Backboard, display panel and display device

Abstract

The utility model relates to a backboard, a display panel and a display device.The backboard comprises a substrate and a driving circuit arranged on the substrate, the driving circuit comprises a plurality of bonding pad set units arrayed on the surface of the substrate, and each bonding pad set unit corresponds to one pixel unit; and the arrangement sequences of the first bonding pad, the second bonding pad and the third bonding pad in each bonding pad group unit in the preset direction are the same. In at least one of the first bonding pad, the second bonding pad and the third bonding pad on the surface of the substrate, one part of the bonding pad of the same type is arranged in an arrangement sequence of positive electrode bonding pad-negative electrode bonding pad, and the other part of the bonding pad of the same type is arranged in an arrangement sequence of negative electrode bonding pad-positive electrode bonding pad. Therefore, the light-emitting chip with the color with poor light-emitting angle symmetry can integrally form a symmetrical light-emitting angle on the display panel, so that the color of the side view angle of the display panel is consistent, and the problem of color cast of the side view angle of the display panel is solved.

Description

Technical Field

[0001] The present application relates to the field of LED display, and in particular to a backplane, a display panel, and a display device. Background Art

[0002] As an active light-emitting display technology, COB (Chip On Board) LED (Light-Emitting Diode) and COG (Chip On Glass) LED displays have the advantages of high brightness and wide color gamut. At present, a display panel is provided with a number of light-emitting LED chips. Due to the limitation of the LED chip production process, the light-emitting angles of the LED chips are asymmetric, resulting in the color cast of the display panel at the side viewing angle, and the colors of the left and right viewing angles are inconsistent, which reduces the display quality of the display panel.

[0003] Therefore, how to improve the color consistency of the display panel at the side viewing angle is an urgent problem to be solved. Utility Model Content

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a backplane, a display panel, and a display device, aiming to solve the problem of color cast at side viewing angles of the display panel.

[0005] In order to solve the above technical problems, an embodiment of the present application provides a backplane, comprising: a substrate, and a driving circuit arranged on the substrate, wherein the driving circuit comprises a plurality of pad group units arrayed on the surface of the substrate, one pad group unit corresponds to one pixel unit, a first pad in the pad group unit corresponds to a red light-emitting chip of the pixel unit, a second pad in the pad group unit corresponds to a green light-emitting chip of the pixel unit, a third pad in the pad group unit corresponds to a blue light-emitting chip of the pixel unit, and the arrangement order of the first pad, the second pad, and the third pad in each pad group unit in a preset direction is the same;

[0006] Among at least one of the first pad, the second pad, and the third pad on the surface of the substrate, a part of the same pad is arranged in the order of positive pad-negative pad, and another part of the same pad is arranged in the order of negative pad-positive pad.

[0007] Optionally, among at least one of the first pad, the second pad, and the third pad, pads of the same type in adjacent rows are arranged in 180° rotational symmetry.

[0008] Optionally, among at least one of the first pad, the second pad, and the third pad, pads of the same type in adjacent columns are arranged in 180° rotational symmetry.

[0009] Optionally, among at least one of the first pad, the second pad and the third pad, pads of the same type in adjacent rows and columns are arranged in 180° rotational symmetry.

[0010] Optionally, among the first pad, the second pad and the third pad, a part of the same pads are arranged in the order of positive pad-negative pad, and another part of the same pads are arranged in the order of negative pad-positive pad.

[0011] Optionally, the driving circuit also includes a conductive circuit, which electrically connects the positive electrode pads in the same row, the conductive circuit electrically connects the negative electrode pads of the first pad in the same column, the negative electrode pads of the second pad in the same column, and the negative electrode pads of the third pad in the same column.

[0012] Optionally, among the first welding pad, the second welding pad, and the third welding pad included in one welding pad group unit, the arrangement order of the positive electrode welding pad and the negative electrode welding pad of at least two kinds of welding pads is the same.

[0013] Based on the same inventive concept, an embodiment of the present application further provides a display panel, comprising a plurality of pixel units, and the backplane as described above, wherein the red light-emitting chip of the pixel unit is bonded to the first pad, the green light-emitting chip of the pixel unit is bonded to the second pad, and the blue light-emitting chip of the pixel unit is bonded to the third pad, and the arrangement order of the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip in each of the pixel units in a preset direction is the same;

[0014] In at least one of the red light-emitting chip, the green light-emitting chip and the blue light-emitting chip, a portion of the light-emitting chips of the same color is rotated by 180°, and another portion is in a non-rotated state.

