Mini LED COB backlight lamp panel

Abstract

The utility model provides a Mini LED COB (Chip On Board) backlight lamp panel. The Mini LED COB backlight lamp panel comprises a PCB (Printed Circuit Board) substrate and at least one LED chip, the LED chip is fixed on the PCB substrate; the Mini LED COB backlight lamp panel further comprises a silica gel piece and a white gel piece. The silica gel piece covers the LED chip, and the silica gel piece is connected with the PCB substrate in an attached mode. And the white glue piece is arranged at the top of the silica gel piece and is positioned right above the LED chip. According to the Mini LED COB backlight lamp panel disclosed by the utility model, the silica gel and the white glue are arranged, so that the light intensity difference between the light intensity right above the LED chip and the light intensity around the LED chip is reduced, the visual effect of the backlight lamp panel is optimized, the low cost of the backlight lamp panel is ensured, and the thin thickness and low cost of a television are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of Mini LED backlight panels, and in particular to a Mini LED COB backlight panel. Background Art

[0002] In the prior art, Mini LED COB backlight panels use a glue dispensing method to dispense glue on LED chips. Figure 1 As shown, the light intensity of the LED chip will be concentrated directly above the LED chip, and the light intensity around the LED chip will be weak, causing the top of the LED chip to be too bright and shadows to be around the LED chip, resulting in horizontal and vertical stripes of shadows on the entire backlight board, and the backlight board has a poor visual effect.

[0003] OD refers to the distance between the backlight panel and the diffuser panel. The smaller the OD, the stronger the halo control ability and the thinner the TV.

[0004] In the prior art, the way to improve the visual effect of Mini LED COB backlight board is to increase the number of LED chips and reduce LED PH to improve the visual effect. However, this method increases the cost of the whole TV set and is not conducive to TV sales. PH is actually used to describe the distance between each point in the module of the LED display screen, also known as the dot pitch. It can be understood that LED PH refers to the center distance between two adjacent LED chips in the LED display screen.

[0005] In the existing technology, the visual effect of the Mini LED COB backlight board can be improved by adopting a large OD, but the large OD increases the thickness of the Mini LED COB backlight board, thereby increasing the thickness of the TV, which has lower market acceptance and is not easy to promote the TV. Utility Model Content

[0006] In view of the shortcomings of the prior art, the utility model provides a Mini LED COB backlight board. By setting silica gel and white glue, the difference in light intensity directly above the LED chip and around the LED chip is reduced, the visual effect of the backlight board is optimized, the low cost of the backlight board is ensured, and the thickness and cost of the TV are ensured to be thin.

[0007] The purpose of this utility model is achieved through the following technical solutions:

[0008] A Mini LED COB backlight board, comprising a PCB substrate and at least one LED chip;

[0009] The LED chip is fixed to the PCB substrate;

[0010] The Mini LED COB backlight panel also includes a silicone part and a white plastic part;

[0011] The silicone member covers the LED chip, and the silicone member is bonded and connected to the PCB substrate;

[0012] The white plastic piece is arranged on the top of the silicone piece and is located directly above the LED chip.

[0013] In one embodiment, the LED chip is die-bonded to the PCB substrate.

[0014] In one embodiment, the silicone member is a hemispherical structure.

[0015] In one of the embodiments, the top of the silicone piece is concave inward toward the center of the sphere to form a receiving groove; the white plastic piece is received or partially received in the receiving groove.

[0016] In one embodiment, the LED chip is located at the center of the hemispherical structure.

[0017] In one embodiment, the LED chip is a NCSP device.

[0018] Compared with the prior art, the utility model has at least the following advantages:

[0019] The Mini LED COB backlight board of the utility model reduces the difference in light intensity above the LED chip and around the LED chip by setting silica gel and white glue, optimizes the visual effect of the backlight board, ensures the low cost of the backlight board, and ensures that the thickness and cost of the TV are thin. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0021] Figure 1 It is the light intensity distribution diagram of the backlight panel in the prior art;

[0022] Figure 2 It is a cross-sectional schematic diagram of the Mini LED COB backlight panel of the utility model;

[0023] Figure 3 for Figure 2 The structural schematic diagram of the PCB substrate shown;

[0024] Figure 4 for Figure 3 A magnified view at point A;

[0025] Figure 5 for Figure 2 The structural diagram of the Mini LED COB backlight board shown;

