Defect positioning device

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a defect positioning device which comprises an adjusting unit, a first calibration piece and a second calibration piece, the first calibration piece comprises a first calibration part, the second calibration piece comprises a second calibration part, and a set distance is formed between the first calibration part and the second calibration part along a first direction; the first calibration piece and the second calibration piece are connected with the adjusting unit, and the adjusting unit is used for synchronously driving the first calibration piece and the second calibration piece to move at least in the direction perpendicular to the first direction. According to the device, the front position and the back position of the wafer correspond to each other through the first calibration piece and the second calibration piece, and the defect position of the wafer can be efficiently and accurately calibrated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a defect locating device. Background Art

[0002] Defect detection is an important part of semiconductor processing technology, which is mainly used to identify particles, scratches, cracks and other material defects on the surface of the substrate.

[0003] Taking wafer processing as an example, defect detection is applied to the wafer's surface defect detection without patterns and surface defect detection with images. For example, in the assembly and packaging process, the wafer needs to be sliced ​​to divide the wafer into multiple dies. Before wafer slicing, the back of the wafer needs to be inspected for defects, which belongs to surface defect detection without patterns. If there is a defect on the back of the wafer, the defect may affect the performance of the corresponding die on the wafer. For example, after the wafer is sliced, if there is a defect on the back of the die, when the die is pasted and assembled with a metal frame or a shell, the defect may affect the connection performance with the metal frame or shell during the assembly process of the die. Therefore, when a defect on the back of the wafer is detected, it is necessary to calibrate the position corresponding to the defect on the front of the wafer to determine the die corresponding to the defect.

[0004] The existing calibration method is usually through dimension measurement, for example, by measuring the distance and angle between the defect on the back of the wafer and the wafer notch, and then using the measured dimensions to reversely infer the defect position on the front of the wafer to achieve position calibration, and then determine the die where the defect is located. This calibration method has poor accuracy and low calibration efficiency, and there is a risk of scratching the front of the wafer during the calibration process.

[0005] Therefore, the utility model provides a defect positioning device, which realizes the correspondence between the front position and the back position of the wafer through a first calibration piece and a second calibration piece, and can efficiently and accurately realize the calibration of the defect position of the wafer. Moreover, during the calibration process, the first calibration piece and the second calibration piece do not need to contact the wafer to eliminate the risk of the wafer being scratched during the calibration process. Utility Model Content

[0006] The purpose of the utility model is to provide a defect positioning device, which realizes the correspondence between the front position and the back position of the wafer through a first calibration piece and a second calibration piece, and can efficiently and accurately realize the calibration of the defect position of the wafer. Moreover, during the calibration process, the first calibration piece and the second calibration piece do not need to contact the wafer, so as to eliminate the risk of the wafer being scratched during the calibration process.

[0007] The utility model provides a defect locating device, comprising: an adjusting unit, a first calibration piece and a second calibration piece;

[0008] The first calibration member includes a first calibration portion, the second calibration member includes a second calibration portion, and a set distance is provided between the first calibration portion and the second calibration portion along a first direction;

[0009] The first calibration member and the second calibration member are connected to the adjustment unit, and the adjustment unit is used to synchronously drive the first calibration member and the second calibration member to move at least along a direction perpendicular to the first direction.

[0010] Optionally, the first marking portion and the second marking portion are facing each other along the first direction.

[0011] Optionally, the first calibration member and the second calibration member are fixedly connected.

[0012] Optionally, the first marking portion is sharp; and / or the second marking portion is sharp.

[0013] Optionally, the defect locating device further comprises a holding unit, the holding unit is provided with a first holding groove and a second holding groove, the first holding groove and the second holding groove are arranged opposite to each other in a direction perpendicular to the first direction;

[0014] Along a projection perpendicular to the first direction, at least a portion of the first retaining groove and the second retaining groove are located between the first marking portion and the second marking portion along the first direction.

[0015] Optionally, the first retaining groove and the second retaining groove are V-shaped, and the deepest part of the bottom of the first retaining groove and the deepest part of the bottom of the second retaining groove are arranged opposite to each other;

[0016] Along the projection perpendicular to the first direction, the deepest part of the bottom of the first retaining groove and the deepest part of the bottom of the second retaining groove are both located between the first marking portion and the second marking portion along the first direction.

[0017] Optionally, the defect locating device further comprises a locating seat having a locating cavity therein, the adjusting unit is arranged on the locating seat, and the first marking part and the second marking part are located in the locating cavity.

