Electronic component

Abstract

An electronic assembly includes a first housing portion and a second housing portion connected to the first housing portion to form a cavity. The circuit board is located in the cavity. The second housing portion has a connector body with a hollow core, where the connector body extends outwardly from the second housing portion. The connector body has a wall having a corresponding wall mating surface facing a corresponding circuit board mating surface of the circuit board. An adhesive sealant is configured to adhere to the wall mating surface and the circuit board mating surface.

Description

[0001] Related Applications

[0002] This application claims priority to U.S. Provisional Application No. 63 / 510,265, filed on June 26, 2023, which is hereby incorporated by reference into this document. Technical Field

[0003] The present disclosure relates to an electronic assembly having a sealed electrical connector. Background Art

[0004] In some prior art, a reliably sealed electrical connector can prevent moisture, water, salt, debris or other contaminants from migrating into the housing of an electronic assembly, wherein moisture, salt, and contaminants can adversely affect the reliability of circuit boards, electrical components, and electronic components. For example, if a mating connector (e.g., a plug or socket) of a cable, wire, conductor, or wiring harness is normally connected continuously to a corresponding electrical connector of an electronic assembly, the mating connector can provide a suitable seal. However, in the absence of a mating connector or during an unmated state, the electrical connector may be susceptible to the influence of moisture, water, salt, or debris intruding into the housing, which may temporarily or permanently interrupt the normal operation of the electronic assembly. Therefore, an electronic assembly having a sealed electrical connector (e.g., in an unmated state or disconnected state of the electrical connector) is required to prevent possible damage to the electronic devices in the housing of the electronic assembly. Utility Model Content

[0005] According to one embodiment, an electronic assembly includes a first housing portion and a second housing portion, the second housing portion being coupled to the first housing portion to form a cavity. A circuit board is located in the cavity. The second housing portion has a connector body with a hollow core, wherein the connector body extends outward from the second housing portion. The connector body has a wall, the wall having a corresponding wall mating surface facing a corresponding circuit board mating surface of the circuit board. An adhesive sealant is configured to adhere to the wall mating surface and the circuit board mating surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a perspective view of the upper side of a first embodiment of an electronic assembly.

[0007] Figure 2 is a perspective view of the upper side of a first embodiment of an electronic assembly with a portion broken away.

[0008] Figure 3 is an exploded perspective view of the underside of a first embodiment of an electronic assembly.

[0009] Figure 4is an exploded perspective view of the upper side of a first embodiment of an electronic assembly.

[0010] Figure 5 is a first embodiment of an electronic assembly along Figure 1 A cross section of reference line 5-5.

[0011] Figure 6 yes Figure 5 An enlarged view of the right side of the cross section.

[0012] Figure 7 yes Figure 5 Magnified view of the central area of ​​the cross section.

[0013] Figure 8 yes Figure 1 A perspective view of the interior of the second housing part.

[0014] Fig. 9 is a perspective view of the upper side of a second embodiment of an electronic assembly.

[0015] Fig.10 is a perspective view of the upper side of a second embodiment of an electronic assembly with the electronic assembly cut away to expose a circuit board.

[0016] Fig.11 is a second embodiment of the electronic assembly along Fig.10 A cross section of reference line 11-11.

[0017] Fig.12 is a perspective view of the upper side of a third embodiment of an electronic assembly with the electronic assembly cut away to reveal a circuit board.

[0018] Fig.13 is a second embodiment of the electronic assembly along Fig.12 A cross section of reference line 13-13.

[0019] Fig.14 One embodiment of a process flow for a method of manufacturing an electronic assembly having a sealed electrical connector is disclosed.

[0020] In any group of two or more drawings, like reference numerals indicate like elements, features, or steps. DETAILED DESCRIPTION

[0021] Specific implementation method. According to one embodiment, Figure 1A top perspective view of an electronic assembly 111 is illustrated, which includes a first housing portion 12 having one or more recesses 16 along at least a portion of an outer peripheral surface 17 of the first housing portion 12. A second housing portion 10 has one or more arms 14 extending from a body of the second housing portion 10, the one or more arms 14 terminating in a mating protrusion 15. One or more arms 14 or one or more mating protrusions 15, or both arms 14 and mating protrusions 15 engage with the recess 16 (e.g., groove) in a snap-fit ​​connection of a mechanical clamp or snap connector 19.

[0022] A cavity 23 is formed between the first housing portion 12 and the second housing portion 10. Figure 2 In the embodiment, the second housing portion 10 is cut open to expose the circuit board 45 located in the cavity 23; Figure 5 As illustrated in the cross-section of FIG. 4 , the circuit board 45 has a conductive trace 52 (e.g., a metal pad) that faces the first housing portion 12 at the metal conductive area 13, wherein the snap connector 19 or a mechanical clamp forms an electrical and mechanical connection between the conductive trace 52 and the metal conductive area 13.

