CSP (Chip Scale Package) light source and display

Abstract

The utility model provides a CSP packaging light source and a displayer, the CSP packaging light source comprises an LED wafer, a light-emitting part and a light-reflecting part, the light-emitting part is connected with the LED wafer, and the light-emitting part is connected with the light-reflecting part; the LED wafer is arranged inside the light-emitting part, the light-reflecting part is provided with an open groove, the LED wafer and the light-emitting part are arranged in the open groove, the surface of the light-emitting part is connected with the inner wall of the open groove, and the LED wafer is installed at the bottom of the open groove. The LED wafer is electrified to emit light, the light-emitting part can supplement the light-emitting spectrum of the LED wafer, the light-emitting part is arranged in the open groove of the light reflecting part, the inner wall of the open groove can reflect light rays emitted by the light-emitting part and the LED wafer, the light rays are emitted to the opening of the open groove in a concentrated mode, light-emitting angle divergence of the LED wafer is avoided, light emitting is more concentrated, and therefore the brightness of the CSP light source is improved. The display adopts the CSP light source provided by the invention, so that the brightness of the display light source can be increased.

Description

Technical Field

[0001] The present application relates to the technical field of LED light sources, and in particular to CSP packaged light sources and displays. Background Art

[0002] Common LED packaging methods include through-hole LED, surface mounted devices, and COB (chips on board). With the development of LED application technology, the application fields of LED devices are becoming more and more extensive, and the requirements for LEDs are also becoming higher and higher. In particular, the requirements for LED size are getting smaller and smaller.

[0003] Due to structural limitations, the above packaging methods cannot make the size of LEDs smaller. In order to address this technical problem, people use CSP (Chip Scale Package) packaging, i.e. wafer-level packaging technology, to solve this problem. CSP packaging is a bracket-free packaging technology that is no longer limited by brackets or substrates, so it can greatly reduce the size of LED light source devices while also having the advantage of good heat dissipation.

[0004] Compared with other LED packaging methods, the existing CSP LED packaging method has some problems. Under the same size conditions, the brightness of the existing CSP LED packaging method is lower than that of the SMD LED packaging method. Utility Model Content

[0005] The technical problem to be solved by the present application is that under the condition of the same size, the brightness of the existing LED using the CSP packaging method is lower than that of the LED using the SMD packaging method.

[0006] In order to solve the above technical problems or at least partially solve the above technical problems, the present application provides a CSP packaged light source and a display.

[0007] In a first aspect, the utility model discloses a CSP packaged light source, which comprises an LED chip, a light-emitting element, and a reflective element, wherein the light-emitting element is connected to the LED chip, and the light-emitting element is connected to the reflective element;

[0008] The LED chip is arranged inside the light-emitting element, the reflective element is provided with a groove, the LED chip and the light-emitting element are arranged in the groove, the surface of the light-emitting element is connected to the inner wall of the groove, and the LED chip is installed at the bottom of the groove;

[0009] The light-emitting element comprises a light-emitting surface and a contact surface. The light-emitting surface is connected to the contact surface, and the light-emitting surface is flush with an edge of the groove of the reflective element.

[0010] Preferably, the LED chip comprises a chip body and an electrode, wherein the electrode is connected to the chip body, and the electrode is connected to the reflective element.

[0011] Preferably, the chip body includes a side surface, a first surface and a second surface, the first surface and the second surface are arranged opposite to each other, the first surface and the second surface are arranged on edges opposite to the side surface, the second surface is connected to the electrode, and the light-emitting element covers the first surface and the side surface.

[0012] Preferably, the surface inside the groove contacts the second surface, the electrode and the light-emitting element, and the first surface faces the opening of the groove.

[0013] Preferably, the electrode thickness is 20um-100um;

[0014] The electrode is made of any material including copper, copper alloy, silver, silver alloy, tin and tin alloy.

[0015] Preferably, the reflective element is composed of glue and reflective material;

[0016] The reflective material includes any one of silicon dioxide, titanium dioxide, metallic silver, and metallic aluminum;

[0017] The thickness of the reflective element is greater than or equal to 0.01 mm.

[0018] Preferably, the contact surface is in contact with the inner wall of the groove, and the light-emitting surface and the first surface are arranged in the light-emitting direction of the LED chip.

[0019] Preferably, the light-emitting component comprises a transparent component, and the transparent component is made of transparent silicone or transparent epoxy resin.