[0018] Optionally, a positioning window is provided on at least one side of the positioning seat along the first direction, and the positioning window is communicated with the positioning cavity.

[0019] Optionally, a through slot is opened on the positioning seat in a direction perpendicular to the first direction, and the through slot is connected to the positioning cavity; along the projection of the opening direction of the through slot, the first marking portion and the second marking portion are located in the through slot.

[0020] Optionally, when the defect locating device includes a holding unit, the holding unit is disposed in the locating cavity.

[0021] In summary, the defect positioning device in the utility model includes: an adjustment unit, a first calibration piece and a second calibration piece; the first calibration piece includes a first calibration part, the second calibration piece includes a second calibration part, and the first calibration part and the second calibration part have a set distance along the first direction; the first calibration piece and the second calibration piece are connected to the adjustment unit, and the adjustment unit is used to synchronously drive the first calibration piece and the second calibration piece to move at least in a direction perpendicular to the first direction.

[0022] With such configuration, the defect positioning device sets the wafer between the first calibration member and the second calibration member, wherein the first calibration member faces the back of the wafer, and the second calibration member faces the back of the wafer. The first calibration member can be driven to move so that the first calibration member can calibrate the defect position on the back of the wafer. Since the first calibration member and the second calibration member move synchronously, the position of the front of the wafer corresponding to the defect can be calibrated by the second calibration member of the second calibration member, and then the tube core where the defect is located can be calibrated. The device realizes the correspondence between the front position and the back position of the wafer through the first calibration member and the second calibration member, and improves the existing indirect calibration method through size calculation into a direct calibration method through the first calibration member and the second calibration member. The calibration method is more efficient and direct, and the calibration accuracy is also higher. In addition, during the calibration process, the wafer position is between the first calibration member and the second calibration member, so that the first calibration member and the second calibration member do not need to contact the wafer, so as to eliminate the risk of the wafer being scratched during the calibration process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The structure of the defect location device of some embodiments of the utility model is shown in FIG. Figure 1 ;

[0024] Figure 2 It is a side view structural schematic diagram of a defect locating device in some embodiments of the utility model;

[0025] Figure 3 The structure of the defect location device of some embodiments of the utility model is shown in FIG. Figure 2 ;

[0026] Figure 4 It is a schematic diagram of the side view structure of a defect location device of some embodiments of the utility model when a wafer is installed;

[0027] Figure 5 A schematic diagram of the structure of a defect location device in some embodiments of the utility model when calibrating the defect position on the back side of a wafer;

[0028] Figure 6A schematic diagram of the structure of a defect location device in some embodiments of the utility model when calibrating a defect position on the front side of a wafer;

[0029] Figure 7 Schematic diagram of the structure of the defect location device in other embodiments of the utility model Figure 1 ;

[0030] Figure 8 It is a side view structural schematic diagram of a defect location device in other embodiments of the utility model;

[0031] Fig. 9 Schematic diagram of the structure of the defect location device in other embodiments of the utility model Figure 2 ;

[0032] Fig.10 It is a schematic diagram of the side view structure of the defect location device of other embodiments of the utility model when a wafer is installed;

[0033] Fig.11 It is a structural schematic diagram of a defect location device in other embodiments of the utility model when calibrating the defect position on the back side of a wafer;

[0034] Fig.12 It is a structural schematic diagram of the defect location device of other embodiments of the present invention when calibrating the defect position of the front side of the wafer.

[0035] In the attached figure:

[0036] 10-adjusting unit; 11-first screw; 12-second screw; 13-first driving member; 14-second driving member; 15-first belt; 16-second belt; 171-first pulley; 172-second pulley; 173-third pulley; 174-fourth pulley; 18-connector;

[0037] 11′- rack; 12′- gear; 13′- track;

[0038] 20-first calibration member; 21-first calibration portion;

[0039] 30-second calibration member; 31-second calibration portion; 32-connecting rod;

[0040] 40-holding unit; 401-first holding groove; 402-second holding groove; 41-first holding member; 42-second holding member;

[0041] 50-positioning seat; 51-positioning cavity; 52-positioning window; 53-through groove;

[0042] 60-wafer; 61-die;

[0043] A-defect location;

[0044] a-first direction, corresponding to the X direction in the drawings;

[0045] X, Y, and Z are three directions perpendicular to each other in the drawings. DETAILED DESCRIPTION

[0046] The defect location device proposed by the utility model is further described in detail below in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model.