[0023] In one embodiment, the snap connector 19 includes a combination of snap arms 14, mating protrusions 15, and corresponding recesses 16 to fixedly or removably connect the first housing portion 12 to the second housing portion 10. In addition, the snap connector 19 or its snap arms 14 provide a compressive or clamping force between the conductive traces 52 and the metallic conductive areas 13 while the snap connector 19 fixedly or removably connects the first housing portion 12 to the second housing portion 10.

[0024] In an alternative embodiment, one or more snap connectors 19 may be replaced by an articulated compression clamp (e.g., a toggle latch clamp) mounted on the outside of one housing portion (e.g., 10, 110, 12, 112) to engage a catch or protrusion on the opposite housing portion of the electronic component (111, 211). For example, the articulated compression clamp has a fixed base mounted (e.g., fastened) to one housing portion and a fixed catch mounted (e.g., fastened) to the opposite housing portion, wherein the fixed base has a lever that is pivotally or rotatably mounted to the fixed base via a first hinge. At the same time, the lever has a latch or latching member that is pivotally or rotatably mounted to the lever via a second hinge, wherein the latching member terminates in a hook that can engage a capture portion to clamp, secure or lock the housing portions (e.g., 10 and 12, or 110 and 112) of the electronic component (111, 211) together.

[0025] In one embodiment, the first housing portion 12 includes a metal base having an outer surface 22. For example, the first housing portion 12 is formed of an extruded metal or an extruded alloy, and the first housing portion 12 has a set of longitudinal ridges 24 on the outer surface 22, wherein the longitudinal ridges 24 can increase structural integrity and promote heat dissipation of heat generating components. The first housing portion 12 is formed of an extruded metal or alloy and has a set of longitudinal ridges 24 and a foot 26 portion.

[0026] Alternatively, the first housing portion 12 may be cast from a metal or alloy, or molded from a composite material, plastic, or polymer with surface metallization to form conductive areas (eg, metal conductive areas 13 ) that interface with conductive traces 52 (eg, metal pads) of the circuit board 45 .

[0027] In the electronic assembly 111, one or more heat generating components are mounted on one or both sides of the circuit board 45. For example, the heat generating components include the capacitor 46, the semiconductor switches (81, 82, 83), and other electrical or electronic devices of the electronic assembly 111.

[0028] The second housing portion 10 includes a cover, wherein the cover is composed of a plastic, polymer, or composite material. For example, for a composite material, the cover can be formed of a plastic or a polymer matrix with a filler (e.g., carbon fiber, glass fiber, etc.). In one embodiment, the arm 14 (of the second housing portion 10), or both the arm 14 and the mating protrusion 15, are composed of some flexible or elastically deformable plastic, polymer, or composite material to support the snap connector 19.

[0029] In one embodiment, the one or more recesses 16 include a first groove in a corresponding first outer side 61 of the first housing portion 12 (e.g., the first outer wall 18) and a second groove in a corresponding second outer side 62 of the first housing portion 12, wherein the first outer side 61 is opposite to the second outer side 62 (e.g., the second outer wall 20).

[0030] Each arm 14 terminates in a protrusion 15 that is sized and shaped to engage or mate with a corresponding recess 16 (e.g., groove or slot) in the second housing portion 10. Each recess 16 (e.g., groove) has a cross-section or profile configured to receive the protrusion 15 at the end of the corresponding arm 14. In addition, each arm 14 can be elastically deformed before engaging the corresponding recess 16 (e.g., groove). Figure 5 As shown, the outer peripheral surface 17 of the first housing portion 12 is generally tapered downwardly and outwardly to maximize elastic deformation of each arm 14 during assembly and before the mating protrusions engage or interlock with the recesses 16 (eg, grooves).

[0031] In addition, the air gap 21 between the outer peripheral surface 17 and the arm 14 supports the removal of the second housing portion 10 from the first housing portion 12, or vice versa, by allowing the end user to insert a tool (e.g., a screwdriver or a pry bar) into the air gap to elastically extract the protrusion 15 from the recess 16, while temporarily elastically deforming the arm 14 so that the protrusion 15 is no longer obstructed by the first housing portion 12.

[0032] In one embodiment, the second housing portion 10 has a first array of arms 14 extending from the second housing portion 10 (e.g., at Figure 1 and Figure 8 ) to engage one or more corresponding recesses 16, such as a first groove or a first set of grooves spaced apart from each other. At the same time, the second housing portion 10 has a second set of arms 14 extending from the second housing portion 10 (e.g., Figure 1 and Figure 8 ) to engage one or more recesses 16, such as a second recess or a second set of recesses spaced apart from each other. Figure 1 As illustrated, the recess 16 in the first housing portion 12 includes first and second continuous grooves, wherein each groove has a cross-section (eg, an upper surface or lip) that can receive a lug, protrusion, or hook.