[0015] Optionally, between the pixel units in adjacent rows and / or columns, the light-emitting chips of the same color are all 180° rotationally symmetric.

[0016] Based on the same inventive concept, an embodiment of the present application further provides a display device, including a housing, and the display panel as described above, wherein the display panel is fixed on the housing.

[0017] The present application provides a backplane, a display panel, and a display device. Among at least one of the first pad, the second pad, and the third pad on the backplane, a portion of the same pad is arranged in the order of positive pad-negative pad. When the light-emitting chip is bonded to the pad of the portion, the light-emitting chip does not need to be rotated, that is, a portion of the light-emitting chip can be in an unrotated state after bonding; the pads of the other portion are arranged in the order of negative pad-positive pad. When the light-emitting chip is bonded to the pad of the portion, the light-emitting chip needs to be rotated 180°, that is, the light-emitting chip of the other portion is rotated 180° after bonding. The light-emitting angle of the unrotated light-emitting chip is symmetrical with the light-emitting angle of the light-emitting chip rotated 180°, so that the light-emitting chip of the color with poor light-emitting angle symmetry can be made to have a more symmetrical light-emitting angle on the display panel as a whole, so that the color of the side viewing angle of the display panel is more consistent, the color cast problem of the side viewing angle of the display panel is solved, and the display quality of the display device is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the first structure of the backplane provided in the embodiment of the present application;

[0019] Figure 2 A schematic diagram of a first structure of a display panel provided in an embodiment of the present application;

[0020] Figure 3 A second structural schematic diagram of a backplane provided in an embodiment of the present application;

[0021] Figure 4 A second structural schematic diagram of a display panel provided in an embodiment of the present application;

[0022] Figure 5 A third structural schematic diagram of the backplane provided in the embodiment of the present application;

[0023] Figure 6 A third structural schematic diagram of a display panel provided in an embodiment of the present application;

[0024] Figure 7 A fourth structural schematic diagram of a backplane provided in an embodiment of the present application;

[0025] Figure 8 A fourth structural schematic diagram of a display panel provided in an embodiment of the present application;

[0026] Fig. 9 A fifth structural schematic diagram of a backplane provided in an embodiment of the present application;

[0027] Fig.10 A fifth structural schematic diagram of a display panel provided in an embodiment of the present application;

[0028] Fig.11A sixth structural schematic diagram of a backplane provided in an embodiment of the present application;

[0029] Fig.12 A sixth structural schematic diagram of a display panel provided in an embodiment of the present application;

[0030] Fig.13 A comparison diagram of the side viewing angle brightness curves of the display panel when the positive and negative electrode pads provided in the embodiment of the present application are arranged symmetrically in adjacent columns and when the positive and negative electrode pads are not arranged symmetrically in adjacent columns;

[0031] Fig.14 A comparison diagram of the side-view angular temperature curves of the display panel when the positive and negative electrode pads provided in the embodiment of the present application are arranged in adjacent rows symmetrically and when the adjacent rows are not arranged symmetrically;

[0032] Fig.15 A wiring diagram of each positive electrode pad on the backplane provided in an embodiment of the present application;

[0033] Fig.16 A wiring diagram of each negative electrode pad on the backplane provided in an embodiment of the present application;

[0034] Fig.17 A schematic diagram of the structure of a light-emitting chip bonded to a backplane provided in an embodiment of the present application;

[0035] Description of reference numerals:

[0036] 1-substrate; 2-first solder pad; 3-second solder pad; 4-third solder pad; 5-red light-emitting chip; 6-green light-emitting chip; 7-blue light-emitting chip; 8-positive electrode solder pad; 9-negative electrode solder pad; 10-positive electrode; 11-negative electrode. DETAILED DESCRIPTION

[0037] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0039] The present application provides a backplane capable of solving the color cast problem of a display panel at a side viewing angle, such as Figure 1-Figure 17 As shown, it includes but is not limited to a substrate 1 and a driving circuit.

[0040] The driving circuit in this embodiment is arranged on the substrate 1, and the driving circuit includes a plurality of pad group units arrayed on the surface of the substrate 1, one pad group unit corresponds to one pixel unit, the first pad 2 in the pad group unit corresponds to the red light-emitting chip 5 of the pixel unit, the second pad 3 in the pad group unit corresponds to the green light-emitting chip 6 of the pixel unit, and the third pad 4 in the pad group unit corresponds to the blue light-emitting chip 7 of the pixel unit, and the arrangement order of the first pad 2, the second pad 3, and the third pad 4 in each pad group unit in a preset direction is the same.