[0047] As used in the present invention, the singular forms "one", "an", and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the terms "at least two" or "a plurality" are usually used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0048] The defect locating device in this embodiment can be applied to defect locating of thin-film structures in semiconductor devices, such as wafers or other substrates.

[0049] In this embodiment, defect positioning of a wafer is taken as an example for description.

[0050] In this embodiment, the first direction a corresponds to the X direction, which corresponds to the horizontal direction; the Y direction is perpendicular to the X direction, which also corresponds to the horizontal direction; the Z direction is perpendicular to the X and Y directions, which corresponds to the vertical direction.

[0051] In other alternative embodiments, the specific directions corresponding to the X direction, the Y direction and the Z direction can be adaptively adjusted based on actual usage requirements.

[0052] Please refer to Figures 1 to 3 As shown, this embodiment provides a defect locating device, including: an adjusting unit 10 , a first calibrating member 20 , a second calibrating member 30 , a holding unit 40 , and a locating seat 50 .

[0053] In this embodiment, the positioning seat 50 is a rectangular parallelepiped structure, and the positioning seat 50 has a positioning cavity 51 therein, and the positioning cavity 51 is also a rectangular parallelepiped structure. The holding unit 40 is disposed in the positioning cavity 51, and the holding unit 40 is used to place the wafer so that the wafer is located in the positioning cavity 51 in a fixed posture.

[0054] The positioning seat 50 and the positioning cavity 51 are not limited to the rectangular parallelepiped structure. In other alternative embodiments, the positioning seat 50 can be set to a cylindrical shape, and correspondingly, the positioning cavity 51 can also be set to a cylindrical cavity. The specific shapes of the positioning seat 50 and the positioning cavity 51 can be adjusted based on the actual assembly requirements with other components.

[0055] The first calibration member 20 includes a first calibration portion 21, and the second calibration member 30 includes a second calibration portion 31. A set distance is provided between the first calibration portion 21 and the second calibration portion 31 along the first direction a. Figure 2 As shown, the first direction a corresponds to the X direction, and there is a set distance between the first calibration part 21 and the second calibration part 31 along the X direction. The set distance is set to avoid the wafer. After the wafer is positioned by the holding unit 40, the wafer is located between the first calibration part 21 and the second calibration part 31 along the X direction. In theory, the set distance only needs to be greater than the thickness of the wafer to be detected, and the specific size of the set distance can be adaptively adjusted based on actual use requirements (for example, the need to prevent interference with the wafer).

[0056] The adjusting unit 10 is disposed on the positioning seat 50 , the first calibration member 20 and the second calibration member 30 are connected to the adjusting unit 10 , and the adjusting unit 10 is used to synchronously drive the first calibration member 20 and the second calibration member 30 to move in a direction perpendicular to the first direction a.

[0057] The wafer to be inspected is set between the first calibration part 21 and the second calibration part 31 along the X direction, and the wafer is perpendicular to the X direction. The first calibration part 21 corresponds to the back of the wafer, and the second calibration part 31 corresponds to the front of the wafer. Therefore, when the first calibration part 20 and the second calibration part 30 move in a direction perpendicular to the first direction a, the first calibration part 20 and the second calibration part 30 actually move in a direction parallel to the wafer. At this time, the position of the first calibration part 21 can be adjusted so that the first calibration part 21 moves to the position corresponding to the defect on the back of the wafer. When the first calibration part 20 and the second calibration part 30 are driven to move synchronously, so that the first calibration part 21 moves to the defect position on the back of the wafer (the position where the first calibration part 21 is opposite to the defect along the X direction), since the relative position relationship between the first calibration part 21 and the second calibration part 31 is determined, the defect position can be calibrated by the second calibration part 31 to correspond to the position of the front of the wafer, and then the die where the defect is located can be calibrated.

[0058] With such configuration, the defect positioning device sets the wafer between the first calibration member and the second calibration member, wherein the first calibration member faces the back of the wafer, and the second calibration member faces the back of the wafer. The first calibration member can be driven to move so that the first calibration member can calibrate the defect position on the back of the wafer. Since the first calibration member and the second calibration member move synchronously, the position of the front of the wafer corresponding to the defect can be calibrated by the second calibration member of the second calibration member, and then the tube core where the defect is located can be calibrated. The device realizes the correspondence between the front position and the back position of the wafer through the first calibration member and the second calibration member, and improves the existing indirect calibration method through size calculation into a direct calibration method through the first calibration member and the second calibration member. The calibration method is more efficient and direct, and the calibration accuracy is also higher. In addition, during the calibration process, the wafer position is between the first calibration member and the second calibration member, so that the first calibration member and the second calibration member do not need to contact the wafer, so as to eliminate the risk of the wafer being scratched during the calibration process.