[0033] In an alternative embodiment, the recess 16 in the first housing portion 12 may include a discrete set of first grooves and a discrete set of second grooves.

[0034] The second housing portion 10 has a protrusion or post 51 extending in the cavity 23 and above (e.g., downwardly) the circuit board 45. In one embodiment, the second housing portion 10 has a protrusion or post 51 that contacts the opposite side of the circuit board 45 opposite the conductive trace 52, and wherein the first housing portion 12 has a conductive protrusion (e.g., conductive ridge) associated with the metal conductive area 13 to contact the conductive trace 52 on the circuit board 45. For example, the conductive protrusion or conductive ridge of the first housing portion 12 can be formed of solder, such as solder applied and reflowed before assembling the circuit board 45 in the cavity of the housing established by mating the first housing portion 12 with the second housing portion 10. In one embodiment, the post 51 projects downwardly: (a) to a degree greater than the gap or spacing between the lower interior surface of the second housing portion 10 and the top or upper surface of the circuit board 45; (b) to a degree that causes physical interference between the printed circuit board (45, 145) and its upper surface; or both, thereby causing the second housing portion 10 to be preloaded with a biasing force to clamp or compress the conductive traces or pads on the circuit board 45 (opposite the contact point of the post 51) toward the conductive protrusion inside the first housing portion 12 (e.g., when the second housing portion 10 is fully engaged or connected to the first housing portion 12). The arms 14 terminating in the protrusion 15 form a snap connector 19 or clamp that allows the center of the second housing portion 10 to be spring-like biased or preloaded along the central axis or longitudinal axis 75 of the second housing portion 12.

[0035] Before the first housing portion 12 and the second housing portion 10 are fastened by one or more snap connectors 19, the second housing portion 10 includes a cover or lid that bulges or arches downward toward the first housing portion 12. The second housing portion is configured or designed to apply a compressive or clamping force to the circuit board (45, 145). The compressive or clamping force is applied to the circuit board (45, 145) by the second housing portion 10 to potentially deform the solder. The second housing portion has sufficient strength, flexibility and elasticity to maintain contact between the conductive traces of the circuit board 45, the solder and the housing of the electronic component 111.

[0036] In reference Figure 2In the illustrated alternative embodiment, prior to coupling the first housing portion 12 and the second housing portion 10 together, the second housing portion 10 may be arched downwardly (e.g., preloaded in a convex manner with a resilient bias) along the transverse axis 71 and over the post 51 proximate a central portion 73 (e.g., having an overall spring-like bias) of the second housing portion 10, the post 51 extending downwardly from the central portion 73. For example, prior to engaging or locking the first housing portion 12 with the second housing portion 10, a gap may exist between the first housing portion 12 and the second housing portion 10 at opposite sides (72, 74). However, when or simultaneously with the second housing portion 10 being fully connected to the first housing portion 12 via the snap connector 19, the second housing portion 10 is elastically deformed or biased (in a compressive manner) such that one or more of the following occurs: (a) the gap disappears, wherein the mating portion of the second housing portion 10 is generally flat and fits into the first housing portion 12 (e.g., at the sides (72, 74)); (b) the second housing portion 10 is spread out about the transverse axis 71 to eliminate the appearance of any protrusion or gap; (c) the second housing portion 10 is configured to apply a compressive or clamping force between the opposite side of the circuit board 45 opposite the conductive trace 52 and the metal conductive area 13. The above-mentioned protrusion can be applied to one or more posts 51 near or around the center portion of the second housing portion 10.

[0037] In yet another alternative embodiment, the solder of the metal conductive area is associated with solder flow through the circuit board (45, 145) during reflow in the oven to create a solder tip on one side (e.g., the underside) of the circuit board (45, 145). For example, the alternative embodiment can be a design improvement to any circuit board manufactured or produced by single-sided reflow.

[0038] like Figure 5 As shown, the conductive trace 52 on the circuit board 45 and the first housing portion 12 are electrically grounded through the above-mentioned electrical contact and mechanical contact between the conductive trace 52 and the metal conductive area 13 or the conductive protrusion associated with the metal conductive area 13. The conductive ridge includes a solder bump. The conductive ridge includes one or more of the following: a generally flat surface, a wavy surface, a dotted surface, or a grooved surface. For example, in one embodiment, the conductive ridge has a wavy surface in which rows of peaks 53 are separated by intermediate valleys 55.

[0039] exist Figure 2, the first semiconductor switch 81 may include a first pair consisting of a low-side semiconductor switch and a high-side semiconductor switch. The second pair of semiconductor switches 82 may include a second pair consisting of a low-side semiconductor switch and a high-side semiconductor switch. The third pair of semiconductor switches 83 may include a third pair consisting of a low-side semiconductor switch and a high-side semiconductor switch.

