged at intervals at the bottom of the positioning block 1, and second positioning holes 9 are arranged in the second positioning columns 8. In the present embodiment, the number of the second positioning columns 8 is at least 2, and the positioning of the bottom of the positioning block 1 is achieved by cooperating with the positioning pins in the packaging injection mold through at least 2 second positioning holes 9.

[0023] In this embodiment, the positioning block 1, the first positioning column 4 and the second positioning column 8 adopt an integrated structure, are prefabricated with insulating plastic or ceramic, have a small size and light weight, and are then placed in the injection mold of the injection molding package base 3 for positioning, thereby improving the positioning accuracy and packaging qualification rate of the SBD chip 2.

[0024] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A SBD device positioning packaging structure, characterized in that: include: A positioning block, an SBD chip, an injection molding package base, a first pin and a second pin, wherein the positioning block is arranged in the injection molding package base, an opening corresponding to the SBD chip is arranged in a concave manner on the front side of the positioning block, and the SBD chip is arranged in the opening, the first pin is arranged at the upper part of the SBD chip and extends to the left to the outside of the injection molding package base, the second pin is arranged at the lower part of the SBD chip and extends to the right to the outside of the injection molding package base, a first positioning column extending upward to the top surface of the injection molding package base is arranged at the top of the positioning block, a first positioning hole is arranged in the first positioning column, and a second positioning column extending downward to the bottom surface of the injection molding package base is arranged at the bottom of the positioning block, and a second positioning hole is arranged in the second positioning column.

2. The SBD device positioning packaging structure according to claim 1, characterized in that: The positioning block, the first positioning column and the second positioning column adopt an integrated structure.

3. The SBD device positioning packaging structure according to claim 1, characterized in that: The positioning block is an insulating plastic block or a ceramic block.

4. The SBD device positioning packaging structure according to claim 1, characterized in that: The top surface of the SBD chip is provided with a first conductive adhesive layer for fixing the first pin.

5. The SBD device positioning packaging structure according to claim 1, characterized in that: The bottom surface of the SBD chip is provided with a second conductive adhesive layer for fixing the second pin.

6. The SBD device positioning packaging structure according to claim 1, characterized in that: The number of the first positioning columns is at least 2.

7. The SBD device positioning packaging structure according to claim 1, characterized in that: The number of the second positioning columns is at least 2.

Images