[0059] To ensure the calibration efficiency of the second calibration part 31. In this embodiment, the second calibration part 31 and the first calibration part 21 are set to be sharp, and the two are set opposite each other along the X direction. When the first calibration part 21 moves to a position opposite to the defect on the back side of the wafer along the X direction, the front side of the wafer opposite to the second calibration part 31 along the X direction is the location of the defect, thereby determining the die where the defect is located.

[0060] In this embodiment, the first calibration part 21 and the second calibration part 31 are arranged in a manner that is directly opposite to each other along the X direction, so as to realize the calibration of the defect position more directly. In other alternative embodiments, the relative position relationship between the first calibration part 21 and the second calibration part 31 can be adjusted based on the calibration requirements. For example, when it is necessary to calibrate the tube core adjacent to the defect, the first calibration part 21 and the second calibration part 31 can have a certain misalignment in the direction perpendicular to the X direction, as long as the relative position relationship between the first calibration part 21 and the second calibration part 31 is determined. Then, when the position of the first calibration part 21 and the position of the second calibration part 31 are determined, the front position of the wafer corresponding to the defect on the back of the wafer can be inferred through the relative position relationship between the two, and the target tube core and the tube core adjacent to the defect can also be intuitively calibrated.

[0061] In addition, in this embodiment, a first calibration unit 21 and a second calibration unit 31 are provided. In other alternative embodiments, multiple first calibration units 21 and multiple second calibration units 31 may be provided, or one first calibration unit 21 and multiple second calibration units 31 may be provided, or one first calibration unit 21 and one second calibration unit 31 may be provided. For example, when four adjacent dies around a defect need to be calibrated, four second calibration units may be provided. The specific number of the first calibration unit 21 and the second calibration unit 31 is adaptively adjusted based on the calibration requirements.

[0062] In this embodiment, the first marking portion 21 and the second marking portion 31 are both configured to be sharp. Figure 1 and Figure 3 As shown, the first calibration portion 21 and the second calibration portion 31 are both triangular sharp structures, and the sharp corners can more accurately calibrate smaller defects. In other alternative embodiments, the first calibration portion 21 and the second calibration portion 31 can be set as a cone structure or a triangular pyramid or other known sharp structures.

[0063] In this embodiment, the first calibration member 20 and the second calibration member 30 are fixedly connected. Then the adjustment unit 10 only needs to drive one of the first calibration member 20 or the second calibration member 30 to move, and the two can maintain synchronous movement. In other alternative embodiments, the first calibration member 20 and the second calibration member 30 can be two independent components, and the adjustment unit 10 can include two sets of driving mechanisms to independently drive the first calibration member 20 and the second calibration member 30, respectively. At this time, it is necessary to ensure that the feeding path of driving the first calibration member 20 is consistent with the feeding path of driving the second calibration member 30, so that the two can move synchronously.

[0064] like Figures 1 to 3 As shown, the positioning seat 50 has a positioning cavity 51 therein, and the positioning cavity 51 is a place for positioning. The holding unit 40 includes a first holding member 41 and a second holding member 42 (the first holding member 41 and the second holding member 42 are Figure 1 and Figure 3 (not shown), the first retaining member 41 and the second retaining member 42 are located in the positioning cavity 51 and fixed on the inner wall of the positioning cavity 51. The first retaining member 41 and the second retaining member 42 can be fixed on the inner wall of the positioning cavity 51 by welding, bonding, etc.

[0065] The first retaining member 41 and the second retaining member 42 are arranged opposite to each other along the Z direction, wherein the first retaining member 41 is located above the second retaining member 42. A first retaining groove 401 is provided on the lower surface of the first retaining member 41, and a second retaining groove 402 is provided on the upper surface of the second retaining member 42, wherein the first retaining groove 401 and the second retaining groove 402 are arranged opposite to each other along the Z direction.

[0066] In this embodiment, the first retaining member 41 and the second retaining member 42 are independent components relative to the positioning seat 50. In other alternative embodiments, the first retaining member 41 and the second retaining member 42 can also be integrally formed with the positioning seat 50, for example, the bottom area of ​​the positioning seat 50 serves as the second retaining member 42, and the first retaining groove 401 is directly opened at the bottom of the positioning cavity 51.