[0040] like Figure 2 , Figure 3 and Figure 4 As illustrated, a dielectric seal or dielectric sealant is applied, dispensed, placed or configured for a corresponding target area or area of ​​a first volume or first region 47 between the second housing portion 10 and the circuit board 45, and for a corresponding target area or area of ​​a second volume or second region 50. In one embodiment, the dielectric seal or dielectric sealant comprises a thermally conductive material having a thermal conductivity exceeding a threshold value. In one configuration, the dielectric seal or dielectric sealant may comprise an elastomer, a polymer adhesive, a latex adhesive or other suitable material that is bonded to, adhered to, covers, contacts or interfaces with one or more of the following: the first housing portion 12, the second housing portion 10, the circuit board 45 or a heat generating component associated with the circuit board 45 or the electronic component 111. For example, a dielectric seal or dielectric sealant can form a barrier to prevent moisture, salt, fog, contaminants, or debris from entering a cavity 23 formed by a first housing portion 12 connected to a second housing portion 10 (e.g., by elastic compression of the dielectric seal or sealant via a snap connector 19, fasteners, or attachments, alone or in combination with an adhesive bond or adhesive).

[0041] like Figure 3 As illustrated, for the first region 47, the dielectric seal or dielectric sealant includes one or more of the following seals: one or more first rings 41, one or more second rings 40, a housing perimeter barrier 42, an adhesive sealant 49 (or a connector seal), and a component thermal interface material 43. For the second region 50, the dielectric seal or dielectric sealant includes a thermally conductive interface, such as a board thermal interface material, which can conduct heat from the heat-generating component or from the circuit board (effectively) to the first housing portion 12, the second housing portion 10, or both.

[0042] exist Figure 4In the embodiment, the circuit board 45 includes a first power electronic module 91 in a first area of ​​the circuit board 45, a second power electronic module area 92 in a second area of ​​the circuit board 45, and a third power electronic module area 93 in a third area of ​​the circuit board 45. Each of the first power electronic module 91, the second power electronic module 92, and the third power electronic module 93 includes a circuit (e.g., an inverter or an electric motor controller), wherein each circuit has a set of alternating current (AC) terminals (31, 32, 33) mounted on the circuit board 45 and extending through one or more openings 79 in the second housing portion 10. In addition, the first power electronic module 91, the second power electronic module 92, and the third power electronic module 93 share a common set of direct current (DC) terminals 30 (e.g., DC terminals of the third power electronic module 93) outside the second housing portion 10. The DC current terminals extend through the openings 88. For example, each inverter has a set of AC terminals mounted on a circuit board and extending through the second housing portion, and wherein the first power electronic module, the second power electronic module and the third power electronic module share a set of common DC terminals outside the second housing portion.

[0043] Fig. 9 is a perspective view of the upper side of a second embodiment of an electronic assembly 211. The electronic assembly 211 is similar to the electronic assembly 111, except that the electronic assembly 211 includes a first power electronic module 91 (of the corresponding first region) separated or separated from a second power electronic module 92 of the corresponding second region and a third power electronic module 93 of the corresponding third region; therefore, the electronic assembly 211 is different from the electronic assembly 111 as follows: (a) the electronic assembly 211 replaces the circuit board 45 of the electronic assembly 111 with a circuit board 145; (b) the circuit board 145 is similar to the first power electronic module 91 of the corresponding first region of the circuit board 45; (c) the circuit board 145 is similar to the first power electronic module 91 of the corresponding first region of the circuit board 45; 145 is filled with electronic components similar to circuit board 45, such as heating elements, capacitors, and semiconductor switches; (d) circuit board 145 has conductive traces and a board layout similar to the first area of ​​circuit board 45; (c) the first housing portion and the second housing portion are reduced in size or volume to accommodate, encapsulate, and protect circuit board 145 and its electronic components from the ingress of moisture, salt, fog, and debris; and (f) common design features or reusable design features of circuit board 145 are based on circuit board 45 (e.g., to facilitate efficient manufacturing, design, and testing of electronic assembly 211). Figure 1 and Fig. 9 Like reference numbers in the drawings indicate like elements or features.

[0044] In one embodiment, the combination of the first power electronic module and the second power electronic module can be separated or separated from the third power electronic module; the third power electronic module has an auxiliary control terminal separated from the common control terminal, wherein the first power electronic module and the second power electronic module have an integrated circuit board that supports a dual inverter with corresponding groups of AC terminals, common control terminals and DC terminals.