[0020] Preferably, the light-emitting member includes fluorescent powder, the fluorescent powder is connected to the transparent member, and the fluorescent powder is mixed with the transparent member;

[0021] The fluorescent powder includes yellow fluorescent powder, green fluorescent powder and red fluorescent powder.

[0022] In a second aspect, the utility model discloses a display, which includes the above-mentioned CSP packaged light source.

[0023] The above technical solution provided by this application has the following advantages compared with the prior art:

[0024] The present application provides a CSP packaged light source and a display. In the CSP packaged light source, the LED chip is powered on to emit light, and the light-emitting component can supplement the spectrum of the light emitted by the LED chip. The light-emitting component is arranged in a groove of a reflective component. The inner wall of the groove can reflect the light emitted by the light-emitting component and the LED chip, so that the light is concentrated and emitted toward the opening of the groove, thereby avoiding the divergence of the light emission angle of the LED chip, and the light emission is more concentrated, thereby improving the brightness of the CSP packaged light source.

[0025] In addition, since the light-emitting component is made of transparent material and wrapped on the LED chip, the reflective component outside the light-emitting component is made of silicone and silicon dioxide. The reflective component can increase the protection of the light-emitting component and the LED chip, making the product more reliable. In addition, the materials used for the reflective component and the light-emitting component are more weather-resistant, and the weather resistance of the product is also improved accordingly.

[0026] The display uses the CSP packaged light source provided in this application, which can increase the brightness of the display light source. In addition, the weather resistance and reliability of the light source are better, thereby improving the service life of the display. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] Figure 1 A schematic diagram of the structure of a CSP packaged light source provided in this application Figure 1 ;

[0030] Figure 2 A schematic diagram of the structure of a CSP packaged light source provided in this application Figure 2 ;

[0031] Figure 3 A schematic cross-sectional structure diagram of a CSP packaged light source provided in this application;

[0032] Figure 4 A schematic diagram of the structure of an LED chip of a CSP packaged light source provided in this application;

[0033] Figure 5 A schematic diagram of the structure of a reflective member of a CSP packaged light source provided in this application;

[0034] Figure 6A schematic diagram of the structure of a display provided in this application.

[0035] Description of reference numerals:

[0036] 1. CSP package light source; 2. Display;

[0037] 11. LED chip; 111. chip body; 1111. side surface; 1112. first surface; 1113. second surface; 112. electrode;

[0038] 12. light-emitting member; 121. light-emitting surface; 122. contact surface;

[0039] 13. Reflective element; 131. Slotting. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with the drawings in this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] First, see Figure 1-5 The utility model discloses a CSP packaged light source 1, which includes an LED chip 11, a light emitting element 12, and a reflective element 13. The light emitting element 12 is connected to the LED chip 11, and the light emitting element 12 is connected to the reflective element 13.

[0042] Specifically, the LED chip 11 is electroluminescent and can emit light after being powered on. The LED chip 11 is arranged inside the light-emitting element 12. The light-emitting element 12 can supplement the spectrum of the light emitted by the LED chip 11 and enhance the brightness. The reflector 13 is provided with a groove 131. The LED chip 11 and the light-emitting element 12 are arranged in the groove 131. The surface of the light-emitting element 12 is connected to the inner wall of the groove 131, and the LED chip 11 is installed at the bottom of the groove 131. That is, the light emitted by the light-emitting element 12 and the LED chip 11 in the groove 131 of the reflector 13 is concentrated and emitted toward the opening of the groove 131, thereby avoiding the light of the LED chip 11 from being diffused and increasing the light intensity emitted by the CSP package light source 1.

[0043] It can be understood that when the LED chip 11 is powered on and emits light, the light-emitting element 12 can supplement the spectrum of the light emitted by the LED chip 11. The light-emitting element 12 is arranged in the groove 131 of the reflective element 13. The inner wall of the groove 131 can reflect the light emitted by the light-emitting element 12 and the LED chip 11, so that the light is concentrated to the opening of the groove 131, avoiding the divergence of the light-emitting angle of the LED chip 11, and the light emission is more concentrated, thereby improving the brightness of the CSP packaged light source 1.

[0044] The LED chip 11 includes a chip body 111 and an electrode 112, wherein the electrode 112 is connected to the chip body 111, and the electrode 112 is connected to the reflector 13. Specifically, the chip body 111 is electroluminescent, and the electrode 112 provides power for the chip body 111. When the electrode 112 is energized, the chip body 111 can emit light.