[0067] Please continue to refer to Figure 2 As shown, the first holding groove 401 and the second holding groove 402 are both set to a V-shaped structure, the deepest part of the bottom of the first holding groove 401 and the deepest part of the bottom of the second holding groove 402 are arranged opposite to each other along the Z direction, and the deepest parts of the two are located between the first calibration part 21 and the second calibration part 31 along the X direction. When locating the defect, the wafer is first placed between the first holding member 41 and the second holding member 42, and the upper edge of the wafer is located in the first holding groove 401 and is positioned at the deepest part of the bottom of the groove, and the lower edge of the wafer is located in the second holding groove 402 and is positioned at the deepest part of the bottom of the groove, so that the posture of the wafer remains fixed. At this time, the first calibration part 21 and the second calibration part 31 are respectively located on both sides of the wafer.

[0068] Please continue to refer to Figure 2 As shown, in this embodiment, the size of the first retaining member 41 and the second retaining member 42 along the X direction is greater than the distance between the first calibration portion 21 and the second calibration portion 31 along the X direction. Projected along the Y direction, the deepest part of the bottom of the first retaining groove 401 and the second retaining groove 402 is located between the first calibration portion 21 and the second calibration portion 31 along the X direction, and the other part of the first retaining groove 401 and the second retaining groove 402 is located outside the first calibration portion 21 and the second calibration portion 31. Therefore, the first calibration portion 21 and the second calibration portion 31 are Figure 2 If it is driven along the Y direction ( Figure 2Therefore, if the first calibration part 21 and the second calibration part 31 need to move to the rear side of the first holder 41 along the Y direction, the first calibration part 20 and the second calibration part 30 need to be driven to move upward along the Z direction to the top of the first holder 41, and then driven along the Y direction ( Figure 2 It moves backward in the Z direction (the direction perpendicular to the paper surface) and then moves downward in the Z direction.

[0069] In other alternative embodiments, the dimension of the first retaining member 41 along the X direction may be smaller than the spacing between the first calibration portion 21 and the second calibration portion 31 along the X direction, in which case the first retaining member 41 and the first retaining groove 401 are completely located between the first calibration portion 21 and the second calibration portion 31 along the first direction a. The first calibration portion 21 and the second calibration portion 31 can be driven to move freely along the Y direction without interfering with the first retaining member 41. Similarly, the dimension of the second retaining member 42 along the X direction may also be smaller than the spacing between the first calibration portion 21 and the second calibration portion 31 along the X direction to prevent interference with the first calibration portion 21 and the second calibration portion 31.

[0070] In this embodiment, the first retaining member 41 and the second retaining member 42 are split structures. In other alternative embodiments, the first retaining member 41 and the second retaining member 42 may also be an integrated structure, for example, the retaining unit 40 may be configured as a "door"-shaped structure, with the two sides adjacent to the opening side thereof serving as the first retaining member 41 and the second retaining member 42, and the opening side of the retaining unit 40 is provided for wafers to enter and exit.

[0071] Please continue to refer to Figures 1 to 3 As shown, positioning windows 52 are provided on both sides of the positioning seat 50 along the first direction a. The positioning windows 52 are rectangular and communicate with the positioning cavity 51. When the wafer is positioned by the holding unit 40, one of the positioning windows 52 corresponds to the front side of the wafer, and the other positioning window 52 corresponds to the back side of the wafer, so as to facilitate the positioning observation of defects, and to facilitate the calibration of the tube core where the defects are located, and also to facilitate marking the corresponding tube core through the positioning windows, for example, by marking the corresponding tube core with a color.

[0072] In other alternative embodiments, the positioning seat 50 may be made of a transparent material. The wafer inside the positioning seat 50 and the first calibration member 20 and the second calibration member 30 may be seen through the positioning seat 50. In this case, the positioning window 52 may not be provided, or the positioning window 52 may be provided only on one side of the positioning seat 50 along the first direction a.

[0073] Please continue to refer to Figures 1 to 3As shown, the positioning seat 50 is provided with through grooves 53 on both sides along the Y direction, the through grooves 53 on both sides are opposite to each other along the Y direction, and the through grooves 53 are connected with the positioning cavity 51. The height of the through grooves 53 is greater than the diameter of the wafer, so the through grooves 53 on one side can allow the wafer to enter the positioning cavity 51, and the through grooves 53 on the other side can allow the wafer to exit the positioning cavity 51.