[0045] In one embodiment, the first power electronic module is separable from the second power electronic module and the third power electronic module, wherein the first power electronic module provides a corresponding single inverter having AC terminals, common control terminals, and DC terminals. As described above, the first housing portion 112 of the electronic assembly 211 is similar to the first housing portion 12 of the electronic assembly 111, except that the first housing portion is reduced in size or volume to accommodate the circuit board 145 (e.g., within a reduced cavity). Similarly, the second housing portion 110 for the electronic assembly 111 is similar to the second housing portion 10 of the electronic assembly 111, except that the second housing portion is reduced in size or volume to accommodate the circuit board 145 (e.g., within a reduced cavity). Fig.10 As illustrated, when the first housing portion 112 and the second housing portion 110 are connected to each other, the perimeter seal 142 or perimeter sealant provides a barrier (e.g., a water-resistant or waterproof barrier) and a thermal interface (e.g., a thermally conductive interface) between the first housing portion 112 and the second housing portion 110. At the same time, the thermally conductive interface 150 provides or enhances thermal communication between one or more heat-generating components of the circuit board 145 and the surrounding environment through the first housing portion 112.

[0046] Fig.10 is a perspective view of the upper side of a second embodiment of an electronic assembly with the electronic assembly cut away to expose a circuit board.

[0047] Fig.11 is a second embodiment of the electronic assembly along Fig.10 A cross section of reference line 11.

[0048] In one configuration, the first power electronic module region 91 and the second power electronic module 92 share a common control terminal of the connector 25, wherein the first region of the first power electronic module 91 and the second region of the second power electronic module 92 are adjacent to each other. In addition, in one configuration, the third region of the third power electronic module 93 is detachable, separable from the first power electronic module 91, or removable from the first power electronic module 91; the second power electronic module 92 and the third power electronic module 93 have auxiliary control terminals of the connector 28 that are separate from the common control terminal. The first power electronic module 91 is Figures 9 to 11 are shown as separate modules.

[0049] For the circuit board 45, the first region, the second region, and the third region can have an intermediate region (e.g., a dielectric tape with tolerances on each side, no circuit traces, and no components mounted on the dielectric tape on either side of the board) that supports lateral cutting of an unpopulated circuit board (e.g., a raw circuit board 45 at an electronics manufacturing plant) along one or more lateral axes (76, 77) substantially perpendicular to the longitudinal axis 78 of the first housing portion (12, 112, 212) (or circuit board 45) to produce a circuit board 145 for a dual inverter or to produce a circuit board 245 for a single inverter. The longitudinal axis 78 is typically parallel or aligned with the longitudinal axis 75, either of which can represent a longitudinal axis of the electronic assembly (11, 111, 211).

[0050] exist Fig.12 and Fig.13 , a third embodiment of an electronic assembly 311 includes a first housing portion 212 and a second housing portion 210 connected to the first housing portion 212 to form a cavity 23. A circuit board 245 is located in the cavity 23. The second housing portion 210 has an electrical connector 28. The electrical connector 28 includes a first electrical connector portion that is configured to mate with or be connected to a second electrical connector portion (e.g., a plug or a socket) to form an electrical connection and a mechanical connection between one or more conductors. The electrical connector 28 includes a connector body 301 having a hollow core, wherein the connector body 301 extends outward (or upward) from the second housing portion 210. The connector body 301 has a wall 302 having a corresponding wall mating surface 315 that faces a corresponding circuit board mating surface 246 of the circuit board 245. When cross-linked, cured, or vulcanized, adhesive sealant 49 is configured to adhere or adhesively bond to wall mating surface 315 and circuit board mating surface 246 .

[0051] In one embodiment, the connector body 301 is integral, monolithic or one-piece with the second housing portion 210 or the second housing body. For example, the connector body 301 is molded simultaneously or integrally with the second housing body 209, or is overmolded with the second housing body 209 to produce a complete second housing portion 210. Overmolding refers to molding the second housing body 209 in a first molding process and then molding the connector body 301 on or connected to the second housing body 209 in a second molding process to form a complete second housing portion 210. In addition, if the second housing body 209 is made of thermoplastic plastic or polymer or other suitable plastic or polymer, the second housing body 209 and the connector body 301 can be connected, welded or fused together by heat sealing, heat molding process, ultrasonic welding or other manufacturing processes. If the second housing portion 210 is constructed from a polymer or plastic or thermoplastic that is not heat resistant, the second housing portion 210 will not be attached and will not be heated as part of the reflow soldering or wave soldering process.

[0052] In one embodiment, the wall mating surface 315 comprises a lower skirt of the connector body 301 having an inwardly stepped or inwardly, downwardly tapered bottom portion 307, footprint or footing. On the circuit board mating surface 246, the bead or ridge of adhesive sealant 49 is aligned with the tapered bottom portion, footprint or footing of the lower skirt.