[0041] It can be understood that the substrate 1 in this embodiment can be made of, but not limited to, phenolic paper laminate, epoxy paper laminate, polyester glass felt laminate, epoxy glass cloth laminate, BT resin board, or glass board. The driving circuit in this embodiment is used to drive the light-emitting chip bonded on the pad to emit light and display. The driving circuit can be partially arranged in the substrate 1 and partially exposed on the surface of the substrate 1. The material of the driving circuit can be, but not limited to, copper, silver, gold, etc. The pad group unit in this embodiment is exposed on the surface of the substrate 1 for bonding the light-emitting chip. The array of the pad group unit can be, but not limited to, a rectangular array distribution. For example, a plurality of rows and columns of pad group units are provided on the front of the substrate 1. Each pad group unit includes or only includes a first pad 2, a second pad 3, and a third pad 4. For example, a pad group unit includes only a first pad 2, a second pad 3, and a third pad 4, and one pad group includes or only includes a positive pad 8 and a negative pad 9. In this embodiment, the arrangement order of the first pad 2, the second pad 3, and the third pad 4 in each pad group unit in the preset direction is the same. For example, each pad group unit is arranged in the order of the first pad 2, the second pad 3, and the third pad 4 on the surface of the substrate 1, or each pad group unit is arranged in the order of the second pad 3, the first pad 2, and the third pad 4. The preset direction in this embodiment is the arrangement direction of the red light-emitting chip 5, the green light-emitting chip 6, and the blue light-emitting chip 7 in a pixel. For example, the preset direction can be but is not limited to the row direction of the array or the column direction of the array, such as Figure 1 The preset direction shown in is the column direction of the array, and the arrangement order of the first pad 2, the second pad 3, and the third pad 4 in each pad group unit in the column direction of the array is the same. The same arrangement order can make the setting of the driving circuit simpler and also facilitate the bonding of the light-emitting chip, which can be bonded in the same red, green, and blue arrangement order, and bonding is less prone to errors.

[0042] In the present embodiment, among at least one of the first pad 2, the second pad 3, and the third pad 4 on the surface of the substrate 1, a part of the same pad is arranged in the order of positive pad 8-negative pad 9, and another part of the same pad is arranged in the order of negative pad 9-positive pad 8. In the present embodiment, a part of the same pad is arranged in the order of positive pad 8-negative pad 9, and when the light-emitting chip is bonded to the pad of this part, the light-emitting chip does not need to be rotated, that is, a part of the light-emitting chips of the same color can be in an unrotated state after bonding; another part is arranged in the order of negative pad 9-positive pad 8, and when the light-emitting chip is bonded to the pad of this part, the light-emitting chip needs to be rotated 180°, that is, the other half of the number of light-emitting chips of the same color is arranged in a 180° rotation after bonding. The light-emitting angle of the unrotated light-emitting chip can be symmetrical with the light-emitting angle of the light-emitting chip rotated 180°. This solves the problem of color cast at the side viewing angle caused by the poor symmetry of the light-emitting angle of one or more colors of the light-emitting chip on the display panel.

[0043] It can be understood that the difference between the number of a part of the same type of pads and the number of the other part in this embodiment may not exceed the number of pads in a row or a column. In some embodiments, a part of the same type of pads may be half the number of the same type of pads, where half the number is the number of the total number of the same type of pads divided by two and rounded. For example, when the pad group unit is set to 5 columns and 6 rows, the total number of the first pads is 30, and the half number of the first pads is 15, even if 15 of the first pads are arranged in the order of positive pads 8-negative pads 9, and the other 15 are arranged in the order of negative pads 9-positive pads 8; for another example, when the pad group unit is set to 5 columns and 5 rows, the total number of the first pads is 25, and the half number of the first pads is 12, even if 12 of the first pads are arranged in the order of positive pads 8-negative pads 9, and the other 13 are arranged in the order of negative pads 9-positive pads 8. In some other embodiments, for example, when the pad group unit is arranged in 5 columns and 6 rows, the first pads of 2 of the columns can be arranged in the order of positive pad 8-negative pad 9, and the first pads of the remaining 3 columns can be arranged in the order of negative pad 9-positive pad 8. At this time, the difference between the number of a part of the same pad and the number of the other part does not exceed the number of pads in one column. In this embodiment, a part of the same pad can be arranged in the order of positive pad 8-negative pad 9 from left to right, and another part of the same pad can be arranged in the order of negative pad 9-positive pad 8 from left to right. The left to right here is relative and is only for explanation, and does not have any limiting effect. In some application scenarios, the settings of positive pads 8 and negative pads 9 in each pad of this embodiment may include the following examples:

[0044] Example 1: Fig. 9As shown, only the arrangement order of the positive electrode pads 8 and the negative electrode pads 9 of a part of the first pads 2 is opposite to that of the first pads 2 of another part. Fig.10 As shown, only a portion of the red light-emitting chips 5 are rotated 180°, which is more suitable for the case where only the light-emitting angle of the red light-emitting chip 5 is not symmetrical.