[0074] In other alternative embodiments, the positioning seat 50 may only have a through slot 53 on one side along the Y direction. Figure 1 A through slot 53 is provided on the left or right side of the middle positioning seat 50 , and the wafer enters and exits through the through slot 53 .

[0075] In this embodiment, the first calibration portion 21 and the second calibration portion 31 are driven by the adjustment unit 10 to move along the Y direction and the Z direction. Therefore, along the projection of the opening direction of the through slot 53, the first calibration portion 21 and the second calibration portion 31 are located in the through slot 53. The wafer can be inserted between the first holding slot 401 and the second holding slot 402 through the through slot 53 to maintain a fixed posture, and after the wafer passes through the through slot 53, it is located between the first calibration portion 21 and the second calibration portion 31.

[0076] In other alternative embodiments, the first calibration portion 21 and the second calibration portion 31 may also be driven to move along the X direction, the Y direction or the Z direction, and in this case, the positions of the first calibration portion 21 and the second calibration portion 31 relative to the through slot 53 may not be limited.

[0077] Combine the following Figure 1 The specific structure of the adjustment unit 10 is introduced.

[0078] The adjusting unit 10 includes a first screw 11 , a second screw 12 , a first driving member 13 , a second driving member 14 , a first belt 15 , a second belt 16 , a first pulley 171 , a second pulley 172 , a third pulley 173 , a fourth pulley 174 and a connector 18 .

[0079] like Figure 1 As shown, in this embodiment, the first screw 11 is installed at the top of the positioning seat 50, and the first screw 11 extends along the Y direction. The first screw 11 can be installed on the positioning seat 50 with a single degree of freedom, for example, both ends of the first screw 11 can be rotatably installed on the positioning seat 50 through bearings. The installation method of the first screw 11 belongs to the prior art and will not be repeated here.

[0080] The first driving member 13, the first belt 15, the first pulley 171 and the second pulley 172 cooperate to drive the first screw 11 to rotate. The first driving member 13 may be, for example, a motor, which may be integrated into the positioning seat 50 or installed on an external device. The driving end of the first driving member 13 is in transmission cooperation with the first pulley 171, the first pulley 171 is in transmission cooperation with the second pulley 172 through the first belt 15, and the second pulley 172 is fixedly installed on the first screw 11. Therefore, the first driving member 13 drives the first pulley 171 to rotate, the first pulley 171 drives the second pulley 172 to rotate through the first belt 15, and the second pulley 172 drives the first screw 11 to rotate.

[0081] The second pulley 172 has the function of a pulley, and its outer peripheral surface is used to cooperate with the first pulley 171. The second pulley 172 is fixedly sleeved on the first screw rod 11 and is fixedly connected to the first screw rod 11. For example, one end of the first screw rod 11 is a bare rod section, and the second pulley 172 is sleeved on the bare rod section with an interference fit, so when the second pulley 172 rotates, it will drive the first screw rod 11 to rotate.

[0082] Please continue to refer to Figure 1 As shown, the connector 18 is threadedly matched with the first screw 11, and the first screw 11 and the connector 18 can form a ball screw structure. The connector 18 is installed on the top of the positioning seat 50 in a linear sliding manner along the Y direction. For example, the connector 18 can achieve a single degree of freedom sliding match along the Y direction through its own raised dovetail protrusion and the dovetail groove on the positioning seat 50. Therefore, when the first screw 11 rotates, the connector 18 can be driven to move linearly along the Y direction with a single degree of freedom.

[0083] The second driving member 14 , the second belt 16 , the third pulley 173 and the fourth pulley 174 cooperate to drive the second screw rod 12 to move.

[0084] The fourth pulley 174 is installed on the connector 18 in a single degree of freedom rotation. The fourth pulley 174 is also threadedly matched with the second screw 12, and the second screw 12 extends along the Z direction. In addition, the second screw 12 can slide with the positioning seat 50 in the Z direction, for example, through a protrusion on the second screw 12 and the Z-direction groove on the positioning seat 50. Therefore, when the fourth pulley 174 rotates, it can drive the second screw 12 to move in the Z direction. The fourth pulley 174 and the second screw 12 can also constitute a ball screw structure. The fourth pulley 174 is driven and matched with the third pulley 173 through the second belt 16, and the third pulley 173 is driven and matched with the output end of the second driving member 14, and the second driving member 14 can be a motor, for example. Therefore, when the second driving member 14 drives the third pulley 173 to rotate, the third pulley 173 drives the fourth pulley 174 to rotate through the second belt 16, and the fourth pulley 174 drives the second screw 12 to move in the Z direction.