[0053] One or more conductors 304 (e.g., conductive pins) extend upwardly within the hollow core defined by the wall 302, wherein the conductors 304 (e.g., conductive pins) are supported by one or more internal dielectric footings 305. The internal dielectric footings 305 comprise a dielectric base or dielectric spacer wherein the conductors 304 are spaced apart from each other (e.g., laterally or coaxially) and from the dielectric wall 302 or walls (e.g., laterally) of the electrical connector 28.

[0054] The assembly or combination of conductor 304 and internal dielectric foot 305 is soldered, brazed, fused, welded, or connected via a conductive adhesive to any of the following: (a) a plated through hole in circuit board 245; (b) a conductive blind via in circuit board 245; (c) a conductive pad or conductive trace on a surface of circuit board 245 (e.g., mounted on the circuit board in a surface mount manner), and wherein conductor 304 is electrically connected to corresponding conductive traces on one or both sides of circuit board 245.

[0055] In one example, the conductive adhesive is composed of metal particles embedded in a plastic or polymer matrix to support the conduction of electrical energy or current. If the combination of conductor 304 and internal dielectric footing 305 is mounted on circuit board 245, conductor 304 is electrically connected to corresponding conductive traces on circuit board 245 through metal plated through holes or metallized blind vias; the assembly (304, 305) and circuit board 245 can be wave soldered or reflow soldered in an oven in the absence of or before the attachment of second housing portion 210 to first housing portion 212.

[0056] Once the second housing portion 210 with the integral electrical connector (25, 28) is attached to the first housing portion 212 or thereafter, the adhesive sealant is cured or vulcanized and becomes adhesively bonded to the mating surfaces of the dielectric wall or walls 302 of the electrical connector (25, 28) and the corresponding circuit board mating surface 246 to form a barrier for preventing moisture, water, contaminants or debris from entering the cavity 23 from within the hollow core (or interior) of the electrical connector (25, 28), where the circuit board 245 is located. The above barrier exists even when the electrical connector (e.g., 25, 28; socket or plug) is not mated or disconnected with the corresponding mating electrical connector (e.g., socket or plug). If the corresponding mating electrical connector (not shown) is inserted into the electrical connector (25, 28), the step 303 in the wall retains or prevents the inserted electrical connector from further or deeper engagement, otherwise further or deeper engagement may damage the conductor or pin.

[0057] The dielectric wall 302 has a footprint, foot portion, or footing that includes or terminates in a wall mating surface 315. In one example, the wall mating surface 315 directly engages the circuit board mating surface 246. In another example, the wall mating surface 315 covers or indirectly engages the circuit board mating surface 246 via an intermediate layer of dielectric material (e.g., dielectric adhesive 49). The footprint, foot portion, or footing of the dielectric wall 302 of the electrical connector 28 is distinct from an internal dielectric footing or dielectric base of the electrical connector 28 that supports the pins or electrical connectors. For example, the internal dielectric footing 305 or dielectric base may include a frame for separating the electrical conductors 304 (e.g., conductive pins) in a matrix, one or more rows, a coaxial pattern, or other pattern; further, the internal dielectric footing 305 may include dielectric spacers, retainers, or both for the conductors 304 (e.g., conductive pins), wherein the dielectric base, the internal dielectric footing 305 is made of plastic, polymer, ceramic, resin, or matrix, or a composite material that withstands the heat of a wave soldering process and / or a reflow soldering process in an oven. The composite material includes plastic, polymer, ceramic, resin, or matrix with glass fiber, ceramic, carbon fiber, or other suitable fillers.

[0058] In such Fig.12 and Fig.13 In one illustrated embodiment, the footprint, foot portion, or wall mating surface 315 of the wall 302 has a generally rectangular perimeter, or has a substantially rectangular perimeter with chamfered or rounded corners. In alternative embodiments, the footprint, foot portion, or wall mating surface 315 of the wall 302 has a substantially elliptical perimeter or has a perimeter of another geometric shape. Here, the conductor 304 (e.g., a conductor or conductive pin of a metal or alloy) is located inward from the footprint or foot portion of the wall 302; the conductor 304 can be located inward from an adhesive sealant (49) that is dispensed on the circuit board 245 or otherwise configured to track or align with the footprint, foot portion, or wall mating surface 205 of the wall 302.

[0059] Because the sealant (e.g., 49) is dispensed to align or register with the footprint or foot portion of the wall of the connector and adhesively bonds the wall, footprint or foot portion to the circuit board 245, the electrical connector 28 facilitates sealing or waterproofing even when the mating connector is disconnected in a disconnected state or unmated state. In addition, sealing the circuit board 245 around the wall spaced apart from the pins or conductors 304 can provide sealing performance comparable to sealing around each individual pin and each individual conductor at the interface of the circuit board 245 within the hollow core of the connector using a dielectric adhesive.