[0045] Example 2, only in the second pads 3, the arrangement order of the positive pads 8 and the negative pads 9 of a part of the second pads 3 is opposite to that of the second pads 3 of another part. In this case, after the light-emitting chips are bonded, only half of the green light-emitting chips 6 are rotated 180°, which is more suitable for the case where the light-emitting angle symmetry of the green light-emitting chips 6 is not good.

[0046] Example 3: Only in the third pads 4, the arrangement order of the positive pads 8 and the negative pads 9 of a part of the third pads 4 is opposite to that of the other part of the third pads 4. In this case, after the light-emitting chips are bonded, only a part of the blue light-emitting chips 7 are rotated 180°, which is more suitable for the case where the light-emitting angle symmetry of the blue light-emitting chips 7 is not good.

[0047] Example 4: Fig.11 As shown in FIG. 1 , among the first pads 2 and the second pads 3, the arrangement order of the positive pads 8 and the negative pads 9 of a part of the first pads 2 is opposite to that of the first pads 2 of another part, and the arrangement order of the positive pads 8 and the negative pads 9 of a part of the second pads 3 is opposite to that of the second pads 3 of another part. Fig.12 As shown, a portion of the red light-emitting chips 5 are rotated 180°, and a portion of the green light-emitting chips 6 are rotated 180°, which is more suitable for the situation where the light-emitting angles of the red and green light-emitting chips 6 are not symmetrical.

[0048] Example 5: In the second pads 3 and the third pads 4, the arrangement order of the positive pads 8 and the negative pads 9 of a part of the second pads 3 is opposite to that of the second pads 3 of another part, and the arrangement order of the positive pads 8 and the negative pads 9 of a part of the third pads 4 is opposite to that of the third pads 4 of another part. At this time, after the light-emitting chips are bonded, a part of the green light-emitting chips 6 are rotated 180°, and a part of the blue light-emitting chips 7 are rotated 180°, which is more suitable for the case where the light-emitting angles of the green and blue light-emitting chips 7 are not symmetrical.

[0049] Example 6: In the first pads 2 and the third pads 4, the arrangement order of the positive pads 8 and the negative pads 9 of a part of the first pads 2 is opposite to that of the first pads 2 of another part, and the arrangement order of the positive pads 8 and the negative pads 9 of a part of the third pads 4 is opposite to that of the third pads 4 of another part. At this time, after the light-emitting chips are bonded, a part of the red light-emitting chips 5 are rotated 180°, and a part of the blue light-emitting chips 7 are rotated 180°, which is more suitable for the situation where the light-emitting angles of the red and blue light-emitting chips 7 are not symmetrical.

[0050] Example 7: Figure 1 , Figure 3 , Figure 5 , Figure 7 , among the first pads 2, the second pads 3 and the third pads 4, a part of the same pads are arranged in the order of positive pad 8-negative pad 9, and the other part are arranged in the order of negative pad 9-positive pad 8. That is, the arrangement order of the positive pad 8 and the negative pad 9 of a part of the first pads 2 is opposite to that of the first pads 2 of another part, and the arrangement order of the positive pad 8 and the negative pad 9 of a part of the second pads 3 is opposite to that of the second pad 3 of another part, and the arrangement order of the positive pad 8 and the negative pad 9 of a part of the third pad 4 is opposite to that of the third pad 4 of another part. At this time, after the light-emitting chip is bonded, as Figure 2 , Figure 4 , Figure 6 , Figure 8 As shown, half of each color light-emitting chip among the red light-emitting chip 5, the green light-emitting chip 6, and the blue light-emitting chip 7 is rotated 180°, which has a wide range of applications and can be used when the light-emitting angles of one, two or three color light-emitting chips are not symmetrical.

