Radial pin packaging structure for ring core type seed ball
By setting ring-core type balls and radial pins on the chip, combined with half-cut dispensing metal and printed metal wires, the shortcomings of traditional packaging structures in contact density and heat dissipation efficiency are solved, and more efficient space utilization and heat dissipation are achieved Effect.
Patent Information
- Application Number
- CN202420903838.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-04-28
AI Technical Summary
Traditional packaging structures can no longer meet the needs of development in improving contact density, especially in terms of effective utilization of chip space and improving heat dissipation efficiency.
Design a radial pin packaging structure for ring-core type balls. By setting up metal balls and pins on the chip, and combining half-cut dispensing metal and printed metal wire with plastic sealant, an effective conductive path and heat dissipation channel is formed. .
The effective utilization of the space around the chip is achieved, the contact density is improved, and the heat dissipation efficiency is improved by optimizing the heat dissipation structure.
Smart Images
Figure CN222507627U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical direction of pin packaging structure, and specifically relates to a radial pin packaging structure for a ring core type bulb. Background Art
[0002] QFN is a pinless package that is square or rectangular in shape. There is a large exposed pad in the center of the bottom of the package for heat conduction, and there are conductive pads around the periphery of the package for electrical connection around the large pad. Since the QFN package does not have gull-wing leads like traditional SOIC and TSOP packages, the conductive path between the internal pins and the pads is short, and the self-inductance coefficient and wiring resistance in the package are very low. In addition, it provides excellent heat dissipation performance through the exposed lead frame pad, which has a direct heat dissipation channel for releasing heat in the package. The heat dissipation pad is usually soldered directly to the circuit board, and the heat dissipation vias in the PCB help to spread the excess power consumption into the copper ground plane, thereby absorbing excess heat.
[0003] The traditional packaging structure has a first pin on the periphery of the chip and a second pin on the bottom to increase the contact density, but it can no longer meet the needs of development. This phenomenon has become a problem that needs to be solved urgently by people in this field. Therefore, a radial pin packaging structure for a ring core type bulb is designed to effectively utilize the space on the chip and increase the contact density. Utility Model Content
[0004] The utility model aims to provide a radial pin packaging structure for a ring-core type bulb in the existing device to solve the problems raised in the above background technology.
[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a radial pin packaging structure for a ring core type seed ball, comprising a chip, a seed metal ball 1 is arranged on the top of the chip, a first pin, a second pin and a third pin are arranged below the chip, a half-cut glue-dispensing metal 2 is connected above the first pin, the other end of the half-cut glue-dispensing metal 2 is connected to a printed metal wire, and the other end of the printed metal wire is connected to the seed metal ball 1;
[0006] The plastic sealant is filled above the first pin, the second pin and the third pin by dispensing, the plastic sealant covers the metal ball, and the bottoms of the first pin, the second pin and the third pin protrude from the bottom of the plastic sealant.
[0007] The utility model further illustrates that the seed metal balls 1 are provided in two groups, the seed metal balls 2 are provided on both sides of the chip, the seed metal balls 3 are provided at the bottom of the chip, and the seed metal balls 3 are provided in four groups.
[0008] The utility model further illustrates that the first seed metal ball, the second seed metal ball and the third seed metal ball are all ring-core type seed balls.
[0009] The utility model further illustrates that the first pin, the second pin and the third pin array are arranged in the same plane, the first pin is arranged in two groups, the second pin is arranged in two groups, and the third pin is arranged in four groups.
[0010] The utility model further illustrates that the third pin is connected to the seed metal ball three, the upper part of the second pin is connected to the half-cut glue-dispensing metal one, and the other end of the half-cut glue-dispensing metal two is connected to the seed metal ball two.
[0011] The utility model further illustrates that the printed metal wire is located outside the plastic sealant.
[0012] Compared with the prior art, the beneficial effects achieved by the utility model are as follows: the utility model, by providing a seed metal ball 1, a seed metal ball 2 and a seed metal ball 3, a first pin, a second pin, a third pin, a half-cut dispensing metal 1, a half-cut dispensing metal 2, and a printed metal wire box plastic sealant, can effectively utilize the space around the chip 1, thereby increasing the contact density and improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0015] In the figure: 1. chip; 2. seed metal ball 1; 3. seed metal ball 2; 4. seed metal ball 3; 5. first pin; 6. second pin; 7. third pin; 8. half-cut dispensing metal 1; 9. half-cut dispensing metal 2; 10. printed metal wire; 11. plastic encapsulation glue. DETAILED DESCRIPTION
[0016] The following is a further non-limiting detailed description of the technical solution of the utility model in conjunction with the preferred embodiments and the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0017] See also Figure 1The utility model provides a technical solution: a radial pin packaging structure for a ring core type seed ball, including a chip 1, a seed metal ball 2 is arranged on the top of the chip 1, and the seed metal ball 2 is arranged in two groups, seed metal balls 2 3 are arranged on both sides of the chip 1, and a seed metal ball 3 4 is arranged on the bottom of the chip 1, and the seed metal ball 3 4 is arranged in four groups.