[0060] To the extent that the wall 302 is integrally formed or molded as part of the second housing portion 210, no sealant is required between the electrical connector 28 and the second housing portion 210. For example, the second housing portion 210 may include a plastic, polymer, or composite housing with an integral wall 302 of the connector.

[0061] However, in some alternative embodiments, the second housing portion 210 is constructed of metal, die-cast metal, aluminum and aluminum alloys, metal or another alloy having an opening to receive the electrical connector 28 having a dielectric body (e.g., the wall 302 of the electrical connector 28) that is adhesively bonded to the second housing portion 210 to seal the electrical connector 28 relative to the housing of the electronic component 311. For example, in an alternative embodiment, the second housing portion 210 can include a metal or alloy body, wherein the dielectric electrical connector 28 or the dielectric connector body 301 of the electrical connector 28 is inserted and sealed to the opening in the metal or alloy body of the second housing portion 210 (e.g., by an adhesive sealant 49, a gasket, an O-ring, a ferrule seal, or an elastomeric seal).

[0062] In one example, adhesive sealant 49 may include an elastomer, synthetic rubber, sealant 49 or polymer or plastic. In another example, adhesive sealant 49 is composed of one or more of the following: silicone, latex material, room temperature vulcanizing (RTV) material that cures adhesive sealant 49.

[0063] The conductors 304 or pins can be surface mounted to corresponding traces or pads on the surface of the circuit board 245 by soldering, fusing or conductive adhesive. In addition, the conductors 304 or pins can be arranged in a matrix or array or another pattern. In the lower portion of the hollow core of the connector body 301, an optional dielectric barrier layer, dielectric glue (e.g., dielectric silicone, limited to the non-contact portion of the pins or conductors 304, which is not used to form an electrical connection in the mating electrical connector 28) or potting compound covers the circuit board 245 and the solder joints in the lower portion of the hollow core to provide further protection from unwanted short circuits due to contamination, and the physical separation between adjacent pins is sufficient. Therefore, the connector body 301 is sealed, airtightly sealed or fluidly isolated relative to the cavity 23 or interior of the housing of the electronic component 311 in a watertight manner.

[0064] In the present disclosure, the electrical connector 28 can be used to replace the sealed header with one or more rows of pins or conductors 304 that can be brazed (e.g., wave soldered or reflow soldered in an oven), wherein the exterior of the dielectric body of the sealed header is sealed to the second housing portion 210, as described below. It should be noted that conventional sealed headers are typically through-hole brazed, rather than surface mount brazed, because the header itself would interfere with the airflow required for a convection brazing oven.

[0065] Fig.14 One embodiment of a process flow for a method of manufacturing an electronic assembly having a sealed electrical connector is disclosed. Fig.14 The method starts at step S500.

[0066] First, according to step S500, the conductor 304 or pin having a dielectric base can be soldered (e.g., wave soldered or reflow soldered in an oven) while the integral connector body 301 of the electrical connector 28 is absent and is part of the second housing portion 210. Second, according to step S502, a dielectric adhesive (e.g., an adhesive sealant, such as silicone or RTV sealant) is dispensed on the circuit board 245 to register or align with the footprint or footing of the wall 302 of the electrical connector (25, 28). Third, according to step S504, the second housing portion 210 having the integral electrical connector (25, 28) is connected to the first housing portion 212 on the circuit board 245 or the first housing portion 212 above the circuit board 245 in a manner aligned with the conductive adhesive to form a sealed electrical connector (25, 28).

[0067] In some embodiments, at step S500, the conductors 304 or pins are mounted by soldering (e.g., with solder and flux, solder paste, or solder balls and flux), fusing, or dispensing a conductive adhesive into a conductive plated through hole or conductive plated through hole in the circuit board 245 or into a conductive blind via in the circuit board 245. The solder forms a protective barrier for preventing moisture, water, salt, or other contaminants from entering the interior of the housing or cavity 23. However, moisture, water, salt, or other contaminants may still potentially cause a short circuit connection between two or more exposed conductors 304 or pins or their respective solder joints unless the dielectric barrier layer or potting compound in the lower portion of the hollow core and the physical separation between adjacent pins are sufficient.

[0068] In the present disclosure, the electrical connector is well suited for sealing or isolating the electrical connector from the remainder of an electronic assembly, such as its electrical components, electronic components, and circuit traces of a circuit board, which may be susceptible to damage or reduced reliability due to the ingress of moisture, water, salt, debris, or other contaminants; some of which conduct electrical energy, which results in possible electrical shorts, and others of which corrode the conductive traces, conductive pads, or leads of the electrical and electronic components, which results in possible intermittent or open circuits. By sealing at the circuit board, a watertight sealed electrical connector or an economical, watertight sealed electrical connector may be formed using a dispensed adhesive sealant (e.g., RTV sealant).