[0051] In some embodiments, Figure 3 As shown, in at least one of the first pads 2, the second pads 3, and the third pads 4, the pads of the same type in the pad group units of adjacent rows are arranged 180° rotationally symmetrically. It can be understood that the 180° rotationally symmetrical arrangement means that a pad takes the midpoint between the adjacent pads of the same type as the rotation center, and after rotating 180 degrees, the pad can overlap with the adjacent pad of the same type, and the arrangement order of the positive pad 8 and the negative pad 9 in the adjacent pads arranged 180° rotationally symmetrically is opposite. For example, a first pad 2 takes the midpoint between the adjacent first pads 2 as the rotation center, and after rotating 180 degrees, the first pad 2 can overlap with the adjacent first pad 2. In this way, a part of the same pad is arranged in the order of positive pad 8-negative pad 9, and the other part is arranged in the order of negative pad 9-positive pad 8.

[0052] In other embodiments, Figure 1As shown, in at least one of the first pad 2, the second pad 3, and the third pad 4, the pads of the same type in the pad group units of adjacent columns are arranged 180° rotationally symmetrically. Thus, it is also possible to arrange a portion of the pads of the same type in the order of positive pad 8-negative pad 9, and the other portion in the order of negative pad 9-positive pad 8. Fig.13 As shown, the curve of Example 1 (the lighter curve) is a curve showing the change of the brightness of the display panel with the viewing angle after the light-emitting chip is bonded on the backplane when the positive and negative electrodes of the same type of pads in each pad group unit of the existing backplane are arranged in the same order; the curve of Example 2 (the darker curve) is a curve showing the change of the brightness of the display panel with the viewing angle when the positive and negative electrodes of the same type of pads in each pad group unit of the existing backplane are arranged in the same order; Figure 1 ), after the light-emitting chip is bonded to the backplane, the curve of the brightness of the display panel changing with the viewing angle shows that after the same type of pads in adjacent columns are arranged 180° rotationally symmetrically, the brightness difference of the display panel at the side viewing angle is significantly reduced. Fig.13 In the curve of Example 1 shown in the figure, the corresponding brightness value L1 is 202.57cd / ㎡ when the side viewing angle is 10 degrees, and the corresponding brightness value L2 is 298.02cd / ㎡ when the side viewing angle is 170 degrees. The difference between L1 and L2 is 95.45. In the curve of Example 2, the corresponding brightness value L3 is 159.71cd / ㎡ when the side viewing angle is 10 degrees, and the corresponding brightness value L4 is 199.14cd / ㎡ when the side viewing angle is 170 degrees. The difference between L3 and L4 is 39.43. It can be clearly seen that after the same type of pads in adjacent columns are arranged in 180° rotational symmetry, the side viewing angle brightness difference of the display panel is significantly reduced. Fig.14 As shown, the curve of Example 1 (the lighter color curve) is a curve showing the change of the color temperature of the display panel with the viewing angle after the light-emitting chip is bonded on the backplane when the positive and negative electrodes of the same type of pads of each pad group unit of the existing backplane are arranged in the same order; the curve of Example 2 (the darker color curve) is a curve showing the change of the color temperature of the display panel with the viewing angle when the positive and negative electrodes of the same type of pads of each pad group unit of the existing backplane are arranged in the same order; Figure 1 ), the color temperature curve of the display panel after bonding the light-emitting chip to the backplane shows that after the same type of pads in adjacent columns are arranged 180° rotationally symmetrically, the color temperature difference of the display panel at the left viewing angle (X coordinate value less than 90) and the right viewing angle (X coordinate value greater than 90) is significantly reduced, that is, the shape of the color temperature curve is closer to a symmetrical curve. For example Fig.14In the curve of Example 1 shown in , the corresponding brightness value K1 when the side viewing angle is 10 degrees is 10268.93k, the corresponding brightness value K2 when the side viewing angle is 170 degrees is 12289.95k, and the difference between K1 and K2 is 2021.02. In the curve of Example 2, the corresponding brightness value K3 when the side viewing angle is 10 degrees is 8969.81k, and the corresponding brightness value K4 when the side viewing angle is 170 degrees is 9992.36k, and the difference between K3 and K4 is 1022.55. It can be clearly seen that after the same type of pads in adjacent columns are arranged in 180° rotational symmetry, the brightness difference between the left and right viewing angles of the display panel can be significantly reduced. Therefore, after the same type of pads in adjacent columns are arranged in 180° rotational symmetry, the brightness and color temperature differences of the left and right viewing angles of the display panel can be reduced, and the visual effect of the side viewing angle of the display panel will be more consistent.