[0018] The seed metal ball 1 2, the seed metal ball 2 3 and the seed metal ball 3 4 are all ring core type seed balls.
[0019] A first pin 5, a second pin 6 and a third pin 7 are arranged below the chip 1. The first pin 5, the second pin 6 and the third pin 7 are arrayed in the same plane. Two groups of first pins 5 are arranged, located at the leftmost and rightmost sides. Two groups of second pins 6 are arranged, located inside the two groups of first pins 5 and below the second seed metal ball 3, adjacent to the first pin 5. Four groups of third pins 7 are arranged, located inside the two groups of second pins 6 and below the third seed metal ball 4.
[0020] The third pin 7 is connected to the seed metal ball three 4, the second pin 6 is connected with a half-cut dispensing metal one 8 above, the other end of the half-cut dispensing metal two 9 is connected to the seed metal ball two 3, the first pin 5 is connected with a half-cut dispensing metal two 9 above, the other end of the half-cut dispensing metal two 9 is connected to a printed metal wire 10, and the other end of the printed metal wire 10 is connected to the seed metal ball one 2, thereby connecting the chip 1 to the first pin 5, the second pin 6 and the third pin 7, effectively utilizing the space around the chip 1 and improving the contact density.
[0021] The plastic sealant 11 is filled above the first pin 5, the second pin 6 and the third pin 7 by dispensing. The plastic sealant 11 covers the metal ball 2, so that a metal conductor is formed inside the plastic sealant 11, while ensuring the strength of the internal connection. The bottoms of the first pin 5, the second pin 6 and the third pin 7 protrude from the bottom of the plastic sealant 11.
[0022] The printed metal wire 10 is located outside the plastic sealant 11. After the plastic sealant 11 is injected to form a metal conductor, it is connected to the seed metal ball 2 and the half-cut dotted metal 9, which can improve the heat dissipation.
[0023] Working principle: Seed metal ball 1 2, seed metal ball 2 3 and seed metal ball 3 4 are arranged around chip 1, the third pin 7 is connected to seed metal ball 3 4, the second pin 6 is connected to seed metal ball 2 3 through half-cut dispensing metal 1 8, and the first pin 5 is connected to seed metal ball 1 2 through half-cut dispensing metal 2 9 and printed metal wire 10, so that chip 1 is connected to the first pin 5, the second pin 6 and the third pin 7, and then a metal conductor is formed in the plastic encapsulation glue 11 by dispensing, while ensuring the internal connection strength, so that the space around chip 1 is effectively utilized, the contact density is improved, and the heat dissipation is ensured.
[0024] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0025] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit them. Although the utility model is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.
Claims
1. A radial pin packaging structure for a ring-core type bulb, comprising a chip (1), characterized in that: A seed metal ball (2) is arranged on the top of the chip (1), a first pin (5), a second pin (6) and a third pin (7) are arranged below the chip (1), a half-cut dispensing metal (9) is connected above the first pin (5), a printed metal wire (10) is connected to the other end of the half-cut dispensing metal (9), and the other end of the printed metal wire (10) is connected to the seed metal ball (2); A plastic sealant (11) is applied above the first pin (5), the second pin (6) and the third pin (7), the plastic sealant (11) covers the metal ball (2), and the bottoms of the first pin (5), the second pin (6) and the third pin (7) protrude from the bottom of the plastic sealant (11).
2. The radial pin packaging structure for a ring-core type bulb according to claim 1, characterized in that: The seed metal balls (2) are arranged in two groups, the seed metal balls (3) are arranged on both sides of the chip (1), the seed metal balls (4) are arranged at the bottom of the chip (1), and the seed metal balls (4) are arranged in four groups.
3. The radial pin packaging structure for a ring-core type bulb according to claim 2, characterized in that: The seed metal ball one (2), the seed metal ball two (3) and the seed metal ball three (4) are all ring-core type seed balls.
4. The radial pin packaging structure for a ring-core type bulb according to claim 3, characterized in that: The first pins (5), the second pins (6) and the third pins (7) are arrayed on the same plane, the first pins (5) are arranged in two groups, the second pins (6) are arranged in two groups, and the third pins (7) are arranged in four groups.
5. The radial pin packaging structure for a ring-core type bulb according to claim 4, characterized in that: The third pin (7) is connected to the seed metal ball three (4), the second pin (6) is connected to the half-cut dispensing metal one (8), and the other end of the half-cut dispensing metal two (9) is connected to the seed metal ball two (3).
6. The radial pin packaging structure for a ring-core type bulb according to claim 5, characterized in that: The printed metal wire (10) is located outside the plastic sealant (11).