[0085] The fourth pulley 174 has the functions of a pulley and a nut, and its outer circumference is used to cooperate with the second belt 16, and its inner circumference is provided with an internal thread for threaded transmission cooperation with the second screw rod 12. In addition, the fourth pulley 174 is also rotatably mounted on the connector 18, for example, the fourth pulley 174 extends outward along one axial end thereof and is rotatably mounted on the connector 18 through a bearing.

[0086] Therefore, the above structure enables the second screw rod 12 to move along the Y direction along with the connector 18 , and can also be driven by the fourth pulley 174 to move along the Z direction.

[0087] In this embodiment, the first calibration portion 21 is connected to the bottom of the second screw rod 12, and the second calibration portion 31 is connected to a connecting rod 32 (such as Figure 2 and Figure 3 As shown in FIG. 1 , the connecting rod 32 is parallel to the second screw rod 12, and the connecting rod 32 is fixedly connected to the second screw rod 12 through an intermediate piece. Therefore, the first calibration portion 21 and the second calibration portion 31 can move synchronously with the second screw rod 12.

[0088] The adjusting unit 10 is a dual-degree-of-freedom driving mode, which can drive the first calibration part 21 and the second calibration part 31 to move synchronously along the Y direction and the Z direction.

[0089] In other alternative embodiments, the adjustment unit 10 may also adopt a three-degree-of-freedom driving mode, for example, driving the first calibration part 21 and the second calibration part 31 to move synchronously along the X direction, the Y direction and the Z direction. Of course, the driving degrees of freedom of the first calibration part 21 and the second calibration part 31 can be determined based on actual needs and matched with the corresponding adjustment unit 10.

[0090] like Figures 4 to 6 As shown, after the wafer 60 is placed in the holding unit 40 and the posture is fixed, the wafer 60 is in an upright state, and the Z direction is perpendicular to the wafer 60. At this time, the wafer 60 is located between the first calibration portion 21 and the second calibration portion 31. The first driving member 13 and the second driving member 14 in the adjustment unit 10 can drive the second screw 12 to move to adjust the position of the first calibration portion 21 and the second calibration portion 31. When Figure 5 As shown, when the sharp portion of the first marking portion 21 faces the position of the defect A on the back of the wafer 60 along the X direction, the second marking portion 31 is as shown in FIG. Figure 6 As shown, its sharp portion is also facing the position of defect A on the front side of wafer 60 along the X direction. Figure 6 As shown, the front side of the wafer 60 has a plurality of rectangular tube cores arranged in a grid shape, and the second calibration portion 31 faces the front side of the wafer 60 . At this time, the tube core 61 corresponding to the defect A can be calibrated by the second calibration portion 31 .

[0091] Please refer to Figures 7 to 9 As shown in FIG. 1 , another embodiment of the defect location device is provided. The difference between this embodiment and the above embodiment lies in the difference in the structure of the adjustment unit 10 .

[0092] In this embodiment, the adjustment unit 10 includes a rack 11 ′, a gear 12 ′, a track 13 ′ and a slider, wherein the slider is not shown.

[0093] The track 13′ is installed at the top position of the positioning seat 50, the track 13′ extends along the Y direction, and the slider is installed on the track 13′ to slide along the Y direction. The rack 11′ is installed on the slider to slide along the Z direction, and the gear 12′ is rotatably installed on the slider, and the gear 12′ is meshed with the rack 11′. Therefore, when the gear 12′ rotates, it can drive the rack 11′ to slide relative to the slider along the Z direction, and at the same time, the rack 11′ can move along the track 13′ in the Y direction with the slider. The first calibration portion 21 is fixedly connected to the lower end of the rack 11′, and the second calibration portion 31 is connected to a connecting rod 32 (such as Figure 8 As shown in FIG. 1 , the connecting rod 32 is parallel to the rack 11 ′. Therefore, the first calibration portion 21 and the second calibration portion 31 can move synchronously along the Y direction and the Z direction with the rack 11 ′.

[0094] In addition, the slider can be externally connected to a first driving member, and the gear 12' can be externally connected to a second driving member. The first driving member can be, for example, a linear motor or a hydraulic driving mechanism. The second driving member can be, for example, a rotary motor.