[0045] The chip body 111 includes a side surface 1111, a first surface 1112 and a second surface 1113. The first surface 1112 and the second surface 1113 are arranged opposite to each other. The first surface 1112 and the second surface 1113 are arranged on opposite edges of the side surface 1111. The second surface 1113 is connected to the electrode 112. The light-emitting element 12 covers the first surface 1112 and the side surface 1111.

[0046] Among them, the light-emitting component 12 is coated on the LED chip 11, wherein at least one surface of the electrode 112 is exposed to the light-emitting component 12 and the reflector 13. By exposing one surface of the electrode 112, the electrode 112 can be energized by the outside world. The light-emitting component 12 covers the first surface 1112 and the side surface 1111 of the chip body 111. In addition, according to the setting of the electrode 112, the light-emitting component 12 partially covers the outer edge of the second surface 1113. The second surface 1113 is usually provided with two electrodes 112, namely the positive electrode and the negative electrode. The gap between the positive electrode 112 and the negative electrode 112 is filled by the reflector 13 to avoid light leakage from the bottom of the LED chip 11. At the same time, the setting of the reflector 13 can increase the reflective effect at this position and improve the luminous brightness of the light source. In addition, the protection of the chip body 111 can be increased.

[0047] Specifically, the surface inside the groove 131 contacts the second surface 1113, the electrode 112 and the light-emitting component 12, the first surface 1112 faces the opening of the groove 131, the groove 131 inside the reflector 13 is set to a cup shape or a bowl shape, the surface of the groove 131 has a certain curvature, and the cross-section of the groove 131 adopts an irregular free-form surface, so that after the light passes through the light-emitting component 12, it is irradiated on the inner wall of the groove 131 of the reflector 13 and can be reflected in the direction of the opening of the groove 131, so that the light is concentrated and reflected toward the opening of the groove 131.

[0048] Optionally, the thickness of the electrode 112 is 20um-100um. By thickening the electrode 112, a larger current can pass through the LED chip 11, thereby increasing the luminous power and making the brightness higher.

[0049] Optionally, the electrode 112 is made of any material of copper, copper alloy, silver, silver alloy, tin, or tin alloy.

[0050] Optionally, the electrode 112 is manufactured by electroplating, chemical plating, evaporation, ball planting, etc., so that the thickness of the electrode 112 is greater than that of a traditional electrode 112 .

[0051] The light emitting element 12 includes a light emitting surface 121 and a contact surface 122 . The light emitting surface 121 is connected to the contact surface 122 . The contact surface 122 contacts the inner wall of the groove 131 . The light emitting surface 121 and the first surface 1112 are arranged in the light emitting direction of the LED chip 11 .

[0052] Specifically, the light-emitting surface 121 is flush with the edge of the groove 131 of the reflector 13, the contact surface 122 contacts the inner wall of the groove 131, and the shapes match. The light-emitting element 12 fills the groove 131 of the reflector 13, and the LED chip 11 emits and refracts in the light-emitting element 12, cooperating with the inner wall of the groove 131 of the reflector 13 to reflect the light along the direction of the opening of the groove 131, thereby achieving a focusing effect and improving the intensity of light emission of the CSP packaged light source 1.

[0053] The light emitting member 12 includes a transparent member, which is made of transparent silicone or transparent epoxy resin. The transparent member is injected into the groove 131 of the reflective member 13 by liquid, and then cured to form an effect matching the inner wall of the groove 131 of the reflective member 13. Specifically, the light emitting member 12 is formed by curing the liquid transparent member, and the transparent member can increase the intensity of the light emitted by the LED chip 11 to avoid affecting the light emitting effect of the chip body 111; at the same time, it can also provide protection for the chip body 111.

[0054] The light-emitting element 12 includes fluorescent powder, and the fluorescent powder is mixed with a transparent element. It can be understood that the light-emitting element 12 can be made of transparent material or made by mixing transparent material with fluorescent powder. Whether to add fluorescent powder can be selected according to the current light brightness and light spectrum.

[0055] Optionally, the phosphor includes any one of yellow phosphor, green phosphor, and red phosphor, or a combination of two or three of them.

[0056] Optionally, the components of the phosphor include one or more of aluminate system phosphors (YAG, (Gd, Y)AG, (Lu, Y)AG), silicate system phosphors (Ba2SiO4, Sr3SiO5), nitride system phosphors (BaSi2O2N2, α-Sialon, β-Sialon, Sr2Si5N8, CaAlSiN3) and fluoride system phosphors (K2SiF6:Mn2+, K2(SiGe)F6:Mn2+).