[0053] In some other embodiments, Figure 5 As shown, in at least one of the first pad 2, the second pad 3, and the third pad 4, the pads of the same type in the pad group units of adjacent rows and adjacent columns are all arranged 180° rotationally symmetrically. In this way, not only can a part of the same pad be arranged in the order of positive pad 8-negative pad 9, and the other part be arranged in the order of negative pad 9-positive pad 8, but the adjacent rows and columns are all arranged symmetrically, which can further improve the symmetry of the light-emitting chip on the entire display panel and enhance the visual consistency of the display panel at a side viewing angle.

[0054] In this embodiment, when a part of the same type of pads among the first pad 2, the second pad 3 and the third pad 4 is arranged in the order of positive pad 8-negative pad 9, and the other part is arranged in the order of negative pad 9-positive pad 8, as shown in FIG. Figure 3 , Figure 5 , Figure 7 , the positive electrode pad 8 and the negative electrode pad 9 in any pad group unit are 180° rotationally symmetrical with the positive electrode pad 8 and the negative electrode pad 9 in the pad group unit in the adjacent row and / or column. For example, a pad group unit includes three pairs of positive electrode pads 8 and negative electrode pads 9, and the pad group unit is arranged in the order of positive electrode pad 8-negative electrode pad 9. After rotating 180° with the center between the adjacent pad group units as the rotation center, the positive electrode pad 8 and the negative electrode pad 9 of the pad group unit can overlap with the positive electrode pad 8 and the negative electrode pad 9 in the adjacent pad group unit, that is, the pad group unit adjacent to it presents the order of negative electrode pad 9-positive electrode pad 8. After the rotational symmetry setting, not only the change setting of the arrangement order of the positive electrode pad 8 and the negative electrode pad 9 is realized, but also the arrangement order between the first pad 2, the second pad 3, and the third pad 4 in each pad group unit can remain unchanged, which is more convenient for the setting of the driving circuit on the backplane.

[0055] In some embodiments, among the first pad 2, the second pad 3, and the third pad 4 included in a pad group unit, the positive pad 8 and the negative pad 9 of at least two pads are arranged in the same order. Figure 7 As shown, in a pad group unit, the pad arrangement order of the first pad 2 and the third pad 4 may be the same, and the pad arrangement order of the second pad 3 is opposite to that of the first and third pads; or it may be as follows Figure 1 , Figure 3 , Figure 5 , the arrangement order of the positive and negative electrode pads of the first pad 2, the second pad 3 and the third pad 4 in a pad group unit are the same.

[0056] This embodiment does not limit the specific circuit settings in the driving circuit. It can connect the positive electrode pads 8 and the negative electrode pads 9 and drive the light-emitting chips to emit light. In some application scenarios, it can be but not limited to electrically connecting the positive electrode pads 8 in the same row, such as Fig.15 As shown; the negative electrode pads 9 of the first pads 2 in the same column are electrically connected together, the negative electrode pads 9 of the second pads 3 in the same column are electrically connected together, and the negative electrode pads 9 of the third pads 4 in the same column are electrically connected together, as shown Fig.16 shown.

[0057] In the above-mentioned backplane, among at least one of the first pad 2, the second pad 3, and the third pad 4, a part of the same pad is arranged in the order of positive pad 8-negative pad 9, and when the light-emitting chip is bonded to the pad of this part, the light-emitting chip does not need to be rotated, that is, a part of the light-emitting chip can be in an unrotated state after bonding; the pads of another part are arranged in the order of negative pad 9-positive pad 8, and when the light-emitting chip is bonded to the pad of this part, the light-emitting chip needs to be rotated 180°, that is, a part of the light-emitting chip is rotated 180° after bonding. The light-emitting angle of the unrotated light-emitting chip is symmetrical with the light-emitting angle of the light-emitting chip rotated 180°, so that the light-emitting chip of the color with poor light-emitting angle symmetry can be made to have a more symmetrical light-emitting angle on the display panel as a whole, so that the color of the side viewing angle of the display panel is consistent, the color cast problem of the side viewing angle of the display panel is solved, and the display quality of the display device is improved. Moreover, the arrangement order of the first pad 2, the second pad 3, and the third pad 4 in each pad group unit is the same, the setting of the driving circuit is simpler, and the bonding of the light-emitting chip is also convenient, and the bonding is less prone to errors.