[0095] Please refer to Figures 10 to 12 As shown, after the wafer 60 is placed in the holding unit 40 and its posture is fixed, the wafer 60 is in an upright state, and the Z direction is perpendicular to the wafer 60. At this time, the wafer 60 is located between the first calibration portion 21 and the second calibration portion 31. At this time, the slider and gear 12' in the adjustment unit 10 can be used to drive the rack 11' to move to adjust the position of the first calibration portion 21 and the second calibration portion 31. Fig.11 As shown, when the sharp portion of the first marking portion 21 faces the position of the defect A on the back of the wafer 60 along the X direction, the second marking portion 31 is as shown in FIG. Fig.12 As shown, the sharp portion is also facing the position of the defect A on the front side of the wafer 60 along the X direction. The second marking portion 31 faces the front side of the wafer 60 , and the die 61 corresponding to the defect A can be marked by the second marking portion 31 .

[0096] The structure of the adjustment unit 10 is not limited to the above two embodiments. For example, the adjustment unit 10 can directly adopt a plurality of linear motor drives to realize the linear motion of the first calibration part 21 and the second calibration part 31 along a plurality of linear directions, or the adjustment unit 10 can adopt a plurality of sets of hydraulic drive mechanisms to realize the linear motion of the first calibration part 21 and the second calibration part 31 along a plurality of linear directions.

[0097] In addition, the movement of the first calibration part 21 and the second calibration part 31 is not limited to linear movement, but they can also rotate around the central axis of the X direction and move linearly in a direction perpendicular to the X direction. In this case, the adjustment unit 10 can use a combination of a linear motor and a rotary motor or a combination of a hydraulic drive structure and a rotary motor to achieve the movement drive of the first calibration part 21 and the second calibration part 31.

[0098] The adjustment unit 10 may be set based on the motion requirements of the first calibration part 21 and the second calibration part 31 , which will not be described in detail herein.

[0099] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0100] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of the utility model. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A defect locating device, characterized in that: include: An adjustment unit, a first calibration member, and a second calibration member; The first calibration member includes a first calibration portion, the second calibration member includes a second calibration portion, and a set distance is provided between the first calibration portion and the second calibration portion along a first direction; The first calibration member and the second calibration member are connected to the adjustment unit, and the adjustment unit is used to synchronously drive the first calibration member and the second calibration member to move at least along a direction perpendicular to the first direction.

2. The defect locating device according to claim 1, characterized in that: The first marking portion and the second marking portion are directly opposite to each other along the first direction.

3. The defect locating device according to claim 1, characterized in that: The first calibration member and the second calibration member are fixedly connected.

4. The defect locating device according to claim 1, characterized in that: The first marking portion is sharp; and / or the second marking portion is sharp.

5. The defect locating device according to claim 1, characterized in that: The defect locating device further comprises a holding unit, on which a first holding groove and a second holding groove are provided, wherein the first holding groove and the second holding groove are arranged opposite to each other in a direction perpendicular to the first direction; Along a projection perpendicular to the first direction, at least a portion of the first retaining groove and the second retaining groove are located between the first marking portion and the second marking portion along the first direction.

6. The defect locating device according to claim 5, characterized in that: The first retaining groove and the second retaining groove are V-shaped, and the deepest part of the bottom of the first retaining groove and the deepest part of the bottom of the second retaining groove are arranged opposite to each other; Along the projection perpendicular to the first direction, the deepest part of the bottom of the first retaining groove and the deepest part of the bottom of the second retaining groove are both located between the first marking portion and the second marking portion along the first direction.

7. The defect locating device according to any one of claims 1 to 6, characterized in that: The defect locating device further comprises a locating seat, wherein the locating seat has a locating cavity therein, the adjusting unit is arranged on the locating seat, and the first marking part and the second marking part are located in the locating cavity.

8. The defect locating device according to claim 7, characterized in that: A positioning window is provided on at least one side of the positioning seat along the first direction, and the positioning window is communicated with the positioning cavity.

9. The defect locating device according to claim 7, characterized in that: A through slot is formed on the positioning seat in a direction perpendicular to the first direction, and the through slot is connected to the positioning cavity; along the projection of the opening direction of the through slot, the first marking portion and the second marking portion are located in the through slot.

10. The defect locating device according to claim 7, characterized in that: When the defect locating device comprises a holding unit, the holding unit is arranged in the locating cavity.

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