[0026] Figure 6 This is the light intensity distribution diagram of the Mini LED COB backlight panel of the present invention. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings below. People familiar with this technology can easily understand other advantages and effects of the utility model from the content disclosed in this specification. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that can be produced by the utility model and the purpose that can be achieved, should still fall within the scope of the technical content disclosed in the utility model. At the same time, the terms such as "upper", "lower", "left", "right" and "middle" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the utility model, and the change or adjustment of their relative relationship. Without substantially changing the technical content, it should also be regarded as the scope of the implementation of the utility model.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0029] like Figure 2 As shown, the utility model discloses a Mini LED COB backlight board 10, including a PCB substrate 100 and at least one LED chip 200. The LED chip 200 is fixed to the PCB substrate 100. The Mini LED COB backlight board 10 also includes a silicone member 300 and a white plastic member 400. The silicone member 300 covers the LED chip 200, and the silicone member 300 is bonded and connected to the PCB substrate 100. The white plastic member 400 is arranged on the top of the silicone member 300 and is located directly above the LED chip 200.

[0030] In this embodiment, the LED chip 200 is die-bonded to the PCB substrate 100 .

[0031] like Figure 2 As shown, in this embodiment, the silicone member 300 is a hemispherical structure, and the LED chip 200 is located at the center of the hemispherical structure.

[0032] like Figure 2 As shown, in this embodiment, the top of the silicone member 300 is concave toward the center of the ball to form a receiving groove 310. The white rubber member 400 is partially received in the receiving groove 310, and part of the white rubber member 400 protrudes from the receiving groove 310. The white rubber member 400 is in the shape of a rugby ball.

[0033] In other embodiments, the white plastic piece 400 can be completely received in the receiving groove 310 , and the white plastic piece 400 and the silicone piece 300 form a complete hemispherical structure.

[0034] In this embodiment, the LED chip 200 is a NCSP device. Of course, in other embodiments, the LED chip 200 can also be other structures.

[0035] like Figure 3 , Figure 4 and Figure 5 As shown, in this embodiment, the PCB substrate 100 includes: a base material 110, a solder resist layer 120, a copper foil layer 130 and a white oil layer 140; the solder resist layer 120 is disposed on the base material 110, the copper foil layer 130 is disposed on the solder resist layer 120, and the white oil layer 140 is disposed on the copper foil layer 130; and, the white oil layer 140 is provided with at least one ink window 141; the ink window 141 is printed with solder paste 142, and the LED chip 200 is connected to the copper foil layer 130 through the ink window 141 and the solder paste 142.

[0036] The light generated by the LED chip 200 is emitted to the silicone member 300, and most of the light is concentrated directly above the LED chip 200 (i.e., the light is concentrated on the top of the silicone member 300); the white plastic member 400 at the top of the silicone member 300 reflects the light to the surroundings of the silicone member 300, and then is reflected by the white oil layer 140 of the PCB substrate 100, thereby enhancing the light intensity around the silicone member 300, reducing the light intensity directly above the LED chip 200, reducing the difference in light intensity directly above the LED chip 200 and around the LED chip 200, and optimizing the visual effect of the backlight board. The light intensity distribution diagram of the Mini LED COB backlight board 10 of the present invention is shown in FIG. Figure 6 The Mini LED COB backlight panel 10 of the present invention does not need to increase the OD or the number of LED chips while ensuring good visual effects, thereby ensuring that the TV is thin, low in cost and good in visual effects.

[0037] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A Mini LED COB backlight panel, characterized in that: It includes a PCB substrate and at least one LED chip; The LED chip is fixed to the PCB substrate; The Mini LED COB backlight panel also includes a silicone part and a white plastic part; The silicone member covers the LED chip, and the silicone member is bonded and connected to the PCB substrate; The white plastic piece is arranged on the top of the silicone piece and is located directly above the LED chip.

2. The Mini LED COB backlight board according to claim 1, characterized in that: The LED chip is die-bonded to the PCB substrate.

3. The Mini LED COB backlight board according to claim 1, characterized in that: The silicone piece is a hemispherical structure.

4. The Mini LED COB backlight board according to claim 3, characterized in that: The top of the silicone piece is concave inwardly toward the center of the sphere to form a receiving groove; the white plastic piece is received or partially received in the receiving groove.

5. The Mini LED COB backlight board according to claim 3, characterized in that: The LED chip is located at the center of the hemispherical structure.

6. The Mini LED COB backlight board according to claim 1, characterized in that: The LED chip is a NCSP device.

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