[0058] This embodiment also provides a display panel such as Figure 1-Figure 17As shown, it includes but is not limited to a plurality of pixel units, and the backplane as described above. Among them, the red light-emitting chip 5 of the pixel unit is bonded to the first pad 2, the green light-emitting chip 6 of the pixel unit is bonded to the second pad 3, and the blue light-emitting chip 7 of the pixel unit is bonded to the third pad 4. The arrangement order of the red light-emitting chip 5, the green light-emitting chip 6, and the blue light-emitting chip 7 in each pixel unit in the preset direction is the same. In at least one light-emitting chip of the red light-emitting chip 5, the green light-emitting chip 6, and the blue light-emitting chip 7, a part of the light-emitting chip of the same color is rotated 180°, and the other part is in an unrotated state. The light-emitting chip in this embodiment is rotated 180° with the center of a single light-emitting chip as the rotation center, and is rotated 180° with the unrotated state as the starting point of the rotation. For example, the unrotated state of the red light-emitting chip 5 is that the positive electrode 10 and the negative electrode 11 are arranged from left to right, and the red light-emitting chip 5 rotated 180° is that the negative electrode 11 and the positive electrode 10 are arranged from left to right.

[0059] It can be understood that, in the present embodiment, each pixel unit includes or only includes a red light-emitting chip 5, a green light-emitting chip 6, and a blue light-emitting chip 7. For example, one pixel unit only includes one red light-emitting chip 5, one green light-emitting chip 6, and one blue light-emitting chip 7. The light-emitting chip in the present embodiment includes a positive electrode 10 and a negative electrode 11. The light-emitting chip in the present embodiment may be an LED light-emitting chip, which may include but is not limited to ordinary-sized LEDs, and may also include micro-LEDs, such as but not limited to Mini LED (Mini Light Emitting Diode, sub-millimeter light-emitting diode), Micro LED (MicroLight Emitting Diode, micrometer-level light-emitting diode). The light-emitting chip in the present embodiment may be a flip-chip LED light-emitting chip, such as Fig.17 As shown, during bonding, the positive electrode 10 of the light-emitting chip can be bonded to the positive electrode pad 8 of the pad group through solder to form an electrical connection, and the negative electrode 11 of the light-emitting chip can be bonded to the negative electrode pad 9 of the pad through solder to form an electrical connection. The solder in this embodiment can be but not limited to lead-containing solder alloy. However, it is not limited to this, and the light-emitting chip in this embodiment can also be bonded to the corresponding pad through other methods.

[0060] The arrangement order of the red light emitting chip 5, the green light emitting chip 6, and the blue light emitting chip 7 of each pixel unit in the preset direction is the same. For example, each pixel unit can be arranged in the order of red, green, and blue, or each pixel unit can be arranged in the order of green, red, and blue. The preset direction in this embodiment can be but is not limited to the row direction of the array or the column direction of the array. For example, Figure 1As shown, the light-emitting chips in each pixel are arranged in the same order of red, green, and blue in the column direction of the array. The same arrangement order of the light-emitting chips in each pixel facilitates the bonding of the light-emitting chips. They can be bonded in the same red, green, and blue arrangement order, and bonding is less prone to errors. The light-emitting chip in this embodiment corresponds to the pad, the positive electrode 10 of the light-emitting chip is bonded to the positive electrode pad 8 of the corresponding pad, and the negative electrode 11 of the light-emitting chip is bonded to the negative electrode pad 9 of the corresponding pad. Therefore, the arrangement of the positive electrode pad 8 and the negative electrode pad 9 in the pad determines whether the light-emitting chip needs to be rotated 180°. For example, Fig. 9 As shown, when only the positive and negative electrode pads 9 in the first pad 2 have opposite settings, that is, the setting mode of the above example 1, a part of the red light-emitting chip 5 corresponding to the first pad 2 is rotated 180°, and the other part is not rotated. Similarly, the specific settings corresponding to examples 2 to 7 in the above embodiments can also be obtained, and will not be repeated here one by one.

[0061] In some embodiments, between adjacent rows and / or columns of pixel units, the light-emitting chips of the same color are 180° rotationally symmetrical. Figure 4 As shown, only the light-emitting chips of the same color between the pixel units of adjacent rows are 180° rotationally symmetrical; it can also be as follows Figure 2 As shown, only the light-emitting chips of the same color between the pixel units of adjacent columns are 180° rotationally symmetrical; it can also be as follows Figure 6 As shown, between the pixel units of adjacent rows and columns, the light-emitting chips of the same color are all 180° rotationally symmetrical. The light-emitting chips of each color are all arranged to rotate 180°, which can further improve the symmetry of the light-emitting chips on the entire display panel.