[0069] In the present disclosure, the electronic assembly is well suited for reducing or eliminating one or more screws, one or more deflectable spring contacts, and any accompanying installation costs that would otherwise be required to create an electrical connection between a conductive trace of a circuit board and a cavity 23 (e.g., inside) of a housing (e.g., at an electrical or chassis ground). Instead, the electrical connection is established by fixing or joining the second housing portion (10, 110, 210) to the first housing portion (12, 112, 212) or vice versa, or by one or more snap connectors or clamps and other features to establish contact between the conductive trace on the circuit board and the corresponding conductive area of ​​the first housing portion (12, 112, 212). For example, the housing facilitates the use of an extruded aluminum design for the first housing portion (12, 112, 212) without requiring any ground screws to connect to an electrical ground or chassis ground, and also without requiring any spring-biased electrical connection to connect to an electrical ground or chassis ground.

[0070] Although the present disclosure has been illustrated and described in detail in the drawings and the foregoing description, the illustration and description should be regarded as exemplary rather than limiting in nature, and it should be understood that illustrative embodiments have been shown and described, and it is desired to protect all changes and modifications that fall within the spirit of the present disclosure. It should be noted that alternative embodiments of the present disclosure may not include all of the features described, but still benefit from at least some of the advantages of these features. Those of ordinary skill in the art can easily conceive of their own embodiments that combine one or more features of the present disclosure and fall within the spirit and scope of the present invention as defined by the appended claims.

Claims

1. An electronic component, characterized in that: The electronic components include: a first housing portion; a second housing portion, the second housing portion being connected to the first housing portion to form a cavity; A circuit board, wherein the circuit board is located in the cavity; the second housing portion having a connector body with a hollow core, the connector body extending outwardly from the second housing portion, and the connector body having a wall having a corresponding wall mating surface facing a corresponding circuit board mating surface of the circuit board; An adhesive sealant is configured to adhere to the wall and the circuit board mating surface.

2. The electronic component according to claim 1, characterized in that The connector body is integral with the second housing portion.

3. The electronic component according to claim 1, characterized in that The connector body and the second housing portion are molded simultaneously or integrally, or the connector body and the second housing portion are overmolded.

4. The electronic component according to claim 1, characterized in that The wall mating surface includes a lower skirt of the connector body having an inwardly stepped or inwardly tapered bottom portion.

5. The electronic component according to claim 4, characterized in that: A bead or ridge of adhesive sealant is aligned with the tapered bottom portion of the lower skirt.

6. The electronic component according to claim 1, characterized in that One or more conductors or conductive pins extend upwardly within the hollow core, and the conductors are supported by one or more dielectric feet or bases.

7. The electronic component according to claim 6, characterized in that: The conductor and dielectric foot combination is surface mounted on the circuit board, and the conductor is electrically connected to corresponding conductive traces on the circuit board.

8. The electronic component according to claim 6, characterized in that: The conductor and dielectric footing combination is mounted on the circuit board, and the conductor is electrically connected to corresponding conductive traces on the circuit board through plated through-holes or metallized blind vias.

9. The electronic component according to claim 1, characterized in that: The adhesive sealant adhesively bonds to the wall and the circuit board mating surface to form a barrier for preventing the ingress of moisture, water, contaminants, or debris from within the hollow core into the cavity in which the circuit board is located.

10. The electronic component according to claim 9, characterized in that The barrier is present even when the connector is in an unmated or disconnected state.

11. The electronic component according to claim 1, characterized in that: The circuit board includes a first power electronics module associated with a corresponding first region of the circuit board, a second power electronics module associated with a corresponding second region of the circuit board, and a third power electronics module associated with a third region of the circuit board; Each of the first power electronic module, the second power electronic module and the third power electronic module includes an inverter, each inverter has a set of AC terminals, the set of AC terminals are mounted on the circuit board and extend through the second housing part, and the first power electronic module, the second power electronic module and the third power electronic module share a set of common DC terminals on the outside of the second housing part.

12. The electronic component according to claim 11, characterized in that The first power electronic module and the second power electronic module share a common control terminal, and the first power electronic module and the second power electronic module are adjacent to each other.

13. The electronic component according to claim 12, characterized in that: The combination of the first power electronic module and the second power electronic module can be separated or separated from the third power electronic module; the third power electronic module has an auxiliary control terminal separated from the common control terminal, and the first power electronic module and the second power electronic module have an integrated circuit board, which supports a dual inverter with corresponding groups of AC terminals, the common control terminals and DC terminals.

14. The electronic component according to claim 12, characterized in that: The first power electronic module is separable from the second power electronic module and the third power electronic module, the first power electronic module providing a corresponding single inverter having AC terminals, the common control terminal and DC terminals.

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