[0057] The reflective element 13 is composed of glue and reflective material, and the reflective material includes any one of silicon dioxide, titanium dioxide, metal silver and metal aluminum.

[0058] It can be understood that since the light-emitting element 12 is made of transparent glue and wrapped on the LED chip 11, and the hardness of the transparent glue is insufficient, the reflector 13 outside the light-emitting element 12 is made of any reflective material such as silicon dioxide, titanium dioxide, metal silver, and metal aluminum, which can improve the hardness of the reflector 13. The reflector 13 can increase the protection of the light-emitting element 12 and the LED chip 11, making the product more reliable, and making the CSP packaged light source 1 made by the CSP packaging method have good protection even without a bracket. In addition, the materials used for the reflector 13 and the light-emitting element 12 are more weather-resistant, and the weather resistance of the product is also improved.

[0059] In particular, the distance between the side surface 1111 and the reflector 13 is greater than or equal to 0.1 mm, and the thickness of the reflector 13 is greater than or equal to 0.01 mm. The light is reflected from the inner wall of the slot 131 of the reflector 13 to ensure that the path is at the opening of the slot 131 and is perpendicular to the first surface 1112, thereby ensuring the luminous intensity of the CSP package light source 1 in the luminous direction.

[0060] Second, see Figure 6 The utility model discloses a display 2, which includes the above-mentioned CSP packaged light source 1. Specifically, the display 2 adopts the CSP packaged light source 1 provided in the present application, which can increase the brightness of the light source of the display 2. In addition, the weather resistance and reliability of the light source are better, so that the service life of the display 2 is also improved.

[0061] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0062] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0063] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0064] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0065] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0066] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0067] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include these modifications and variations.

[0068] The above is a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A CSP packaged light source, characterized in that: It includes an LED chip, a light-emitting element, and a reflective element, wherein the light-emitting element is connected to the LED chip, and the light-emitting element is connected to the reflective element; The LED chip is arranged inside the light-emitting element, the reflective element is provided with a groove, the LED chip and the light-emitting element are arranged in the groove, the surface of the light-emitting element is connected to the inner wall of the groove, and the LED chip is installed at the bottom of the groove; The light-emitting element comprises a light-emitting surface and a contact surface. The light-emitting surface is connected to the contact surface, and the light-emitting surface is flush with an edge of the groove of the reflective element.

2. The CSP packaged light source according to claim 1, characterized in that: The LED chip comprises a chip body and an electrode, wherein the electrode is connected to the chip body, and the electrode is connected to the reflective element.

3. The CSP packaged light source according to claim 2, characterized in that: The chip body includes a side surface, a first surface and a second surface, the first surface and the second surface are arranged opposite to each other, the first surface and the second surface are arranged on edges opposite to the side surface, the second surface is connected to the electrode, and the light-emitting component covers the first surface and the side surface.

4. The CSP packaged light source according to claim 3, characterized in that: The surface in the groove contacts the second surface, the electrode and the light-emitting element, and the first surface faces the opening of the groove.

5. The CSP packaged light source according to claim 2, characterized in that: The electrode thickness is 20um-100um; The electrode is made of any material including copper, copper alloy, silver, silver alloy, tin and tin alloy.

6. The CSP packaged light source according to claim 1, characterized in that: The reflective element is composed of glue and reflective material; The reflective material includes any one of silicon dioxide, titanium dioxide, metallic silver, and metallic aluminum; The thickness of the reflective element is greater than or equal to 0.01 mm.

7. The CSP packaged light source according to claim 3, characterized in that: The contact surface is in contact with the inner wall of the groove, and the light-emitting surface and the first surface are arranged in the light-emitting direction of the LED chip.

8. The CSP packaged light source according to claim 7, characterized in that: The light-emitting component comprises a transparent component, and the transparent component is made of transparent silica gel or transparent epoxy resin.

9. The CSP packaged light source according to claim 8, characterized in that: The light-emitting member includes fluorescent powder, the fluorescent powder is connected to the transparent member, and the fluorescent powder is mixed with the transparent member; The fluorescent powder includes yellow fluorescent powder, green fluorescent powder and red fluorescent powder.

10. A display, characterized in that: A CSP packaged light source comprising any one of claims 1 to 9.

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