[0062] The above-mentioned display panel bonds the light-emitting chip to the pad, and the light-emitting chip corresponds to the pad one by one. Among at least one of the red light-emitting chip 5, the green light-emitting chip 6, and the blue light-emitting chip 7, a part of the light-emitting chip of the same color is rotated 180°, and the other part is in an unrotated state. The light-emitting angle of the unrotated light-emitting chip is symmetrical with the light-emitting angle of the light-emitting chip rotated 180°, so that the light-emitting chips of colors with poor light-emitting angle symmetry can be made to have symmetrical light-emitting angles on the display panel as a whole, so that the color of the side viewing angle of the display panel is consistent, which solves the problem of color cast at the side viewing angle of the display panel and improves the display quality of the display panel. Moreover, the arrangement order of the red, green, and blue light-emitting chips in each pixel group unit is the same, which facilitates the bonding of the light-emitting chip and makes the bonding less prone to errors.

[0063] This embodiment further provides a display device, which includes a housing and the display panel as described above, wherein the display panel is fixed on the housing.

[0064] The material of the housing in this embodiment can be plastic or metal, or part of it can be plastic and part of it can be metal. This embodiment does not specifically limit the connection method between the display panel and the housing, and the connection and fixation between the two can be achieved. The display device provided in this embodiment can be, but is not limited to, a television, an advertising screen, a mobile phone, a car display, an AR, a VR and other display devices.

[0065] In the above-mentioned display device, the light-emitting angle of the unrotated light-emitting chip on the display panel is symmetrical with the light-emitting angle of the light-emitting chip rotated 180°, thereby making the light-emitting angles of the light-emitting chips of colors with poor light-emitting angle symmetry on the display panel as a whole symmetrical, making the color of the display panel consistent at the side viewing angle, solving the problem of color cast at the side viewing angle of the display panel, and improving the display quality of the display device.

[0066] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A backplane, characterized in that: include: A substrate, and a driving circuit disposed on the substrate, wherein the driving circuit comprises a plurality of pad group units arrayed on the surface of the substrate, wherein one pad group unit corresponds to one pixel unit, a first pad in the pad group unit corresponds to a red light-emitting chip of the pixel unit, a second pad in the pad group unit corresponds to a green light-emitting chip of the pixel unit, and a third pad in the pad group unit corresponds to a blue light-emitting chip of the pixel unit, and an arrangement order of the first pad, the second pad, and the third pad in each pad group unit in a preset direction is the same; Among at least one of the first pad, the second pad, and the third pad on the surface of the substrate, a part of the same pad is arranged in the order of positive pad-negative pad, and another part of the same pad is arranged in the order of negative pad-positive pad.

2. The back plate according to claim 1, characterized in that: At least one of the first pad, the second pad, and the third pad has pads of the same type in adjacent rows arranged in 180° rotational symmetry.

3. The back plate according to claim 1, characterized in that: At least one of the first pad, the second pad, and the third pad has pads of the same type in adjacent columns arranged in 180° rotational symmetry.

4. The back plate according to claim 1, characterized in that: At least one of the first pad, the second pad and the third pad has pads of the same type in adjacent rows and columns that are arranged in 180° rotational symmetry.

5. The back plate according to claim 1, characterized in that: Among the first pad, the second pad and the third pad, a part of the same pads are arranged in the order of positive pad-negative pad, and another part of the same pads are arranged in the order of negative pad-positive pad.

6. The backplane according to any one of claims 1 to 5, characterized in that: The drive circuit also includes a conductive circuit, which electrically connects the positive electrode pads in the same row, the negative electrode pads of the first pads in the same column, the negative electrode pads of the second pads in the same column, and the negative electrode pads of the third pads in the same column.

7. The backplane according to any one of claims 1 to 4, characterized in that: Among the first pad, the second pad, and the third pad included in one pad group unit, the positive electrode pad and the negative electrode pad of at least two kinds of pads are arranged in the same order.

8. A display panel, characterized in that: A backplane comprising a plurality of pixel units, and the backplane according to any one of claims 1 to 7, wherein a red light-emitting chip of the pixel unit is bonded to the first pad, a green light-emitting chip of the pixel unit is bonded to the second pad, and a blue light-emitting chip of the pixel unit is bonded to the third pad, and an arrangement order of the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip in each pixel unit in a preset direction is the same; In at least one of the red light-emitting chip, the green light-emitting chip and the blue light-emitting chip, a portion of the light-emitting chips of the same color is rotated by 180°, and another portion is in a non-rotated state.

9. The display panel according to claim 8, wherein: Between the pixel units in adjacent rows and / or columns, the light-emitting chips of the same color are all 180° rotationally symmetrical.

10. A display device, characterized in that: It comprises a shell, and the display panel as claimed in claim 8 or 9, wherein the display panel is fixed on the shell.

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